JP1580899S - - Google Patents
Info
- Publication number
- JP1580899S JP1580899S JPD2016-24833F JP2016024833F JP1580899S JP 1580899 S JP1580899 S JP 1580899S JP 2016024833 F JP2016024833 F JP 2016024833F JP 1580899 S JP1580899 S JP 1580899S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-24833F JP1580899S (enrdf_load_stackoverflow) | 2016-11-15 | 2016-11-15 | |
US29/602,605 USD832227S1 (en) | 2016-11-15 | 2017-05-02 | Semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-24833F JP1580899S (enrdf_load_stackoverflow) | 2016-11-15 | 2016-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1580899S true JP1580899S (enrdf_load_stackoverflow) | 2017-07-10 |
Family
ID=59270492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2016-24833F Active JP1580899S (enrdf_load_stackoverflow) | 2016-11-15 | 2016-11-15 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD832227S1 (enrdf_load_stackoverflow) |
JP (1) | JP1580899S (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD993201S1 (en) | 2021-03-09 | 2023-07-25 | Rohm Co., Ltd. | Semiconductor module |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1592769S (enrdf_load_stackoverflow) * | 2017-05-02 | 2017-12-11 | ||
JP1603358S (enrdf_load_stackoverflow) * | 2017-10-19 | 2018-05-07 | ||
JP1603359S (enrdf_load_stackoverflow) * | 2017-10-19 | 2018-05-07 | ||
JP1642346S (enrdf_load_stackoverflow) | 2019-03-20 | 2019-09-30 | ||
JP1660133S (enrdf_load_stackoverflow) * | 2019-09-26 | 2020-05-25 | ||
JP1661378S (enrdf_load_stackoverflow) * | 2020-02-27 | 2020-06-08 | ||
USD937231S1 (en) | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
JP1696315S (ja) * | 2021-03-23 | 2021-10-04 | 電力用半導体素子 | |
USD1056861S1 (en) * | 2021-03-23 | 2025-01-07 | Rohm Co., Ltd. | Power semiconductor module |
USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
JP1725480S (enrdf_load_stackoverflow) * | 2022-01-05 | 2022-09-22 | ||
JP1725479S (enrdf_load_stackoverflow) * | 2022-01-05 | 2022-09-22 | ||
JP1741186S (ja) * | 2022-11-01 | 2023-04-06 | 半導体素子 | |
JP1741185S (ja) * | 2022-11-01 | 2023-04-06 | 半導体素子 | |
USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
TWD230243S (zh) * | 2022-11-02 | 2024-03-01 | 嘉和半導體股份有限公司 新竹市東區公道五路三段1號7樓之5 (中華民國) | 半導體元件的封裝結構 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
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USD259782S (en) * | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259560S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) * | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
JPS60239043A (ja) * | 1984-05-14 | 1985-11-27 | Oki Electric Ind Co Ltd | 半導体装置用パツケ−ジの製造方法 |
JP2744685B2 (ja) * | 1990-08-08 | 1998-04-28 | 三菱電機株式会社 | 半導体装置 |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD397092S (en) * | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
KR100218368B1 (ko) * | 1997-04-18 | 1999-09-01 | 구본준 | 리드프레임과 그를 이용한 반도체 패키지 및 그의 제조방법 |
EP0884781A3 (en) * | 1997-06-12 | 1999-06-30 | Hitachi, Ltd. | Power semiconductor module |
TW473882B (en) * | 1998-07-06 | 2002-01-21 | Hitachi Ltd | Semiconductor device |
USD416236S (en) * | 1998-09-02 | 1999-11-09 | Citizen Electronics Co., Ltd. | Integrated circuit package |
JP2000208690A (ja) * | 1999-01-12 | 2000-07-28 | Sony Corp | リ―ドフレ―ム、樹脂封止型半導体装置およびその製造方法 |
KR100355794B1 (ko) * | 1999-10-15 | 2002-10-19 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지 |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
JP4151209B2 (ja) * | 2000-08-29 | 2008-09-17 | 三菱電機株式会社 | 電力用半導体装置 |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
TWD101174S1 (zh) * | 2002-03-11 | 2004-11-01 | 東芝股份有限公司 | 半導體元件(四) |
USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD509810S1 (en) * | 2003-07-30 | 2005-09-20 | Delta Electronics Inc. | Molding structure of electric element |
JP4294405B2 (ja) * | 2003-07-31 | 2009-07-15 | 株式会社ルネサステクノロジ | 半導体装置 |
USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
JP1563812S (enrdf_load_stackoverflow) * | 2016-04-11 | 2016-11-21 |
-
2016
- 2016-11-15 JP JPD2016-24833F patent/JP1580899S/ja active Active
-
2017
- 2017-05-02 US US29/602,605 patent/USD832227S1/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD993201S1 (en) | 2021-03-09 | 2023-07-25 | Rohm Co., Ltd. | Semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
USD832227S1 (en) | 2018-10-30 |