JP2002359246A5 - - Google Patents
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- Publication number
- JP2002359246A5 JP2002359246A5 JP2002089262A JP2002089262A JP2002359246A5 JP 2002359246 A5 JP2002359246 A5 JP 2002359246A5 JP 2002089262 A JP2002089262 A JP 2002089262A JP 2002089262 A JP2002089262 A JP 2002089262A JP 2002359246 A5 JP2002359246 A5 JP 2002359246A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- width
- wiring
- manufacturing
- resist mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 12
- 238000000034 method Methods 0.000 claims 10
- 238000005530 etching Methods 0.000 claims 6
- 238000003475 lamination Methods 0.000 claims 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089262A JP4338934B2 (ja) | 2001-03-27 | 2002-03-27 | 配線の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-91192 | 2001-03-27 | ||
| JP2001091192 | 2001-03-27 | ||
| JP2002089262A JP4338934B2 (ja) | 2001-03-27 | 2002-03-27 | 配線の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008277827A Division JP5376709B2 (ja) | 2001-03-27 | 2008-10-29 | 半導体装置及びその作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002359246A JP2002359246A (ja) | 2002-12-13 |
| JP2002359246A5 true JP2002359246A5 (enrdf_load_stackoverflow) | 2005-09-08 |
| JP4338934B2 JP4338934B2 (ja) | 2009-10-07 |
Family
ID=26612251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002089262A Expired - Lifetime JP4338934B2 (ja) | 2001-03-27 | 2002-03-27 | 配線の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4338934B2 (enrdf_load_stackoverflow) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG116443A1 (en) * | 2001-03-27 | 2005-11-28 | Semiconductor Energy Lab | Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same. |
| US7183146B2 (en) | 2003-01-17 | 2007-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| US7405033B2 (en) | 2003-01-17 | 2008-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing resist pattern and method for manufacturing semiconductor device |
| KR20080106361A (ko) | 2003-02-05 | 2008-12-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 레지스트 패턴의 형성방법 및 반도체장치의 제조방법 |
| EP1592049A1 (en) | 2003-02-05 | 2005-11-02 | Sel Semiconductor Energy Laboratory Co., Ltd. | Process for manufacturing display |
| KR101069333B1 (ko) | 2003-02-05 | 2011-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치의 제조방법 |
| JP4748990B2 (ja) | 2003-02-06 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| CN100472731C (zh) | 2003-02-06 | 2009-03-25 | 株式会社半导体能源研究所 | 半导体制造装置 |
| WO2004070821A1 (ja) | 2003-02-06 | 2004-08-19 | Semiconductor Energy Laboratory Co., Ltd. | 表示装置の作製方法 |
| JP4869601B2 (ja) | 2003-03-26 | 2012-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
| US7061570B2 (en) | 2003-03-26 | 2006-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| JPWO2004096449A1 (ja) | 2003-04-25 | 2006-07-13 | 株式会社半導体エネルギー研究所 | 荷電ビームを用いた液滴吐出装置及び該装置を用いてのパターンの作製方法 |
| US7192859B2 (en) | 2003-05-16 | 2007-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device and display device |
| US7202155B2 (en) | 2003-08-15 | 2007-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing wiring and method for manufacturing semiconductor device |
| CN100568457C (zh) | 2003-10-02 | 2009-12-09 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
| WO2005041310A1 (en) | 2003-10-28 | 2005-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same, and television receiver |
| WO2005041280A1 (en) | 2003-10-28 | 2005-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| CN100464429C (zh) | 2003-10-28 | 2009-02-25 | 株式会社半导体能源研究所 | 液晶显示设备及其制造方法,以及液晶电视接收机 |
| US7439086B2 (en) | 2003-11-14 | 2008-10-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing liquid crystal display device |
| US8247965B2 (en) | 2003-11-14 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting display device and method for manufacturing the same |
| US20050170643A1 (en) | 2004-01-29 | 2005-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Forming method of contact hole, and manufacturing method of semiconductor device, liquid crystal display device and EL display device |
| US7416977B2 (en) | 2004-04-28 | 2008-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device, liquid crystal television, and EL television |
| US7494923B2 (en) | 2004-06-14 | 2009-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of wiring substrate and semiconductor device |
| US7859606B2 (en) | 2004-09-15 | 2010-12-28 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| JP4817946B2 (ja) * | 2005-04-15 | 2011-11-16 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US7888702B2 (en) | 2005-04-15 | 2011-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of the display device |
| KR100817746B1 (ko) | 2006-12-07 | 2008-03-31 | 한국전자통신연구원 | 다층 구조의 박막 트랜지스터 제조방법 및 상기 박막트랜지스터를 포함하는 능동 구동 표시 소자 |
| JP2011064751A (ja) * | 2009-09-15 | 2011-03-31 | Seiko Epson Corp | 導電膜積層部材、電気光学装置、電子機器 |
| JP6585354B2 (ja) * | 2014-03-07 | 2019-10-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102470044B1 (ko) * | 2016-05-13 | 2022-11-24 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 및 이의 제조 방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0945688A (ja) * | 1995-07-28 | 1997-02-14 | Sony Corp | 配線構造及びその形成方法 |
| JPH1116913A (ja) * | 1997-06-27 | 1999-01-22 | Sony Corp | 半導体装置及びその製造方法 |
| JP3883706B2 (ja) * | 1998-07-31 | 2007-02-21 | シャープ株式会社 | エッチング方法、及び薄膜トランジスタマトリックス基板の製造方法 |
| JP4159713B2 (ja) * | 1998-11-25 | 2008-10-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2001053283A (ja) * | 1999-08-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
-
2002
- 2002-03-27 JP JP2002089262A patent/JP4338934B2/ja not_active Expired - Lifetime
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