MX2008015411A - Estructura de placa de enfriamiento de aparato de enfriamiento y transmisor con el aparato de enfriamiento. - Google Patents
Estructura de placa de enfriamiento de aparato de enfriamiento y transmisor con el aparato de enfriamiento.Info
- Publication number
- MX2008015411A MX2008015411A MX2008015411A MX2008015411A MX2008015411A MX 2008015411 A MX2008015411 A MX 2008015411A MX 2008015411 A MX2008015411 A MX 2008015411A MX 2008015411 A MX2008015411 A MX 2008015411A MX 2008015411 A MX2008015411 A MX 2008015411A
- Authority
- MX
- Mexico
- Prior art keywords
- flow
- cooling plate
- cooling
- cooling apparatus
- plate structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Transmitters (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Una estructura de placa de enfriamiento de un aparato de enfriamiento incluye una placa de enfriamiento y cuando menos un conducto de circulación de refrigerante dispuesto en la placa de enfriamiento. El conducto incluye portillos de introducción y descarga de refrigerante dispuestos lado por lado en una superficie externa de la placa de enfriamiento en un estado expuesto, una parte de flujo dentro extendiéndose desde el portillo de introducción a una posición intermedia entre el portillo de introducción y el portillo de descarga en la placa de enfriamiento, y una parte de flujo fuera extendiéndose a lo largo de la parte de flujo dentro desde la posición intermedia al portillo de descarga de modo que la parte de flujo fuera está separada de la parte de flujo dentro. Los elementos generadores de calor están dispuestos a lo largo del conducto de circulación en una porción intermedia entre una porción correspondiente a la parte de flujo dentro y una porción correspondiente a la parte de flujo fuera, ambas correspondiendo a la parte de flujo dentro y a la parte de flujo fuera del conducto de circulación, en la superficie externa de la placa de enfriamiento.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007313830A JP4703633B2 (ja) | 2007-12-04 | 2007-12-04 | 冷却プレート構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2008015411A true MX2008015411A (es) | 2009-06-17 |
Family
ID=40674555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2008015411A MX2008015411A (es) | 2007-12-04 | 2008-12-03 | Estructura de placa de enfriamiento de aparato de enfriamiento y transmisor con el aparato de enfriamiento. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7986528B2 (es) |
| JP (1) | JP4703633B2 (es) |
| CN (1) | CN101453866B (es) |
| BR (1) | BRPI0805172A2 (es) |
| CA (1) | CA2645751C (es) |
| MX (1) | MX2008015411A (es) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
| EP2354744B1 (en) * | 2010-01-20 | 2017-09-20 | ABB Technology Oy | Cooling element |
| JP5162621B2 (ja) * | 2010-05-07 | 2013-03-13 | 日本発條株式会社 | 温度調節装置、冷却装置、及び温度調節装置の製造方法 |
| CN102397085B (zh) * | 2010-09-09 | 2015-04-08 | 株式会社东芝 | 超声波探头 |
| US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
| US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
| JP5734129B2 (ja) * | 2011-08-09 | 2015-06-10 | 日本発條株式会社 | 流路付き部材及びその製造方法 |
| US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
| US8913384B2 (en) | 2012-06-20 | 2014-12-16 | International Business Machines Corporation | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
| CN103929923A (zh) * | 2013-01-11 | 2014-07-16 | 吴绍明 | 电子装置的运算电路板的保护结构及保护方法 |
| CN105592665A (zh) * | 2014-10-24 | 2016-05-18 | 富瑞精密组件（昆山）有限公司 | 散热装置 |
| CN110762788A (zh) * | 2019-10-12 | 2020-02-07 | 青岛海信日立空调系统有限公司 | 一种空调器室外机、循环系统以及控制方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495364U (es) * | 1972-04-18 | 1974-01-17 | ||
| JPS495364A (es) | 1972-05-02 | 1974-01-18 | ||
| JPS6336053U (es) * | 1986-08-26 | 1988-03-08 | ||
| US4884168A (en) * | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
| US5826643A (en) * | 1996-06-07 | 1998-10-27 | International Business Machines Corporation | Method of cooling electronic devices using a tube in plate heat sink |
| US5899077A (en) * | 1997-12-02 | 1999-05-04 | Solid State Cooling Systems, Inc. | Thermoelectric cooling/heating system for high purity or corrosive liquids |
| US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
| JP3556175B2 (ja) * | 2001-03-09 | 2004-08-18 | 株式会社日立製作所 | 半導体モジュール及び電力変換装置 |
| JP2003078270A (ja) | 2001-09-07 | 2003-03-14 | Hitachi Ltd | 電子装置 |
| US6782195B2 (en) * | 2002-04-03 | 2004-08-24 | Applied Integrated Systems, Inc. | Heat exchanger for high purity fluid handling systems |
| JP3730968B2 (ja) * | 2003-03-26 | 2006-01-05 | Ｔｄｋ株式会社 | スイッチング電源 |
| WO2005004571A1 (ja) * | 2003-06-30 | 2005-01-13 | Advantest Corporation | 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド |
| JP2005197454A (ja) * | 2004-01-07 | 2005-07-21 | Mitsubishi Electric Corp | 冷却装置 |
| DE102004026061B4 (de) * | 2004-05-25 | 2009-09-10 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls |
| US7673389B2 (en) * | 2005-07-19 | 2010-03-09 | International Business Machines Corporation | Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component |
-
2007
- 2007-12-04 JP JP2007313830A patent/JP4703633B2/ja not_active Expired - Fee Related
-
2008
- 2008-11-25 US US12/323,328 patent/US7986528B2/en not_active Expired - Fee Related
- 2008-12-01 CA CA2645751A patent/CA2645751C/en not_active Expired - Fee Related
- 2008-12-03 MX MX2008015411A patent/MX2008015411A/es active IP Right Grant
- 2008-12-04 BR BRPI0805172-0A patent/BRPI0805172A2/pt not_active Application Discontinuation
- 2008-12-04 CN CN2008101788933A patent/CN101453866B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101453866A (zh) | 2009-06-10 |
| CA2645751A1 (en) | 2009-06-04 |
| CN101453866B (zh) | 2013-04-10 |
| JP2009141013A (ja) | 2009-06-25 |
| US7986528B2 (en) | 2011-07-26 |
| CA2645751C (en) | 2012-06-12 |
| US20090139706A1 (en) | 2009-06-04 |
| BRPI0805172A2 (pt) | 2009-08-18 |
| JP4703633B2 (ja) | 2011-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |