JP4703633B2 - 冷却プレート構造 - Google Patents
冷却プレート構造 Download PDFInfo
- Publication number
- JP4703633B2 JP4703633B2 JP2007313830A JP2007313830A JP4703633B2 JP 4703633 B2 JP4703633 B2 JP 4703633B2 JP 2007313830 A JP2007313830 A JP 2007313830A JP 2007313830 A JP2007313830 A JP 2007313830A JP 4703633 B2 JP4703633 B2 JP 4703633B2
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- side flow
- introduction
- cooling plate
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Transmitters (AREA)
- Measuring Fluid Pressure (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Description
Claims (1)
- 流体導入口と流体排出口が離間されて併設して配置され、且つ、前記流体導入口からの作動流体が導入される導入側流路と、該導入側流路に折り返し形成され、導入された作動流体を前記流体排出口に導く排出側流路とが離間されて添うように併設されて複数重、折り返し配管した管路が埋設される冷却プレートと、
この冷却プレートの前記管路上を除く領域に該管路に沿って配列されて搭載される複数の発熱体と、
を具備したことを特徴とする冷却プレート構造。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007313830A JP4703633B2 (ja) | 2007-12-04 | 2007-12-04 | 冷却プレート構造 |
US12/323,328 US7986528B2 (en) | 2007-12-04 | 2008-11-25 | Cooling plate structure of cooling apparatus and transmitter with the cooling apparatus |
CA2645751A CA2645751C (en) | 2007-12-04 | 2008-12-01 | Cooling plate structure of cooling apparatus and transmitter with the cooling apparatus |
MX2008015411A MX2008015411A (es) | 2007-12-04 | 2008-12-03 | Estructura de placa de enfriamiento de aparato de enfriamiento y transmisor con el aparato de enfriamiento. |
CN2008101788933A CN101453866B (zh) | 2007-12-04 | 2008-12-04 | 冷却装置的冷却板结构 |
BRPI0805172-0A BRPI0805172A2 (pt) | 2007-12-04 | 2008-12-04 | estrutura de placa de resfriamento de aparelho de resfriamento |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007313830A JP4703633B2 (ja) | 2007-12-04 | 2007-12-04 | 冷却プレート構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009141013A JP2009141013A (ja) | 2009-06-25 |
JP4703633B2 true JP4703633B2 (ja) | 2011-06-15 |
Family
ID=40674555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007313830A Expired - Fee Related JP4703633B2 (ja) | 2007-12-04 | 2007-12-04 | 冷却プレート構造 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7986528B2 (ja) |
JP (1) | JP4703633B2 (ja) |
CN (1) | CN101453866B (ja) |
BR (1) | BRPI0805172A2 (ja) |
CA (1) | CA2645751C (ja) |
MX (1) | MX2008015411A (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
EP2354744B1 (en) * | 2010-01-20 | 2017-09-20 | ABB Technology Oy | Cooling element |
JP5162621B2 (ja) * | 2010-05-07 | 2013-03-13 | 日本発條株式会社 | 温度調節装置、冷却装置、及び温度調節装置の製造方法 |
CN102397085B (zh) * | 2010-09-09 | 2015-04-08 | 株式会社东芝 | 超声波探头 |
US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
JP5734129B2 (ja) * | 2011-08-09 | 2015-06-10 | 日本発條株式会社 | 流路付き部材及びその製造方法 |
US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
US8913384B2 (en) | 2012-06-20 | 2014-12-16 | International Business Machines Corporation | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
CN103929923A (zh) * | 2013-01-11 | 2014-07-16 | 吴绍明 | 电子装置的运算电路板的保护结构及保护方法 |
CN105592665A (zh) * | 2014-10-24 | 2016-05-18 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
CN110762788A (zh) * | 2019-10-12 | 2020-02-07 | 青岛海信日立空调系统有限公司 | 一种空调器室外机、循环系统以及控制方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS495364U (ja) * | 1972-04-18 | 1974-01-17 | ||
JPS6336053U (ja) * | 1986-08-26 | 1988-03-08 | ||
JP2002270748A (ja) * | 2001-03-09 | 2002-09-20 | Hitachi Ltd | 半導体モジュール及び電力変換装置 |
JP2005197454A (ja) * | 2004-01-07 | 2005-07-21 | Mitsubishi Electric Corp | 冷却装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS495364A (ja) | 1972-05-02 | 1974-01-18 | ||
US4884168A (en) * | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
US5826643A (en) * | 1996-06-07 | 1998-10-27 | International Business Machines Corporation | Method of cooling electronic devices using a tube in plate heat sink |
US5899077A (en) * | 1997-12-02 | 1999-05-04 | Solid State Cooling Systems, Inc. | Thermoelectric cooling/heating system for high purity or corrosive liquids |
US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
JP2003078270A (ja) | 2001-09-07 | 2003-03-14 | Hitachi Ltd | 電子装置 |
US6782195B2 (en) * | 2002-04-03 | 2004-08-24 | Applied Integrated Systems, Inc. | Heat exchanger for high purity fluid handling systems |
JP3730968B2 (ja) * | 2003-03-26 | 2006-01-05 | Tdk株式会社 | スイッチング電源 |
WO2005004571A1 (ja) * | 2003-06-30 | 2005-01-13 | Advantest Corporation | 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド |
DE102004026061B4 (de) * | 2004-05-25 | 2009-09-10 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls |
US7673389B2 (en) * | 2005-07-19 | 2010-03-09 | International Business Machines Corporation | Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component |
-
2007
- 2007-12-04 JP JP2007313830A patent/JP4703633B2/ja not_active Expired - Fee Related
-
2008
- 2008-11-25 US US12/323,328 patent/US7986528B2/en not_active Expired - Fee Related
- 2008-12-01 CA CA2645751A patent/CA2645751C/en not_active Expired - Fee Related
- 2008-12-03 MX MX2008015411A patent/MX2008015411A/es active IP Right Grant
- 2008-12-04 CN CN2008101788933A patent/CN101453866B/zh not_active Expired - Fee Related
- 2008-12-04 BR BRPI0805172-0A patent/BRPI0805172A2/pt not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS495364U (ja) * | 1972-04-18 | 1974-01-17 | ||
JPS6336053U (ja) * | 1986-08-26 | 1988-03-08 | ||
JP2002270748A (ja) * | 2001-03-09 | 2002-09-20 | Hitachi Ltd | 半導体モジュール及び電力変換装置 |
JP2005197454A (ja) * | 2004-01-07 | 2005-07-21 | Mitsubishi Electric Corp | 冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
CA2645751C (en) | 2012-06-12 |
US20090139706A1 (en) | 2009-06-04 |
CN101453866B (zh) | 2013-04-10 |
US7986528B2 (en) | 2011-07-26 |
BRPI0805172A2 (pt) | 2009-08-18 |
MX2008015411A (es) | 2009-06-17 |
CN101453866A (zh) | 2009-06-10 |
CA2645751A1 (en) | 2009-06-04 |
JP2009141013A (ja) | 2009-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4703633B2 (ja) | 冷却プレート構造 | |
JP6076497B2 (ja) | 熱交換器 | |
JP4311373B2 (ja) | 電気温水器用の熱交換器 | |
KR20110022049A (ko) | 열교환기 | |
ATE479048T1 (de) | Beheizbarer steckverbinder | |
US20090212039A1 (en) | Fluid Controlling Apparatus | |
JP2019052757A (ja) | ガイドレール、ガイドレールを取り付けるための下部構造体、およびガイドレールと下部構造体とを有するアセンブリ | |
JP5332115B2 (ja) | パワー素子搭載用ユニット | |
US20170184352A1 (en) | Radiator having a reverse flow manifold | |
FI122741B (fi) | Tehomuuttajan tehokomponenttien jäähdytys | |
JP5333161B2 (ja) | ヒートシンク | |
JP6531099B2 (ja) | 熱交換器、加熱装置、加熱システム、および水を加熱するための方法 | |
JP2015114004A (ja) | 熱交換器 | |
EP3339751A1 (en) | H-piece | |
JP4084359B2 (ja) | 液々熱交換器 | |
JP2010019481A (ja) | 蓄熱装置 | |
JP6357629B2 (ja) | 薬液用温度調整装置 | |
KR101462188B1 (ko) | 냉난방 시스템 | |
ATE462935T1 (de) | Elektrischer kombinationsboiler | |
JP2012032118A (ja) | 給湯管 | |
JP2019113279A (ja) | ヒートポンプ給湯装置 | |
KR200426631Y1 (ko) | 알루미늄으로 제작된 응축기 | |
JP5218175B2 (ja) | 蓄熱装置及びそれを備えた給湯機 | |
JP2008107080A (ja) | 床暖房システム | |
JP2001336833A (ja) | 熱交換方法、熱交換器及び熱交換システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20091008 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091013 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100608 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100809 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110215 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110308 |
|
LAPS | Cancellation because of no payment of annual fees |