IN2014CN04113A - - Google Patents

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Publication number
IN2014CN04113A
IN2014CN04113A IN4113CHN2014A IN2014CN04113A IN 2014CN04113 A IN2014CN04113 A IN 2014CN04113A IN 4113CHN2014 A IN4113CHN2014 A IN 4113CHN2014A IN 2014CN04113 A IN2014CN04113 A IN 2014CN04113A
Authority
IN
India
Prior art keywords
cover
heat radiation
radiation section
face
relative air
Prior art date
Application number
Inventor
Hiroyuki Higashino
Yukio Nakashima
Shigetoshi Ipposhi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of IN2014CN04113A publication Critical patent/IN2014CN04113A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P1/00—Air cooling
    • F01P1/06—Arrangements for cooling other engine or machine parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61C—LOCOMOTIVES; MOTOR RAILCARS
    • B61C17/00—Arrangement or disposition of parts; Details or accessories not otherwise provided for; Use of control gear and control systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change

Abstract

A cooling device for an under floor device for a vehicle is provided with: a base plate having an under floor device mounted on the rear face side thereof; a heat radiation section mounted to the front face side of the base plate and radiating heat which is transferred from the under floor device through the base plate; a cover for covering the heat radiation section and having side face openings in both side faces of the cover which face the movement direction of a vehicle the side face openings enabling relative air flow to flow therein and enabling the flowed in relative air to flow therefrom; and guide plates provided in the side gap regions between the heat radiation section and the side face of the cover the side face being located on the side into which the relative air flow flows the guide plates closing at least a part of the gap region between the heat radiation section and the faces of the cover which connect both side faces of the cover the guide plate conducting to the heat radiation section the relative air flow which flows in from the side face openings.
IN4113CHN2014 2011-12-09 2012-11-22 IN2014CN04113A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011270023 2011-12-09
PCT/JP2012/080368 WO2013084729A1 (en) 2011-12-09 2012-11-22 Cooling device for under-floor device for vehicle

Publications (1)

Publication Number Publication Date
IN2014CN04113A true IN2014CN04113A (en) 2015-07-10

Family

ID=48574103

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4113CHN2014 IN2014CN04113A (en) 2011-12-09 2012-11-22

Country Status (9)

Country Link
US (1) US9863302B2 (en)
EP (1) EP2789518B9 (en)
JP (1) JP5474265B2 (en)
KR (1) KR101588989B1 (en)
CN (1) CN103987607B (en)
BR (1) BR112014012776B1 (en)
ES (1) ES2748450T3 (en)
IN (1) IN2014CN04113A (en)
WO (1) WO2013084729A1 (en)

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JP6177465B2 (en) * 2015-01-08 2017-08-09 三菱電機株式会社 Cooling system for railway vehicles
JP6494408B2 (en) * 2015-05-07 2019-04-03 三菱電機株式会社 Cooling device for vehicle equipment
JP6753686B2 (en) * 2015-08-21 2020-09-09 株式会社東芝 Power converters and railcars
JP6414187B2 (en) * 2016-02-15 2018-10-31 富士電機株式会社 Power converter
DE112016006653B4 (en) 2016-03-25 2024-01-18 Mitsubishi Electric Corporation VEHICLE CONTROL DEVICE
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CN111051178A (en) * 2017-09-08 2020-04-21 株式会社日立制作所 Power conversion device for railway vehicle and railway vehicle equipped with power conversion device
WO2023144914A1 (en) * 2022-01-26 2023-08-03 三菱電機株式会社 Electronic device

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Also Published As

Publication number Publication date
EP2789518A1 (en) 2014-10-15
CN103987607B (en) 2016-08-24
BR112014012776A2 (en) 2017-08-22
JPWO2013084729A1 (en) 2015-04-27
ES2748450T3 (en) 2020-03-16
CN103987607A (en) 2014-08-13
EP2789518B9 (en) 2019-12-25
BR112014012776B1 (en) 2021-02-02
US20140318736A1 (en) 2014-10-30
KR20140089421A (en) 2014-07-14
US9863302B2 (en) 2018-01-09
JP5474265B2 (en) 2014-04-16
WO2013084729A1 (en) 2013-06-13
EP2789518A4 (en) 2015-09-02
ES2748450T9 (en) 2020-08-18
EP2789518B1 (en) 2019-08-28
KR101588989B1 (en) 2016-01-26

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