CA2233329C - Method for electrolytic deposition of metal coatings - Google Patents
Method for electrolytic deposition of metal coatings Download PDFInfo
- Publication number
- CA2233329C CA2233329C CA002233329A CA2233329A CA2233329C CA 2233329 C CA2233329 C CA 2233329C CA 002233329 A CA002233329 A CA 002233329A CA 2233329 A CA2233329 A CA 2233329A CA 2233329 C CA2233329 C CA 2233329C
- Authority
- CA
- Canada
- Prior art keywords
- metal
- current
- copper
- anodes
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 83
- 239000002184 metal Substances 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 58
- 230000008021 deposition Effects 0.000 title claims abstract description 33
- 238000000576 coating method Methods 0.000 title claims description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 70
- 239000010949 copper Substances 0.000 claims abstract description 70
- 150000001875 compounds Chemical class 0.000 claims abstract description 33
- 230000002441 reversible effect Effects 0.000 claims abstract description 14
- 239000000654 additive Substances 0.000 claims description 15
- 230000000996 additive effect Effects 0.000 claims description 13
- -1 iron ion Chemical class 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 150000002500 ions Chemical class 0.000 claims description 9
- 229910000510 noble metal Inorganic materials 0.000 claims description 9
- 230000003797 telogen phase Effects 0.000 claims description 8
- 238000004090 dissolution Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 4
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical class [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims description 4
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 4
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 4
- 239000010419 fine particle Substances 0.000 claims description 3
- 238000009827 uniform distribution Methods 0.000 claims description 3
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 11
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 81
- 239000000243 solution Substances 0.000 description 63
- 239000011248 coating agent Substances 0.000 description 48
- 229910021645 metal ion Inorganic materials 0.000 description 16
- 239000000463 material Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 9
- 229910001431 copper ion Inorganic materials 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 9
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000008151 electrolyte solution Substances 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 239000001117 sulphuric acid Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 159000000000 sodium salts Chemical class 0.000 description 4
- 235000011149 sulphuric acid Nutrition 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- 206010001488 Aggression Diseases 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000010405 anode material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- 239000006259 organic additive Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 description 1
- 101100072272 Caenorhabditis elegans ife-3 gene Proteins 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XGGLLRJQCZROSE-UHFFFAOYSA-K ammonium iron(iii) sulfate Chemical compound [NH4+].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGGLLRJQCZROSE-UHFFFAOYSA-K 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- VZDYWEUILIUIDF-UHFFFAOYSA-J cerium(4+);disulfate Chemical compound [Ce+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O VZDYWEUILIUIDF-UHFFFAOYSA-J 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000002635 electroconvulsive therapy Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- 159000000014 iron salts Chemical class 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001521 polyalkylene glycol ether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- HYTYHTSMCRDHIM-UHFFFAOYSA-M potassium;2-sulfanylacetate Chemical compound [K+].[O-]C(=O)CS HYTYHTSMCRDHIM-UHFFFAOYSA-M 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- PXLIDIMHPNPGMH-UHFFFAOYSA-N sodium chromate Chemical compound [Na+].[Na+].[O-][Cr]([O-])(=O)=O PXLIDIMHPNPGMH-UHFFFAOYSA-N 0.000 description 1
- CMZUMMUJMWNLFH-UHFFFAOYSA-N sodium metavanadate Chemical compound [Na+].[O-][V](=O)=O CMZUMMUJMWNLFH-UHFFFAOYSA-N 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003019 stabilising effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- RVUXIPACAZKWHU-UHFFFAOYSA-N sulfuric acid;heptahydrate Chemical compound O.O.O.O.O.O.O.OS(O)(=O)=O RVUXIPACAZKWHU-UHFFFAOYSA-N 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 238000010518 undesired secondary reaction Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19545231.3 | 1995-11-21 | ||
| DE19545231A DE19545231A1 (de) | 1995-11-21 | 1995-11-21 | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| PCT/EP1996/005140 WO1997019206A1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2233329A1 CA2233329A1 (en) | 1997-05-29 |
| CA2233329C true CA2233329C (en) | 2005-07-26 |
Family
ID=7779164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002233329A Expired - Fee Related CA2233329C (en) | 1995-11-21 | 1996-11-21 | Method for electrolytic deposition of metal coatings |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6099711A (enExample) |
| EP (1) | EP0862665B1 (enExample) |
| JP (2) | JP2000500529A (enExample) |
| AT (1) | ATE190677T1 (enExample) |
| CA (1) | CA2233329C (enExample) |
| DE (2) | DE19545231A1 (enExample) |
| ES (1) | ES2144789T3 (enExample) |
| TW (1) | TW420728B (enExample) |
| WO (1) | WO1997019206A1 (enExample) |
Families Citing this family (86)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19736350C1 (de) * | 1997-08-21 | 1999-08-05 | Atotech Deutschland Gmbh | Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens |
| US6946065B1 (en) * | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
| US6793796B2 (en) | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| ATE282248T1 (de) * | 1999-01-21 | 2004-11-15 | Atotech Deutschland Gmbh | Verfahren zum galvanischen bilden von leiterstrukturen aus hochreinem kupfer bei der herstellung von integrierten schaltungen |
| DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
| DE19925373B4 (de) * | 1999-06-02 | 2006-04-06 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Galvanisieren |
| US20040045832A1 (en) * | 1999-10-14 | 2004-03-11 | Nicholas Martyak | Electrolytic copper plating solutions |
| US6294060B1 (en) | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
| JP2001267726A (ja) * | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | 配線基板の電解メッキ方法及び配線基板の電解メッキ装置 |
| US6491806B1 (en) | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| NL1015348C2 (nl) * | 2000-05-31 | 2001-12-03 | D R P P B V Dutch Reverse Puls | Methode ter verbetering van electrolytische metaal neerslagverdeling op een substraat met behulp van Periodic Reversal Current waarbij gebruik wordt gemaakt van Oplosbare-, Inerte- en Hybride Anoden. |
| DE10061186C1 (de) * | 2000-12-07 | 2002-01-17 | Astrium Gmbh | Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens |
| US20040060728A1 (en) * | 2001-01-04 | 2004-04-01 | Philippe Steiert | Method for producing electroconductive structures |
| JP2002235189A (ja) * | 2001-02-05 | 2002-08-23 | Sansha Electric Mfg Co Ltd | めっき電流供給電源装置 |
| US6620303B2 (en) * | 2001-05-21 | 2003-09-16 | Hong Kong Polytechnic University | Process for making nickel electroforms |
| US6881318B2 (en) * | 2001-07-26 | 2005-04-19 | Applied Materials, Inc. | Dynamic pulse plating for high aspect ratio features |
| WO2003033775A1 (en) * | 2001-10-16 | 2003-04-24 | Shinko Electric Industries Co., Ltd. | Method of copper-plating small-diameter holes |
| JP2003183879A (ja) * | 2001-12-18 | 2003-07-03 | Learonal Japan Inc | 電解めっき方法 |
| US6919011B2 (en) * | 2001-12-27 | 2005-07-19 | The Hong Kong Polytechnic University | Complex waveform electroplating |
| US7077945B2 (en) * | 2002-03-01 | 2006-07-18 | Northwest Aluminum Technologies | Cu—Ni—Fe anode for use in aluminum producing electrolytic cell |
| US6558525B1 (en) | 2002-03-01 | 2003-05-06 | Northwest Aluminum Technologies | Anode for use in aluminum producing electrolytic cell |
| JP3964263B2 (ja) * | 2002-05-17 | 2007-08-22 | 株式会社デンソー | ブラインドビアホール充填方法及び貫通電極形成方法 |
| US7247222B2 (en) * | 2002-07-24 | 2007-07-24 | Applied Materials, Inc. | Electrochemical processing cell |
| US7128823B2 (en) * | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
| US7223323B2 (en) | 2002-07-24 | 2007-05-29 | Applied Materials, Inc. | Multi-chemistry plating system |
| US20040134775A1 (en) * | 2002-07-24 | 2004-07-15 | Applied Materials, Inc. | Electrochemical processing cell |
| KR100389061B1 (ko) * | 2002-11-14 | 2003-06-25 | 일진소재산업주식회사 | 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법 |
| DE10259362A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zum Abscheiden einer Legierung auf ein Substrat |
| EP1475463B2 (en) † | 2002-12-20 | 2017-03-01 | Shipley Company, L.L.C. | Reverse pulse plating method |
| DE10261493A1 (de) * | 2002-12-23 | 2004-07-08 | METAKEM Gesellschaft für Schichtchemie der Metalle mbH | Anode zur Galvanisierung |
| US20040118691A1 (en) * | 2002-12-23 | 2004-06-24 | Shipley Company, L.L.C. | Electroplating method |
| KR20040073974A (ko) * | 2003-02-14 | 2004-08-21 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 전기도금 조성물 |
| US20050157475A1 (en) * | 2004-01-15 | 2005-07-21 | Endicott Interconnect Technologies, Inc. | Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| US7972491B2 (en) * | 2004-04-15 | 2011-07-05 | Hitachi Metals, Ltd. | Method for imparting hydrogen resistance to articles |
| EP1598449B1 (en) * | 2004-04-26 | 2010-08-04 | Rohm and Haas Electronic Materials, L.L.C. | Improved plating method |
| US20050284766A1 (en) * | 2004-06-25 | 2005-12-29 | Herdman Roderick D | Pulse reverse electrolysis of acidic copper electroplating solutions |
| US7329334B2 (en) * | 2004-09-16 | 2008-02-12 | Herdman Roderick D | Controlling the hardness of electrodeposited copper coatings by variation of current profile |
| DE102004045451B4 (de) * | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| FR2881146B1 (fr) * | 2005-01-27 | 2007-10-19 | Snecma Moteurs Sa | Procede de reparation d'une surface de frottement d'une aube a calage variable de turbomachine |
| JP4799887B2 (ja) * | 2005-03-24 | 2011-10-26 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| JP2006283169A (ja) * | 2005-04-04 | 2006-10-19 | Okuno Chem Ind Co Ltd | 酸性電気銅めっき液、及び含硫黄有機化合物の電解消耗量の少ない電気銅めっき方法 |
| EP1712660A1 (de) * | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
| EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
| ES2303973T3 (es) * | 2005-05-25 | 2008-09-01 | Enthone Inc. | Procedimiento y dispositivo para ajustar la concentracion de iones en electrolitos. |
| US7425255B2 (en) * | 2005-06-07 | 2008-09-16 | Massachusetts Institute Of Technology | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| TWI314957B (en) * | 2005-12-29 | 2009-09-21 | Ind Tech Res Inst | Apparatus for metal plating on a substrate |
| ATE484943T1 (de) | 2006-03-30 | 2010-10-15 | Atotech Deutschland Gmbh | Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen |
| US20070278107A1 (en) * | 2006-05-30 | 2007-12-06 | Northwest Aluminum Technologies | Anode for use in aluminum producing electrolytic cell |
| JP2009167506A (ja) * | 2008-01-21 | 2009-07-30 | Ebara Udylite Kk | 酸性電解銅めっき液およびこれを用いる微細配線回路の作製方法 |
| DE102008031003B4 (de) | 2008-06-30 | 2010-04-15 | Siemens Aktiengesellschaft | Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit |
| US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US20100206737A1 (en) * | 2009-02-17 | 2010-08-19 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
| US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
| EP2392694A1 (en) | 2010-06-02 | 2011-12-07 | ATOTECH Deutschland GmbH | Method for etching of copper and copper alloys |
| US20120024713A1 (en) * | 2010-07-29 | 2012-02-02 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte |
| EP2518187A1 (en) * | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
| US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
| CN103179806B (zh) * | 2011-12-21 | 2019-05-28 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
| EP2735627A1 (en) | 2012-11-26 | 2014-05-28 | ATOTECH Deutschland GmbH | Copper plating bath composition |
| JP6035678B2 (ja) * | 2013-02-19 | 2016-11-30 | 住友金属鉱山株式会社 | フレキシブル配線板の製造方法ならびにフレキシブル配線板 |
| JP6411741B2 (ja) * | 2013-05-20 | 2018-10-24 | 国立大学法人 熊本大学 | 電解処理方法及び電解処理装置 |
| EP2865787A1 (en) * | 2013-10-22 | 2015-04-29 | ATOTECH Deutschland GmbH | Copper electroplating method |
| WO2016169952A1 (en) | 2015-04-20 | 2016-10-27 | Atotech Deutschland Gmbh | Electrolytic copper plating bath compositions and a method for their use |
| EP3135709B1 (en) | 2015-08-31 | 2018-01-10 | ATOTECH Deutschland GmbH | Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions |
| TWI662161B (zh) | 2015-08-31 | 2019-06-11 | 德商德國艾托特克公司 | 水性銅電鍍浴及沉積銅或銅合金於基板上之方法 |
| ES2681836T3 (es) | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| WO2018033461A1 (en) | 2016-08-15 | 2018-02-22 | Atotech Deutschland Gmbh | Acidic aqueous composition for electrolytic copper plating |
| EP3360988B1 (en) | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
| EP3470552B1 (en) | 2017-10-13 | 2020-12-30 | ATOTECH Deutschland GmbH | An acidic aqueous composition for electrolytically depositing a copper deposit |
| PT3483307T (pt) | 2017-11-09 | 2020-07-03 | Atotech Deutschland Gmbh | Composições de revestimento para deposição de cobre eletrolítico, a sua utilização e um método para depósito electrolítico de uma camada de cobre ou liga de cobre na pelo menos uma superfície de um substrato |
| PT3508620T (pt) | 2018-01-09 | 2021-07-12 | Atotech Deutschland Gmbh | Aditivo de ureileno, a sua utilização e um método de preparação para esse fim |
| EP3511444B1 (en) | 2018-01-16 | 2020-07-22 | ATOTECH Deutschland GmbH | Metal or metal alloy deposition composition and plating compound |
| US11414772B2 (en) | 2018-06-15 | 2022-08-16 | Alberto Todescan | Electrolytic treatment process for coating stainless steel objects |
| US11716819B2 (en) * | 2018-06-21 | 2023-08-01 | Averatek Corporation | Asymmetrical electrolytic plating for a conductive pattern |
| JP7087759B2 (ja) * | 2018-07-18 | 2022-06-21 | 住友金属鉱山株式会社 | 銅張積層板 |
| CN112210801A (zh) * | 2019-07-09 | 2021-01-12 | 江西博泉化学有限公司 | 一种用于高纵横比电路板通孔电镀的电镀液及其电镀方法 |
| KR102875198B1 (ko) * | 2019-08-19 | 2025-10-22 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 구리로 충전된 마이크로비아들을 포함하는 고밀도 상호연결 인쇄 회로 기판을 제조하는 방법 |
| CN114342569A (zh) | 2019-08-19 | 2022-04-12 | 德国艾托特克有限两合公司 | 高密度互连印刷电路板的制造顺序及高密度互连印刷电路板 |
| EP3901331A1 (en) | 2020-04-23 | 2021-10-27 | ATOTECH Deutschland GmbH | Acidic aqueous composition for electrolytically depositing a copper deposit |
| EP3933073B1 (en) | 2020-06-29 | 2023-11-29 | Atotech Deutschland GmbH & Co. KG | Copper electroplating bath |
| US11542626B2 (en) * | 2020-10-08 | 2023-01-03 | Honeywell International Inc. | Systems and methods for enclosed electroplating chambers |
| EP4032930B1 (en) | 2021-01-22 | 2023-08-30 | Atotech Deutschland GmbH & Co. KG | Biuret-based quaternized polymers and their use in metal or metal alloy plating baths |
| CN113106527B (zh) * | 2021-04-19 | 2024-09-10 | 深圳铱创科技有限公司 | 不溶性阳极及脉冲电镀设备 |
| EP4400634A1 (en) | 2023-01-13 | 2024-07-17 | Atotech Deutschland GmbH & Co. KG | Process for producing copper foil by electrolytic deposition of copper |
| CN120239188B (zh) * | 2025-05-29 | 2025-09-16 | 珠海市航达科技有限公司 | 一种pcb板铜电镀方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1396436A (en) * | 1973-01-08 | 1975-06-04 | Akad Wissenschaften Ddr | Process for the electrolytic production of hard-magnetic layers |
| CH629542A5 (de) * | 1976-09-01 | 1982-04-30 | Inoue Japax Res | Verfahren und vorrichtung zur galvanischen materialablagerung. |
| NL8105150A (nl) * | 1981-11-13 | 1983-06-01 | Veco Beheer Bv | Werkwijze voor het vervaardigen van zeefmateriaal, verkregen zeefmateriaal, alsmede inrichting voor het uitvoeren van de werkwijze. |
| US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
| JPS58161793A (ja) * | 1982-03-19 | 1983-09-26 | Hitachi Ltd | 連続電気めつき方法 |
| DD215589B5 (de) * | 1983-05-11 | 1994-06-01 | Heinz Dr Rer Nat Liebscher | Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion |
| JPS59215500A (ja) * | 1983-05-19 | 1984-12-05 | Fuji Photo Film Co Ltd | 電解処理方法 |
| US4808569A (en) * | 1986-10-24 | 1989-02-28 | Gaf Corporation | Fragrance additive |
| JPS63297590A (ja) * | 1987-05-29 | 1988-12-05 | Nagano Pref Gov | 高速電流反転電解によるめつき方法 |
| DD261613A1 (de) * | 1987-06-05 | 1988-11-02 | Leipzig Galvanotechnik | Verfahren zur elektrolytischen kupferabscheidung aus sauren elektrolyten mit dimensionsstabiler anode |
| GB8801827D0 (en) * | 1988-01-27 | 1988-02-24 | Jct Controls Ltd | Improvements in electrochemical processes |
| WO1989008157A1 (fr) * | 1988-02-23 | 1989-09-08 | Minsky Radiotekhnichesky Institut | Dispositif d'application de revetements galvaniques |
| GB8913561D0 (en) * | 1989-06-13 | 1989-08-02 | Learonal Uk Plc | Method of stabilising an organic additive in an electroplating solution |
| JPH04320088A (ja) * | 1991-04-18 | 1992-11-10 | Cmk Corp | プリント配線板の製造方法 |
| DE4344387C2 (de) * | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
-
1995
- 1995-11-21 DE DE19545231A patent/DE19545231A1/de not_active Withdrawn
-
1996
- 1996-11-15 TW TW085113990A patent/TW420728B/zh not_active IP Right Cessation
- 1996-11-21 US US09/066,313 patent/US6099711A/en not_active Expired - Lifetime
- 1996-11-21 ES ES96939882T patent/ES2144789T3/es not_active Expired - Lifetime
- 1996-11-21 AT AT96939882T patent/ATE190677T1/de active
- 1996-11-21 CA CA002233329A patent/CA2233329C/en not_active Expired - Fee Related
- 1996-11-21 EP EP96939882A patent/EP0862665B1/de not_active Expired - Lifetime
- 1996-11-21 DE DE59604701T patent/DE59604701D1/de not_active Expired - Lifetime
- 1996-11-21 WO PCT/EP1996/005140 patent/WO1997019206A1/de not_active Ceased
- 1996-11-21 JP JP9519399A patent/JP2000500529A/ja not_active Withdrawn
-
2009
- 2009-10-02 JP JP2009230437A patent/JP5417112B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ATE190677T1 (de) | 2000-04-15 |
| WO1997019206A1 (de) | 1997-05-29 |
| TW420728B (en) | 2001-02-01 |
| EP0862665B1 (de) | 2000-03-15 |
| ES2144789T3 (es) | 2000-06-16 |
| JP2000500529A (ja) | 2000-01-18 |
| JP2009299195A (ja) | 2009-12-24 |
| CA2233329A1 (en) | 1997-05-29 |
| US6099711A (en) | 2000-08-08 |
| EP0862665A1 (de) | 1998-09-09 |
| JP5417112B2 (ja) | 2014-02-12 |
| DE59604701D1 (de) | 2000-04-20 |
| DE19545231A1 (de) | 1997-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20151123 |