JPH11219930A5 - - Google Patents

Info

Publication number
JPH11219930A5
JPH11219930A5 JP1998034347A JP3434798A JPH11219930A5 JP H11219930 A5 JPH11219930 A5 JP H11219930A5 JP 1998034347 A JP1998034347 A JP 1998034347A JP 3434798 A JP3434798 A JP 3434798A JP H11219930 A5 JPH11219930 A5 JP H11219930A5
Authority
JP
Japan
Prior art keywords
semiconductor wafer
sensor
reference position
rotating
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998034347A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11219930A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10034347A priority Critical patent/JPH11219930A/ja
Priority claimed from JP10034347A external-priority patent/JPH11219930A/ja
Priority to US09/238,612 priority patent/US6439962B1/en
Publication of JPH11219930A publication Critical patent/JPH11219930A/ja
Publication of JPH11219930A5 publication Critical patent/JPH11219930A5/ja
Pending legal-status Critical Current

Links

JP10034347A 1998-01-30 1998-01-30 洗浄装置 Pending JPH11219930A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10034347A JPH11219930A (ja) 1998-01-30 1998-01-30 洗浄装置
US09/238,612 US6439962B1 (en) 1998-01-30 1999-01-28 Cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10034347A JPH11219930A (ja) 1998-01-30 1998-01-30 洗浄装置

Publications (2)

Publication Number Publication Date
JPH11219930A JPH11219930A (ja) 1999-08-10
JPH11219930A5 true JPH11219930A5 (enExample) 2005-07-21

Family

ID=12411618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10034347A Pending JPH11219930A (ja) 1998-01-30 1998-01-30 洗浄装置

Country Status (2)

Country Link
US (1) US6439962B1 (enExample)
JP (1) JPH11219930A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6293855B1 (en) * 1998-03-09 2001-09-25 Ebara Corporation Polishing apparatus
JP2002219645A (ja) * 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2002353183A (ja) * 2001-05-28 2002-12-06 Nisso Engineering Co Ltd ウエハ洗浄装置
JP4620911B2 (ja) * 2001-09-05 2011-01-26 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4773650B2 (ja) * 2001-09-25 2011-09-14 株式会社岡本工作機械製作所 ウエハのスピン洗浄・乾燥方法および洗浄・乾燥装置
JP2003133274A (ja) * 2001-10-22 2003-05-09 Ebara Corp 研磨装置
US7090560B2 (en) * 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060247803A1 (en) * 2005-03-29 2006-11-02 Kazushi Mori Control system, control method, process system, and computer readable storage medium and computer program
DE102005027721A1 (de) * 2005-06-16 2007-01-04 Dürr Ecoclean GmbH Reinigungsvorrichtung und Verfahren zum Reinigen von Werkstücken
JP4522329B2 (ja) * 2005-06-24 2010-08-11 株式会社Sokudo 基板処理装置
JP5132108B2 (ja) 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4730127B2 (ja) * 2006-02-22 2011-07-20 日産自動車株式会社 車両用ブレーキ装置
KR100786627B1 (ko) 2006-07-24 2007-12-21 두산메카텍 주식회사 웨이퍼의 회전 감지장치
KR100733264B1 (ko) 2006-08-07 2007-06-28 동부일렉트로닉스 주식회사 반도체 소자의 제조 방법
JP2008270753A (ja) * 2007-03-09 2008-11-06 Applied Materials Inc クリーニング時における基板の回転のモニタ方法及び装置
KR101004432B1 (ko) * 2008-06-10 2010-12-28 세메스 주식회사 매엽식 기판 처리 장치
KR101170760B1 (ko) * 2009-07-24 2012-08-03 세메스 주식회사 기판 연마 장치
US20110296634A1 (en) * 2010-06-02 2011-12-08 Jingdong Jia Wafer side edge cleaning apparatus
US9781994B2 (en) * 2012-12-07 2017-10-10 Taiwan Semiconductor Manufacturing Company Limited Wafer cleaning
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
US9700988B2 (en) 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
CN105789075B (zh) * 2014-12-16 2019-02-19 北京北方华创微电子装备有限公司 基座旋转是否正常的监测方法及装卸载基片的方法
JP6491903B2 (ja) * 2015-02-19 2019-03-27 株式会社荏原製作所 基板洗浄装置および方法
US10096460B2 (en) 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US11600484B2 (en) * 2019-08-22 2023-03-07 Taiwan Semiconductor Manufacturing Company Ltd. Cleaning method, semiconductor manufacturing method and a system thereof
CN111389772A (zh) * 2020-03-24 2020-07-10 长江存储科技有限责任公司 清洗装置及清洗方法
CN112388449A (zh) * 2020-11-16 2021-02-23 株洲华信精密工业股份有限公司 一种用于机械配件加工的打磨装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4197679A (en) * 1977-04-15 1980-04-15 Ito & Okamoto, Esq. Method for controlling the rotational speed of a rotary body
JPS6080241A (ja) 1983-10-07 1985-05-08 Hitachi Ltd 位置合せ装置
KR920001715Y1 (ko) * 1989-07-12 1992-03-13 박경 판유리 변형 면취기의 회전테이블의 회전속도 자동조절장치
US5518542A (en) * 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
US5468302A (en) * 1994-07-13 1995-11-21 Thietje; Jerry Semiconductor wafer cleaning system
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
JPH08267347A (ja) * 1995-03-31 1996-10-15 Shin Etsu Handotai Co Ltd オリエンテーション・フラットを有するウエーハ面取り部の鏡面研磨方法とその装置
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer

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