FI20115321A0 - Menetelmä yhden tai useamman monikiteisen piikerroksen kerrrostamiseksi substraatille - Google Patents
Menetelmä yhden tai useamman monikiteisen piikerroksen kerrrostamiseksi substraatilleInfo
- Publication number
- FI20115321A0 FI20115321A0 FI20115321A FI20115321A FI20115321A0 FI 20115321 A0 FI20115321 A0 FI 20115321A0 FI 20115321 A FI20115321 A FI 20115321A FI 20115321 A FI20115321 A FI 20115321A FI 20115321 A0 FI20115321 A0 FI 20115321A0
- Authority
- FI
- Finland
- Prior art keywords
- depositing
- substrate
- polycrystalline silicon
- silicon layers
- reactor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76882—Reflowing or applying of pressure to better fill the contact hole
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20115321A FI124354B (fi) | 2011-04-04 | 2011-04-04 | Menetelmä yhden tai useamman polykiteisen piikerroksen pinnoittamiseksi substraatille |
CA2832084A CA2832084C (en) | 2011-04-04 | 2012-03-30 | Method for depositing one or more polycrystalline silicon layers on substrate |
PCT/FI2012/050325 WO2012136888A1 (en) | 2011-04-04 | 2012-03-30 | Method for depositing one or more polycrystalline silicon layers on substrate |
CN201280024707.5A CN103547704B (zh) | 2011-04-04 | 2012-03-30 | 用于在衬底上沉积一个或者多个多晶硅层的方法 |
EP12768580.8A EP2694699B1 (en) | 2011-04-04 | 2012-03-30 | Method for depositing one or more polycrystalline silicon layers on substrate |
US14/009,838 US9728452B2 (en) | 2011-04-04 | 2012-03-30 | Method for depositing one or more polycrystalline silicon layers on substrate |
SG2013074000A SG194066A1 (en) | 2011-04-04 | 2012-03-30 | Method for depositing one or more polycrystalline silicon layers on substrate |
JP2014503183A JP6117769B2 (ja) | 2011-04-04 | 2012-03-30 | スルーウェハービアを基材に形成するための方法 |
JP2017004355A JP6374540B2 (ja) | 2011-04-04 | 2017-01-13 | 1層以上の多結晶シリコン層を基材に堆積する方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20115321 | 2011-04-04 | ||
FI20115321A FI124354B (fi) | 2011-04-04 | 2011-04-04 | Menetelmä yhden tai useamman polykiteisen piikerroksen pinnoittamiseksi substraatille |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20115321A0 true FI20115321A0 (fi) | 2011-04-04 |
FI20115321L FI20115321L (fi) | 2012-10-05 |
FI124354B FI124354B (fi) | 2014-07-15 |
Family
ID=43919644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20115321A FI124354B (fi) | 2011-04-04 | 2011-04-04 | Menetelmä yhden tai useamman polykiteisen piikerroksen pinnoittamiseksi substraatille |
Country Status (8)
Country | Link |
---|---|
US (1) | US9728452B2 (fi) |
EP (1) | EP2694699B1 (fi) |
JP (2) | JP6117769B2 (fi) |
CN (1) | CN103547704B (fi) |
CA (1) | CA2832084C (fi) |
FI (1) | FI124354B (fi) |
SG (1) | SG194066A1 (fi) |
WO (1) | WO2012136888A1 (fi) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101706747B1 (ko) * | 2015-05-08 | 2017-02-15 | 주식회사 유진테크 | 비정질 박막의 형성방법 |
CN106894080B (zh) * | 2015-12-18 | 2019-03-29 | 有研半导体材料有限公司 | 一种大直径硅基多晶硅膜的制备方法 |
FR3076292B1 (fr) * | 2017-12-28 | 2020-01-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de transfert d'une couche utile sur un substrat support |
CN111785628A (zh) * | 2020-06-28 | 2020-10-16 | 上海华虹宏力半导体制造有限公司 | Igbt器件的制造方法 |
CN111883428A (zh) * | 2020-07-16 | 2020-11-03 | 上海华虹宏力半导体制造有限公司 | 发射区多晶硅的形成方法及器件 |
CN112490114B (zh) * | 2020-11-27 | 2023-11-14 | 上海华虹宏力半导体制造有限公司 | 一种调整多晶硅沉积速率的方法及锗硅hbt器件的制造方法 |
CN115613007A (zh) * | 2022-10-13 | 2023-01-17 | 上海中欣晶圆半导体科技有限公司 | 一种改善翘曲的成膜方法 |
Family Cites Families (38)
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US4882299A (en) * | 1987-07-16 | 1989-11-21 | Texas Instruments Incorporated | Deposition of polysilicon using a remote plasma and in situ generation of UV light. |
EP0467190B1 (en) * | 1990-07-16 | 1997-03-19 | Applied Materials, Inc. | Process for depositing highly doped polysilicon layer on stepped surface of semiconductor wafer resulting in enhanced step coverage |
US5141892A (en) | 1990-07-16 | 1992-08-25 | Applied Materials, Inc. | Process for depositing highly doped polysilicon layer on stepped surface of semiconductor wafer resulting in enhanced step coverage |
US5080933A (en) * | 1990-09-04 | 1992-01-14 | Motorola, Inc. | Selective deposition of polycrystalline silicon |
US6328794B1 (en) * | 1993-06-26 | 2001-12-11 | International Business Machines Corporation | Method of controlling stress in a film |
JP2685028B2 (ja) * | 1995-05-31 | 1997-12-03 | 日本電気株式会社 | 半導体装置の製造方法 |
US5618752A (en) | 1995-06-05 | 1997-04-08 | Harris Corporation | Method of fabrication of surface mountable integrated circuits |
TW388123B (en) * | 1997-09-02 | 2000-04-21 | Tsmc Acer Semiconductor Mfg Co | Method of producing DRAM capacitance and structure thereof |
US7786562B2 (en) * | 1997-11-11 | 2010-08-31 | Volkan Ozguz | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias |
US6162711A (en) * | 1999-01-15 | 2000-12-19 | Lucent Technologies, Inc. | In-situ boron doped polysilicon with dual layer and dual grain structure for use in integrated circuits manufacturing |
KR100442570B1 (ko) * | 2000-06-29 | 2004-07-30 | 주식회사 하이닉스반도체 | 반도체소자의 이중게이트전극 형성방법 |
JP4484185B2 (ja) * | 2000-08-29 | 2010-06-16 | コバレントマテリアル株式会社 | シリコン半導体基板の化学的気相薄膜成長方法 |
JP2003077845A (ja) * | 2001-09-05 | 2003-03-14 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
JP4439796B2 (ja) * | 2001-10-05 | 2010-03-24 | 株式会社日立国際電気 | 半導体デバイスの製造方法および基板処理装置 |
US6905963B2 (en) * | 2001-10-05 | 2005-06-14 | Hitachi Kokusai Electric, Inc. | Fabrication of B-doped silicon film by LPCVD method using BCI3 and SiH4 gases |
US6639312B2 (en) * | 2001-11-07 | 2003-10-28 | Matrix Semiconductor, Inc | Dummy wafers and methods for making the same |
JP2005039153A (ja) * | 2003-07-18 | 2005-02-10 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体デバイスの製造方法 |
US7208369B2 (en) * | 2003-09-15 | 2007-04-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual poly layer and method of manufacture |
US7468311B2 (en) * | 2003-09-30 | 2008-12-23 | Tokyo Electron Limited | Deposition of silicon-containing films from hexachlorodisilane |
US20050181633A1 (en) * | 2004-02-17 | 2005-08-18 | Hochberg Arthur K. | Precursors for depositing silicon-containing films and processes thereof |
US7435665B2 (en) * | 2004-10-06 | 2008-10-14 | Okmetic Oyj | CVD doped structures |
KR100618869B1 (ko) * | 2004-10-22 | 2006-09-13 | 삼성전자주식회사 | 커패시터를 포함하는 반도체 소자 및 그 제조방법 |
US7205187B2 (en) * | 2005-01-18 | 2007-04-17 | Tokyo Electron Limited | Micro-feature fill process and apparatus using hexachlorodisilane or other chlorine-containing silicon precursor |
US20070048956A1 (en) | 2005-08-30 | 2007-03-01 | Tokyo Electron Limited | Interrupted deposition process for selective deposition of Si-containing films |
JPWO2007077917A1 (ja) * | 2005-12-28 | 2009-06-11 | 株式会社日立国際電気 | 半導体装置の製造方法および基板処理装置 |
US8282733B2 (en) * | 2007-04-02 | 2012-10-09 | Hitachi Kokusai Electric Inc. | Manufacturing method of semiconductor apparatus |
US7843022B2 (en) * | 2007-10-18 | 2010-11-30 | The Board Of Trustees Of The Leland Stanford Junior University | High-temperature electrostatic transducers and fabrication method |
US20100203243A1 (en) | 2007-12-27 | 2010-08-12 | Applied Materials, Inc. | Method for forming a polysilicon film |
US8912654B2 (en) * | 2008-04-11 | 2014-12-16 | Qimonda Ag | Semiconductor chip with integrated via |
US7968975B2 (en) * | 2008-08-08 | 2011-06-28 | International Business Machines Corporation | Metal wiring structure for integration with through substrate vias |
JP5568467B2 (ja) * | 2008-08-28 | 2014-08-06 | パナソニック株式会社 | 半導体装置 |
JP2012507150A (ja) * | 2008-10-23 | 2012-03-22 | サンディスク スリーディー,エルエルシー | 低減された層間剥離特性を示す炭素系メモリ素子およびその形成方法 |
JP5201048B2 (ja) | 2009-03-25 | 2013-06-05 | 富士通株式会社 | 半導体装置とその製造方法 |
DK2411163T3 (da) * | 2009-03-26 | 2013-06-10 | Norwegian Univ Sci & Tech Ntnu | Waferbundet cmut-array med ledende kontakthuller |
US7943463B2 (en) * | 2009-04-02 | 2011-05-17 | Micron Technology, Inc. | Methods of semiconductor processing involving forming doped polysilicon on undoped polysilicon |
JP5696530B2 (ja) * | 2010-05-01 | 2015-04-08 | 東京エレクトロン株式会社 | 薄膜の形成方法及び成膜装置 |
US8466061B2 (en) * | 2010-09-23 | 2013-06-18 | Infineon Technologies Ag | Method for forming a through via in a semiconductor element and semiconductor element comprising the same |
US8318575B2 (en) * | 2011-02-07 | 2012-11-27 | Infineon Technologies Ag | Compressive polycrystalline silicon film and method of manufacture thereof |
-
2011
- 2011-04-04 FI FI20115321A patent/FI124354B/fi active IP Right Grant
-
2012
- 2012-03-30 CN CN201280024707.5A patent/CN103547704B/zh active Active
- 2012-03-30 JP JP2014503183A patent/JP6117769B2/ja active Active
- 2012-03-30 SG SG2013074000A patent/SG194066A1/en unknown
- 2012-03-30 WO PCT/FI2012/050325 patent/WO2012136888A1/en active Application Filing
- 2012-03-30 US US14/009,838 patent/US9728452B2/en not_active Expired - Fee Related
- 2012-03-30 EP EP12768580.8A patent/EP2694699B1/en active Active
- 2012-03-30 CA CA2832084A patent/CA2832084C/en active Active
-
2017
- 2017-01-13 JP JP2017004355A patent/JP6374540B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN103547704B (zh) | 2016-03-30 |
FI20115321L (fi) | 2012-10-05 |
EP2694699B1 (en) | 2017-05-03 |
SG194066A1 (en) | 2013-11-29 |
CN103547704A (zh) | 2014-01-29 |
CA2832084A1 (en) | 2012-10-11 |
JP2017112382A (ja) | 2017-06-22 |
FI124354B (fi) | 2014-07-15 |
JP2014514760A (ja) | 2014-06-19 |
EP2694699A1 (en) | 2014-02-12 |
US9728452B2 (en) | 2017-08-08 |
EP2694699A4 (en) | 2014-09-17 |
WO2012136888A1 (en) | 2012-10-11 |
US20140061867A1 (en) | 2014-03-06 |
CA2832084C (en) | 2020-09-08 |
JP6117769B2 (ja) | 2017-04-19 |
JP6374540B2 (ja) | 2018-08-15 |
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