IN2014CN04113A - - Google Patents

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Publication number
IN2014CN04113A
IN2014CN04113A IN4113CHN2014A IN2014CN04113A IN 2014CN04113 A IN2014CN04113 A IN 2014CN04113A IN 4113CHN2014 A IN4113CHN2014 A IN 4113CHN2014A IN 2014CN04113 A IN2014CN04113 A IN 2014CN04113A
Authority
IN
India
Prior art keywords
cover
heat radiation
radiation section
face
relative air
Prior art date
Application number
Other languages
English (en)
Inventor
Hiroyuki Higashino
Yukio Nakashima
Shigetoshi Ipposhi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of IN2014CN04113A publication Critical patent/IN2014CN04113A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P1/00—Air cooling
    • F01P1/06—Arrangements for cooling other engine or machine parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61C—LOCOMOTIVES; MOTOR RAILCARS
    • B61C17/00—Arrangement or disposition of parts; Details or accessories not otherwise provided for; Use of control gear and control systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Transportation (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling, Air Intake And Gas Exhaust, And Fuel Tank Arrangements In Propulsion Units (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
IN4113CHN2014 2011-12-09 2012-11-22 IN2014CN04113A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011270023 2011-12-09
PCT/JP2012/080368 WO2013084729A1 (fr) 2011-12-09 2012-11-22 Dispositif de refroidissement pour dispositif sous-plancher pour véhicule

Publications (1)

Publication Number Publication Date
IN2014CN04113A true IN2014CN04113A (fr) 2015-07-10

Family

ID=48574103

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4113CHN2014 IN2014CN04113A (fr) 2011-12-09 2012-11-22

Country Status (9)

Country Link
US (1) US9863302B2 (fr)
EP (1) EP2789518B9 (fr)
JP (1) JP5474265B2 (fr)
KR (1) KR101588989B1 (fr)
CN (1) CN103987607B (fr)
BR (1) BR112014012776B1 (fr)
ES (1) ES2748450T3 (fr)
IN (1) IN2014CN04113A (fr)
WO (1) WO2013084729A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5827599B2 (ja) * 2012-06-29 2015-12-02 株式会社日立製作所 鉄道車両用電力変換装置
US9401864B2 (en) 2013-10-31 2016-07-26 Palo Alto Research Center Incorporated Express header for packets with hierarchically structured variable-length identifiers
JP6177465B2 (ja) * 2015-01-08 2017-08-09 三菱電機株式会社 鉄道車両用の冷却装置
JP6494408B2 (ja) * 2015-05-07 2019-04-03 三菱電機株式会社 車両機器の冷却装置
JP6753686B2 (ja) * 2015-08-21 2020-09-09 株式会社東芝 電力変換装置及び鉄道車両
JP6414187B2 (ja) * 2016-02-15 2018-10-31 富士電機株式会社 電力変換装置
CN108883779B (zh) * 2016-03-25 2020-02-18 三菱电机株式会社 车辆用控制装置
JP6914776B2 (ja) * 2017-08-04 2021-08-04 株式会社東芝 電力変換装置及び鉄道車両
CN111051178A (zh) * 2017-09-08 2020-04-21 株式会社日立制作所 铁路车辆的电力转换装置以及搭载了电力转换装置的铁路车辆
WO2023144914A1 (fr) * 2022-01-26 2023-08-03 三菱電機株式会社 Dispositif électronique

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Also Published As

Publication number Publication date
KR101588989B1 (ko) 2016-01-26
WO2013084729A1 (fr) 2013-06-13
JPWO2013084729A1 (ja) 2015-04-27
ES2748450T9 (es) 2020-08-18
CN103987607A (zh) 2014-08-13
KR20140089421A (ko) 2014-07-14
BR112014012776A2 (pt) 2017-08-22
EP2789518B9 (fr) 2019-12-25
ES2748450T3 (es) 2020-03-16
CN103987607B (zh) 2016-08-24
JP5474265B2 (ja) 2014-04-16
BR112014012776B1 (pt) 2021-02-02
EP2789518A4 (fr) 2015-09-02
EP2789518A1 (fr) 2014-10-15
US20140318736A1 (en) 2014-10-30
EP2789518B1 (fr) 2019-08-28
US9863302B2 (en) 2018-01-09

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