JP2002506287A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002506287A5 JP2002506287A5 JP2000535044A JP2000535044A JP2002506287A5 JP 2002506287 A5 JP2002506287 A5 JP 2002506287A5 JP 2000535044 A JP2000535044 A JP 2000535044A JP 2000535044 A JP2000535044 A JP 2000535044A JP 2002506287 A5 JP2002506287 A5 JP 2002506287A5
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- sealing material
- gate
- mold member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003566 sealing material Substances 0.000 description 38
- 239000000463 material Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 11
- 239000008393 encapsulating agent Substances 0.000 description 10
- 238000007789 sealing Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 101100497221 Bacillus thuringiensis subsp. alesti cry1Ae gene Proteins 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1008488A NL1008488C2 (nl) | 1998-03-05 | 1998-03-05 | Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. |
| NL1008488 | 1998-03-05 | ||
| PCT/NL1999/000118 WO1999045586A1 (en) | 1998-03-05 | 1999-03-04 | Mould part, mould and method for encapsulating electronic components mounted on a carrier |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002506287A JP2002506287A (ja) | 2002-02-26 |
| JP2002506287A5 true JP2002506287A5 (https=) | 2009-09-10 |
| JP4628543B2 JP4628543B2 (ja) | 2011-02-09 |
Family
ID=19766666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000535044A Expired - Lifetime JP4628543B2 (ja) | 1998-03-05 | 1999-03-04 | モールド部材、モールドおよびキャリア上に配設された電子部品を封止する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6428731B1 (https=) |
| EP (2) | EP2161740A3 (https=) |
| JP (1) | JP4628543B2 (https=) |
| KR (1) | KR100617654B1 (https=) |
| DE (1) | DE69941923D1 (https=) |
| MY (1) | MY123241A (https=) |
| NL (1) | NL1008488C2 (https=) |
| WO (1) | WO1999045586A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020043389A1 (en) * | 2000-09-29 | 2002-04-18 | Selvarajan Murugan | Virtual gate design for thin packages |
| US6562272B1 (en) * | 2000-12-05 | 2003-05-13 | Cypress Semiconductor Corporation | Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages |
| JP2006031336A (ja) * | 2004-07-15 | 2006-02-02 | Fujitsu Ltd | Rfidタグの製造方法 |
| US20080057528A1 (en) * | 2006-08-30 | 2008-03-06 | Kimberly-Clark Worldwide, Inc. | Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte |
| GB2481974A (en) * | 2010-07-12 | 2012-01-18 | Biocomposites Ltd | Bone cement pellet mould |
| DE102010038915A1 (de) * | 2010-08-04 | 2012-02-09 | Robert Bosch Gmbh | Vorrichtung und Verfahren zum Herstellen von aus Kunststoff bestehenden Formteilen |
| CN103753756B (zh) * | 2014-01-03 | 2016-08-17 | 铜陵中发三佳科技股份有限公司 | 一种用于led支架的emc封装装置 |
| JP7134930B2 (ja) * | 2019-08-21 | 2022-09-12 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849170B2 (ja) * | 1977-10-25 | 1983-11-02 | 旭化成株式会社 | コ−トハンガ−型ゲ−トを有する射出成形用金型 |
| US4513942A (en) * | 1983-05-25 | 1985-04-30 | Bourns, Inc. | Plate molding apparatus with interlocking cavity plates |
| JPS60126841A (ja) * | 1983-12-14 | 1985-07-06 | Hitachi Ltd | 樹脂封止用金型 |
| JPS6353006A (ja) * | 1986-08-22 | 1988-03-07 | Hitachi Ltd | 成形装置 |
| JPH029142A (ja) * | 1988-06-28 | 1990-01-12 | Fujitsu Ltd | 半導体装置の製造方法 |
| JP2631520B2 (ja) * | 1988-08-05 | 1997-07-16 | 株式会社日立製作所 | 樹脂封止パッケージの成形方法 |
| US5417905A (en) * | 1989-05-26 | 1995-05-23 | Esec (Far East) Limited | Method of making a card having decorations on both faces |
| JP2855787B2 (ja) * | 1990-05-16 | 1999-02-10 | セイコーエプソン株式会社 | 樹脂封止型半導体装置製造用金型並びにそれを用いた樹脂封止型半導体装置の製造方法 |
| US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
| JP2586831B2 (ja) * | 1994-09-22 | 1997-03-05 | 日本電気株式会社 | 樹脂封止用金型および半導体装置の製造方法 |
| EP0730937B1 (en) * | 1994-11-21 | 1998-02-18 | Apic Yamada Corporation | A resin molding machine with release film |
| JP3246848B2 (ja) * | 1995-02-22 | 2002-01-15 | アピックヤマダ株式会社 | 汎用ゲート位置樹脂モールド装置および樹脂モールド方法 |
| JPH0936151A (ja) * | 1995-07-20 | 1997-02-07 | Japan Aviation Electron Ind Ltd | 小型樹脂モールド集積回路装置の製造方法およびこの方法により製造された集積回路装置 |
| US5698242A (en) * | 1995-12-20 | 1997-12-16 | General Instrument Corporation Of Delaware | Apparatus for the injection molding of semiconductor elements |
| US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
| US6256873B1 (en) * | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
-
1998
- 1998-03-05 NL NL1008488A patent/NL1008488C2/nl not_active IP Right Cessation
-
1999
- 1999-03-04 EP EP09177224A patent/EP2161740A3/en not_active Withdrawn
- 1999-03-04 DE DE69941923T patent/DE69941923D1/de not_active Expired - Fee Related
- 1999-03-04 WO PCT/NL1999/000118 patent/WO1999045586A1/en not_active Ceased
- 1999-03-04 JP JP2000535044A patent/JP4628543B2/ja not_active Expired - Lifetime
- 1999-03-04 US US09/623,443 patent/US6428731B1/en not_active Expired - Fee Related
- 1999-03-04 EP EP99909406A patent/EP1060507B1/en not_active Expired - Lifetime
- 1999-03-04 KR KR1020007009813A patent/KR100617654B1/ko not_active Expired - Fee Related
- 1999-03-05 MY MYPI99000827A patent/MY123241A/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01192154A (ja) | リードフレーム | |
| JP2002506287A5 (https=) | ||
| JPH03205117A (ja) | マルチプランジャー成形金型 | |
| JP4628543B2 (ja) | モールド部材、モールドおよびキャリア上に配設された電子部品を封止する方法 | |
| JP3411448B2 (ja) | 半導体素子の樹脂封止金型及び半導体装置の製造方法 | |
| CA1201819A (en) | Electronic device method using a leadframe with an integral mold vent means | |
| JPH0788901A (ja) | 樹脂封止用金型 | |
| JP2675644B2 (ja) | 半導体装置用樹脂モールド金型装置 | |
| JP2973901B2 (ja) | 半導体樹脂封止用金型 | |
| JPH01123713A (ja) | モールド金型 | |
| JPH04132234A (ja) | 樹脂封止型半導体集積回路の樹脂封止装置 | |
| JPH058106Y2 (https=) | ||
| JPH05218122A (ja) | 樹脂封止型半導体装置の樹脂封止金型 | |
| KR100518911B1 (ko) | 몰딩금형의게이트구조 | |
| JP2812327B1 (ja) | 光半導体装置樹脂封止金型 | |
| JPH04249121A (ja) | 樹脂封止金型 | |
| JPH0536745A (ja) | 封止金型及び封止方法 | |
| JP2757706B2 (ja) | 半導体装置用樹脂封入金型 | |
| JPS5839868Y2 (ja) | 樹脂封止金型 | |
| JPH065644A (ja) | 樹脂封止型半導体装置の樹脂封止方法 | |
| JPH0289349A (ja) | Tab用フィルムキャリアテープ | |
| JPH07130784A (ja) | 半導体樹脂封止用金型 | |
| JPH10202687A (ja) | リリースフィルムを用いる樹脂モールド方法 | |
| JPH0453239A (ja) | 樹脂封止型半導体装置用のモールド金型 | |
| JPS59108323A (ja) | 半導体樹脂封止用金型 |