JP4186827B2 - 半導体の製造方法 - Google Patents
半導体の製造方法 Download PDFInfo
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- JP4186827B2 JP4186827B2 JP2004022513A JP2004022513A JP4186827B2 JP 4186827 B2 JP4186827 B2 JP 4186827B2 JP 2004022513 A JP2004022513 A JP 2004022513A JP 2004022513 A JP2004022513 A JP 2004022513A JP 4186827 B2 JP4186827 B2 JP 4186827B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 239000010408 film Substances 0.000 claims description 70
- 238000006243 chemical reaction Methods 0.000 claims description 49
- 230000005284 excitation Effects 0.000 claims description 44
- 239000007789 gas Substances 0.000 claims description 41
- 239000012159 carrier gas Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 description 35
- 239000012495 reaction gas Substances 0.000 description 15
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 11
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229910052786 argon Inorganic materials 0.000 description 8
- 238000000354 decomposition reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910020818 PH 3 Inorganic materials 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- -1 Ni and Cr Chemical compound 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Description
シリコン膜は通常、モノシランもしくはジシランを分解して形成されるが、その際、二分子もしくはそれ以上の水素が放出される。しかし、これは、アルゴンに比べて比重が小さいため、通常、反応室の上部に設置され、励起室に徐々に蓄積される。それに従い、時間とともに励起室でのプラズマ状態が変化する。特に、アルゴンガスで安定な放電が維持されるように設計された装置において、水素のようなプラズマ状態のまったく異なるガスの割合が増えると、放電の維持が難しくなる。成膜の初期においては先にも述べたように2nm/sの成膜速度が得られていることから、その時点でのガス組成を保つ機能を装置に付加することで成膜速度を一定に保つことができると考えられる。すなわち、成膜時の反応ガス種の組成を一定に保つことにより、高速で高品質の薄膜を形成できる。
本実施例では、Arをキャリヤガスとして、SiH4を反応ガスとして用い、非晶質シリコン膜の堆積を行った。図1において、キャリヤガス1としてArを100sccmで励起室3に導入した。励起室3は直径5cm、長さ40cmの石英管製である。
本実施例では、図1において、Arをキャリヤガス1として、SiH4を反応ガス7として用い、非晶質シリコン膜の堆積を行う際、マイクロ波電源5ではなく13.56MHzのRF電源を用いた。ただ、図1とは異なり、導波管は用いず、励起室を直接電極で挟んで放電させた。
本実施例では、図3の如く励起室13中に反応ガス分解用の加熱ワイヤ14を設けた装置構成とし、反応ガスとしてSiH4、PH3、ArとH2を用い、ドーピングした非晶質シリコン膜の堆積を行った。
本実施例では、ArとNH3をキャリヤガスとして、SiH4を反応ガスとして用い、非晶質窒化シリコン膜の堆積を行った。堆積には実施例1と同様の装置を用いた。
2 補助排気
3 励起室
3a キャリヤガス導入口
3b 補助排気口
3c 高周波導入部
4 マッチング装置
5 マイクロ波電源
6 プラズマ領域
7 反応ガス
8 反応室
9 基板ホルダ
9a 基板
10 主排気口
19 ガラス基板
Claims (2)
- 励起室でキャリアガスを励起し、これを下方の反応室に導入して反応性気体を活性化させて基板上に成膜を行う半導体の製造方法において、
前記キャリアガスは水素原子を含有せず、前記反応性気体は水素原子を含有するものを用い、前記反応室の下方に設けた主排気口から該反応室内の気体を排出すると共に、前記励起室でのガス組成が一定となるように該励起室の上部に設けられた補助排気口から該励起室の上部に徐々に蓄積する水素を排気しながら、かつ前記補助排気口からの排気量を前記主排気口からの排気量より少なくして成膜することを特徴とする半導体の製造方法。 - 上記基板上にシリコン系薄膜を成膜することを特徴とする請求項1記載の半導体の製造方法。
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JP2004022513A JP4186827B2 (ja) | 2004-01-30 | 2004-01-30 | 半導体の製造方法 |
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JP2005217220A JP2005217220A (ja) | 2005-08-11 |
JP4186827B2 true JP4186827B2 (ja) | 2008-11-26 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007165524A (ja) * | 2005-12-13 | 2007-06-28 | Seiko Epson Corp | 半導体装置の製造方法、電子機器の製造方法、半導体装置および電子機器 |
CN102179175B (zh) * | 2011-03-18 | 2013-05-22 | 北京理工大学 | 一种利用远程等离子体对膜组件整体改性的装置及方法 |
CN102773020B (zh) * | 2012-07-18 | 2014-07-23 | 北京理工大学 | 一种利用远程等离子体对膜组件进行整体化学接枝的方法 |
IN2015DN01821A (ja) | 2012-08-09 | 2015-05-29 | Shinetsu Chemical Co |
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