IN2015DN01821A - - Google Patents

Info

Publication number
IN2015DN01821A
IN2015DN01821A IN1821DEN2015A IN2015DN01821A IN 2015DN01821 A IN2015DN01821 A IN 2015DN01821A IN 1821DEN2015 A IN1821DEN2015 A IN 1821DEN2015A IN 2015DN01821 A IN2015DN01821 A IN 2015DN01821A
Authority
IN
India
Prior art keywords
plasma
silicon nitride
ammonia gas
chamber
flow
Prior art date
Application number
Other languages
English (en)
Inventor
Mitsuhito Takahashi
Takenori Watabe
Hiroyuki Otsuka
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of IN2015DN01821A publication Critical patent/IN2015DN01821A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/129—Passivating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H01L21/205—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H10F77/315—Coatings for devices having potential barriers for photovoltaic cells the coatings being antireflective or having enhancing optical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Photovoltaic Devices (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Crystallography & Structural Chemistry (AREA)
IN1821DEN2015 2012-08-09 2013-07-30 IN2015DN01821A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012176907 2012-08-09
PCT/JP2013/070564 WO2014024729A1 (ja) 2012-08-09 2013-07-30 太陽電池の製造方法、及びその製造方法により製造された太陽電池

Publications (1)

Publication Number Publication Date
IN2015DN01821A true IN2015DN01821A (enExample) 2015-05-29

Family

ID=50067961

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1821DEN2015 IN2015DN01821A (enExample) 2012-08-09 2013-07-30

Country Status (10)

Country Link
US (1) US9559221B2 (enExample)
EP (1) EP2884544B1 (enExample)
JP (1) JP5884911B2 (enExample)
KR (1) KR102097758B1 (enExample)
CN (1) CN104521003B (enExample)
IN (1) IN2015DN01821A (enExample)
MY (1) MY170163A (enExample)
RU (1) RU2635834C2 (enExample)
TW (1) TWI622183B (enExample)
WO (1) WO2014024729A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014024729A1 (ja) * 2012-08-09 2014-02-13 信越化学工業株式会社 太陽電池の製造方法、及びその製造方法により製造された太陽電池
JP6369680B2 (ja) * 2014-05-30 2018-08-08 パナソニックＩｐマネジメント株式会社 太陽電池
US9559236B2 (en) * 2014-09-24 2017-01-31 Sunpower Corporation Solar cell fabricated by simplified deposition process
CN106282965B (zh) * 2016-08-31 2019-09-20 东方日升新能源股份有限公司 太阳能电池硅片的等离子增强化学气相沉积法
US20210381107A1 (en) * 2020-06-03 2021-12-09 Micron Technology, Inc. Material deposition systems, and related methods and microelectronic devices
CN115425114B (zh) * 2022-09-30 2025-09-12 福建金石能源有限公司 一种异质结太阳能电池的制造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5073804A (en) * 1977-12-05 1991-12-17 Plasma Physics Corp. Method of forming semiconductor materials and barriers
JP2808004B2 (ja) * 1989-01-30 1998-10-08 京セラ株式会社 太陽電池
JPH0873297A (ja) 1994-09-05 1996-03-19 Shin Etsu Chem Co Ltd 太陽電池用基板材料の製法とこれを用いた太陽電池
EP0994515B1 (en) * 1998-10-12 2007-08-22 Kaneka Corporation Method of manufacturing silicon-based thin-film photoelectric conversion device
JP2002270879A (ja) * 2001-03-14 2002-09-20 Mitsubishi Electric Corp 半導体装置
JP2003273034A (ja) * 2002-03-14 2003-09-26 Crystage Co Ltd 薄膜形成装置
JP4186827B2 (ja) 2004-01-30 2008-11-26 日立電線株式会社 半導体の製造方法
JP4540447B2 (ja) * 2004-10-27 2010-09-08 シャープ株式会社 太陽電池および太陽電池の製造方法
JP4767110B2 (ja) * 2006-06-30 2011-09-07 シャープ株式会社 太陽電池、および太陽電池の製造方法
JP2009117569A (ja) 2007-11-06 2009-05-28 Shimadzu Corp 反射防止膜成膜方法および反射防止膜成膜装置
JP5173370B2 (ja) 2007-11-21 2013-04-03 シャープ株式会社 光電変換素子の製造方法
JP4573902B2 (ja) * 2008-03-28 2010-11-04 三菱電機株式会社 薄膜形成方法
RU2417481C2 (ru) * 2009-02-13 2011-04-27 Российская Академия сельскохозяйственных наук Государственное научное учреждение Всероссийский научно-исследовательский институт электрификации сельского хозяйства (ГНУ ВИЭСХ РОССЕЛЬХОЗАКАДЕМИИ) Фотоэлектрический преобразователь (варианты) и способ его изготовления (варианты)
DE102010000002B4 (de) * 2010-01-04 2013-02-21 Roth & Rau Ag Verfahren zur Abscheidung von Mehrlagenschichten und/oder Gradientenschichten
US20110245957A1 (en) * 2010-04-06 2011-10-06 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
US20110272024A1 (en) * 2010-04-13 2011-11-10 Applied Materials, Inc. MULTI-LAYER SiN FOR FUNCTIONAL AND OPTICAL GRADED ARC LAYERS ON CRYSTALLINE SOLAR CELLS
KR101381305B1 (ko) * 2010-04-23 2014-04-07 솔렉셀, 인크. 고효율 태양 전지 극 저 표면 재결합 속도를 달성하기 위한 패시베이션 방법 및 장치
US20110262641A1 (en) * 2010-04-26 2011-10-27 Aventa Systems, Llc Inline chemical vapor deposition system
US20110272008A1 (en) * 2010-05-07 2011-11-10 Applied Materials, Inc. Oxide nitride stack for backside reflector of solar cell
WO2012036002A1 (ja) * 2010-09-14 2012-03-22 信越化学工業株式会社 太陽電池及びその製造方法
US20120164784A1 (en) * 2010-12-23 2012-06-28 Primestar Solar, Inc. Integrated deposition of thin film layers in cadmium telluride based photovoltaic module manufacture
CN104025304A (zh) * 2012-01-03 2014-09-03 应用材料公司 用于提高si太阳能电池的表面钝化的性能和稳定性的缓冲层
CN104040732A (zh) * 2012-01-03 2014-09-10 应用材料公司 钝化结晶硅太阳能电池的先进平台
WO2014024729A1 (ja) * 2012-08-09 2014-02-13 信越化学工業株式会社 太陽電池の製造方法、及びその製造方法により製造された太陽電池
US20140174532A1 (en) * 2012-12-21 2014-06-26 Michael P. Stewart Optimized anti-reflection coating layer for crystalline silicon solar cells

Also Published As

Publication number Publication date
RU2015107986A (ru) 2016-09-27
EP2884544A1 (en) 2015-06-17
CN104521003B (zh) 2016-11-23
WO2014024729A1 (ja) 2014-02-13
US9559221B2 (en) 2017-01-31
CN104521003A (zh) 2015-04-15
TWI622183B (zh) 2018-04-21
KR20150041785A (ko) 2015-04-17
EP2884544B1 (en) 2018-05-09
TW201428989A (zh) 2014-07-16
MY170163A (en) 2019-07-09
EP2884544A4 (en) 2016-02-10
RU2635834C2 (ru) 2017-11-16
US20150206990A1 (en) 2015-07-23
JPWO2014024729A1 (ja) 2016-07-25
KR102097758B1 (ko) 2020-04-07
JP5884911B2 (ja) 2016-03-15

Similar Documents

Publication Publication Date Title
KR102889866B1 (ko) 캡슐화 방법
IN2015DN01821A (enExample)
TWI714534B (zh) 原子層沉積所形成的氮化矽膜之特徵部內溼蝕刻速率的均勻降低用方法及設備
JP6367658B2 (ja) プラズマアシストプロセスにより酸化膜を生成する方法
TW200641998A (en) Formation of silicon nitride film
WO2013098702A3 (en) Mixed mode pulsing etching in plasma processing systems
US9165762B2 (en) Method of depositing silicone dioxide films
WO2011137059A3 (en) Amorphous carbon deposition method for improved stack defectivity
JP2011044704A5 (ja) 微結晶半導体膜の作製方法および半導体装置の作製方法
TW201614094A (en) Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates
WO2012002995A3 (en) Thin films and methods of making them using cyclohexasilane
WO2012044622A3 (en) Low-temperature dielectric film formation by chemical vapor deposition
WO2008064109A3 (en) Equipment for high volume manufacture of group iii-v semiconductor materials
TW200629336A (en) Semiconductor plasma-processing apparatus and method
WO2011156657A3 (en) High productivity thin film deposition method and system
WO2012170150A3 (en) Selective deposition of polymer films on bare silicon instead of oxide surface
JP2013153164A5 (enExample)
WO2010105585A8 (de) Substratbearbeitungsanlage und substratbearbeitungsverfahren
WO2008130448A3 (en) Temperature-controlled purge gate valve for chemical vapor deposition chamber
MY182212A (en) Methods and structures for forming and protecting thin films on substrates
WO2012047035A3 (ko) 대칭형 유입구 및 유출구를 통해 반응가스를 공급하는 기판 처리 장치
CN103578937B (zh) 氮化硅薄膜的制造方法
TW201130049A (en) Method for forming silicon nitride film, and method for producing semiconductor memory device
US20200032392A1 (en) Hyrodgen partial pressure control in a vacuum process chamber
FI20115321A0 (fi) Menetelmä yhden tai useamman monikiteisen piikerroksen kerrrostamiseksi substraatille