JP2000232239A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000232239A5 JP2000232239A5 JP1999037826A JP3782699A JP2000232239A5 JP 2000232239 A5 JP2000232239 A5 JP 2000232239A5 JP 1999037826 A JP1999037826 A JP 1999037826A JP 3782699 A JP3782699 A JP 3782699A JP 2000232239 A5 JP2000232239 A5 JP 2000232239A5
- Authority
- JP
- Japan
- Prior art keywords
- nitride semiconductor
- growing
- protective film
- substrate
- impurities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03782699A JP4304750B2 (ja) | 1998-12-08 | 1999-02-16 | 窒化物半導体の成長方法及び窒化物半導体素子 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-348761 | 1998-12-08 | ||
| JP34876198 | 1998-12-08 | ||
| JP03782699A JP4304750B2 (ja) | 1998-12-08 | 1999-02-16 | 窒化物半導体の成長方法及び窒化物半導体素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000232239A JP2000232239A (ja) | 2000-08-22 |
| JP2000232239A5 true JP2000232239A5 (enExample) | 2006-04-27 |
| JP4304750B2 JP4304750B2 (ja) | 2009-07-29 |
Family
ID=26376974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03782699A Expired - Fee Related JP4304750B2 (ja) | 1998-12-08 | 1999-02-16 | 窒化物半導体の成長方法及び窒化物半導体素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4304750B2 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3587081B2 (ja) | 1999-05-10 | 2004-11-10 | 豊田合成株式会社 | Iii族窒化物半導体の製造方法及びiii族窒化物半導体発光素子 |
| JP3555500B2 (ja) | 1999-05-21 | 2004-08-18 | 豊田合成株式会社 | Iii族窒化物半導体及びその製造方法 |
| US6580098B1 (en) | 1999-07-27 | 2003-06-17 | Toyoda Gosei Co., Ltd. | Method for manufacturing gallium nitride compound semiconductor |
| JP2001185493A (ja) | 1999-12-24 | 2001-07-06 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 |
| JP4432180B2 (ja) | 1999-12-24 | 2010-03-17 | 豊田合成株式会社 | Iii族窒化物系化合物半導体の製造方法、iii族窒化物系化合物半導体素子及びiii族窒化物系化合物半導体 |
| JP2001267242A (ja) | 2000-03-14 | 2001-09-28 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体及びその製造方法 |
| CN1213462C (zh) | 2000-03-14 | 2005-08-03 | 丰田合成株式会社 | 用于制造ⅲ族氮化物系化合物半导体的方法以及ⅲ族氮化物系化合物半导体器件 |
| TW518767B (en) | 2000-03-31 | 2003-01-21 | Toyoda Gosei Kk | Production method of III nitride compound semiconductor and III nitride compound semiconductor element |
| JP2001313259A (ja) | 2000-04-28 | 2001-11-09 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体基板の製造方法及び半導体素子 |
| US7619261B2 (en) | 2000-08-07 | 2009-11-17 | Toyoda Gosei Co., Ltd. | Method for manufacturing gallium nitride compound semiconductor |
| US6858882B2 (en) | 2000-09-08 | 2005-02-22 | Sharp Kabushiki Kaisha | Nitride semiconductor light-emitting device and optical device including the same |
| WO2002039555A1 (en) | 2000-11-10 | 2002-05-16 | Sharp Kabushiki Kaisha | Nitride semiconductor luminous element and optical device including it |
| EP1367150B1 (en) | 2001-02-14 | 2009-08-19 | Toyoda Gosei Co., Ltd. | Production method for semiconductor crystal and semiconductor luminous element |
| JP2002280314A (ja) | 2001-03-22 | 2002-09-27 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法、及びそれに基づくiii族窒化物系化合物半導体素子 |
| JP3705142B2 (ja) | 2001-03-27 | 2005-10-12 | ソニー株式会社 | 窒化物半導体素子及びその作製方法 |
| JP2004262757A (ja) * | 2001-04-24 | 2004-09-24 | Sony Corp | 窒化物半導体、半導体素子およびこれらの製造方法 |
| JP3690326B2 (ja) | 2001-10-12 | 2005-08-31 | 豊田合成株式会社 | Iii族窒化物系化合物半導体の製造方法 |
| KR101363377B1 (ko) | 2002-04-15 | 2014-02-14 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 무극성 질화 갈륨 박막의 전위 감소 |
| KR101170889B1 (ko) * | 2003-05-21 | 2012-08-06 | 쌩-고벵 크리스톡스 에 드테끄퇴르 | 마스크를 통한 측면 성장에 의한 질화갈륨 기판의 제조 방법 및 이에 의해 제조된 장치 |
| EP1619729B1 (en) * | 2004-04-16 | 2010-02-10 | Nitride Semiconductors Co., Ltd. | Gallium nitride based light-emitting device |
| JP5323412B2 (ja) * | 2008-07-25 | 2013-10-23 | シャープ株式会社 | 電界効果トランジスタ |
| JP5489117B2 (ja) | 2009-09-01 | 2014-05-14 | シャープ株式会社 | 窒化物半導体素子、窒化物半導体素子の製造方法、窒化物半導体層の製造方法および窒化物半導体発光素子 |
| JP5705179B2 (ja) * | 2012-08-15 | 2015-04-22 | 株式会社東芝 | 窒化物半導体ウェーハ、窒化物半導体装置及び窒化物半導体結晶の成長方法 |
| JP2017092075A (ja) * | 2015-11-02 | 2017-05-25 | 株式会社ソディック | 発光素子 |
| GB2593693B (en) * | 2020-03-30 | 2022-08-03 | Plessey Semiconductors Ltd | LED precursor |
-
1999
- 1999-02-16 JP JP03782699A patent/JP4304750B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000232239A5 (enExample) | ||
| EP1033751A3 (en) | Method for forming buried layers with top-side contacts and the resulting structure | |
| EP1041621A3 (en) | Multilayered wafer with thrick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof | |
| JP2000021771A5 (enExample) | ||
| EP1328014A4 (en) | SEMICONDUCTOR BASE MATERIAL AND METHOD OF MAKING SAID MATERIAL | |
| EP1351284A3 (en) | SiGe heterojunction bipolar transistor and method for fabricating the same | |
| WO2004027820A3 (en) | Self-aligned npn transistor with raised extrinsic base | |
| DE60043854D1 (de) | Einstufige pendeo- oder laterale epitaxie von gruppe iii-nitridschichten | |
| JP2001185493A5 (enExample) | ||
| JP2005508086A5 (enExample) | ||
| JP2000164922A5 (enExample) | ||
| EP0858101A3 (en) | Manufacturing of an Si/SiGe super lattice structure by epitaxial growth | |
| WO2009007907A3 (en) | Single crystal growth on a mis-matched substrate | |
| EP3872843A1 (fr) | Procédé de fabrication d'un transistor bipolaire et transistor bipolaire susceptible d'être obtenu par un tel procédé | |
| IL178450A (en) | Manufacture of cadmium mercury telluride | |
| EP0401473A3 (en) | Method of low defect junction and isolation formation in semiconductor material | |
| JPS55105344A (en) | Semiconductor device | |
| JP2004521489A5 (enExample) | ||
| WO2002058162A3 (en) | Metamorphic long wavelength high-speed photodiode | |
| KR100641063B1 (ko) | 단결정 구조물 형성 방법 및 이를 이용한 반도체 장치의제조 방법 | |
| JP2003046203A5 (enExample) | ||
| US8039328B2 (en) | Trench Schottky device with single barrier | |
| JPS5539685A (en) | Semiconductor device | |
| EP1523079A3 (en) | Compound semiconductor, method for manufacturing the same, semiconductor device, and method for manufacturing the same | |
| JP2639041B2 (ja) | バラクタダイオードの製造方法 |