JP2001038614A5 - - Google Patents

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Publication number
JP2001038614A5
JP2001038614A5 JP1999211198A JP21119899A JP2001038614A5 JP 2001038614 A5 JP2001038614 A5 JP 2001038614A5 JP 1999211198 A JP1999211198 A JP 1999211198A JP 21119899 A JP21119899 A JP 21119899A JP 2001038614 A5 JP2001038614 A5 JP 2001038614A5
Authority
JP
Japan
Prior art keywords
cleaning
polished
polishing
semiconductor substrate
film thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999211198A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001038614A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP21119899A priority Critical patent/JP2001038614A/ja
Priority claimed from JP21119899A external-priority patent/JP2001038614A/ja
Priority to EP00116023A priority patent/EP1072359B1/en
Priority to DE60027510T priority patent/DE60027510T2/de
Priority to US09/626,124 priority patent/US6409576B1/en
Publication of JP2001038614A publication Critical patent/JP2001038614A/ja
Publication of JP2001038614A5 publication Critical patent/JP2001038614A5/ja
Pending legal-status Critical Current

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JP21119899A 1999-07-26 1999-07-26 研磨装置 Pending JP2001038614A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP21119899A JP2001038614A (ja) 1999-07-26 1999-07-26 研磨装置
EP00116023A EP1072359B1 (en) 1999-07-26 2000-07-26 Semiconductor wafer polishing apparatus
DE60027510T DE60027510T2 (de) 1999-07-26 2000-07-26 Halbleiterscheibe Poliervorrichtung
US09/626,124 US6409576B1 (en) 1999-07-26 2000-07-26 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21119899A JP2001038614A (ja) 1999-07-26 1999-07-26 研磨装置

Publications (2)

Publication Number Publication Date
JP2001038614A JP2001038614A (ja) 2001-02-13
JP2001038614A5 true JP2001038614A5 (enExample) 2004-12-24

Family

ID=16602004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21119899A Pending JP2001038614A (ja) 1999-07-26 1999-07-26 研磨装置

Country Status (4)

Country Link
US (1) US6409576B1 (enExample)
EP (1) EP1072359B1 (enExample)
JP (1) JP2001038614A (enExample)
DE (1) DE60027510T2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020023715A1 (en) * 2000-05-26 2002-02-28 Norio Kimura Substrate polishing apparatus and substrate polishing mehod
DE10053410C1 (de) * 2000-10-27 2002-04-04 Haertl Erwin Schleifanlage und Verfahren zum differenzierten Schleifen einer mit einem leitfähigem Material beschichteten Platte für Leiterplatinen
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
JP2002251079A (ja) * 2001-02-26 2002-09-06 Canon Inc 画像形成装置及び回転体速度検出装置
US7204743B2 (en) * 2001-02-27 2007-04-17 Novellus Systems, Inc. Integrated circuit interconnect fabrication systems
TWI222154B (en) * 2001-02-27 2004-10-11 Asm Nutool Inc Integrated system for processing semiconductor wafers
US20040259348A1 (en) * 2001-02-27 2004-12-23 Basol Bulent M. Method of reducing post-CMP defectivity
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
KR100734669B1 (ko) * 2003-08-08 2007-07-02 동부일렉트로닉스 주식회사 반도체 소자의 제조 방법 및 그 장치
US7030603B2 (en) * 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
JP4464642B2 (ja) 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
JP4511591B2 (ja) * 2004-09-28 2010-07-28 株式会社荏原製作所 基板洗浄装置及び洗浄部材の交換時期判定方法
JP5093651B2 (ja) * 2007-06-12 2012-12-12 株式会社ニコン 作業情報管理システム
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
CN102485424B (zh) * 2010-12-03 2015-01-21 中芯国际集成电路制造(北京)有限公司 抛光装置及其异常处理方法
JP6265702B2 (ja) * 2012-12-06 2018-01-24 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
JP6007889B2 (ja) * 2013-12-03 2016-10-19 信越半導体株式会社 面取り加工装置及びノッチレスウェーハの製造方法
JP6423600B2 (ja) 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
JP6560572B2 (ja) * 2015-09-14 2019-08-14 株式会社荏原製作所 反転機および基板研磨装置
JP6792512B2 (ja) * 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
CN110459497B (zh) * 2018-05-08 2022-04-22 北京北方华创微电子装备有限公司 晶圆预定位方法
JP2024525321A (ja) * 2021-06-15 2024-07-12 アクス テクノロジー エルエルシー 化学機械平坦化（ＣＭＰ）プロセスのｉｎ－ｓｉｔｕモニタリング方法及び装置
CN119546419A (zh) * 2022-07-14 2025-02-28 应用材料公司 监测面朝上抛光的厚度

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JPH1076464A (ja) * 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit

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