DE69941923D1 - Formteil, form und herstellungsverfahren zum umhüllen von elektronischen bauteilen auf einem träger - Google Patents
Formteil, form und herstellungsverfahren zum umhüllen von elektronischen bauteilen auf einem trägerInfo
- Publication number
- DE69941923D1 DE69941923D1 DE69941923T DE69941923T DE69941923D1 DE 69941923 D1 DE69941923 D1 DE 69941923D1 DE 69941923 T DE69941923 T DE 69941923T DE 69941923 T DE69941923 T DE 69941923T DE 69941923 D1 DE69941923 D1 DE 69941923D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- support
- electronic components
- molding
- wrapping electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000465 moulding Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2714—Gates elongated, e.g. film-like, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1008488A NL1008488C2 (nl) | 1998-03-05 | 1998-03-05 | Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. |
PCT/NL1999/000118 WO1999045586A1 (en) | 1998-03-05 | 1999-03-04 | Mould part, mould and method for encapsulating electronic components mounted on a carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69941923D1 true DE69941923D1 (de) | 2010-03-04 |
Family
ID=19766666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69941923T Expired - Fee Related DE69941923D1 (de) | 1998-03-05 | 1999-03-04 | Formteil, form und herstellungsverfahren zum umhüllen von elektronischen bauteilen auf einem träger |
Country Status (8)
Country | Link |
---|---|
US (1) | US6428731B1 (de) |
EP (2) | EP1060507B1 (de) |
JP (1) | JP4628543B2 (de) |
KR (1) | KR100617654B1 (de) |
DE (1) | DE69941923D1 (de) |
MY (1) | MY123241A (de) |
NL (1) | NL1008488C2 (de) |
WO (1) | WO1999045586A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020043389A1 (en) * | 2000-09-29 | 2002-04-18 | Selvarajan Murugan | Virtual gate design for thin packages |
US6562272B1 (en) * | 2000-12-05 | 2003-05-13 | Cypress Semiconductor Corporation | Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages |
JP2006031336A (ja) * | 2004-07-15 | 2006-02-02 | Fujitsu Ltd | Rfidタグの製造方法 |
US20080057528A1 (en) * | 2006-08-30 | 2008-03-06 | Kimberly-Clark Worldwide, Inc. | Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte |
GB2481974A (en) * | 2010-07-12 | 2012-01-18 | Biocomposites Ltd | Bone cement pellet mould |
DE102010038915A1 (de) * | 2010-08-04 | 2012-02-09 | Robert Bosch Gmbh | Vorrichtung und Verfahren zum Herstellen von aus Kunststoff bestehenden Formteilen |
CN103753756B (zh) * | 2014-01-03 | 2016-08-17 | 铜陵中发三佳科技股份有限公司 | 一种用于led支架的emc封装装置 |
JP7134930B2 (ja) * | 2019-08-21 | 2022-09-12 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849170B2 (ja) * | 1977-10-25 | 1983-11-02 | 旭化成株式会社 | コ−トハンガ−型ゲ−トを有する射出成形用金型 |
US4513942A (en) * | 1983-05-25 | 1985-04-30 | Bourns, Inc. | Plate molding apparatus with interlocking cavity plates |
JPS60126841A (ja) * | 1983-12-14 | 1985-07-06 | Hitachi Ltd | 樹脂封止用金型 |
JPS6353006A (ja) * | 1986-08-22 | 1988-03-07 | Hitachi Ltd | 成形装置 |
JPH029142A (ja) * | 1988-06-28 | 1990-01-12 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2631520B2 (ja) * | 1988-08-05 | 1997-07-16 | 株式会社日立製作所 | 樹脂封止パッケージの成形方法 |
US5417905A (en) * | 1989-05-26 | 1995-05-23 | Esec (Far East) Limited | Method of making a card having decorations on both faces |
JP2855787B2 (ja) * | 1990-05-16 | 1999-02-10 | セイコーエプソン株式会社 | 樹脂封止型半導体装置製造用金型並びにそれを用いた樹脂封止型半導体装置の製造方法 |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
JP2586831B2 (ja) * | 1994-09-22 | 1997-03-05 | 日本電気株式会社 | 樹脂封止用金型および半導体装置の製造方法 |
EP0730937B1 (de) * | 1994-11-21 | 1998-02-18 | Apic Yamada Corporation | Harzformmaschine mit Trennfolie |
JP3246848B2 (ja) * | 1995-02-22 | 2002-01-15 | アピックヤマダ株式会社 | 汎用ゲート位置樹脂モールド装置および樹脂モールド方法 |
JPH0936151A (ja) * | 1995-07-20 | 1997-02-07 | Japan Aviation Electron Ind Ltd | 小型樹脂モールド集積回路装置の製造方法およびこの方法により製造された集積回路装置 |
US5698242A (en) * | 1995-12-20 | 1997-12-16 | General Instrument Corporation Of Delaware | Apparatus for the injection molding of semiconductor elements |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
US6256873B1 (en) * | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
-
1998
- 1998-03-05 NL NL1008488A patent/NL1008488C2/nl not_active IP Right Cessation
-
1999
- 1999-03-04 EP EP99909406A patent/EP1060507B1/de not_active Expired - Lifetime
- 1999-03-04 JP JP2000535044A patent/JP4628543B2/ja not_active Expired - Lifetime
- 1999-03-04 EP EP09177224A patent/EP2161740A3/de not_active Withdrawn
- 1999-03-04 WO PCT/NL1999/000118 patent/WO1999045586A1/en active IP Right Grant
- 1999-03-04 US US09/623,443 patent/US6428731B1/en not_active Expired - Fee Related
- 1999-03-04 DE DE69941923T patent/DE69941923D1/de not_active Expired - Fee Related
- 1999-03-04 KR KR1020007009813A patent/KR100617654B1/ko not_active IP Right Cessation
- 1999-03-05 MY MYPI99000827A patent/MY123241A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20010041616A (ko) | 2001-05-25 |
EP1060507A1 (de) | 2000-12-20 |
JP4628543B2 (ja) | 2011-02-09 |
EP2161740A2 (de) | 2010-03-10 |
JP2002506287A (ja) | 2002-02-26 |
MY123241A (en) | 2006-05-31 |
US6428731B1 (en) | 2002-08-06 |
KR100617654B1 (ko) | 2006-08-28 |
NL1008488C2 (nl) | 1999-09-07 |
EP2161740A3 (de) | 2011-08-24 |
WO1999045586A1 (en) | 1999-09-10 |
EP1060507B1 (de) | 2010-01-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69737877D1 (de) | Elektronisches Bauelement mit Kontaktanschlussdrähten versehen mit einem keramischen Hochtemperaturelement, und Verfahren zu dessen Herstellung | |
DE69813510D1 (de) | Spritzengussverfahren und gerät zum herstellen von gegenständen aus zwei komponenten | |
DE60031680D1 (de) | Mehrschichtige, gedruckte leiterplatte und herstellungsmethode für eine mehrschichtige, gedruckte leiterplatte | |
DE60030743D1 (de) | Herstellungsmethode für eine leiterplatte | |
DE69831586D1 (de) | Schaltung und verfahren zum konfigurieren und registrieren einer kryptografischen vorrichtung | |
FI971028A0 (fi) | Menetelmä kumiperustan valmistamiseksi | |
DE69934130D1 (de) | Gedruckte leiterplatte und verfahren zu ihrer herstellung | |
DE69839486D1 (de) | Gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69830623D1 (de) | Klebstoff zum verbinden von schaltelementen, leiterplatte und verfahren zur herstellung derselben | |
IL137035A0 (en) | Method and device for configuring a link | |
DE69841064D1 (de) | Widerstand und Herstellungsverfahren dafür | |
DE69910025D1 (de) | Verfahren zum Verpacken | |
DE69704140D1 (de) | Vorrichtung zum Entladen von Verpackungen aus einem Förderer | |
DE69822170D1 (de) | Vorrichtung zum umwickeln von artikeln | |
NO990290D0 (no) | Tungt antennelig plastbehandling og fremgangsmÕte til fremstilling av et fyllstoff | |
DE60006653D1 (de) | Vorrichtung und verfahren zum mehrschichtspritzgiessen | |
GB2379076B (en) | Method and apparatus for composing a song | |
DE50113866D1 (de) | Verfahren und Einrichtung zum Entwurf von auf eineGestricken | |
DE59906631D1 (de) | Vorrichtung zum Prüfen von Zigarettengruppen | |
DE69941923D1 (de) | Formteil, form und herstellungsverfahren zum umhüllen von elektronischen bauteilen auf einem träger | |
FI19992329A (fi) | Menetelmä tiedonsiirtoyhteyden ylläpitämiseksi | |
DE69907928D1 (de) | Verfahren, rechner und hergestellter gegenstand zum fehlertoleranten urladen | |
DE69529583D1 (de) | Formbrett und Herstellungsverfahren für eine Halbleiteranordnung | |
DE59903757D1 (de) | Verfahren zum verbinden, markieren und strukturellen verändern von monofilen | |
DE69809487D1 (de) | Vorrichtung und Verfahnren zum Schmelzblasen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |