NL1008488C2 - Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. - Google Patents

Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. Download PDF

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Publication number
NL1008488C2
NL1008488C2 NL1008488A NL1008488A NL1008488C2 NL 1008488 C2 NL1008488 C2 NL 1008488C2 NL 1008488 A NL1008488 A NL 1008488A NL 1008488 A NL1008488 A NL 1008488A NL 1008488 C2 NL1008488 C2 NL 1008488C2
Authority
NL
Netherlands
Prior art keywords
mold
mold cavity
encapsulating material
elongated
mold part
Prior art date
Application number
NL1008488A
Other languages
English (en)
Dutch (nl)
Inventor
Hendrikus Johannes Bern Peters
Marcel Gerardus Anton Tomassen
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1008488A priority Critical patent/NL1008488C2/nl
Priority to DE69941923T priority patent/DE69941923D1/de
Priority to KR1020007009813A priority patent/KR100617654B1/ko
Priority to JP2000535044A priority patent/JP4628543B2/ja
Priority to US09/623,443 priority patent/US6428731B1/en
Priority to EP99909406A priority patent/EP1060507B1/en
Priority to EP09177224A priority patent/EP2161740A3/en
Priority to PCT/NL1999/000118 priority patent/WO1999045586A1/en
Priority to MYPI99000827A priority patent/MY123241A/en
Application granted granted Critical
Publication of NL1008488C2 publication Critical patent/NL1008488C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B29C2045/2714—Gates elongated, e.g. film-like, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
NL1008488A 1998-03-05 1998-03-05 Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. NL1008488C2 (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL1008488A NL1008488C2 (nl) 1998-03-05 1998-03-05 Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
DE69941923T DE69941923D1 (de) 1998-03-05 1999-03-04 Formteil, form und herstellungsverfahren zum umhüllen von elektronischen bauteilen auf einem träger
KR1020007009813A KR100617654B1 (ko) 1998-03-05 1999-03-04 캐리어에 장착된 전자 부품을 밀봉하기 위한 몰드 부품, 몰드 및 방법
JP2000535044A JP4628543B2 (ja) 1998-03-05 1999-03-04 モールド部材、モールドおよびキャリア上に配設された電子部品を封止する方法
US09/623,443 US6428731B1 (en) 1998-03-05 1999-03-04 Mould part, mould and method for encapsulating electronic components mounted on a carrier
EP99909406A EP1060507B1 (en) 1998-03-05 1999-03-04 Mould part, mould and method for encapsulating electronic components mounted on a carrier
EP09177224A EP2161740A3 (en) 1998-03-05 1999-03-04 Mould part, mould and method for encapsulating electronic components mounted on a carrier
PCT/NL1999/000118 WO1999045586A1 (en) 1998-03-05 1999-03-04 Mould part, mould and method for encapsulating electronic components mounted on a carrier
MYPI99000827A MY123241A (en) 1998-03-05 1999-03-05 Mould part, mould and method for encapsulating electronic components mounted on a carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1008488A NL1008488C2 (nl) 1998-03-05 1998-03-05 Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
NL1008488 1998-03-05

Publications (1)

Publication Number Publication Date
NL1008488C2 true NL1008488C2 (nl) 1999-09-07

Family

ID=19766666

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1008488A NL1008488C2 (nl) 1998-03-05 1998-03-05 Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.

Country Status (8)

Country Link
US (1) US6428731B1 (https=)
EP (2) EP2161740A3 (https=)
JP (1) JP4628543B2 (https=)
KR (1) KR100617654B1 (https=)
DE (1) DE69941923D1 (https=)
MY (1) MY123241A (https=)
NL (1) NL1008488C2 (https=)
WO (1) WO1999045586A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020043389A1 (en) * 2000-09-29 2002-04-18 Selvarajan Murugan Virtual gate design for thin packages
US6562272B1 (en) * 2000-12-05 2003-05-13 Cypress Semiconductor Corporation Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages
JP2006031336A (ja) * 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
GB2481974A (en) * 2010-07-12 2012-01-18 Biocomposites Ltd Bone cement pellet mould
DE102010038915A1 (de) * 2010-08-04 2012-02-09 Robert Bosch Gmbh Vorrichtung und Verfahren zum Herstellen von aus Kunststoff bestehenden Formteilen
CN103753756B (zh) * 2014-01-03 2016-08-17 铜陵中发三佳科技股份有限公司 一种用于led支架的emc封装装置
JP7134930B2 (ja) * 2019-08-21 2022-09-12 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244739A (ja) * 1988-08-05 1990-02-14 Hitachi Ltd 樹脂封止パッケージの成形方法
JPH0425035A (ja) * 1990-05-16 1992-01-28 Seiko Epson Corp 樹脂封止型半導体装置製造用金型並びにそれを用いた樹脂封止型半導体装置の製造方法
GB2293130A (en) * 1994-07-06 1996-03-20 Neu Dynamics Corp Encapsulation moulding
JPH0936151A (ja) * 1995-07-20 1997-02-07 Japan Aviation Electron Ind Ltd 小型樹脂モールド集積回路装置の製造方法およびこの方法により製造された集積回路装置

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Publication number Priority date Publication date Assignee Title
JPS5849170B2 (ja) * 1977-10-25 1983-11-02 旭化成株式会社 コ−トハンガ−型ゲ−トを有する射出成形用金型
US4513942A (en) * 1983-05-25 1985-04-30 Bourns, Inc. Plate molding apparatus with interlocking cavity plates
JPS60126841A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 樹脂封止用金型
JPS6353006A (ja) * 1986-08-22 1988-03-07 Hitachi Ltd 成形装置
JPH029142A (ja) * 1988-06-28 1990-01-12 Fujitsu Ltd 半導体装置の製造方法
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
JP2586831B2 (ja) * 1994-09-22 1997-03-05 日本電気株式会社 樹脂封止用金型および半導体装置の製造方法
EP0730937B1 (en) * 1994-11-21 1998-02-18 Apic Yamada Corporation A resin molding machine with release film
JP3246848B2 (ja) * 1995-02-22 2002-01-15 アピックヤマダ株式会社 汎用ゲート位置樹脂モールド装置および樹脂モールド方法
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
US6256873B1 (en) * 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244739A (ja) * 1988-08-05 1990-02-14 Hitachi Ltd 樹脂封止パッケージの成形方法
JPH0425035A (ja) * 1990-05-16 1992-01-28 Seiko Epson Corp 樹脂封止型半導体装置製造用金型並びにそれを用いた樹脂封止型半導体装置の製造方法
GB2293130A (en) * 1994-07-06 1996-03-20 Neu Dynamics Corp Encapsulation moulding
JPH0936151A (ja) * 1995-07-20 1997-02-07 Japan Aviation Electron Ind Ltd 小型樹脂モールド集積回路装置の製造方法およびこの方法により製造された集積回路装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 205 (E - 0921) 26 April 1990 (1990-04-26) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 188 (E - 1198) 7 May 1992 (1992-05-07) *
PATENT ABSTRACTS OF JAPAN vol. 097, no. 006 30 June 1997 (1997-06-30) *

Also Published As

Publication number Publication date
US6428731B1 (en) 2002-08-06
DE69941923D1 (de) 2010-03-04
WO1999045586A1 (en) 1999-09-10
EP1060507B1 (en) 2010-01-13
KR100617654B1 (ko) 2006-08-28
EP2161740A2 (en) 2010-03-10
JP2002506287A (ja) 2002-02-26
EP1060507A1 (en) 2000-12-20
EP2161740A3 (en) 2011-08-24
KR20010041616A (ko) 2001-05-25
JP4628543B2 (ja) 2011-02-09
MY123241A (en) 2006-05-31

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Effective date: 20131017

TD Modifications of names of proprietors of patents

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V1 Lapsed because of non-payment of the annual fee

Effective date: 20141001