|
EP1187140A3
(en)
*
|
2000-09-05 |
2002-09-11 |
Matsushita Electric Industrial Co., Ltd. |
Method for driving semiconductor memory
|
|
JP3951773B2
(ja)
*
|
2002-03-28 |
2007-08-01 |
富士通株式会社 |
リーク電流遮断回路を有する半導体集積回路
|
|
US6735117B2
(en)
*
|
2002-07-01 |
2004-05-11 |
Honeywell International Inc. |
Hold-up power supply for flash memory
|
|
KR100469153B1
(ko)
|
2002-08-30 |
2005-02-02 |
주식회사 하이닉스반도체 |
강유전체 메모리 장치
|
|
JP2005101522A
(ja)
*
|
2003-08-21 |
2005-04-14 |
Matsushita Electric Ind Co Ltd |
半導体集積回路装置
|
|
JP2005115857A
(ja)
*
|
2003-10-10 |
2005-04-28 |
Sony Corp |
ファイル記憶装置
|
|
CN1942883A
(zh)
*
|
2004-05-25 |
2007-04-04 |
松下电器产业株式会社 |
半导体存储卡
|
|
JP4197678B2
(ja)
*
|
2004-12-24 |
2008-12-17 |
富士通マイクロエレクトロニクス株式会社 |
半導体装置
|
|
US7212431B2
(en)
*
|
2004-12-29 |
2007-05-01 |
Hynix Semiconductor Inc. |
Nonvolatile ferroelectric memory device and control method thereof
|
|
KR100665844B1
(ko)
*
|
2005-01-04 |
2007-01-09 |
삼성전자주식회사 |
강유전체 메모리 장치 및 그의 구동방법
|
|
US7589584B1
(en)
*
|
2005-04-01 |
2009-09-15 |
Altera Corporation |
Programmable voltage regulator with dynamic recovery circuits
|
|
JP4822828B2
(ja)
*
|
2005-12-13 |
2011-11-24 |
ルネサスエレクトロニクス株式会社 |
不揮発性記憶装置
|
|
JP2007251351A
(ja)
*
|
2006-03-14 |
2007-09-27 |
Renesas Technology Corp |
半導体装置
|
|
JP4996277B2
(ja)
|
2007-02-09 |
2012-08-08 |
株式会社東芝 |
半導体記憶システム
|
|
KR101071212B1
(ko)
*
|
2007-05-18 |
2011-10-10 |
후지쯔 세미컨덕터 가부시키가이샤 |
반도체 메모리
|
|
JP2009003991A
(ja)
*
|
2007-06-19 |
2009-01-08 |
Toshiba Corp |
半導体装置及び半導体メモリテスト装置
|
|
JP2009032324A
(ja)
*
|
2007-07-26 |
2009-02-12 |
Spansion Llc |
複数のメモリブロックを備える不揮発性記憶装置
|
|
CN101682325B
(zh)
*
|
2008-02-27 |
2013-06-05 |
松下电器产业株式会社 |
半导体集成电路以及包括该半导体集成电路的各种装置
|
|
US8031549B2
(en)
*
|
2008-09-19 |
2011-10-04 |
Freescale Semiconductor, Inc. |
Integrated circuit having boosted array voltage and method therefor
|
|
JP2010097633A
(ja)
*
|
2008-10-14 |
2010-04-30 |
Toshiba Corp |
半導体記憶装置
|
|
US8072237B1
(en)
*
|
2009-06-04 |
2011-12-06 |
Altera Corporation |
Computer-aided design tools and memory element power supply circuitry for selectively overdriving circuit blocks
|
|
JP4908560B2
(ja)
*
|
2009-08-31 |
2012-04-04 |
株式会社東芝 |
強誘電体メモリ及びメモリシステム
|
|
US8164964B2
(en)
*
|
2009-09-16 |
2012-04-24 |
Arm Limited |
Boosting voltage levels applied to an access control line when accessing storage cells in a memory
|
|
DE102010011749B4
(de)
|
2010-03-17 |
2018-05-03 |
Texas Instruments Deutschland Gmbh |
Elektronische Vorrichtung und Verfahren zur FRAM-Spannungsversorgungsverwaltung
|
|
US8120984B2
(en)
*
|
2010-03-23 |
2012-02-21 |
Ememory Technology Inc. |
High-voltage selecting circuit which can generate an output voltage without a voltage drop
|
|
US8437169B2
(en)
*
|
2010-12-20 |
2013-05-07 |
Texas Instruments Incorporated |
Fast response circuits and methods for FRAM power loss protection
|
|
JP2013077962A
(ja)
*
|
2011-09-30 |
2013-04-25 |
Renesas Electronics Corp |
論理回路、半導体集積回路
|
|
JP2013191262A
(ja)
*
|
2012-03-15 |
2013-09-26 |
Elpida Memory Inc |
半導体装置
|
|
US9444460B1
(en)
|
2013-11-22 |
2016-09-13 |
Altera Corporation |
Integrated circuits with programmable overdrive capabilities
|
|
JP6287609B2
(ja)
*
|
2014-06-11 |
2018-03-07 |
株式会社ソシオネクスト |
半導体装置及び半導体装置の設計方法
|
|
US10121534B1
(en)
|
2015-12-18 |
2018-11-06 |
Altera Corporation |
Integrated circuit with overdriven and underdriven pass gates
|
|
KR20180047835A
(ko)
*
|
2016-11-01 |
2018-05-10 |
에스케이하이닉스 주식회사 |
저항성 메모리 장치
|
|
JP6389937B1
(ja)
*
|
2017-08-29 |
2018-09-12 |
力晶科技股▲ふん▼有限公司 |
電源制御回路及び電源制御回路を備えた論理回路装置
|
|
US10229727B1
(en)
*
|
2018-03-13 |
2019-03-12 |
Micron Technology, Inc. |
Apparatus and method for controlling erasing data in ferroelectric memory cells
|
|
US10600468B2
(en)
*
|
2018-08-13 |
2020-03-24 |
Wuxi Petabyte Technologies Co, Ltd. |
Methods for operating ferroelectric memory cells each having multiple capacitors
|
|
US11476260B2
(en)
|
2019-02-27 |
2022-10-18 |
Kepler Computing Inc. |
High-density low voltage non-volatile memory with unidirectional plate-line and bit-line and pillar capacitor
|
|
US10847201B2
(en)
|
2019-02-27 |
2020-11-24 |
Kepler Computing Inc. |
High-density low voltage non-volatile differential memory bit-cell with shared plate line
|
|
US11527277B1
(en)
|
2021-06-04 |
2022-12-13 |
Kepler Computing Inc. |
High-density low voltage ferroelectric memory bit-cell
|
|
US11729991B1
(en)
|
2021-11-01 |
2023-08-15 |
Kepler Computing Inc. |
Common mode compensation for non-linear polar material based differential memory bit-cell
|
|
US11482270B1
(en)
|
2021-11-17 |
2022-10-25 |
Kepler Computing Inc. |
Pulsing scheme for a ferroelectric memory bit-cell to minimize read or write disturb effect and refresh logic
|
|
US12327581B2
(en)
*
|
2021-12-21 |
2025-06-10 |
Intel Corporation |
Embedded memory IC's with power supply droop circuitry coupled to ferroelectric capacitors
|
|
US12108609B1
(en)
|
2022-03-07 |
2024-10-01 |
Kepler Computing Inc. |
Memory bit-cell with stacked and folded planar capacitors
|
|
US12324163B1
(en)
|
2022-03-15 |
2025-06-03 |
Kepler Computing Inc. |
Planar capacitors with shared electrode and methods of fabrication
|
|
US20230395134A1
(en)
|
2022-06-03 |
2023-12-07 |
Kepler Computing Inc. |
Write disturb mitigation for non-linear polar material based multi-capacitor bit-cell
|
|
US12324162B1
(en)
|
2022-06-17 |
2025-06-03 |
Kepler Computing Inc. |
Stacked capacitors with shared electrodes and methods of fabrication
|
|
US12300297B1
(en)
|
2022-08-05 |
2025-05-13 |
Kepler Computing Inc. |
Memory array with buried or backside word-line
|
|
US12062584B1
(en)
|
2022-10-28 |
2024-08-13 |
Kepler Computing Inc. |
Iterative method of multilayer stack development for device applications
|
|
US11741428B1
(en)
|
2022-12-23 |
2023-08-29 |
Kepler Computing Inc. |
Iterative monetization of process development of non-linear polar material and devices
|
|
US12347476B1
(en)
|
2022-12-27 |
2025-07-01 |
Kepler Computing Inc. |
Apparatus and method to improve sensing noise margin in a non-linear polar material based bit-cell
|
|
US12334127B2
(en)
|
2023-01-30 |
2025-06-17 |
Kepler Computing Inc. |
Non-linear polar material based multi-capacitor high density bit-cell
|
|
US11765908B1
(en)
|
2023-02-10 |
2023-09-19 |
Kepler Computing Inc. |
Memory device fabrication through wafer bonding
|
|
US20240274651A1
(en)
|
2023-02-10 |
2024-08-15 |
Kepler Computing Inc. |
Method of forming stacked capacitors through wafer bonding
|