JP2000306914A5 - - Google Patents

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Publication number
JP2000306914A5
JP2000306914A5 JP2000086214A JP2000086214A JP2000306914A5 JP 2000306914 A5 JP2000306914 A5 JP 2000306914A5 JP 2000086214 A JP2000086214 A JP 2000086214A JP 2000086214 A JP2000086214 A JP 2000086214A JP 2000306914 A5 JP2000306914 A5 JP 2000306914A5
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Japan
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JP2000086214A
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JP2000306914A (ja
JP4566325B2 (ja
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Priority claimed from US09/285,666 external-priority patent/US20020000665A1/en
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Publication of JP2000306914A5 publication Critical patent/JP2000306914A5/ja
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Publication of JP4566325B2 publication Critical patent/JP4566325B2/ja
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JP2000086214A 1999-04-05 2000-03-27 半導体装置を製造する方法 Expired - Fee Related JP4566325B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US285666 1981-07-21
US09/285,666 US20020000665A1 (en) 1999-04-05 1999-04-05 Semiconductor device conductive bump and interconnect barrier

Publications (3)

Publication Number Publication Date
JP2000306914A JP2000306914A (ja) 2000-11-02
JP2000306914A5 true JP2000306914A5 (ja) 2007-05-17
JP4566325B2 JP4566325B2 (ja) 2010-10-20

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JP2000086214A Expired - Fee Related JP4566325B2 (ja) 1999-04-05 2000-03-27 半導体装置を製造する方法

Country Status (5)

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US (2) US20020000665A1 (ja)
JP (1) JP4566325B2 (ja)
CN (1) CN1192430C (ja)
SG (1) SG84587A1 (ja)
TW (1) TW490793B (ja)

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