JP2002050939A - 圧電振動子 - Google Patents
圧電振動子Info
- Publication number
- JP2002050939A JP2002050939A JP2000235859A JP2000235859A JP2002050939A JP 2002050939 A JP2002050939 A JP 2002050939A JP 2000235859 A JP2000235859 A JP 2000235859A JP 2000235859 A JP2000235859 A JP 2000235859A JP 2002050939 A JP2002050939 A JP 2002050939A
- Authority
- JP
- Japan
- Prior art keywords
- film
- piezoelectric
- bonding
- piezoelectric vibrating
- reed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 6
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 6
- 229920001709 polysilazane Polymers 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 150000004703 alkoxides Chemical class 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 230000002452 interceptive effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000010453 quartz Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000235859A JP2002050939A (ja) | 2000-08-03 | 2000-08-03 | 圧電振動子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000235859A JP2002050939A (ja) | 2000-08-03 | 2000-08-03 | 圧電振動子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002050939A true JP2002050939A (ja) | 2002-02-15 |
| JP2002050939A5 JP2002050939A5 (https=) | 2005-05-19 |
Family
ID=18727999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000235859A Pending JP2002050939A (ja) | 2000-08-03 | 2000-08-03 | 圧電振動子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002050939A (https=) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303761A (ja) * | 2005-04-19 | 2006-11-02 | Seiko Instruments Inc | 表面実装型圧電発振器 |
| JP2007060484A (ja) * | 2005-08-26 | 2007-03-08 | Seiko Instruments Inc | 水晶振動子、発振器及び電子機器 |
| JP2007200982A (ja) * | 2006-01-24 | 2007-08-09 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
| JP2009200778A (ja) * | 2008-02-21 | 2009-09-03 | Seiko Instruments Inc | 圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計 |
| JP2009246613A (ja) * | 2008-03-31 | 2009-10-22 | Kyocera Kinseki Corp | 圧電デバイス |
| US7867807B2 (en) * | 2006-03-29 | 2011-01-11 | Hamamatsu Photonics K.K. | Method for manufacturing photoelectric converting device |
| JP2011066566A (ja) * | 2009-09-16 | 2011-03-31 | Nippon Dempa Kogyo Co Ltd | 圧電振動デバイス及び圧電振動デバイスの製造方法 |
| JP2011228319A (ja) * | 2010-04-15 | 2011-11-10 | Sumitomo Metal Electronics Devices Inc | 電子部品素子収納用パッケージ |
| JP2012009969A (ja) * | 2010-06-23 | 2012-01-12 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス及びその製造方法 |
| JP2012015363A (ja) * | 2010-07-01 | 2012-01-19 | Seiko Instruments Inc | 電子デバイス、電子機器及び電子デバイスの製造方法 |
| JP2012227268A (ja) * | 2011-04-18 | 2012-11-15 | Seiko Instruments Inc | ガラス封止型パッケージの製造方法、及び光学デバイス |
| JP2013191642A (ja) * | 2012-03-12 | 2013-09-26 | Mitsubishi Materials Corp | パワーモジュール及びその製造方法 |
| KR20220117210A (ko) * | 2019-12-19 | 2022-08-23 | 에베 그룹 에. 탈너 게엠베하 | 개별화된 캡슐화된 부품 및 이를 제조하는 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1032454A (ja) * | 1996-07-15 | 1998-02-03 | Olympus Optical Co Ltd | マイクロ圧電振動子 |
| JPH10297931A (ja) * | 1997-04-24 | 1998-11-10 | Matsushita Electric Ind Co Ltd | 複合圧電基板の製造方法 |
| JPH11145758A (ja) * | 1997-11-06 | 1999-05-28 | Seiko Epson Corp | 圧電素子およびその製造方法 |
| JP2000068780A (ja) * | 1998-08-21 | 2000-03-03 | Seiko Instruments Inc | 水晶振動子およびその製造方法 |
-
2000
- 2000-08-03 JP JP2000235859A patent/JP2002050939A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1032454A (ja) * | 1996-07-15 | 1998-02-03 | Olympus Optical Co Ltd | マイクロ圧電振動子 |
| JPH10297931A (ja) * | 1997-04-24 | 1998-11-10 | Matsushita Electric Ind Co Ltd | 複合圧電基板の製造方法 |
| JPH11145758A (ja) * | 1997-11-06 | 1999-05-28 | Seiko Epson Corp | 圧電素子およびその製造方法 |
| JP2000068780A (ja) * | 1998-08-21 | 2000-03-03 | Seiko Instruments Inc | 水晶振動子およびその製造方法 |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303761A (ja) * | 2005-04-19 | 2006-11-02 | Seiko Instruments Inc | 表面実装型圧電発振器 |
| JP2007060484A (ja) * | 2005-08-26 | 2007-03-08 | Seiko Instruments Inc | 水晶振動子、発振器及び電子機器 |
| JP2007200982A (ja) * | 2006-01-24 | 2007-08-09 | Fuji Electric Holdings Co Ltd | 半導体装置およびその製造方法 |
| US7867807B2 (en) * | 2006-03-29 | 2011-01-11 | Hamamatsu Photonics K.K. | Method for manufacturing photoelectric converting device |
| US8448311B2 (en) | 2008-02-21 | 2013-05-28 | Seiko Instruments Inc. | Method of manufacturing a piezoelectric vibrator |
| JP2009200778A (ja) * | 2008-02-21 | 2009-09-03 | Seiko Instruments Inc | 圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計 |
| JP2009246613A (ja) * | 2008-03-31 | 2009-10-22 | Kyocera Kinseki Corp | 圧電デバイス |
| JP2011066566A (ja) * | 2009-09-16 | 2011-03-31 | Nippon Dempa Kogyo Co Ltd | 圧電振動デバイス及び圧電振動デバイスの製造方法 |
| CN102025335A (zh) * | 2009-09-16 | 2011-04-20 | 日本电波工业株式会社 | 压电振动装置以及压电振动装置的制造方法 |
| CN102025335B (zh) * | 2009-09-16 | 2014-01-15 | 日本电波工业株式会社 | 压电振动装置以及压电振动装置的制造方法 |
| JP2011228319A (ja) * | 2010-04-15 | 2011-11-10 | Sumitomo Metal Electronics Devices Inc | 電子部品素子収納用パッケージ |
| US8729775B2 (en) | 2010-06-23 | 2014-05-20 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric vibrating devices and methods for manufacturing same |
| JP2012009969A (ja) * | 2010-06-23 | 2012-01-12 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス及びその製造方法 |
| JP2012015363A (ja) * | 2010-07-01 | 2012-01-19 | Seiko Instruments Inc | 電子デバイス、電子機器及び電子デバイスの製造方法 |
| JP2012227268A (ja) * | 2011-04-18 | 2012-11-15 | Seiko Instruments Inc | ガラス封止型パッケージの製造方法、及び光学デバイス |
| JP2013191642A (ja) * | 2012-03-12 | 2013-09-26 | Mitsubishi Materials Corp | パワーモジュール及びその製造方法 |
| KR20220117210A (ko) * | 2019-12-19 | 2022-08-23 | 에베 그룹 에. 탈너 게엠베하 | 개별화된 캡슐화된 부품 및 이를 제조하는 방법 |
| JP2023517414A (ja) * | 2019-12-19 | 2023-04-26 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | カプセル化されて個別化された構成要素およびカプセル化されて個別化された構成要素を製造する方法 |
| JP7529777B2 (ja) | 2019-12-19 | 2024-08-06 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | カプセル化されて個別化された構成要素およびカプセル化されて個別化された構成要素を製造する方法 |
| KR102764738B1 (ko) | 2019-12-19 | 2025-02-06 | 에베 그룹 에. 탈너 게엠베하 | 개별화된 캡슐화된 부품 및 이를 제조하는 방법 |
| US12283491B2 (en) | 2019-12-19 | 2025-04-22 | Ev Group E. Thallner Gmbh | Method for producing singulated encapsulated components |
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