TWD230243S - 半導體元件的封裝結構 - Google Patents

半導體元件的封裝結構 Download PDF

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Publication number
TWD230243S
TWD230243S TW112301956F TW112301956F TWD230243S TW D230243 S TWD230243 S TW D230243S TW 112301956 F TW112301956 F TW 112301956F TW 112301956 F TW112301956 F TW 112301956F TW D230243 S TWD230243 S TW D230243S
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TW
Taiwan
Prior art keywords
semiconductor element
package structure
packaging structure
design
item
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TW112301956F
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English (en)
Inventor
郭家泰
王振宇
王聖博
傅喬
劉耀鍾
Original Assignee
嘉和半導體股份有限公司 新竹市東區公道五路三段1號7樓之5 (中華民國)
嘉和半導體股份有限公司
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Application filed by 嘉和半導體股份有限公司 新竹市東區公道五路三段1號7樓之5 (中華民國), 嘉和半導體股份有限公司 filed Critical 嘉和半導體股份有限公司 新竹市東區公道五路三段1號7樓之5 (中華民國)
Publication of TWD230243S publication Critical patent/TWD230243S/zh

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Abstract

【物品用途】;本設計物品，係用於一種半導體元件的封裝結構。;【設計說明】;本設計物品之特徵包含封裝結構以及封裝結構中電路板的特有紋路。

Description

半導體元件的封裝結構
本設計物品，係用於一種半導體元件的封裝結構。
本設計物品之特徵包含封裝結構以及封裝結構中電路板的特有紋路。
TW112301956F 2022-11-02 2023-04-24 半導體元件的封裝結構 TWD230243S (zh)

Applications Claiming Priority (2)

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CN2022307284508 2022-11-02
CN202230728450 2022-11-02

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TWD230243S true TWD230243S (zh) 2024-03-01

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TW112301956F TWD230243S (zh) 2022-11-02 2023-04-24 半導體元件的封裝結構

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US (1) USD1059315S1 (zh)
TW (1) TWD230243S (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193991S (zh) 2017-06-30 2018-11-11 新世紀光電股份有限公司 發光二極體封裝

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JPH06173081A (ja) * 1992-12-03 1994-06-21 Murata Mfg Co Ltd 電子部品
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
TW473882B (en) * 1998-07-06 2002-01-21 Hitachi Ltd Semiconductor device
JP3842444B2 (ja) * 1998-07-24 2006-11-08 富士通株式会社 半導体装置の製造方法
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
TWD101174S1 (zh) * 2002-03-11 2004-11-01 東芝股份有限公司 半導體元件(四)
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
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JP4294405B2 (ja) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ 半導体装置
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
JP1577498S (zh) * 2016-09-30 2017-05-29
JP1580899S (zh) * 2016-11-15 2017-07-10
JP1577511S (zh) * 2016-11-15 2017-05-29
JP1584883S (zh) * 2017-01-31 2017-08-28
JP1584651S (zh) * 2017-01-31 2017-08-28
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
JP1695980S (zh) * 2021-03-09 2021-09-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193991S (zh) 2017-06-30 2018-11-11 新世紀光電股份有限公司 發光二極體封裝

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USD1059315S1 (en) 2025-01-28

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