JP1660133S - - Google Patents

Info

Publication number
JP1660133S
JP1660133S JPD2019-21603F JP2019021603F JP1660133S JP 1660133 S JP1660133 S JP 1660133S JP 2019021603 F JP2019021603 F JP 2019021603F JP 1660133 S JP1660133 S JP 1660133S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-21603F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-21603F priority Critical patent/JP1660133S/ja
Priority to US29/729,269 priority patent/USD945384S1/en
Application granted granted Critical
Publication of JP1660133S publication Critical patent/JP1660133S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-21603F 2019-09-26 2019-09-26 Active JP1660133S (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-21603F JP1660133S (enExample) 2019-09-26 2019-09-26
US29/729,269 USD945384S1 (en) 2019-09-26 2020-03-25 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-21603F JP1660133S (enExample) 2019-09-26 2019-09-26

Publications (1)

Publication Number Publication Date
JP1660133S true JP1660133S (enExample) 2020-05-25

Family

ID=70775936

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-21603F Active JP1660133S (enExample) 2019-09-26 2019-09-26

Country Status (2)

Country Link
US (1) USD945384S1 (enExample)
JP (1) JP1660133S (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7523928B2 (ja) * 2020-03-27 2024-07-29 ラピスセミコンダクタ株式会社 シールドケース
JP1682283S (enExample) * 2020-07-31 2021-03-29
JP1680788S (enExample) * 2020-07-31 2021-03-08

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
KR100209760B1 (ko) * 1996-12-19 1999-07-15 구본준 반도체 패키지 및 이의 제조방법
USD396696S (en) * 1997-01-30 1998-08-04 Sony Corporation Semiconductor package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
KR100218368B1 (ko) * 1997-04-18 1999-09-01 구본준 리드프레임과 그를 이용한 반도체 패키지 및 그의 제조방법
TW473882B (en) * 1998-07-06 2002-01-21 Hitachi Ltd Semiconductor device
KR100355794B1 (ko) * 1999-10-15 2002-10-19 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD459317S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD458234S1 (en) * 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) * 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) * 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459316S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) * 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) * 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
JP4068336B2 (ja) * 2001-11-30 2008-03-26 株式会社東芝 半導体装置
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
TWD101174S1 (zh) * 2002-03-11 2004-11-01 東芝股份有限公司 半導體元件(四)
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
JP4294405B2 (ja) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ 半導体装置
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
JP4600065B2 (ja) * 2005-02-03 2010-12-15 富士電機システムズ株式会社 半導体装置及びその製造方法
USD633879S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD834545S1 (en) * 2015-04-01 2018-11-27 Infineon Technologies Ag Semiconductor module
US9553022B1 (en) * 2015-07-06 2017-01-24 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
JP6827776B2 (ja) * 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
JP1577511S (enExample) * 2016-11-15 2017-05-29
JP1580899S (enExample) * 2016-11-15 2017-07-10
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
JP1665773S (enExample) * 2018-11-07 2020-08-11
JP1642346S (enExample) * 2019-03-20 2019-09-30

Also Published As

Publication number Publication date
USD945384S1 (en) 2022-03-08

Similar Documents

Publication Publication Date Title
BR112019017762A2 (enExample)
JP1642346S (enExample)
BR112021008711A2 (enExample)
BR112019016141A2 (enExample)
AU2020104490A5 (enExample)
BR112019016138A2 (enExample)
BR112019016142A2 (enExample)
BR112021012348A2 (enExample)
BR112021013128A2 (enExample)
BR112019016136A2 (enExample)
BR102019023359A2 (enExample)
BR102020020816B1 (pt) Veículo, e, método para controlar o movimento de ar através de um veículo com uma ventoinha do veículo
BR102020018650B1 (pt) Método para preparar óxido de cálcio usando um forno pré- aquecedor de suspensão de múltiplos estágios
BR102020017390B1 (pt) Bomba multifásica
BR102020011722B1 (pt) Porta de tela para um pacote de radiadores
BR102020005860B1 (pt) Controle de obstrução para um implemento agrícola
BR112021012379B1 (pt) Material de aço adequado para uso em ambiente ácido
BR112021012064B1 (pt) Sistema e método de previsão de risco de ataque de insetos
BR112021013352B1 (pt) Processo e dispositivo para endireitar arame ou material de fita
BR112021010564B1 (pt) Sistema de armadilha para animais e método de monitoramento do mesmo
BR112021013470B1 (pt) Conector de acesso sem agulha para facilitar a entrega de instrumento a um conjunto de cateter
BR102020000355B1 (pt) Embreagem que tem dois estágios para aplicar torque variado entre um eixo de entrada e um eixo de saída
BR102019027339B1 (pt) Sistema de aspersão de água e difusor de sistema de aspersão de água
BR102019026542B1 (pt) Sistema para detectar e controlar a posição de spoiler de asa de aeronave
BR102019026293B1 (pt) Sistema de aeronave, e, método para transmitir energia de um primeiro componente para um segundo componente