JP1642346S - - Google Patents

Info

Publication number
JP1642346S
JP1642346S JPD2019-5939F JP2019005939F JP1642346S JP 1642346 S JP1642346 S JP 1642346S JP 2019005939 F JP2019005939 F JP 2019005939F JP 1642346 S JP1642346 S JP 1642346S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-5939F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-5939F priority Critical patent/JP1642346S/ja
Priority to US29/705,573 priority patent/USD904325S1/en
Application granted granted Critical
Publication of JP1642346S publication Critical patent/JP1642346S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-5939F 2019-03-20 2019-03-20 Active JP1642346S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-5939F JP1642346S (enrdf_load_stackoverflow) 2019-03-20 2019-03-20
US29/705,573 USD904325S1 (en) 2019-03-20 2019-09-13 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-5939F JP1642346S (enrdf_load_stackoverflow) 2019-03-20 2019-03-20

Publications (1)

Publication Number Publication Date
JP1642346S true JP1642346S (enrdf_load_stackoverflow) 2019-09-30

Family

ID=68052196

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-5939F Active JP1642346S (enrdf_load_stackoverflow) 2019-03-20 2019-03-20

Country Status (2)

Country Link
US (1) USD904325S1 (enrdf_load_stackoverflow)
JP (1) JP1642346S (enrdf_load_stackoverflow)

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US11333677B2 (en) 2018-07-23 2022-05-17 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
JP1664282S (enrdf_load_stackoverflow) * 2019-07-24 2020-07-27
JP1659716S (enrdf_load_stackoverflow) * 2019-08-29 2020-05-18
JP1659677S (enrdf_load_stackoverflow) * 2019-08-29 2020-05-18
JP1659675S (enrdf_load_stackoverflow) 2019-08-29 2020-05-18
JP1659676S (enrdf_load_stackoverflow) 2019-08-29 2020-05-18
JP1659674S (enrdf_load_stackoverflow) * 2019-08-29 2020-05-18
JP1659673S (enrdf_load_stackoverflow) * 2019-08-29 2020-05-18
JP1659678S (enrdf_load_stackoverflow) 2019-08-29 2020-05-18
JP1660133S (enrdf_load_stackoverflow) * 2019-09-26 2020-05-25
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
JP1682283S (enrdf_load_stackoverflow) * 2020-07-31 2021-03-29
JP1680788S (enrdf_load_stackoverflow) * 2020-07-31 2021-03-08

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JP1580899S (enrdf_load_stackoverflow) 2016-11-15 2017-07-10

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