IN2014DN09101A - - Google Patents

Download PDF

Info

Publication number
IN2014DN09101A
IN2014DN09101A IN9101DEN2014A IN2014DN09101A IN 2014DN09101 A IN2014DN09101 A IN 2014DN09101A IN 9101DEN2014 A IN9101DEN2014 A IN 9101DEN2014A IN 2014DN09101 A IN2014DN09101 A IN 2014DN09101A
Authority
IN
India
Prior art keywords
block copolymer
uneven structure
transferring
mold
base material
Prior art date
Application number
Other languages
English (en)
Inventor
Takashi Seki
Satoshi Masuyama
Maki Fukuda
Suzushi Nishimura
Original Assignee
Jx Nippon Oil & Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Oil & Energy Corp filed Critical Jx Nippon Oil & Energy Corp
Publication of IN2014DN09101A publication Critical patent/IN2014DN09101A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3807—Resin-bonded materials, e.g. inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3878—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts used as masters for making successive impressions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/165—Monolayers, e.g. Langmuir-Blodgett
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C2033/385—Manufacturing moulds, e.g. shaping the mould surface by machining by laminating a plurality of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058—Liquid or visquous
    • B29K2105/0061—Gel or sol
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2825/00—Use of polymers of vinyl-aromatic compounds or derivatives thereof as mould material
    • B29K2825/04—Polymers of styrene
    • B29K2825/08—Copolymers of styrene, e.g. AS or SAN, i.e. acrylonitrile styrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2833/00—Use of polymers of unsaturated acids or derivatives thereof as mould material
    • B29K2833/04—Polymers of esters
    • B29K2833/12—Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Photovoltaic Devices (AREA)
IN9101DEN2014 2012-04-26 2013-03-19 IN2014DN09101A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012101065 2012-04-26
PCT/JP2013/057851 WO2013161454A1 (ja) 2012-04-26 2013-03-19 微細パターン転写用のモールドの製造方法及びそれを用いた凹凸構造を有する基板の製造方法、並びに該凹凸構造を有する基板を有する有機ｅｌ素子の製造方法

Publications (1)

Publication Number Publication Date
IN2014DN09101A true IN2014DN09101A (enExample) 2015-05-22

Family

ID=49482791

Family Applications (1)

Application Number Title Priority Date Filing Date
IN9101DEN2014 IN2014DN09101A (enExample) 2012-04-26 2013-03-19

Country Status (10)

Country Link
US (1) US20150028325A1 (enExample)
EP (1) EP2842721B1 (enExample)
JP (1) JP5695799B2 (enExample)
KR (1) KR20140106704A (enExample)
CN (1) CN104254438B (enExample)
AU (1) AU2013253941B2 (enExample)
CA (1) CA2870426C (enExample)
IN (1) IN2014DN09101A (enExample)
TW (1) TWI574812B (enExample)
WO (1) WO2013161454A1 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201501910A (zh) * 2013-03-06 2015-01-16 Jx Nippon Oil & Energy Corp 具有凹凸構造之構件的製造方法以及藉由該方法所製出之具有凹凸構造之構件
WO2015075833A1 (ja) * 2013-11-25 2015-05-28 東京エレクトロン株式会社 パターン形成方法及び加熱装置
EP3089550A4 (en) * 2013-12-27 2017-09-06 JX Nippon Oil & Energy Corporation Light-emitting element
KR20160138419A (ko) * 2014-03-26 2016-12-05 제이엑스 에네루기 가부시키가이샤 에피택셜 성장용 기판 및 이것을 사용한 발광 소자
JP6438678B2 (ja) * 2014-05-14 2018-12-19 Ｊｘｔｇエネルギー株式会社 凹凸構造を有するフィルム部材
JP6609402B2 (ja) * 2014-06-19 2019-11-20 デクセリアルズ株式会社 光学フィルム及びその製造方法
KR101499123B1 (ko) * 2014-07-04 2015-03-06 고려대학교 산학협력단 태양전지용 유리기판 텍스처링 방법
EP3178632A1 (en) * 2014-08-04 2017-06-14 JX Nippon Oil & Energy Corporation Method for manufacturing member having irregular pattern
TWI556002B (zh) * 2014-08-05 2016-11-01 群創光電股份有限公司 抗反射結構及電子裝置
WO2016052769A1 (ko) * 2014-09-29 2016-04-07 (주) 마이크로핏 마이크로 반구체 어레이 플레이트의 제조방법, 마이크로 반구체 어레이 플레이트를 포함하는 미세유체소자 및 이를 이용한 세포 집합체의 배양방법
JP6471447B2 (ja) * 2014-10-02 2019-02-20 大日本印刷株式会社 ワイヤーグリッド偏光子の製造用部材の修正方法とワイヤーグリッド偏光子の製造方法および露光方法
DE102016200793B4 (de) * 2015-02-11 2024-04-04 Heidelberger Druckmaschinen Ag Verfahren zum Herstellen einer Werkzeugplatte zum Bearbeiten von Bedruckstoff
JP2016201257A (ja) * 2015-04-10 2016-12-01 株式会社ジャパンディスプレイ 表示装置の製造方法
JP6702317B2 (ja) * 2015-05-13 2020-06-03 凸版印刷株式会社 凹凸パターン形成体の製造方法、その製造装置、及びシール
JP2016219341A (ja) * 2015-05-25 2016-12-22 Ｊｘエネルギー株式会社 発光素子
SG10202003822RA (en) * 2015-10-27 2020-05-28 Agency Science Tech & Res Nanoinjection molding
JP6784487B2 (ja) 2015-10-30 2020-11-11 デクセリアルズ株式会社 光学体、および表示装置
US10981304B2 (en) * 2016-06-05 2021-04-20 Okinawa Institute Of Science And Technology School Corporation Method of nanoscale patterning based on controlled pinhole formation
JP7148535B2 (ja) * 2017-03-16 2022-10-05 ユニヴェルシテ デクス－マルセイユ ナノインプリントリソグラフィプロセスと、それから得られるパターン化基板
TWI787246B (zh) * 2017-03-30 2022-12-21 日商日本瑞翁股份有限公司 光學薄膜、其製造方法、偏光板及液晶顯示裝置
EP3388238A1 (en) * 2017-04-13 2018-10-17 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Carrier, use of a carrier, method of activating a carrier and method of making a carrier
KR20200008545A (ko) 2017-05-19 2020-01-28 제이엑스티지 에네루기 가부시키가이샤 반사 방지 부재
EP3633416A4 (en) * 2017-05-31 2021-01-20 JXTG Nippon Oil & Energy Corporation ANTI-FOG ELEMENT
JP6918631B2 (ja) * 2017-08-18 2021-08-11 浜松ホトニクス株式会社 光検出素子
JP6393384B1 (ja) * 2017-10-06 2018-09-19 日本ペイント・オートモーティブコーティングス株式会社 防眩ハードコート層の形成方法
US12420456B2 (en) 2018-03-20 2025-09-23 Sharklet Technologies, Inc. Molds for manufacturing textured articles, methods of manufacturing thereof and articles manufactured therefrom
US11717991B2 (en) * 2018-03-20 2023-08-08 Sharklet Technologies, Inc. Molds for manufacturing textured articles, methods of manufacturing thereof and articles manufactured therefrom
CN115503159B (zh) * 2018-05-30 2025-09-05 富士胶片株式会社 图案原盘、模具的制造方法及基体的制造方法
TWI688832B (zh) * 2018-08-22 2020-03-21 鋆洤科技股份有限公司 精細金屬遮罩的製法
CN109597278A (zh) * 2019-02-01 2019-04-09 集美大学 光功能织构薄膜的压印装置及压印方法
US10482192B1 (en) * 2019-02-12 2019-11-19 SmileDirectClub LLC Systems and methods for selecting and marking a location on a dental aligner
WO2021079740A1 (ja) * 2019-10-21 2021-04-29 王子ホールディングス株式会社 三次元成形用フィルム、凹凸構造付き三次元構造体、その製造方法及び電鋳型の製造方法
KR102286438B1 (ko) * 2020-04-01 2021-08-05 연세대학교 산학협력단 패턴화된 금속 나노구 어레이층의 제조방법, 이를 포함하는 전자 소자의 제조방법 및 이에 의해 제조된 전자 소자
TWI726779B (zh) * 2020-07-29 2021-05-01 光群雷射科技股份有限公司 轉印滾輪的製造方法、及滾輪母膜與其製造方法
CN115256716A (zh) * 2021-04-30 2022-11-01 维达力实业（赤壁）有限公司 具有颗粒质感的模具和壳体、制备方法及应用
EP4119321A1 (en) * 2021-07-13 2023-01-18 Essilor International Method for fabricating microstructured inserts for injection molding
CN115723461B (zh) * 2021-08-30 2024-12-03 苏州苏大维格科技集团股份有限公司 一种光学转移材料及其制备方法
TWI876935B (zh) * 2024-03-19 2025-03-11 安可光電股份有限公司 金屬線偏光片的製作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9028859B2 (en) * 2006-07-07 2015-05-12 Advanced Cardiovascular Systems, Inc. Phase-separated block copolymer coatings for implantable medical devices
CN101205054B (zh) * 2007-12-11 2011-03-30 山东大学 一种微型金属镍模具制作方法
JP2010017865A (ja) 2008-07-08 2010-01-28 Fuji Electric Device Technology Co Ltd ナノインプリント用モールドの製造方法
JP4654279B2 (ja) 2008-08-28 2011-03-16 株式会社日立製作所 微細構造を有する高分子薄膜およびパターン基板の製造方法
KR101521687B1 (ko) * 2009-07-16 2015-05-19 제이엑스 닛코닛세키에너지주식회사 회절 격자 및 그것을 이용한 유기 ｅｌ 소자, 및 이들의 제조 방법
JP5484817B2 (ja) * 2009-08-04 2014-05-07 株式会社東芝 パターン形成方法及び半導体装置の製造方法
JP5394857B2 (ja) * 2009-08-27 2014-01-22 富士フイルム株式会社 高分子膜の製造方法
KR20130040172A (ko) * 2010-03-26 2013-04-23 제이엑스 닛코 닛세키 에네루기 가부시키가이샤 연료 전지 시스템, 개질기 시스템, 및 연료 전지 시스템의 운전 방법
JP5322182B2 (ja) * 2010-05-14 2013-10-23 Ｊｘ日鉱日石エネルギー株式会社 有機ｅｌ素子用のマイクロレンズ、それを用いた有機ｅｌ素子、及びそれらの製造方法
JP5598970B2 (ja) * 2010-06-18 2014-10-01 凸版印刷株式会社 微細構造体の製造方法、複合体

Also Published As

Publication number Publication date
JP5695799B2 (ja) 2015-04-08
CA2870426A1 (en) 2013-10-31
KR20140106704A (ko) 2014-09-03
EP2842721A4 (en) 2015-09-16
CA2870426C (en) 2016-07-05
CN104254438A (zh) 2014-12-31
JPWO2013161454A1 (ja) 2015-12-24
TWI574812B (zh) 2017-03-21
EP2842721A1 (en) 2015-03-04
EP2842721B1 (en) 2017-01-04
WO2013161454A1 (ja) 2013-10-31
AU2013253941A1 (en) 2014-11-27
TW201402297A (zh) 2014-01-16
CN104254438B (zh) 2016-11-09
US20150028325A1 (en) 2015-01-29
AU2013253941B2 (en) 2015-09-17

Similar Documents

Publication Publication Date Title
IN2014DN09101A (enExample)
EA201390169A1 (ru) Способ получения материала, содержащего основу, снабженную покрытием
TW201130183A (en) Method of manufacturing high resolution organic thin film pattern
Lei et al. Highly ordered nanostructures with tunable size, shape and properties: A new way to surface nano-patterning using ultra-thin alumina masks
WO2017067813A3 (en) A method of manufacturing a pellicle for a lithographic apparatus, a pellicle for a lithographic apparatus, a lithographic apparatus, a device manufacturing method, an apparatus for processing a pellicle, and a method for processing a pellicle
WO2012118887A3 (en) Apparatus and process for atomic layer deposition
EP2922083A3 (en) Plasma pre-clean process
WO2012118952A3 (en) Apparatus and process for atomic layer deposition
PH12014502176A1 (en) Release film for ceramic green sheet production process
GB2496956B (en) Transparent conductor
IN2014CN02683A (enExample)
WO2012125481A3 (en) Thin film through-glass via and methods for forming same
WO2012047042A3 (ko) 미세 패턴 형성 방법 및 이를 이용한 미세 채널 트랜지스터 및 미세 채널 발광트랜지스터의 형성방법
MX354168B (es) Método para la manufactura de micro características de producto impreso y disposición para la producción continua de tal producto.
MX2016008676A (es) Proceso para formar un producto de película integral.
GB201319526D0 (en) Method for producing transparent electrically conductive film laminates and transparent electrically conductive film laminate
TW201713184A (en) Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
WO2013003522A3 (en) Semiconductor substrate and method of forming
WO2013015648A3 (en) Method of manufacturing mold for nano imprint
PL412520A1 (pl) Sposób wytwarzania folii grafenowej o zadanej liczbie warstw grafenu
EA201691900A1 (ru) Способ повторного использования подложек и несущих подложек
JP2013254783A5 (enExample)
FR2968241B1 (fr) Procede de fabrication d'un article permettant l'apposition d'un film
EP2983043A3 (en) Mask for photolithography; method of manufacturing the same and method of manufacturing substrate using the same
WO2013182280A3 (de) Verfahren zur oberflächenbehandlung von gegenständen