JP1641098S - - Google Patents
Info
- Publication number
- JP1641098S JP1641098S JPD2018-14083F JP2018014083F JP1641098S JP 1641098 S JP1641098 S JP 1641098S JP 2018014083 F JP2018014083 F JP 2018014083F JP 1641098 S JP1641098 S JP 1641098S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-14083F JP1641098S (enExample) | 2018-06-26 | 2018-06-26 | |
| US29/673,188 USD913978S1 (en) | 2018-06-26 | 2018-12-12 | Semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-14083F JP1641098S (enExample) | 2018-06-26 | 2018-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1641098S true JP1641098S (enExample) | 2019-09-09 |
Family
ID=67841861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2018-14083F Active JP1641098S (enExample) | 2018-06-26 | 2018-06-26 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD913978S1 (enExample) |
| JP (1) | JP1641098S (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD971863S1 (en) | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1021830S1 (en) | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD937791S1 (en) * | 2018-12-26 | 2021-12-07 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
| USD936025S1 (en) * | 2018-12-26 | 2021-11-16 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
| TWD202895S (zh) * | 2019-03-27 | 2020-02-21 | 家登精密工業股份有限公司 | 光罩盒組裝件 |
| USD1073632S1 (en) * | 2021-04-23 | 2025-05-06 | Wolfspeed, Inc. | Power module |
| JP1727400S (ja) * | 2022-01-28 | 2022-10-14 | 半導体素子 | |
| JP1727398S (ja) * | 2022-01-28 | 2022-10-14 | 半導体素子 | |
| JP1769931S (enExample) * | 2023-09-11 | 2024-05-08 | ||
| JP1769848S (enExample) * | 2023-09-11 | 2024-05-08 | ||
| JP1769849S (enExample) * | 2023-09-11 | 2024-05-08 |
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| US3602846A (en) | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
| US3825876A (en) | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
| US3762039A (en) | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
| US3846734A (en) | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
| US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
| JPS60239043A (ja) | 1984-05-14 | 1985-11-27 | Oki Electric Ind Co Ltd | 半導体装置用パツケ−ジの製造方法 |
| US4987474A (en) * | 1987-09-18 | 1991-01-22 | Hitachi, Ltd. | Semiconductor device and method of manufacturing the same |
| US4916519A (en) | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
| US5557504A (en) | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
| USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD357462S (en) | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD360619S (en) * | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD357901S (en) | 1993-09-27 | 1995-05-02 | Telefonaktiebolaget Lm Ericsson | Power supply unit |
| US5757070A (en) * | 1995-10-24 | 1998-05-26 | Altera Corporation | Integrated circuit package |
| USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD396211S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
| EP0884781A3 (en) | 1997-06-12 | 1999-06-30 | Hitachi, Ltd. | Power semiconductor module |
| USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
| JP2003077939A (ja) | 2001-09-05 | 2003-03-14 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| JP2004063688A (ja) * | 2002-07-26 | 2004-02-26 | Mitsubishi Electric Corp | 半導体装置及び半導体アセンブリモジュール |
| USD505399S1 (en) | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505400S1 (en) | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD548202S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD539761S1 (en) | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| JP5041798B2 (ja) | 2006-12-15 | 2012-10-03 | 三菱電機株式会社 | 半導体装置 |
| USD874411S1 (en) | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
| JP2010147116A (ja) | 2008-12-17 | 2010-07-01 | Mitsubishi Electric Corp | 半導体装置 |
| USD648682S1 (en) * | 2011-03-31 | 2011-11-15 | Cheng Uei Precision Industry Co., Ltd. | Double-card connector |
| USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719537S1 (en) | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD754084S1 (en) | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD772182S1 (en) | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| JP1533793S (enExample) | 2015-02-04 | 2015-09-28 | ||
| USD766851S1 (en) | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
| USD767516S1 (en) | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
| JP6362560B2 (ja) | 2015-03-24 | 2018-07-25 | 三菱電機株式会社 | 半導体モジュール、電力変換装置および半導体モジュールの製造方法 |
| USD814431S1 (en) | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
| JP1551590S (enExample) | 2015-11-30 | 2016-06-13 | ||
| JP1565636S (enExample) | 2016-03-11 | 2016-12-19 | ||
| JP1578687S (enExample) | 2016-11-08 | 2017-06-12 | ||
| USD853342S1 (en) | 2017-02-28 | 2019-07-09 | Infineon Technologies Ag | High-performance semiconductor module |
| JP1603359S (enExample) * | 2017-10-19 | 2018-05-07 | ||
| USD864884S1 (en) | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| USD859334S1 (en) | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877102S1 (en) | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD873226S1 (en) | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
| USD874412S1 (en) | 2018-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
| JP1632173S (enExample) | 2018-06-01 | 2019-05-27 | ||
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
-
2018
- 2018-06-26 JP JPD2018-14083F patent/JP1641098S/ja active Active
- 2018-12-12 US US29/673,188 patent/USD913978S1/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD971863S1 (en) | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1021830S1 (en) | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| USD913978S1 (en) | 2021-03-23 |
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