JP2001520118A5 - - Google Patents

Download PDF

Info

Publication number
JP2001520118A5
JP2001520118A5 JP2000516788A JP2000516788A JP2001520118A5 JP 2001520118 A5 JP2001520118 A5 JP 2001520118A5 JP 2000516788 A JP2000516788 A JP 2000516788A JP 2000516788 A JP2000516788 A JP 2000516788A JP 2001520118 A5 JP2001520118 A5 JP 2001520118A5
Authority
JP
Japan
Prior art keywords
stripping
cleaning composition
coated substrate
composition according
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000516788A
Other languages
English (en)
Japanese (ja)
Other versions
JP4554813B2 (ja
JP2001520118A (ja
Filing date
Publication date
Priority claimed from US08/951,424 external-priority patent/US5988186A/en
Application filed filed Critical
Publication of JP2001520118A publication Critical patent/JP2001520118A/ja
Publication of JP2001520118A5 publication Critical patent/JP2001520118A5/ja
Application granted granted Critical
Publication of JP4554813B2 publication Critical patent/JP4554813B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000516788A 1997-10-16 1998-10-13 水性剥離及び清浄用組成物 Expired - Lifetime JP4554813B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/951,424 US5988186A (en) 1991-01-25 1997-10-16 Aqueous stripping and cleaning compositions
US08/951,424 1997-10-16
PCT/US1998/021563 WO1999020408A1 (en) 1997-10-16 1998-10-13 Improvement in aqueous stripping and cleaning compositions

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009149844A Division JP2009256680A (ja) 1997-10-16 2009-06-24 水性剥離及び清浄用組成物

Publications (3)

Publication Number Publication Date
JP2001520118A JP2001520118A (ja) 2001-10-30
JP2001520118A5 true JP2001520118A5 (enExample) 2009-03-12
JP4554813B2 JP4554813B2 (ja) 2010-09-29

Family

ID=25491673

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000516788A Expired - Lifetime JP4554813B2 (ja) 1997-10-16 1998-10-13 水性剥離及び清浄用組成物
JP2009149844A Pending JP2009256680A (ja) 1997-10-16 2009-06-24 水性剥離及び清浄用組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009149844A Pending JP2009256680A (ja) 1997-10-16 2009-06-24 水性剥離及び清浄用組成物

Country Status (10)

Country Link
US (1) US5988186A (enExample)
EP (1) EP1023129B1 (enExample)
JP (2) JP4554813B2 (enExample)
KR (1) KR100541300B1 (enExample)
AT (1) ATE353034T1 (enExample)
AU (1) AU1081099A (enExample)
CA (1) CA2306954A1 (enExample)
DE (1) DE69837011T2 (enExample)
TW (1) TW460579B (enExample)
WO (1) WO1999020408A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268323B1 (en) * 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
KR100288769B1 (ko) * 1998-07-10 2001-09-17 윤종용 포토레지스트용스트리퍼조성물
KR100268108B1 (ko) * 1998-08-25 2000-12-01 윤종용 포토레지스트용 스트리퍼 조성물
US6337174B1 (en) * 1998-09-17 2002-01-08 Samsung Electronics Co., Ltd. Method of stripping a photoresist from a semiconductor substrate dimethylacetamide or a combination of monoethanolamine and dimethylsulfoxide
US6562726B1 (en) * 1999-06-29 2003-05-13 Micron Technology, Inc. Acid blend for removing etch residue
US6194366B1 (en) 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6723691B2 (en) 1999-11-16 2004-04-20 Advanced Technology Materials, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6531436B1 (en) * 2000-02-25 2003-03-11 Shipley Company, L.L.C. Polymer removal
KR100360985B1 (ko) * 2000-04-26 2002-11-18 주식회사 동진쎄미켐 레지스트 스트리퍼 조성물
KR100363271B1 (ko) * 2000-06-12 2002-12-05 주식회사 동진쎄미켐 포토레지스트 리무버 조성물
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
TWI275903B (en) * 2001-03-13 2007-03-11 Nagase Chemtex Corp A composition for stripping photo resist
US6652666B2 (en) * 2001-05-02 2003-11-25 Taiwan Semiconductor Manufacturing Co. Ltd Wet dip method for photoresist and polymer stripping without buffer treatment step
KR100554964B1 (ko) * 2001-09-07 2006-03-03 길준잉 포토레지스트 스트립핑 조성물 및 이를 사용한 패턴 형성방법
KR20030023204A (ko) * 2001-09-12 2003-03-19 삼성전자주식회사 포토레지스트용 스트리퍼 조성물
KR100438015B1 (ko) * 2001-10-10 2004-06-30 엘지.필립스 엘시디 주식회사 구리용 레지스트 제거용 조성물
EP1468335A4 (en) * 2002-01-11 2006-05-17 Az Electronic Materials Usa CLEANER COMPOSITION FOR A POSITIVE OR NEGATIVE PHOTOGRAPHIST
AU2003268622A1 (en) * 2002-09-06 2004-03-29 Basf Corporation Method of removing coatings from plastic articles
JP4282054B2 (ja) * 2002-09-09 2009-06-17 東京応化工業株式会社 デュアルダマシン構造形成プロセスに用いられる洗浄液および基板の処理方法
KR20040089429A (ko) * 2003-10-13 2004-10-21 주식회사 동진쎄미켐 포토레지스트 박리액 조성물
KR101136026B1 (ko) * 2004-09-24 2012-04-18 주식회사 동진쎄미켐 포토레지스트용 박리제 및 상기 박리제를 이용한 박막트랜지스터 표시판의 제조 방법
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
US20060148666A1 (en) * 2004-12-30 2006-07-06 Advanced Technology Materials Inc. Aqueous cleaner with low metal etch rate
TWI393178B (zh) * 2005-01-27 2013-04-11 Advanced Tech Materials 半導體基板處理用之組成物
US7923423B2 (en) * 2005-01-27 2011-04-12 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
KR100751919B1 (ko) * 2005-11-18 2007-08-31 램테크놀러지 주식회사 포토레지스트 제거용 조성물 및 이를 이용한 패턴 형성방법
TW200734448A (en) * 2006-02-03 2007-09-16 Advanced Tech Materials Low pH post-CMP residue removal composition and method of use
US8685909B2 (en) 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
US20080076688A1 (en) * 2006-09-21 2008-03-27 Barnes Jeffrey A Copper passivating post-chemical mechanical polishing cleaning composition and method of use
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
TWI338026B (en) * 2007-01-05 2011-03-01 Basf Electronic Materials Taiwan Ltd Composition and method for stripping organic coatings
TWI437093B (zh) * 2007-08-03 2014-05-11 Epoch Material Co Ltd 半導體銅製程用水相清洗組合物
EP2110462B8 (en) * 2008-04-19 2012-09-05 Cognis IP Management GmbH Compositions for degreasing metal surfaces
WO2010048139A2 (en) 2008-10-21 2010-04-29 Advanced Technology Materials, Inc. Copper cleaning and protection formulations
US8110535B2 (en) * 2009-08-05 2012-02-07 Air Products And Chemicals, Inc. Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
US8101561B2 (en) * 2009-11-17 2012-01-24 Wai Mun Lee Composition and method for treating semiconductor substrate surface
KR101668063B1 (ko) * 2013-05-07 2016-10-20 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 사용한 포토레지스트의 박리방법
JP6359276B2 (ja) * 2014-01-08 2018-07-18 東栄化成株式会社 剥離剤及び塗膜の剥離方法
CN105527803B (zh) * 2014-09-29 2020-08-18 安集微电子（上海）有限公司 一种光刻胶清洗液
US10073351B2 (en) * 2014-12-23 2018-09-11 Versum Materials Us, Llc Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
TWI861658B (zh) * 2022-12-30 2024-11-11 達興材料股份有限公司 清潔組合物、清洗方法和半導體製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395348A (en) * 1981-11-23 1983-07-26 Ekc Technology, Inc. Photoresist stripping composition and method
JPS59219743A (ja) * 1983-05-28 1984-12-11 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト現像液
DE3523088A1 (de) * 1985-06-28 1987-01-08 Hoechst Ag Verfahren zur vermeidung der korrosion metallischer werkstoffe
US4770713A (en) * 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
US5190723A (en) * 1988-02-25 1993-03-02 Ciba-Geigy Corporation Process for inhibiting corrosion
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5753601A (en) * 1991-01-25 1998-05-19 Ashland Inc Organic stripping composition
US5556482A (en) * 1991-01-25 1996-09-17 Ashland, Inc. Method of stripping photoresist with composition containing inhibitor
US5496491A (en) * 1991-01-25 1996-03-05 Ashland Oil Company Organic stripping composition
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US5419877A (en) * 1993-09-17 1995-05-30 General Atomics Acoustic barrier separator
US6326130B1 (en) * 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
JP3121185B2 (ja) * 1993-10-26 2000-12-25 東京応化工業株式会社 ポジ型レジスト用剥離液
US5419779A (en) * 1993-12-02 1995-05-30 Ashland Inc. Stripping with aqueous composition containing hydroxylamine and an alkanolamine
US5597420A (en) * 1995-01-17 1997-01-28 Ashland Inc. Stripping composition having monoethanolamine
US5563119A (en) * 1995-01-26 1996-10-08 Ashland Inc. Stripping compositions containing alkanolamine compounds
US5648324A (en) * 1996-01-23 1997-07-15 Ocg Microelectronic Materials, Inc. Photoresist stripping composition
US5665688A (en) * 1996-01-23 1997-09-09 Olin Microelectronics Chemicals, Inc. Photoresist stripping composition
US5709756A (en) * 1996-11-05 1998-01-20 Ashland Inc. Basic stripping and cleaning composition
US5698503A (en) * 1996-11-08 1997-12-16 Ashland Inc. Stripping and cleaning composition

Similar Documents

Publication Publication Date Title
JP2001520118A5 (enExample)
US4765844A (en) Solvents for photoresist removal
TWI275904B (en) Photoresist stripper composition, and exfoliation method of a photoresist using it
JP2001520118A (ja) 水性剥離及び清浄用組成物
JP2013501958A5 (enExample)
KR101734593B1 (ko) 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
KR102032321B1 (ko) 얼룩 발생 방지용 레지스트 박리액 조성물
WO1988006640A1 (en) Paint removing compositions
CN101750917A (zh) 用于光致抗蚀剂的剥离剂组合物及剥离光致抗蚀剂的方法
JP2012500421A (ja) Ｌｃｄを製造するためのフォトレジスト剥離組成物
JPH02267557A (ja) 表面からポリマー物質を洗除する液性洗浄組成物
CN101286017A (zh) 厚膜光刻胶清洗剂
CN102472984B (zh) 剥除铜或铜合金光阻的组成物
KR101082515B1 (ko) 포토레지스트 스트리퍼 조성물 및 이를 이용한 포토레지스트 박리방법
KR20130131796A (ko) Ｔｆｔ 제조용 레지스트 박리제 조성물 및 이를 이용한 ｔｆｔ의 제조방법
CN101794087B (zh) 用于光致抗蚀剂的剥离剂组合物及使用所述剥离剂组合物剥离光致抗蚀剂的方法
KR102757703B1 (ko) 레지스트 박리액 조성물, 및 디스플레이 장치용 플랫 패널의 제조방법 및 그에 의해 제조된 디스플레이 장치용 플랫 패널, 및 디스플레이 장치
JP2012514765A (ja) フォトレジストストリッパー組成物及びこれを利用したフォトレジストの剥離方法
JP2017155199A (ja) 水性塗膜剥離剤
JP4165208B2 (ja) レジスト剥離方法
JP4165209B2 (ja) レジスト剥離剤
JP4474776B2 (ja) レジスト剥離剤
KR20130139482A (ko) 레지스트 박리액 조성물
JP4442415B2 (ja) レジスト剥離剤
KR101543827B1 (ko) 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법