JP2007200982A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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Abstract
【解決手段】放熱用金属ベース1に半田接合した絶縁基板2の導体パターンにパワー半導体素子3を半田マウントした構成になる半導体装置において、半導体素子3および半導体素子/絶縁基板,絶縁基板/金属ベース間の半田接合層4を包含して半導体素子の表面,および絶縁基板の外周面を、ポリシザランをコーティング剤として室温放置によりガラス転化させたガラスコート9,10で覆い、このガラスコートにより各部品の熱サイクルに伴う自由な熱変形を拘束して半田接合層4に発生する歪みを低減させるようにする。
【選択図】 図1
Description
半導体素子およびその半田接合層を包含して半導体素子/絶縁基板間の接合部表面に硬質なガラスコートを施し、部品間の半田接合部周域をガラスコートで封止するものとする(請求項1)。
(1)前記の半導体装置において、半導体素子の上面に金属製のヒートスプレッダ,ないしは該ヒートスプレッダを介して配線用のリードフレームを積層してその相互間を半田接合した上で、半導体素子と前記ヒートスプレッダ,リードフレームの一部およびその半田接合層を一括包含して、その接合部にガラスコートを施す(請求項2)。
(2)前記の半導体装置において、絶縁基板を放熱用金属ベース上に搭載して半田接合した上で、その半田接合層を包含して絶縁基板/金属ベースの接合部周面にガラスコートを施す(請求項3)。
(3)前記ガラスコートのコーティング剤がポリシザランで、そのガラスコート膜厚さを5〜20μm以下とする(請求項4)。
このガラスコートの線膨張係数(9pmm/℃)は、半導体素子(Si)の線膨張係数(3pmm/℃)と絶縁基板の導体パターン,ヒートスプレッダ,リードフレーム(Cu)の線膨張係数(16pmm/℃)の中間であり、このガラスコートで前記接合部品の周面を覆うことにより、ガラスコートがシェルとしてヒートサイクルに伴う半導体素子およびこれに半田接合した接合相手部材の自由な熱変形を拘束し、これにより半田接合層に発生する歪みを低減させてモジュールの長期信頼性が向上する。
2 絶縁基板
3 パワー半導体素子
4 半田接合層
5 ボンディングワイヤ
9,10 ガラスコート
11 ヒートスプレッダ
12 リードフレーム
Claims (6)
- 絶縁基板の表面に形成した導体パターンにパワー半導体素子を半田マウントした半導体装置において、
前記半導体素子およびその半田接合層を包含して半導体素子/絶縁基板の接合部表面にガラスコートを施したことを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、半導体素子の上面に金属製のヒートスプレッダ,ないしは該ヒートスプレッダを介して配線用のリードフレームを積層してその相互間を半田接合した上で、半導体素子と前記ヒートスプレッダ,リードフレームの一部およびその半田接合層を一括包含して、その接合部にガラスコートを施したことを特徴とする半導体装置。
- 請求項1または2に記載の半導体装置において、絶縁基板を放熱用金属ベース上に搭載して半田接合した上で、その半田接合層を包含して絶縁基板/金属ベースの接合部周面にガラスコートを施したことを特徴とする半導体装置。
- 請求項1ないし3のいずれかに記載の半導体装置において、ガラスコートのコーティング剤がポリシザランで、そのガラスコート膜厚を5〜20μmとしたことを特徴とする半導体装置。
- 請求項4に記載の半導体装置において、ポリシザランをスプレー法,ポッティング法,ディッピング法のいずれかの方法で半田接合部にコーティングした上で、室温放置によりガラス質に転化させることを特徴とする半導体装置の製造方法。
- 請求項5に記載の製造方法において、ディッピング法によるポリシザランのコーティング工程でコーティング剤原液に超音波振動を加えてコーティングを行うことを特徴とする半導体装置の製造方法。
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JP2006015083A JP5176276B2 (ja) | 2006-01-24 | 2006-01-24 | 半導体装置およびその製造方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194275A (ja) * | 2008-02-18 | 2009-08-27 | Sumitomo Electric Ind Ltd | 実装用組立構造および樹脂封止型半導体装置 |
JP2011124398A (ja) * | 2009-12-11 | 2011-06-23 | Hitachi Ltd | 接合構造及びその製造方法 |
JP2013191642A (ja) * | 2012-03-12 | 2013-09-26 | Mitsubishi Materials Corp | パワーモジュール及びその製造方法 |
WO2024095813A1 (ja) * | 2022-10-31 | 2024-05-10 | 日本発條株式会社 | 部品実装基板、部品実装基板の製造方法、電子モジュール、及び電子モジュールの製造方法 |
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JPH01181596A (ja) * | 1988-01-11 | 1989-07-19 | Nippon Denso Co Ltd | 混成集積回路装置及びその製造方法 |
JPH0585053U (ja) * | 1992-04-22 | 1993-11-16 | サンケン電気株式会社 | 抵抗素子を備えた電子部品 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009194275A (ja) * | 2008-02-18 | 2009-08-27 | Sumitomo Electric Ind Ltd | 実装用組立構造および樹脂封止型半導体装置 |
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TWI420632B (zh) * | 2009-12-11 | 2013-12-21 | Hitachi Ltd | A bonding structure and a manufacturing method thereof |
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