JP2001323224A5 - - Google Patents
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- Publication number
- JP2001323224A5 JP2001323224A5 JP2000144269A JP2000144269A JP2001323224A5 JP 2001323224 A5 JP2001323224 A5 JP 2001323224A5 JP 2000144269 A JP2000144269 A JP 2000144269A JP 2000144269 A JP2000144269 A JP 2000144269A JP 2001323224 A5 JP2001323224 A5 JP 2001323224A5
- Authority
- JP
- Japan
- Prior art keywords
- connection
- terminal
- adhesive composition
- circuit
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144269A JP4747396B2 (ja) | 2000-05-17 | 2000-05-17 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144269A JP4747396B2 (ja) | 2000-05-17 | 2000-05-17 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001323224A JP2001323224A (ja) | 2001-11-22 |
| JP2001323224A5 true JP2001323224A5 (https=) | 2009-12-03 |
| JP4747396B2 JP4747396B2 (ja) | 2011-08-17 |
Family
ID=18650947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000144269A Expired - Fee Related JP4747396B2 (ja) | 2000-05-17 | 2000-05-17 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4747396B2 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184487A (ja) | 2000-12-15 | 2002-06-28 | Sony Chem Corp | 異方性導電接着剤 |
| JP5111711B2 (ja) * | 2002-01-31 | 2013-01-09 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
| JP4844461B2 (ja) * | 2002-02-28 | 2011-12-28 | 日立化成工業株式会社 | 回路接続材料及びそれを用いた回路端子の接続構造 |
| JP4154919B2 (ja) * | 2002-02-28 | 2008-09-24 | 日立化成工業株式会社 | 回路接続材料及びそれを用いた回路端子の接続構造 |
| JP2005347273A (ja) * | 2005-06-06 | 2005-12-15 | Hitachi Chem Co Ltd | 熱架橋型回路接続材料及びそれを用いた回路板の製造方法 |
| US7579360B2 (en) | 2005-06-09 | 2009-08-25 | Bristol-Myers Squibb Company | Triazolopyridine 11-beta hydroxysteroid dehydrogenase type I inhibitors |
| JP5181220B2 (ja) * | 2007-04-19 | 2013-04-10 | 日立化成株式会社 | 回路接続用接着フィルム、接続構造体及びその製造方法 |
| JP2007317657A (ja) * | 2007-05-08 | 2007-12-06 | Hitachi Chem Co Ltd | 熱架橋型回路接続材料及びそれを用いた回路板の製造方法 |
| US8119658B2 (en) | 2007-10-01 | 2012-02-21 | Bristol-Myers Squibb Company | Triazolopyridine 11-beta hydroxysteroid dehydrogenase type I inhibitors |
| JP5126233B2 (ja) * | 2007-10-05 | 2013-01-23 | 日立化成工業株式会社 | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法、回路接続体及び接着剤組成物の硬化物 |
| KR101130377B1 (ko) * | 2007-10-18 | 2012-03-27 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체 |
| JP4572960B2 (ja) * | 2008-06-23 | 2010-11-04 | 日立化成工業株式会社 | 回路接続用異方導電性接着剤フィルム、それを用いた回路端子の接続方法及び回路端子の接続構造 |
| JP5668636B2 (ja) * | 2010-08-24 | 2015-02-12 | 日立化成株式会社 | 回路接続構造体の製造方法 |
| KR102092988B1 (ko) | 2012-09-28 | 2020-03-25 | 벤더르빌트 유니버시티 | 선택성 bmp 저해제로써 융합된 헤테로 고리 화합물들 |
| JP6301366B2 (ja) * | 2013-12-26 | 2018-03-28 | タツタ電線株式会社 | 電子部品接着材料及び電子部品の接着方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06293182A (ja) * | 1993-04-08 | 1994-10-21 | Nitto Denko Corp | 可逆性感熱記録媒体用組成物および可逆性感熱記録シート |
| JP3729584B2 (ja) * | 1996-12-26 | 2005-12-21 | 三井化学株式会社 | 半導体ウエハの裏面研削方法及びその方法に用いる粘着フィルム |
| JP4402750B2 (ja) * | 1997-09-18 | 2010-01-20 | 日立化成工業株式会社 | 回路電極の接続方法 |
| JP3885349B2 (ja) * | 1998-03-31 | 2007-02-21 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
| JP4794704B2 (ja) * | 1998-03-31 | 2011-10-19 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
| JP4794702B2 (ja) * | 1998-03-31 | 2011-10-19 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
-
2000
- 2000-05-17 JP JP2000144269A patent/JP4747396B2/ja not_active Expired - Fee Related
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