KR100529746B1 - 제어된 양의 융제를 패키지에 도포하는 브러시 플럭싱 자동화 시스템 - Google Patents

제어된 양의 융제를 패키지에 도포하는 브러시 플럭싱 자동화 시스템 Download PDF

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Publication number
KR100529746B1
KR100529746B1 KR10-2000-7010253A KR20007010253A KR100529746B1 KR 100529746 B1 KR100529746 B1 KR 100529746B1 KR 20007010253 A KR20007010253 A KR 20007010253A KR 100529746 B1 KR100529746 B1 KR 100529746B1
Authority
KR
South Korea
Prior art keywords
substrate
flux
brush
assembled
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2000-7010253A
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English (en)
Korean (ko)
Other versions
KR20010041941A (ko
Inventor
마스터라엔.
가다도마리아지.
칸모함마드주바이르
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20010041941A publication Critical patent/KR20010041941A/ko
Application granted granted Critical
Publication of KR100529746B1 publication Critical patent/KR100529746B1/ko
Assigned to 글로벌파운드리즈 인크. reassignment 글로벌파운드리즈 인크. 권리의 전부이전등록 Assignors: 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR10-2000-7010253A 1998-03-17 1999-03-17 제어된 양의 융제를 패키지에 도포하는 브러시 플럭싱 자동화 시스템 Expired - Fee Related KR100529746B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9/040,511 1998-03-17
US09/040,511 1998-03-17
US09/040,511 US6098867A (en) 1998-03-17 1998-03-17 Automated brush fluxing system for application of controlled amount of flux to packages

Publications (2)

Publication Number Publication Date
KR20010041941A KR20010041941A (ko) 2001-05-25
KR100529746B1 true KR100529746B1 (ko) 2005-11-22

Family

ID=21911370

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7010253A Expired - Fee Related KR100529746B1 (ko) 1998-03-17 1999-03-17 제어된 양의 융제를 패키지에 도포하는 브러시 플럭싱 자동화 시스템

Country Status (5)

Country Link
US (1) US6098867A (https=)
EP (1) EP1064677A1 (https=)
JP (1) JP2002507836A (https=)
KR (1) KR100529746B1 (https=)
WO (1) WO1999048141A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60034970T2 (de) * 1999-03-10 2008-02-21 Unilever N.V. Gefrierschutzprotein enthaltendes Speiseeis
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6597444B1 (en) * 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6709963B1 (en) * 2000-07-14 2004-03-23 Advanced Micro Devices, Inc. Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps
AU2001281178A1 (en) * 2000-08-24 2002-03-04 Advanced Micro Devices Inc. Controlled and programmed deposition of flux on a flip-chip die by spraying

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841751A (en) * 1969-06-04 1974-10-15 Xerox Corp Electrostatic color reproduction method
JPS5119710B2 (https=) * 1972-05-19 1976-06-19
JPS5496044A (en) * 1978-01-14 1979-07-30 Toshiba Corp Developing device of electrostatic latent images
JPS5540034A (en) * 1978-09-12 1980-03-21 Citizen Watch Co Ltd Flux coating method and coating device for soldering
JPS6326261A (ja) * 1986-03-17 1988-02-03 Alps Electric Co Ltd プリント基板のフラツクス塗布方法
US4724170A (en) * 1986-09-02 1988-02-09 The Goodyear Tire & Rubber Company Apparatus and method for applying cement to an end portion of a flexible strip
US5065692A (en) * 1990-04-30 1991-11-19 At&T Bell Laboratories Solder flux applicator
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
US5324406A (en) * 1992-09-10 1994-06-28 Tosoh Smd, Inc. Automatic brush plating machine
JPH0758446A (ja) * 1993-08-19 1995-03-03 Toshiba Corp フラックス塗布装置
JPH07183649A (ja) * 1993-12-22 1995-07-21 Matsushita Electric Ind Co Ltd フラックスの塗布装置
US5475889A (en) * 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers

Also Published As

Publication number Publication date
JP2002507836A (ja) 2002-03-12
US6098867A (en) 2000-08-08
KR20010041941A (ko) 2001-05-25
WO1999048141A1 (en) 1999-09-23
EP1064677A1 (en) 2001-01-03

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