JP1580899S - - Google Patents

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Publication number
JP1580899S
JP1580899S JPD2016-24833F JP2016024833F JP1580899S JP 1580899 S JP1580899 S JP 1580899S JP 2016024833 F JP2016024833 F JP 2016024833F JP 1580899 S JP1580899 S JP 1580899S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-24833F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-24833F priority Critical patent/JP1580899S/ja
Priority to US29/602,605 priority patent/USD832227S1/en
Application granted granted Critical
Publication of JP1580899S publication Critical patent/JP1580899S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-24833F 2016-11-15 2016-11-15 Active JP1580899S (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2016-24833F JP1580899S (enExample) 2016-11-15 2016-11-15
US29/602,605 USD832227S1 (en) 2016-11-15 2017-05-02 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-24833F JP1580899S (enExample) 2016-11-15 2016-11-15

Publications (1)

Publication Number Publication Date
JP1580899S true JP1580899S (enExample) 2017-07-10

Family

ID=59270492

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-24833F Active JP1580899S (enExample) 2016-11-15 2016-11-15

Country Status (2)

Country Link
US (1) USD832227S1 (enExample)
JP (1) JP1580899S (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD993201S1 (en) 2021-03-09 2023-07-25 Rohm Co., Ltd. Semiconductor module

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JP1592769S (enExample) * 2017-05-02 2017-12-11
JP1603358S (enExample) * 2017-10-19 2018-05-07
JP1603359S (enExample) * 2017-10-19 2018-05-07
JP1642346S (enExample) 2019-03-20 2019-09-30
JP1660133S (enExample) * 2019-09-26 2020-05-25
JP1661378S (enExample) * 2020-02-27 2020-06-08
USD937231S1 (en) 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module
JP1696315S (ja) * 2021-03-23 2021-10-04 電力用半導体素子
JP1725480S (enExample) * 2022-01-05 2022-09-22
JP1725479S (enExample) * 2022-01-05 2022-09-22
JP1741186S (ja) * 2022-11-01 2023-04-06 半導体素子
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
JP1741185S (ja) * 2022-11-01 2023-04-06 半導体素子
TWD230243S (zh) * 2022-11-02 2024-03-01 嘉和半導體股份有限公司 新竹市東區公道五路三段1號7樓之5 (中華民國) 半導體元件的封裝結構

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JP4294405B2 (ja) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ 半導体装置
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD993201S1 (en) 2021-03-09 2023-07-25 Rohm Co., Ltd. Semiconductor module

Also Published As

Publication number Publication date
USD832227S1 (en) 2018-10-30

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