JP2001153621A - 外観検査装置 - Google Patents

外観検査装置

Info

Publication number
JP2001153621A
JP2001153621A JP34024199A JP34024199A JP2001153621A JP 2001153621 A JP2001153621 A JP 2001153621A JP 34024199 A JP34024199 A JP 34024199A JP 34024199 A JP34024199 A JP 34024199A JP 2001153621 A JP2001153621 A JP 2001153621A
Authority
JP
Japan
Prior art keywords
image
images
color
input
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP34024199A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001153621A5 (enExample
Inventor
Eiji Yonezawa
栄二 米澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidek Co Ltd
Original Assignee
Nidek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidek Co Ltd filed Critical Nidek Co Ltd
Priority to JP34024199A priority Critical patent/JP2001153621A/ja
Priority to DE60027113T priority patent/DE60027113T2/de
Priority to EP00126105A priority patent/EP1107012B1/en
Priority to US09/726,122 priority patent/US6801651B2/en
Publication of JP2001153621A publication Critical patent/JP2001153621A/ja
Publication of JP2001153621A5 publication Critical patent/JP2001153621A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8809—Adjustment for highlighting flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP34024199A 1999-11-30 1999-11-30 外観検査装置 Withdrawn JP2001153621A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP34024199A JP2001153621A (ja) 1999-11-30 1999-11-30 外観検査装置
DE60027113T DE60027113T2 (de) 1999-11-30 2000-11-29 Optische Prüfvorrichtung
EP00126105A EP1107012B1 (en) 1999-11-30 2000-11-29 Visual inspection apparatus
US09/726,122 US6801651B2 (en) 1999-11-30 2000-11-30 Visual inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34024199A JP2001153621A (ja) 1999-11-30 1999-11-30 外観検査装置

Publications (2)

Publication Number Publication Date
JP2001153621A true JP2001153621A (ja) 2001-06-08
JP2001153621A5 JP2001153621A5 (enExample) 2006-12-14

Family

ID=18335057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34024199A Withdrawn JP2001153621A (ja) 1999-11-30 1999-11-30 外観検査装置

Country Status (4)

Country Link
US (1) US6801651B2 (enExample)
EP (1) EP1107012B1 (enExample)
JP (1) JP2001153621A (enExample)
DE (1) DE60027113T2 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205983A (ja) * 2007-02-22 2008-09-04 Meidensha Corp 画像処理装置
JP2011521256A (ja) * 2008-05-19 2011-07-21 ペムトロンカンパニーリミテッド 表面形状測定装置
JP2011226947A (ja) * 2010-04-21 2011-11-10 Graduate School For The Creation Of New Photonics Industries 分光イメージング装置及び分光イメージング方法
US8768053B2 (en) 2008-10-17 2014-07-01 Samsung Electronics Co., Ltd. Image processing apparatus and method of providing high sensitive color images
CN103900973A (zh) * 2014-04-24 2014-07-02 黄晓鹏 危险品检测装置和检测方法
JP2019084393A (ja) * 2017-03-14 2019-06-06 株式会社トプコン 涙液層厚み測定装置及び方法
JP2019084391A (ja) * 2017-03-14 2019-06-06 株式会社トプコン 涙液層厚み測定装置及び方法
JP2021009086A (ja) * 2019-07-02 2021-01-28 第一実業ビスウィル株式会社 外観検査装置
JP2024178273A (ja) * 2019-07-26 2024-12-24 株式会社Fuji 対基板作業システム

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10157244B4 (de) * 2001-11-22 2006-05-04 Leica Microsystems Semiconductor Gmbh Verfahren und Vorrichtung zur Defektanalyse von Wafern
DE10330003B4 (de) 2003-07-03 2007-03-08 Leica Microsystems Semiconductor Gmbh Vorrichtung, Verfahren und Computerprogramm zur Wafer-Inspektion
ATE407369T1 (de) * 2004-12-29 2008-09-15 Emedstream S R L Verfahren und system zur verarbeitung digitaler ultraschall-bildsequenzen
EP1846890A2 (en) * 2005-01-26 2007-10-24 Vu Medisch Centrum Imaging apparatus and method of forming composite image from a plurality of source images
CN102566327B (zh) * 2010-12-08 2016-06-08 无锡华润上华科技有限公司 显影均匀性调试方法
US9939386B2 (en) 2012-04-12 2018-04-10 KLA—Tencor Corporation Systems and methods for sample inspection and review
EP3232211B1 (en) * 2014-12-08 2025-03-26 Koh Young Technology Inc. Method for inspecting terminal of component formed on substrate and substrate inspection apparatus
JP6834174B2 (ja) * 2016-05-13 2021-02-24 株式会社ジェイテクト 外観検査方法および外観検査装置
JP6859627B2 (ja) * 2016-08-09 2021-04-14 株式会社ジェイテクト 外観検査装置
JP6859628B2 (ja) 2016-08-10 2021-04-14 株式会社ジェイテクト 外観検査方法および外観検査装置
WO2018047239A1 (ja) * 2016-09-06 2018-03-15 オリンパス株式会社 観察装置
CN107340294A (zh) * 2016-12-24 2017-11-10 重庆都英科技有限公司 一种电机换向器自动化视觉检测系统
US11475636B2 (en) * 2017-10-31 2022-10-18 Vmware, Inc. Augmented reality and virtual reality engine for virtual desktop infrastucture
US10621768B2 (en) 2018-01-09 2020-04-14 Vmware, Inc. Augmented reality and virtual reality engine at the object level for virtual desktop infrastucture
JP7132046B2 (ja) * 2018-09-13 2022-09-06 株式会社東芝 検索装置、検索方法及びプログラム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071776B2 (ja) * 1983-11-25 1995-01-11 株式会社日立製作所 パターン検査装置
JPS6244609A (ja) * 1985-08-23 1987-02-26 Hitachi Ltd 検査方法
DE3751233T2 (de) * 1986-10-31 1995-08-24 Seiko Epson Corp Anzeigevorrichtung vom Projektionstyp.
JPH0499346A (ja) * 1990-08-17 1992-03-31 Nec Corp ウェーハ外観検査装置
JPH06167460A (ja) * 1992-05-29 1994-06-14 Omron Corp 検査装置
US5923430A (en) * 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
JPH09508476A (ja) * 1994-01-31 1997-08-26 エス・ディー・エル・インコーポレイテッド レーザ照明ディスプレイシステム
JPH08102957A (ja) * 1994-09-30 1996-04-16 Hitachi Denshi Ltd 電子内視鏡装置
US5726443A (en) * 1996-01-18 1998-03-10 Chapman Glenn H Vision system and proximity detector
JP3657345B2 (ja) * 1996-04-25 2005-06-08 オリンパス株式会社 膜厚検査装置
JPH1183455A (ja) 1997-09-04 1999-03-26 Dainippon Printing Co Ltd 外観検査装置
EP0930498A3 (en) 1997-12-26 1999-11-17 Nidek Co., Ltd. Inspection apparatus and method for detecting defects
JP2001343336A (ja) * 2000-05-31 2001-12-14 Nidek Co Ltd 欠陥検査方法及び欠陥検査装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205983A (ja) * 2007-02-22 2008-09-04 Meidensha Corp 画像処理装置
JP2011521256A (ja) * 2008-05-19 2011-07-21 ペムトロンカンパニーリミテッド 表面形状測定装置
US8768053B2 (en) 2008-10-17 2014-07-01 Samsung Electronics Co., Ltd. Image processing apparatus and method of providing high sensitive color images
US9025871B2 (en) 2008-10-17 2015-05-05 Samsung Electronics Co., Ltd. Image processing apparatus and method of providing high sensitive color images
JP2011226947A (ja) * 2010-04-21 2011-11-10 Graduate School For The Creation Of New Photonics Industries 分光イメージング装置及び分光イメージング方法
CN103900973A (zh) * 2014-04-24 2014-07-02 黄晓鹏 危险品检测装置和检测方法
CN103900973B (zh) * 2014-04-24 2017-01-04 黄晓鹏 危险品检测方法
JP2019084392A (ja) * 2017-03-14 2019-06-06 株式会社トプコン 涙液層厚み測定装置及び方法
JP2019084393A (ja) * 2017-03-14 2019-06-06 株式会社トプコン 涙液層厚み測定装置及び方法
JP2019084391A (ja) * 2017-03-14 2019-06-06 株式会社トプコン 涙液層厚み測定装置及び方法
JP7069072B2 (ja) 2017-03-14 2022-05-17 株式会社トプコン 涙液層厚み測定装置及び方法
JP7069073B2 (ja) 2017-03-14 2022-05-17 株式会社トプコン 涙液層厚み測定装置及び方法
JP2021009086A (ja) * 2019-07-02 2021-01-28 第一実業ビスウィル株式会社 外観検査装置
JP7315282B2 (ja) 2019-07-02 2023-07-26 第一実業ビスウィル株式会社 外観検査装置
JP2024178273A (ja) * 2019-07-26 2024-12-24 株式会社Fuji 対基板作業システム
JP7705995B2 (ja) 2019-07-26 2025-07-10 株式会社Fuji 対基板作業システム

Also Published As

Publication number Publication date
EP1107012A1 (en) 2001-06-13
US6801651B2 (en) 2004-10-05
DE60027113T2 (de) 2006-09-07
US20010012393A1 (en) 2001-08-09
EP1107012B1 (en) 2006-04-05
DE60027113D1 (de) 2006-05-18

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