|
DE19736350C1
(de)
*
|
1997-08-21 |
1999-08-05 |
Atotech Deutschland Gmbh |
Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
|
|
US6946065B1
(en)
*
|
1998-10-26 |
2005-09-20 |
Novellus Systems, Inc. |
Process for electroplating metal into microscopic recessed features
|
|
US6793796B2
(en)
|
1998-10-26 |
2004-09-21 |
Novellus Systems, Inc. |
Electroplating process for avoiding defects in metal features of integrated circuit devices
|
|
ATE282248T1
(de)
*
|
1999-01-21 |
2004-11-15 |
Atotech Deutschland Gmbh |
Verfahren zum galvanischen bilden von leiterstrukturen aus hochreinem kupfer bei der herstellung von integrierten schaltungen
|
|
DE19915146C1
(de)
*
|
1999-01-21 |
2000-07-06 |
Atotech Deutschland Gmbh |
Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
|
|
DE19925373B4
(de)
*
|
1999-06-02 |
2006-04-06 |
Robert Bosch Gmbh |
Verfahren und Vorrichtung zum Galvanisieren
|
|
US20040045832A1
(en)
*
|
1999-10-14 |
2004-03-11 |
Nicholas Martyak |
Electrolytic copper plating solutions
|
|
US6294060B1
(en)
|
1999-10-21 |
2001-09-25 |
Ati Properties, Inc. |
Conveyorized electroplating device
|
|
JP2001267726A
(ja)
*
|
2000-03-22 |
2001-09-28 |
Toyota Autom Loom Works Ltd |
配線基板の電解メッキ方法及び配線基板の電解メッキ装置
|
|
US6491806B1
(en)
|
2000-04-27 |
2002-12-10 |
Intel Corporation |
Electroplating bath composition
|
|
NL1015348C2
(nl)
*
|
2000-05-31 |
2001-12-03 |
D R P P B V Dutch Reverse Puls |
Methode ter verbetering van electrolytische metaal neerslagverdeling op een substraat met behulp van Periodic Reversal Current waarbij gebruik wordt gemaakt van Oplosbare-, Inerte- en Hybride Anoden.
|
|
DE10061186C1
(de)
*
|
2000-12-07 |
2002-01-17 |
Astrium Gmbh |
Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens
|
|
US20040060728A1
(en)
*
|
2001-01-04 |
2004-04-01 |
Philippe Steiert |
Method for producing electroconductive structures
|
|
JP2002235189A
(ja)
*
|
2001-02-05 |
2002-08-23 |
Sansha Electric Mfg Co Ltd |
めっき電流供給電源装置
|
|
US6620303B2
(en)
*
|
2001-05-21 |
2003-09-16 |
Hong Kong Polytechnic University |
Process for making nickel electroforms
|
|
US6881318B2
(en)
*
|
2001-07-26 |
2005-04-19 |
Applied Materials, Inc. |
Dynamic pulse plating for high aspect ratio features
|
|
WO2003033775A1
(en)
*
|
2001-10-16 |
2003-04-24 |
Shinko Electric Industries Co., Ltd. |
Method of copper-plating small-diameter holes
|
|
JP2003183879A
(ja)
*
|
2001-12-18 |
2003-07-03 |
Learonal Japan Inc |
電解めっき方法
|
|
US6919011B2
(en)
*
|
2001-12-27 |
2005-07-19 |
The Hong Kong Polytechnic University |
Complex waveform electroplating
|
|
US7077945B2
(en)
*
|
2002-03-01 |
2006-07-18 |
Northwest Aluminum Technologies |
Cu—Ni—Fe anode for use in aluminum producing electrolytic cell
|
|
US6558525B1
(en)
|
2002-03-01 |
2003-05-06 |
Northwest Aluminum Technologies |
Anode for use in aluminum producing electrolytic cell
|
|
JP3964263B2
(ja)
*
|
2002-05-17 |
2007-08-22 |
株式会社デンソー |
ブラインドビアホール充填方法及び貫通電極形成方法
|
|
US7247222B2
(en)
*
|
2002-07-24 |
2007-07-24 |
Applied Materials, Inc. |
Electrochemical processing cell
|
|
US7128823B2
(en)
*
|
2002-07-24 |
2006-10-31 |
Applied Materials, Inc. |
Anolyte for copper plating
|
|
US7223323B2
(en)
|
2002-07-24 |
2007-05-29 |
Applied Materials, Inc. |
Multi-chemistry plating system
|
|
US20040134775A1
(en)
*
|
2002-07-24 |
2004-07-15 |
Applied Materials, Inc. |
Electrochemical processing cell
|
|
KR100389061B1
(ko)
*
|
2002-11-14 |
2003-06-25 |
일진소재산업주식회사 |
전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
|
|
DE10259362A1
(de)
*
|
2002-12-18 |
2004-07-08 |
Siemens Ag |
Verfahren zum Abscheiden einer Legierung auf ein Substrat
|
|
EP1475463B2
(en)
†
|
2002-12-20 |
2017-03-01 |
Shipley Company, L.L.C. |
Reverse pulse plating method
|
|
DE10261493A1
(de)
*
|
2002-12-23 |
2004-07-08 |
METAKEM Gesellschaft für Schichtchemie der Metalle mbH |
Anode zur Galvanisierung
|
|
US20040118691A1
(en)
*
|
2002-12-23 |
2004-06-24 |
Shipley Company, L.L.C. |
Electroplating method
|
|
KR20040073974A
(ko)
*
|
2003-02-14 |
2004-08-21 |
롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. |
전기도금 조성물
|
|
US20050157475A1
(en)
*
|
2004-01-15 |
2005-07-21 |
Endicott Interconnect Technologies, Inc. |
Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
|
|
US7972491B2
(en)
*
|
2004-04-15 |
2011-07-05 |
Hitachi Metals, Ltd. |
Method for imparting hydrogen resistance to articles
|
|
EP1598449B1
(en)
*
|
2004-04-26 |
2010-08-04 |
Rohm and Haas Electronic Materials, L.L.C. |
Improved plating method
|
|
US20050284766A1
(en)
*
|
2004-06-25 |
2005-12-29 |
Herdman Roderick D |
Pulse reverse electrolysis of acidic copper electroplating solutions
|
|
US7329334B2
(en)
*
|
2004-09-16 |
2008-02-12 |
Herdman Roderick D |
Controlling the hardness of electrodeposited copper coatings by variation of current profile
|
|
DE102004045451B4
(de)
*
|
2004-09-20 |
2007-05-03 |
Atotech Deutschland Gmbh |
Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
|
|
FR2881146B1
(fr)
*
|
2005-01-27 |
2007-10-19 |
Snecma Moteurs Sa |
Procede de reparation d'une surface de frottement d'une aube a calage variable de turbomachine
|
|
JP4799887B2
(ja)
*
|
2005-03-24 |
2011-10-26 |
石原薬品株式会社 |
電気銅メッキ浴、並びに銅メッキ方法
|
|
JP2006283169A
(ja)
*
|
2005-04-04 |
2006-10-19 |
Okuno Chem Ind Co Ltd |
酸性電気銅めっき液、及び含硫黄有機化合物の電解消耗量の少ない電気銅めっき方法
|
|
EP1712660A1
(de)
*
|
2005-04-12 |
2006-10-18 |
Enthone Inc. |
Unlösliche Anode
|
|
EP1717351A1
(de)
*
|
2005-04-27 |
2006-11-02 |
Enthone Inc. |
Galvanikbad
|
|
ES2303973T3
(es)
*
|
2005-05-25 |
2008-09-01 |
Enthone Inc. |
Procedimiento y dispositivo para ajustar la concentracion de iones en electrolitos.
|
|
US7425255B2
(en)
*
|
2005-06-07 |
2008-09-16 |
Massachusetts Institute Of Technology |
Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
|
|
TWI314957B
(en)
*
|
2005-12-29 |
2009-09-21 |
Ind Tech Res Inst |
Apparatus for metal plating on a substrate
|
|
ATE484943T1
(de)
|
2006-03-30 |
2010-10-15 |
Atotech Deutschland Gmbh |
Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
|
|
US20070278107A1
(en)
*
|
2006-05-30 |
2007-12-06 |
Northwest Aluminum Technologies |
Anode for use in aluminum producing electrolytic cell
|
|
JP2009167506A
(ja)
*
|
2008-01-21 |
2009-07-30 |
Ebara Udylite Kk |
酸性電解銅めっき液およびこれを用いる微細配線回路の作製方法
|
|
DE102008031003B4
(de)
|
2008-06-30 |
2010-04-15 |
Siemens Aktiengesellschaft |
Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit
|
|
US11225727B2
(en)
|
2008-11-07 |
2022-01-18 |
Lam Research Corporation |
Control of current density in an electroplating apparatus
|
|
US10011917B2
(en)
|
2008-11-07 |
2018-07-03 |
Lam Research Corporation |
Control of current density in an electroplating apparatus
|
|
US20100206737A1
(en)
*
|
2009-02-17 |
2010-08-19 |
Preisser Robert F |
Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
|
|
US9385035B2
(en)
|
2010-05-24 |
2016-07-05 |
Novellus Systems, Inc. |
Current ramping and current pulsing entry of substrates for electroplating
|
|
EP2392694A1
(en)
|
2010-06-02 |
2011-12-07 |
ATOTECH Deutschland GmbH |
Method for etching of copper and copper alloys
|
|
US20120024713A1
(en)
*
|
2010-07-29 |
2012-02-02 |
Preisser Robert F |
Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte
|
|
EP2518187A1
(en)
*
|
2011-04-26 |
2012-10-31 |
Atotech Deutschland GmbH |
Aqueous acidic bath for electrolytic deposition of copper
|
|
US9028666B2
(en)
|
2011-05-17 |
2015-05-12 |
Novellus Systems, Inc. |
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
|
|
CN103179806B
(zh)
*
|
2011-12-21 |
2019-05-28 |
奥特斯有限公司 |
组合的通孔镀覆和孔填充的方法
|
|
EP2735627A1
(en)
|
2012-11-26 |
2014-05-28 |
ATOTECH Deutschland GmbH |
Copper plating bath composition
|
|
JP6035678B2
(ja)
*
|
2013-02-19 |
2016-11-30 |
住友金属鉱山株式会社 |
フレキシブル配線板の製造方法ならびにフレキシブル配線板
|
|
JP6411741B2
(ja)
*
|
2013-05-20 |
2018-10-24 |
国立大学法人 熊本大学 |
電解処理方法及び電解処理装置
|
|
EP2865787A1
(en)
*
|
2013-10-22 |
2015-04-29 |
ATOTECH Deutschland GmbH |
Copper electroplating method
|
|
WO2016169952A1
(en)
|
2015-04-20 |
2016-10-27 |
Atotech Deutschland Gmbh |
Electrolytic copper plating bath compositions and a method for their use
|
|
EP3135709B1
(en)
|
2015-08-31 |
2018-01-10 |
ATOTECH Deutschland GmbH |
Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
|
|
TWI662161B
(zh)
|
2015-08-31 |
2019-06-11 |
德商德國艾托特克公司 |
水性銅電鍍浴及沉積銅或銅合金於基板上之方法
|
|
ES2681836T3
(es)
|
2015-09-10 |
2018-09-17 |
Atotech Deutschland Gmbh |
Composición de baño para chapado de cobre
|
|
WO2018033461A1
(en)
|
2016-08-15 |
2018-02-22 |
Atotech Deutschland Gmbh |
Acidic aqueous composition for electrolytic copper plating
|
|
EP3360988B1
(en)
|
2017-02-09 |
2019-06-26 |
ATOTECH Deutschland GmbH |
Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
|
|
EP3470552B1
(en)
|
2017-10-13 |
2020-12-30 |
ATOTECH Deutschland GmbH |
An acidic aqueous composition for electrolytically depositing a copper deposit
|
|
PT3483307T
(pt)
|
2017-11-09 |
2020-07-03 |
Atotech Deutschland Gmbh |
Composições de revestimento para deposição de cobre eletrolítico, a sua utilização e um método para depósito electrolítico de uma camada de cobre ou liga de cobre na pelo menos uma superfície de um substrato
|
|
PT3508620T
(pt)
|
2018-01-09 |
2021-07-12 |
Atotech Deutschland Gmbh |
Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
|
|
EP3511444B1
(en)
|
2018-01-16 |
2020-07-22 |
ATOTECH Deutschland GmbH |
Metal or metal alloy deposition composition and plating compound
|
|
US11414772B2
(en)
|
2018-06-15 |
2022-08-16 |
Alberto Todescan |
Electrolytic treatment process for coating stainless steel objects
|
|
US11716819B2
(en)
*
|
2018-06-21 |
2023-08-01 |
Averatek Corporation |
Asymmetrical electrolytic plating for a conductive pattern
|
|
JP7087759B2
(ja)
*
|
2018-07-18 |
2022-06-21 |
住友金属鉱山株式会社 |
銅張積層板
|
|
CN112210801A
(zh)
*
|
2019-07-09 |
2021-01-12 |
江西博泉化学有限公司 |
一种用于高纵横比电路板通孔电镀的电镀液及其电镀方法
|
|
KR102875198B1
(ko)
*
|
2019-08-19 |
2025-10-22 |
아토테크 도이칠란트 게엠베하 운트 콤파니 카게 |
구리로 충전된 마이크로비아들을 포함하는 고밀도 상호연결 인쇄 회로 기판을 제조하는 방법
|
|
CN114342569A
(zh)
|
2019-08-19 |
2022-04-12 |
德国艾托特克有限两合公司 |
高密度互连印刷电路板的制造顺序及高密度互连印刷电路板
|
|
EP3901331A1
(en)
|
2020-04-23 |
2021-10-27 |
ATOTECH Deutschland GmbH |
Acidic aqueous composition for electrolytically depositing a copper deposit
|
|
EP3933073B1
(en)
|
2020-06-29 |
2023-11-29 |
Atotech Deutschland GmbH & Co. KG |
Copper electroplating bath
|
|
US11542626B2
(en)
*
|
2020-10-08 |
2023-01-03 |
Honeywell International Inc. |
Systems and methods for enclosed electroplating chambers
|
|
EP4032930B1
(en)
|
2021-01-22 |
2023-08-30 |
Atotech Deutschland GmbH & Co. KG |
Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
|
|
CN113106527B
(zh)
*
|
2021-04-19 |
2024-09-10 |
深圳铱创科技有限公司 |
不溶性阳极及脉冲电镀设备
|
|
EP4400634A1
(en)
|
2023-01-13 |
2024-07-17 |
Atotech Deutschland GmbH & Co. KG |
Process for producing copper foil by electrolytic deposition of copper
|
|
CN120239188B
(zh)
*
|
2025-05-29 |
2025-09-16 |
珠海市航达科技有限公司 |
一种pcb板铜电镀方法
|