USD904325S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD904325S1
USD904325S1 US29/705,573 US201929705573F USD904325S US D904325 S1 USD904325 S1 US D904325S1 US 201929705573 F US201929705573 F US 201929705573F US D904325 S USD904325 S US D904325S
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semiconductor module
view
semiconductor
module
ornamental design
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Takanori Omichi
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Sansha Electric Manufacturing Co Ltd
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Sansha Electric Manufacturing Co Ltd
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Assigned to SANSHA ELECTRIC MANUFACTURING COMPANY, LIMITED reassignment SANSHA ELECTRIC MANUFACTURING COMPANY, LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OMICHI, TAKANORI
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US29/705,573 2019-03-20 2019-09-13 Semiconductor module Active USD904325S1 (en)

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JPD2019-5939F JP1642346S (enrdf_load_stackoverflow) 2019-03-20 2019-03-20
JP2019-5939 2019-03-20

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD934190S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934189S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934188S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934822S1 (en) * 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD1046799S1 (en) * 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module

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USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
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USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module

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US3497750A (en) * 1966-12-02 1970-02-24 Westinghouse Electric Corp Flexible electroluminescent lamp with dual-purpose metallized plastic film component
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
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USD432505S (en) * 1997-08-06 2000-10-24 Sony Corporation Semiconductor element
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD461171S1 (en) * 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD459317S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) * 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) * 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD458234S1 (en) * 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
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USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
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USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
US20080200041A1 (en) * 2007-02-16 2008-08-21 Ritek Corporation Storage device
US20110248627A1 (en) * 2010-04-07 2011-10-13 Panasonic Electric Works Co., Ltd. Organic el module and illumination device including same
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11747775B2 (en) 2018-07-23 2023-09-05 CACI, Inc.—Federal Integrated tamper detection system and methods
US11333677B2 (en) 2018-07-23 2022-05-17 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
US11662698B2 (en) 2018-07-23 2023-05-30 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
USD1046799S1 (en) * 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934822S1 (en) * 2019-08-29 2021-11-02 Rohm Co., Ltd. Circuit board for power semiconductor module
USD981355S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD981354S1 (en) 2019-08-29 2023-03-21 Rohm Co., Ltd. Power semiconductor module
USD934188S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Power semiconductor module
USD934189S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD934190S1 (en) * 2019-08-29 2021-10-26 Rohm Co., Ltd. Circuit board for power semiconductor module
USD969761S1 (en) 2019-08-29 2022-11-15 Rohm Co., Ltd. Power semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module

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