JP2001345292A5 - - Google Patents

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Publication number
JP2001345292A5
JP2001345292A5 JP2000166682A JP2000166682A JP2001345292A5 JP 2001345292 A5 JP2001345292 A5 JP 2001345292A5 JP 2000166682 A JP2000166682 A JP 2000166682A JP 2000166682 A JP2000166682 A JP 2000166682A JP 2001345292 A5 JP2001345292 A5 JP 2001345292A5
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JP
Japan
Prior art keywords
polishing
layer
semiconductor wafer
turntable
barrier metal
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Application number
JP2000166682A
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English (en)
Japanese (ja)
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JP3916375B2 (ja
JP2001345292A (ja
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Priority to JP2000166682A priority Critical patent/JP3916375B2/ja
Priority claimed from JP2000166682A external-priority patent/JP3916375B2/ja
Priority to US09/870,479 priority patent/US6663469B2/en
Publication of JP2001345292A publication Critical patent/JP2001345292A/ja
Publication of JP2001345292A5 publication Critical patent/JP2001345292A5/ja
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Publication of JP3916375B2 publication Critical patent/JP3916375B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000166682A 2000-06-02 2000-06-02 ポリッシング方法および装置 Expired - Lifetime JP3916375B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000166682A JP3916375B2 (ja) 2000-06-02 2000-06-02 ポリッシング方法および装置
US09/870,479 US6663469B2 (en) 2000-06-02 2001-06-01 Polishing method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000166682A JP3916375B2 (ja) 2000-06-02 2000-06-02 ポリッシング方法および装置

Publications (3)

Publication Number Publication Date
JP2001345292A JP2001345292A (ja) 2001-12-14
JP2001345292A5 true JP2001345292A5 (enExample) 2005-07-14
JP3916375B2 JP3916375B2 (ja) 2007-05-16

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Family Applications (1)

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JP2000166682A Expired - Lifetime JP3916375B2 (ja) 2000-06-02 2000-06-02 ポリッシング方法および装置

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US (1) US6663469B2 (enExample)
JP (1) JP3916375B2 (enExample)

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JP6635088B2 (ja) * 2017-04-24 2020-01-22 信越半導体株式会社 シリコンウエーハの研磨方法
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TWI828706B (zh) 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
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