IT1070048B - Metodo di fabbriacazione di un dispositivo semiconduttore e dispositivo fabbricato con detto metodo - Google Patents

Metodo di fabbriacazione di un dispositivo semiconduttore e dispositivo fabbricato con detto metodo

Info

Publication number
IT1070048B
IT1070048B IT29113/76A IT2911376A IT1070048B IT 1070048 B IT1070048 B IT 1070048B IT 29113/76 A IT29113/76 A IT 29113/76A IT 2911376 A IT2911376 A IT 2911376A IT 1070048 B IT1070048 B IT 1070048B
Authority
IT
Italy
Prior art keywords
manufacture
semiconductive
manufactured
device manufactured
semiconductive device
Prior art date
Application number
IT29113/76A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT1070048B publication Critical patent/IT1070048B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/225—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H10P30/212—Through-implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/22—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/944—Shadow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/983—Zener diodes
IT29113/76A 1975-11-11 1976-11-08 Metodo di fabbriacazione di un dispositivo semiconduttore e dispositivo fabbricato con detto metodo IT1070048B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7513161A NL7513161A (nl) 1975-11-11 1975-11-11 Werkwijze ter vervaardiging van een halfgeleider- inrichting, en inrichting vervaardigd volgens de werkwijze.

Publications (1)

Publication Number Publication Date
IT1070048B true IT1070048B (it) 1985-03-25

Family

ID=19824830

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29113/76A IT1070048B (it) 1975-11-11 1976-11-08 Metodo di fabbriacazione di un dispositivo semiconduttore e dispositivo fabbricato con detto metodo

Country Status (9)

Country Link
US (1) US4104085A (it)
JP (1) JPS5260579A (it)
AU (1) AU505948B2 (it)
CA (1) CA1071333A (it)
DE (1) DE2650511C2 (it)
FR (1) FR2331884A1 (it)
GB (1) GB1553417A (it)
IT (1) IT1070048B (it)
NL (1) NL7513161A (it)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2802838A1 (de) * 1978-01-23 1979-08-16 Siemens Ag Mis-feldeffekttransistor mit kurzer kanallaenge
US4357178A (en) * 1978-12-20 1982-11-02 Ibm Corporation Schottky barrier diode with controlled characteristics and fabrication method
FR2445617A1 (fr) * 1978-12-28 1980-07-25 Ibm France Resistance a tension de claquage amelioree obtenue par une double implantation ionique dans un substrat semi-conducteur et son procede de fabrication
JPS5826829B2 (ja) * 1979-08-30 1983-06-06 富士通株式会社 ダイナミックメモリセルの製造方法
NL7907680A (nl) * 1979-10-18 1981-04-22 Philips Nv Zenerdiode.
DE3003391C2 (de) * 1980-01-31 1984-08-30 Josef Dipl.-Phys. Dr. 8041 Fahrenzhausen Kemmer Strahlungsdetektor mit einem passivierten pn-Halbleiterübergang
JPS5856481A (ja) * 1981-09-30 1983-04-04 Fujitsu Ltd ゲルマニウム受光素子の製造方法
US4473941A (en) * 1982-12-22 1984-10-02 Ncr Corporation Method of fabricating zener diodes
DE3581348D1 (de) * 1984-09-28 1991-02-21 Siemens Ag Verfahren zum herstellen eines pn-uebergangs mit hoher durchbruchsspannung.
US4579626A (en) * 1985-02-28 1986-04-01 Rca Corporation Method of making a charge-coupled device imager
US4910158A (en) * 1987-11-23 1990-03-20 Hughes Aircraft Company Zener diode emulation and method of forming the same
US4968634A (en) * 1988-05-20 1990-11-06 Siemens Aktiengesellschaft Fabrication process for photodiodes responsive to blue light
CN1011991B (zh) * 1988-08-29 1991-03-13 里特机械公司 在纺织机械内的一种加热方法
JPH02159775A (ja) * 1988-12-14 1990-06-19 Toshiba Corp 半導体受光素子及びその製造方法
US5256579A (en) * 1989-04-03 1993-10-26 Massachusetts Institute Of Technology Tunable-frequency Gunn diodes fabrication with focused ion beams
US5550069A (en) * 1990-06-23 1996-08-27 El Mos Electronik In Mos Technologie Gmbh Method for producing a PMOS transistor
DE4020076A1 (de) * 1990-06-23 1992-01-09 El Mos Elektronik In Mos Techn Verfahren zur herstellung eines pmos-transistors sowie pmos-transistor
JPH07245397A (ja) * 1994-03-07 1995-09-19 Oki Electric Ind Co Ltd 半導体装置の製造方法
US5384273A (en) * 1994-04-26 1995-01-24 Motorola Inc. Method of making a semiconductor device having a short gate length
WO1997011498A1 (en) * 1995-09-18 1997-03-27 Philips Electronics N.V. A varicap diode and method of manufacturing a varicap diode
JPH10242394A (ja) * 1997-02-27 1998-09-11 Matsushita Electron Corp 半導体装置の製造方法
JP3016371B2 (ja) * 1997-03-26 2000-03-06 日本電気株式会社 光検出器の製造方法
DE19837395C2 (de) * 1998-08-18 2001-07-19 Infineon Technologies Ag Verfahren zur Herstellung eines eine strukturierte Isolationsschicht enthaltenden Halbleiterbauelements
US6815363B2 (en) * 2000-08-11 2004-11-09 The Regents Of The University Of California Method for nanomachining high aspect ratio structures
US7887711B2 (en) * 2002-06-13 2011-02-15 International Business Machines Corporation Method for etching chemically inert metal oxides
DE102009017505B4 (de) * 2008-11-21 2014-07-10 Ketek Gmbh Strahlungsdetektor, Verwendung eines Strahlungsdetektors und Verfahren zur Herstellung eines Strahlungsdetektors
US8350365B1 (en) * 2011-01-13 2013-01-08 Xilinx, Inc. Mitigation of well proximity effect in integrated circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697829A (en) * 1968-12-30 1972-10-10 Gen Electric Semiconductor devices with improved voltage breakdown characteristics
BE756039A (fr) * 1969-09-15 1971-02-15 Western Electric Co Procede pour former, par implantation d'ions, une zone localisee dans un corps de semi-conducteur
US3666548A (en) * 1970-01-06 1972-05-30 Ibm Monocrystalline semiconductor body having dielectrically isolated regions and method of forming
JPS5624392B2 (it) * 1971-08-11 1981-06-05
DE2207654B2 (de) * 1972-02-18 1974-02-14 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zum Herstellen einer Zenerdiode
US3769109A (en) * 1972-04-19 1973-10-30 Bell Telephone Labor Inc PRODUCTION OF SiO{11 {11 TAPERED FILMS

Also Published As

Publication number Publication date
FR2331884B1 (it) 1982-06-18
CA1071333A (en) 1980-02-05
JPS5756786B2 (it) 1982-12-01
GB1553417A (en) 1979-09-26
AU1944276A (en) 1978-05-18
DE2650511A1 (de) 1977-05-12
AU505948B2 (en) 1979-12-06
JPS5260579A (en) 1977-05-19
US4104085A (en) 1978-08-01
NL7513161A (nl) 1977-05-13
DE2650511C2 (de) 1983-10-27
FR2331884A1 (fr) 1977-06-10

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