JP3469475B2 - Semiconductor cooling equipment for railway vehicles - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device installed under the floor of a railway vehicle.

[0002]

2. Description of the Related Art An electric power converter for driving a vehicle installed under the floor of a railway vehicle converts electric power input from a railway overhead wire by switching a semiconductor element to control an electric motor for driving the vehicle. The semiconductor cooling device plays an important role as a component of the power conversion device in order to efficiently release the generated heat to the outside air.

A semiconductor cooling device accommodates a semiconductor element and its peripheral circuit parts, and has a cooler as a cooling means. The cooler is a heat receiving portion to which the semiconductor element is attached and a heat radiating portion for discharging heat to the outside of the device. However, for driving vehicles installed under the floor of a railway vehicle, the heat dissipation part of the cooler is installed on the side of the vehicle under the car floor, and heat is dissipated from the heat dissipation part to the atmosphere by natural cooling. Often.

This is for the purpose of eliminating the need for maintenance work of the equipment by not using the blower as the cooling of the heat radiating part is natural cooling, and the reason for arranging it on the side of the vehicle is to discharge it to the under floor of the vehicle. This is to make it easier for the vehicle to receive the wind when the vehicle is running, without heat buildup.

A specific configuration will be described with reference to the drawings.

23 (a) to 23 (c) show a conventional device.
FIG. 23 (a) is a perspective view showing a conventional device, which is attached to a vehicle body. FIG. 23B shows A in FIG.
FIG. 23 is a cross-sectional view taken along line 23-A23, that is, a cross-sectional view in the longitudinal direction of the sleeper. 23C is a horizontal cross-section (apparatus plan view) of FIG.

The cooler 1 comprises a heat receiving portion 3 to which a plurality of semiconductor elements 2 are attached and a heat radiating portion 4'for radiating heat to the atmosphere. At least the semiconductor element 2 of the heat receiving portion 3 of the cooler 1 is provided so that the semiconductor element 2 and its peripheral parts are in an environment free from contamination.
The part to be attached must be housed in the sealed part of the device. On the other hand, it is necessary to dispose the heat dissipating section 4'in the open section of the device to efficiently dissipate heat to the atmosphere.

Further, in order to prevent the exhaust heat from accumulating under the floor of the vehicle and warming the wiring and piping under the floor, the heat radiating portion 4'is arranged on the side of the vehicle body.

In order to efficiently transfer heat from the heat receiving section 3 to the heat radiating section 4 ', the cooler 1 often adopts a heat pipe system utilizing the phase change of the refrigerant. That is, one end of the heat pipe 5 is embedded in the heat receiving portion 3, and a large number of heat radiation fins 6 are attached to the other side. The heat pipe 5 is installed so that the heat receiving portion 3 side is inclined downward, and the refrigerant enclosed in the heat pipe 5 is evaporated by the heat generated from the semiconductor element 2 on the heat receiving portion 3 side and condensed on the radiating fin 6 side. Will dissipate heat to the atmosphere.
The condensed refrigerant repeats a cycle in which the inside of the heat pipe 5 returns to the heat receiving portion 3 side by gravity.

Since the heat radiation fins 6 dissipate heat to the atmosphere by natural cooling, they are installed almost vertically to the ground, and an ascending airflow can easily pass between the heat radiation fins 6.

The heat pipe 5 is connected through the radiating fins 6 so that it is substantially horizontal. However, as described above, the evaporation portion side is tilted slightly downward, and the refrigerant condensed on the radiating fin 6 side is directed to the heat receiving portion 3 side. It is supposed to come back.

The semiconductor cooling device constructed as described above is provided in the box 7 of the power converter, the semiconductor element mounting portion is inside (closed) the box 7, and the heat radiating portion 4'of the cooler is outside the box 7. The heat receiving portion 3 is attached as a boundary so as to be an (open portion). The box body 7 of the power conversion device is mounted below the floor of the vehicle body 8 of the railway vehicle in such a direction that the heat radiating portion 4'is on the side of the vehicle body. Further, there is a fitting limit 9 under the floor of the vehicle body as a space in which equipment such as a power conversion device can be fitted, and the devices including the cooler 1 are mounted within the fitting limit 9. Outfitting limit 9
Generally has a chamfered lower corner.

[0013]

In a semiconductor cooling device installed under the floor of a railway vehicle, it is conceivable to use traveling wind during traveling of the vehicle to improve heat dissipation efficiency toward the atmosphere side.
In the conventional device, although the heat radiating portion 4'is installed on the vehicle side of the device, a large number of heat radiating fins 6 are arranged from the vehicle body center side (cooler heat receiving portion side) to the vehicle body side side (cooler tip side). ) Are mounted side by side with a predetermined bitch, and the structure is such that the traveling wind is difficult to penetrate between the radiator fins on the cooler heat receiving part side, which is the back side where the traveling wind enters.

In other words, the radiating fin at the most tip of the cooler receives the running wind, but the radiating fins on the base side of the cooler inside the chiller are blocked by the radiating fin at the tip so that the running wind does not easily enter and is effective. There was a drawback that running wind could not be used.

When a plurality of coolers are arranged in the rail direction,
In particular, in the cooler on the rear side in the vehicle traveling direction, the traveling wind does not easily flow to the base side of the heat radiating portion.

Further, since the refrigerant is sealed in the cooler and air-tightly connected, the cooler has high reliability so that the element breakage caused by the abnormal temperature rise of the cooler due to the leakage of the refrigerant due to the poor air density does not occur. Required.

Further, although water or perfluorocarbon type refrigerant is usually used as the refrigerant, it is impossible to cool due to freezing of the refrigerant in a low temperature environment, and environmental problems can be dealt with.
It is desirable to apply a cooling method that does not require a refrigerant from the viewpoint of simplifying the cooler configuration.

An object of the present invention is to solve the above problems and to provide a small-sized and lightweight semiconductor cooling device that effectively utilizes the vehicle traveling wind and has improved cooling performance.

[0019]

According to the present invention, in a power converter for driving a vehicle installed under the floor of a railroad vehicle, traveling wind during running of the vehicle is effectively taken into a cooler section, and the space between the cooler radiator fins is provided. The cooler is configured to allow traveling wind to flow, and the cooler is a simple cooler with a small number of parts and a small number of parts without using heat transfer means that uses the phase change of the refrigerant. Is made possible.

According to another aspect of the semiconductor cooling device of the present invention, the radiator fin portion of the cooler is on the side of the power conversion device on the vehicle body side, and a plurality of semiconductor elements are planarly arranged on one inner surface of the cooler. It is installed in a state of substantially surface contact), the surface is installed so that the lower side is the vehicle body center side and the upper side is the vehicle body side side, and it is installed from the vertical, and the opposite surface (outer surface) of the cooler is A large number of radiating fins for dissipating heat to the atmosphere are formed at a predetermined interval in the vertical direction, and each radiating fin is a plate fin of the same external shape with a substantially flat plate shape, which is lined up and down almost horizontally. Since the air is moved relative to the cooling device when the vehicle is running and the heat radiation fins are oriented horizontally, the air resistance is small and the air flows between the heat radiation fins effectively, and the heat generated by the semiconductor element is generated. Can dissipate heat to the atmosphere. And, even when the vehicle traveling wind is not sufficiently obtained, the heat radiation fins arranged vertically are
Since it is installed on the side of the vehicle body, it can be said that it is an effective radiation fin even for upward airflow during natural cooling. When these radiating fins are inclined so that the tip side is upward, the air between the upper and lower radiating fins can flow not only in the traveling direction of the vehicle but also upward, which has the effect of enhancing the cooling effect during natural cooling.

The semiconductor cooling device corresponding to claim 2, the heat radiation fin part of the cooler Ri Oh <br/> on the vehicle body side end of the power converter, a plurality of semiconductor elements on one of the inner surface of the cooler It is mounted on a flat surface, and on its outer surface, a large number of heat radiation fins for heat dissipation to the atmosphere are formed at predetermined intervals, and each heat radiation fin is a plate fin with a substantially flat plate shape, and is arranged almost vertically above and below. Since the air moves relatively to the cooling device when the vehicle is running, and the heat radiation fins are arranged in a horizontal direction, the air resistance is small and the air flows between the heat radiation fins effectively, and The generated heat can be dissipated to the atmosphere well. When these radiating fins are inclined so that the tip side is upward, the air between the upper and lower radiating fins can flow not only in the traveling direction of the vehicle but also upward, which has the effect of enhancing the cooling effect during natural cooling.

[0022]

[0023]

[0024]

According to a third aspect of the present invention, there is provided a semiconductor cooling device according to the first or second aspect , wherein a semiconductor element for one phase of an inverter circuit or a converter circuit is attached to the cooler, and three or two coolers are provided. The radiation fins are arranged side by side and are arranged for each phase so that there is a gap from the adjacent radiation fins, and air can flow vertically through the voids. The heat dissipation effect during cooling is also secured.

A semiconductor cooling device according to a fourth aspect is the semiconductor cooling device according to the first or second aspect , wherein the semiconductor element on the upper arm side of the inverter circuit or the converter circuit is attached to one cooler and the lower arm is attached to the other cooler. In addition to the same effect as the previous section by dividing the cooler by installing the semiconductor elements of multiple phases on the side and arranging the coolers in close proximity, the potential on one side of the semiconductor element group attached to one cooler is common Therefore, electrical connection can be easily performed.

According to a fourth aspect of the present invention, the semiconductor element is a flat element having two electrode surfaces facing each other, and the semiconductor element on the lower arm side is a ceramic plate or the like with its negative electrode side facing the cooler. It may be directly attached without sandwiching the insulator. In this case, one side of the semiconductor element has the same potential and the lower arm side has the ground potential, as described in the previous section, so that a configuration that does not require insulation is possible.

According to a fifth aspect of the present invention, there is provided a semiconductor cooling device according to the fourth aspect , wherein the cooler to which the semiconductor element on the lower arm side is attached is smaller than the cooler to which the semiconductor element on the upper arm side is attached. The lower arm side cooler is placed on the side of the vehicle body below, and the upper arm side cooler is placed on top of each other, and the lower arm side is placed between the cooler and the semiconductor element. Since a ceramic plate, a connecting conductor, etc.) are not required, the temperature difference in this portion is smaller than that of the upper arm, and the cooler can be downsized. On the other hand, the space where the device can be installed under the floor of the railway vehicle (equipment limit) is generally a chamfered lower section, and by arranging the smaller cooler on the lower arm side on the lower side, It is possible to place parts by effectively utilizing the outfitting limit.

According to a sixth aspect of the present invention, there is provided a semiconductor cooling device according to the fourth aspect, wherein the two coolers are on the vehicle body side of the power converter and the other cooler is below the power converter. , A cooler is arranged so that the respective semiconductor elements are close to each other inside the power conversion device. For cooling, the cooler should be arranged below the power conversion device where the traveling wind can be effectively used and on the side of the vehicle body. Then, all of them can be cooled well, and the semiconductor elements attached to the respective coolers can be arranged three-dimensionally close to each other so that the respective terminals can be directly connected in the power converter.

[0030]

The semiconductor cooling device according to claim 7 is the semiconductor cooling device according to claim 1 or 2, wherein the width of the radiation fin on the tip side is smaller than the width on the root side, and the width of the radiation fin on the tip side is lower than that on the low temperature side. Since the higher temperature side closer to the root side, which is closer to the semiconductor element that is the heat source, contributes more to cooling, it is a fin shape considering fin efficiency. In addition, considering the time when these coolers are lined up side by side, since the gap at the tip of the coolers that are adjacent to each other is large, it can be expected that running wind will flow into the radiating fin base side from this part and cooling efficiency can be improved. Get better.

[0032]

[0033]

According to the first or second aspect of the present invention, if the heat radiation fin is provided with a notch with a side left, a cut and raised shape bent upward at an angle of 90 degrees or less is provided.
In addition to allowing air to move in the vertical direction of the radiating fins, since holes are provided without reducing the fin surface area, cooling efficiency is further improved. Further, in this cut-and-raised part, the cut-and-raised part is located on the side closer to the semiconductor element, that is, on the high-temperature side, if the cut-and-raised part is located closer to the tip of the heat radiation fin than the one side that is the broken line and the cut-and-raised surface is parallel to the vehicle traveling direction. Since the remaining portion is cut and raised while being connected, it is effective for the flow of heat transmitted through the radiation fins, and the cooling efficiency in this portion is high. In this product, if different positions lanced and below the radiating fins adjacent arranged to the heat radiating fins, same as defined in Claim 7, a hole while the movement of air from the lower flow radiating fin surface of the upper The cooling efficiency of the radiating fins is further improved because it moves upward through the radiating fins.

[0035]

[0036]

[0037]

According to an eighth aspect of the present invention, there is provided a semiconductor cooling device according to the first or second aspect, in which the heat radiation fin is formed by forming a coolant passage inside the plate, and the working fluid is sealed in the passage. The shape of the vessel is the same as that of the simple plate-shaped heat radiation fin described above, but the fin has a high fin efficiency without any temperature difference from the root side to the tip of the heat radiation fin.

A semiconductor cooling device according to a ninth aspect is the semiconductor cooling device according to the first or second aspect , wherein the base portion of the cooler to which the semiconductor element is attached does not have a uniform thickness, and the attachment surface of the semiconductor element is a flat surface. The opposite surface, that is, the surface on the radiation fin side is not flat, the central part of the part where the semiconductor element is attached has the largest thickness, and the thickness is smaller at the position away from the semiconductor element. Considering the temperature gradient of the element mounting base part, the part away from the semiconductor element to increase the fin efficiency of the heat radiation fin (the temperature gradient with the semiconductor element is large and the temperature is low)
Then, the thickness of the base portion can be reduced, and the cooling can be efficiently performed without increasing the temperature gradient between the radiation fin and the semiconductor element attached to the portion. In addition, when pressing a flat semiconductor element toward the cooler, bending stress is applied to the cooler, but since the center of the base part is thick, deflection is also reduced and the contact pressure distribution of the semiconductor element is uniform. There is also an advantage.

[0040]

[0041]

[0042]

[0043]

[0044]

A semiconductor cooling device according to claim 10 is
The ratio according to claim 1 or 2, the element of flat shape which two faces semiconductor element opposing the electrode surface, but is pressed piece surface to the cooler, the main cooler on the other surface of the semiconductor element A small auxiliary heat radiation fin is sandwiched between the elements, and the amount of heat generated from the semiconductor element is not constant, and it has the function of suppressing the instantaneous temperature rise due to the instantaneous overload (peak loss). .

A semiconductor cooling device according to claim 11 is
In claim 10 , the auxiliary heat radiation fins are shaped such that air flows between the fins in a direction orthogonal to the heat radiation fins of the main cooler, that is, in the up-down direction, and the device sealing portion is adapted to the flow of air moving in the sealing portion. The fin shape is used to improve the performance of the auxiliary heat radiation fins and to further suppress the temperature rise of the semiconductor element.

A semiconductor cooling device according to claim 12 is
In claim 10 , the auxiliary heat radiation fin is electrically connected for taking out one electrode of the semiconductor element and also serves as a conductor, which leads to a reduction in the number of parts.

[0048]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) (Corresponding to Claims 1 and 3 ) (Structure) FIG. 1A shows a semiconductor cooler according to a first embodiment of the present invention as a power conversion device. FIG. 1 is a perspective view showing a state of being assembled and fitted under the floor of the vehicle body, and FIG. 1 (b) shows A1- in FIG. 1 (a).
The sectional view (longitudinal sectional view of a semiconductor cooler) which follows the A1 line is shown.

The cooler 1a is attached to the box 7 of the power converter, and the inside of the box 7 is a hermetically sealed part and the outside is an open part. The cooler 1a includes a heat receiving portion 3a to which the semiconductor element 2 is attached and a heat radiating portion 4, and the heat radiating portion 4 is composed of a large number (a plurality of) of heat radiating fins 6a.

The heat receiving portion 3a is attached so as to be inclined with respect to the box body 7 such that the lower portion thereof is on the vehicle body center side and the upper portion thereof is on the vehicle body lateral side. The cooling fins 6a are substantially plate-shaped plate fins, and a large number of cooling fins 6a are connected to the heat receiving portion 3a substantially horizontally at predetermined intervals. The heat receiving portion 3a and the heat radiating portion 4 may be integrally formed of a metal material. The radiating fins 6a are arranged on the vehicle body 8 on the side of the vehicle body, and are mounted so as to fit within the mounting limit 9.

In this embodiment, the semiconductor element 2 for one phase of the inverter circuit is mounted on one cooler 1a, and three coolers 1a are arranged to form a three-phase inverter circuit. The heat dissipating portion 4 of the cooler 1a arranged in three in the front-rear direction of the vehicle
The heat radiating fins 6a have a width smaller than the width (dimension in the rail longitudinal direction) of the heat receiving portions 3a so that they are arranged at intervals. (Operation) The heat generated from the semiconductor element 2 is conducted to the radiation fin 6a through the heat receiving portion 3a, and is dissipated from the surface of the radiation fin 6a to the atmosphere. In the power converter for driving a vehicle, naturally, heat is generated from the semiconductor element 2 when the vehicle is running, and when the vehicle is stopped, the semiconductor element 2 is not energized, so that no loss occurs. When the vehicle is traveling, a wind traveling through the vehicle flows to a device mounted below the floor of the vehicle body. In other words, air will flow in from the surroundings. The running wind acts on the vehicle and objects (equipment installed under the vehicle floor) that move integrally with the vehicle when the air around the vehicle moves relative to the vehicle when the vehicle is running. Is.

This traveling wind is generated by the heat radiation fins 6 when the vehicle is traveling.
As a result, the air flow velocity increases on the surface of the heat radiation fins 6a (compared to the case of natural convection only), the heat transfer coefficient improves, and the heat radiation performance of the heat radiation fins 6a improves. Since the radiating fins 6a are oriented horizontally, the traveling wind can come in from the tips of the fins 6a to the root side, and conventionally, in a cooler using a heat pipe, the radiating fins on the tip side are blocked. In the present embodiment, since the direction of the heat radiating fins is horizontal, the running wind, which is hard to flow, flows into the heat radiating fins on the base side and flows to the base side so that the running wind can be used over the entire area of the heat radiating fins 6a.

In addition, when the vehicle is running at a low speed, sufficient traveling wind may not be obtained, and heat radiation by natural convection from the radiation fins 6a to the atmosphere may be predominant, but the cooler 1a is phase by phase. Since the radiation fins 6a are divided, and a space is provided between the radiation fins 6a and the adjacent radiation fins 6a, the upward airflow at the time of natural convection passes through this portion, and the air flows into the radiation fins 6a to cause natural convection. It is possible to dissipate heat.

Further, the radiating fins 6a are installed closer to the vehicle body side as they become the upper radiating fins, and the air flow due to natural convection flows along the radiating fins 6a when going upward from below. The radiating fins 6a can effectively dissipate heat to the atmosphere even with respect to an ascending airflow during natural convection. (Effects) According to the present embodiment, the traveling wind when the vehicle is traveling effectively flows between the radiation fins 6a, so that the fin efficiency is improved, and the cooling device can be downsized and the performance can be improved.

Since the fin efficiency is improved, it is not necessary to use a cooler that utilizes the phase change of the refrigerant (to improve the fin efficiency by keeping the entire heat radiation fin at the same temperature), and a cooler that does not use the refrigerant is possible. . Although the refrigerant is required to have freezing resistance or environment resistance, the cooler of the present embodiment has no such problems. Further, since there is no airtight connection portion for sealing the refrigerant, it becomes unnecessary to manage the refrigerant leakage.

The cooler component parts are greatly reduced, and the reliability is improved.

When the heat receiving part is inclined and attached to the box of the apparatus, the mounting surface of the semiconductor element can be made wider than that in the case where it is mounted vertically, and a sufficient mounting space for the semiconductor element can be secured. A design with a lot of flexibility in mounting is possible. (Second Embodiment) (Corresponding to Claims 2 and 3 ) (Structure) FIG. 2 (a) shows a semiconductor cooler according to a second embodiment of the present invention, which is incorporated in a power converter and mounted under the floor of a vehicle body. 2B is a cross-sectional view (longitudinal cross-sectional view of the semiconductor cooler) taken along line A2-A2 of FIG. 2A.

In this embodiment as well, as in the first embodiment, the cooler 1b is attached to the box body 7 of the power converter so that the heat radiating portion 4 is on the side of the vehicle body, and the semiconductor element 2 of the heat receiving portion 3b is connected to the cooler 1b. A large number of heat radiation fins 6b are provided on the surface (outer surface side) opposite to the inner surface to be attached. In the present embodiment, the heat receiving portion 3b is vertically attached to the box body 7, and a large number of radiating fins 6b having a substantially plate-like plate fin shape are horizontally provided at predetermined intervals. The radiation fin 6b may be integrally formed with the heat receiving portion 3b by a metal material.

Also in this embodiment, the semiconductor element 2 for one phase of the inverter circuit is mounted on one cooler 1b, and three coolers 1b are arranged side by side to form a three-phase inverter circuit. The heat dissipating portion 4 of the cooler 1b arranged in three in the front-rear direction of the vehicle
The heat radiating fins 6b have a width smaller than the width (dimension in the rail direction) of the heat receiving portions 3b so that they are spaced from each other. (Operation) The heat generated from the semiconductor element 2 is transferred to the radiating fins 6b via the heat receiving portion 3b by heat conduction, and the running wind when the vehicle is running flows between the radiating fins 6b as in the case of the first embodiment. The heat dissipation performance from the fins 6b to the atmosphere is improved. In addition, this is also the same as in the first embodiment.
Since b is divided for each phase and a space is provided between the heat radiation fins 6b and the adjacent heat radiation fins 6b, an upward airflow during natural convection passes through this portion and air is directed to the heat radiation fins 6b. Since it is possible to radiate heat due to natural convection, the heat radiation fins 6b can be discharged due to natural convection if sufficient traveling wind is not obtained when the vehicle is traveling at low speed.
Dissipates heat into the atmosphere. (Effect) Similar to the first embodiment, the traveling wind is used to improve the fin efficiency of the radiating fins 6b, so that the cooling device can be downsized and the performance can be improved, and the cooling device using no refrigerant is possible. Becomes

Further, in this embodiment, the mounting surface of the semiconductor element is vertical, and the sealed portion inside the box is provided with a space having a rectangular cross section, and the semiconductor element peripheral circuit parts housed in this portion are dead spaces. It is possible to implement with low efficiency.

Further, since the radiator fins of the cooler are installed at right angles to the heat receiving portion, the shape of the cooler itself is simple and easy to manufacture. (Third Embodiment) (Corresponding to Claims 2 and 3 ) (Structure) FIG. 3 (a) shows a semiconductor cooler according to a third embodiment of the present invention, which is incorporated in a power converter and mounted under the floor of a vehicle body. 3B shows a cross-sectional view (longitudinal cross-sectional view of the semiconductor cooler) taken along line A3-A3 of FIG. 3A.

In the present embodiment, the heat dissipation part 4 of the cooler 1c is arranged below the box body 7. The semiconductor element 2 is attached to one side (the inner surface side of the box body 7) of the heat receiving section 3c, and a large number of heat radiation fins 6c are provided on the opposite surface (outer surface side of the box body 7) at right angles to the heat receiving section 3c. Is the same as in the second embodiment. The radiating fin 6c is preferably formed integrally with the heat receiving portion 3c, as in all the other embodiments. (Function) The lowermost part of the outfitting limit 9 under the floor of the vehicle body is closest to the ground, and the traveling wind can be utilized most effectively. In other words, the running wind is
When the vehicle is traveling, the air around the vehicle moves relative to the vehicle and flows to the vehicle and to objects that move integrally with the vehicle (equipment installed under the vehicle floor).
The air moves most relative to the stationary ground.

In the present embodiment, the traveling wind flows between the radiation fins 6c due to the movement of air relative to the ground when the vehicle is traveling, and the fin efficiency of the radiation fins 6c is improved. (Effect) By improving the fin efficiency due to the running wind, it is possible to make the cooler smaller and improve its performance. However, since this heat dissipation part is located at the bottom of the outfitting limit where the running wind is most easily obtained, the effect is as described above. There is an effect more than the embodiment of. (Fourth Embodiment) (Corresponding to Claim 3 ) FIG. 4 (a) is a perspective view showing a state in which a semiconductor cooler according to a fourth embodiment of the present invention is incorporated in a power conversion device and is mounted under the floor of a vehicle body. FIG. 4B shows a perspective view of the semiconductor cooler alone.

In this embodiment, the cooler 1d is attached to the box body 7 as in the second embodiment, but the radiator fin 6d having a round bar shape (pin fin) is provided on the side surface of the cooler 1d on the vehicle body side. Are arranged vertically and horizontally in the heat receiving portion 3d at predetermined intervals. In this case, the radiation fin 6d is substantially horizontal to the ground.

In the present embodiment, the air can flow between the radiating fins 6d both horizontally and vertically, and the radiating fins can be used for both cooling by running wind and natural convection during low-speed running of the vehicle. 6d is a fin shape capable of effectively radiating heat. (Fifth Embodiment) (Corresponding to Claim 3 ) FIG. 5 (a) is a perspective view showing a state in which a semiconductor cooler according to a fifth embodiment of the present invention is incorporated in a power conversion device and is mounted under the floor of a vehicle body. FIG. 5B shows a perspective view of the semiconductor cooler alone.

In this embodiment, a cooler 1e having a large number of narrow plate-shaped heat radiation fins 6e arranged vertically and horizontally at a predetermined interval perpendicular to the heat receiving portion 3e is attached to the box body 7. Fourth
As in the above embodiment, air can flow between the heat radiating fins 6e both horizontally and vertically, and the heat radiating fins 6e are effective in both cooling by running wind and natural convection when the vehicle is running at low speed. It has a fin shape that can dissipate heat. (Sixth Embodiment) (Corresponding to Claim 3 ) FIG. 6 (a) is a perspective view showing a state in which a semiconductor cooler according to a sixth embodiment of the present invention is incorporated in a power conversion device and is mounted under the floor of a vehicle body. FIG. 6B shows a perspective view of the semiconductor cooler alone.

In the cooler 1f of the present embodiment, the radiating fins 6f are constructed by twisting a narrow plate-like fin 90 degrees in the middle. Reference numeral 6f 'indicates a twisted portion. That is, a large number of heat radiation fins 6f are attached to the heat receiving portion 3f at predetermined intervals so that the heat radiating fins 6f are vertically oriented on the heat receiving portion 3f side (root side) and the tip end side is horizontally oriented to form the cooler 1f. ing.

In this embodiment as well, as in the fourth and fifth embodiments, the cooler is compatible with both running wind cooling and natural convection cooling. However, the fins are not provided on the tip side of the radiating fins where running wind easily flows. The horizontal direction does not obstruct the running wind, and the natural convection is due to the ascending air current generated by the temperature rise of the fins, and the fin root side closer to the heat source has more natural convection effect, so the fin root is vertical. The fins are oriented so that the natural convection effect can be fully utilized. Further, when air flows to the twisted portion in the middle of the heat radiation fin 6f, an effect of promoting turbulence in the fin curved surface portion can be obtained. (Seventh Embodiment) (Corresponding to Claims 4 and 5 ) (Structure) FIG. 7A shows a circuit diagram to which the seventh embodiment of the present invention is applied, and FIG. 7B shows the present invention. The sectional view of the semiconductor cooler of a 7th embodiment of is shown.

In this embodiment, as shown in FIG.
An inverter circuit in which two semiconductor elements 2a are connected in series, both ends thereof are connected to a positive electrode and a negative electrode of a power supply, and a semiconductor switching circuit (for one phase) whose intermediate point is connected to a motor as an output is connected in parallel in three phases. Is a power conversion device.

As shown in FIG. 7 (b), in this embodiment, the cooler attached to the box body 7 of the electric power converter mounted on the underfloor of the vehicle body 8 is divided into upper and lower stages, and is placed on the side of the vehicle body. It is installed so that the heat dissipation part comes. In the present embodiment, the semiconductor element 2a is a flat semiconductor element having two opposing surfaces serving as electrode surfaces, and the electrode surfaces are pressed against a cooler for cooling.

The heat receiving portion 3g of the upper cooler 1g has the semiconductor element 2a on the upper arm side of the power converter circuit, and the heat receiving portion 3h of the lower cooler 1h has the semiconductor element 2a on the lower arm side of the power converter circuit. Is pressed. Semiconductor device 2a on the upper arm side
Is pressed against the heat receiving portion 3g with the ceramic insulating plate 10 and the conductor 11 having good heat conduction sandwiched therebetween, and the negative arm of the semiconductor element 2a on the lower arm side is directly pressed against the heat receiving portion 3h without being insulated.

In both the upper cooler 1g and the lower cooler 1h, a large number of heat radiation fins 6g and 6h are formed on the sides of the vehicle body of the heat receiving portions 3g and 3h, respectively. 1g radiation fin 6g is lower side cooler 1h
Is larger than the radiation fin 6h. (The height of the radiation fins is high or the number of the radiation fins is large.) (Operation) The heat generated from the semiconductor element 2a on the upper arm side passes through the conductor 11 and the ceramics insulating plate 10 and the cooler 1g.
Of the semiconductor element 2a on the lower arm side is directly conducted to the heat receiving portion 3h of the cooler 1h, and the heat is dissipated to the atmosphere from the heat radiating fins 6h. Heat is dissipated. Similar to the above-described embodiment, the traveling wind is used to efficiently dissipate heat to the atmosphere.

The upper arm side semiconductor element 2a and the lower arm side semiconductor element 2a have the same allowable temperature rise value, but the lower arm side is interposed between the cooler 1h and the semiconductor element 2a. Therefore, the heat dissipation performance required for the cooler 1h is not the same as that of the cooler 1g on the upper arm side, but is allowed to be low.

Therefore, the radiation fin 6h on the lower arm side is
As compared with the heat radiation fins 6h on the upper arm side, the heat radiation portion 4 can be downsized by a method such as reducing the fin height or reducing the number of fins.

On the other hand, the negative electrode side of the semiconductor element 2a on the lower arm side is the most negative side potential of the power conversion circuit, that is, the ground potential, and is pressed against the cooler 1h as described in (Structure) of this embodiment. In doing so, there is no need for electrical insulation, and the semiconductor element 2a is directly connected to the heat receiving portion 3 of the cooler 1h.
The heat receiving portion 3h can be directly attached to the box body 7. (Of course, it is also possible to attach the semiconductor elements on the lower arm side of a plurality of phases to the cooler of the same potential without insulating them from each other.) Between the semiconductor element 2a on the upper arm side and the heat receiving portion 3g of the cooler 1g. However, the ceramic insulating plate 10 is interposed to ensure electrical insulation, and the heat receiving portion 3g itself is larger than the heat receiving portion 3h on the lower arm side in consideration of the insulation creepage distance. (In other words, the number of radiating fins that can be installed is higher on the cooler on the upper arm side.) Furthermore, considering the relationship between the outfitting limit 9 and the radiating fins 6g and 6h, the radiating fins 6g on the upper arm side are on the upper side. Is also disposed on the upper side, and the fin height of the upper arm side heat radiation fin 6g can be higher than that of the lower arm side heat radiation fin 6h because of the relationship with the lower corner portion of the outfitting limit 9 (vehicle body Extend it to the side).

As described above, the heat dissipation performance required for the coolers 1g and 1h is different between the upper arm side and the lower arm side.
It is necessary for the upper arm side to have higher heat dissipation performance than the lower arm side, and the size and conditions of the cooler that are inevitably allowed in terms of the structure match. Further, even considering the cooling performance under the condition that the traveling wind is insufficient when the vehicle is traveling at low speed, the cooler 1g located at the upper side is not a little affected by the rise in exhaust air temperature of the cooler 1h located below the cooler 1g. Therefore, it is desirable that the upper cooler can be configured larger. (Effect) It is similar to the above-described embodiments that the cooler can be made compact and high-performance by effectively using the traveling wind when the vehicle is running, but in this embodiment, the flat element is used. In this case, an efficient method for installing the semiconductor element in the cooler is provided, and it is possible to reduce the size of the entire semiconductor cooling device and improve its performance (wasteless configuration). In addition, the side of the vehicle body (the part where the tentacle is expected to be relatively) is composed of the ground potential component, which is preferable in terms of product safety. (Eighth Embodiment) (Corresponding to Claim 6 ) (Structure) FIG. 8A shows a state in which a semiconductor cooler according to an eighth embodiment of the present invention is incorporated in a power conversion device and mounted under the floor of a vehicle body. 8B is a sectional view taken along line A8-A8 of FIG. 8A (a vertical sectional view of the semiconductor cooler).

This embodiment is similar to the seventh embodiment in that
The semiconductor element 2a is a flat element, and the cooler is divided into an upper arm side and a lower arm side. However, on both the upper arm side and the lower arm side, the semiconductor element 2a is directly connected without electrical insulation.
It is pressed by the heat receiving parts 3i, 3j of the coolers 1i, 1j.

For the same reason as described in the seventh embodiment, the negative arm side of the semiconductor element 2a on the lower arm side is directly pressed by the heat receiving portion 3j of the cooler 1j, and the side of the vehicle body with respect to the box body 7 side. The cooler 1j is installed so that the heat radiating section 4 is arranged.

On the other hand, the semiconductor element 2a on the upper arm side is also directly pressed by the heat receiving portion 3i of the cooler 1i, like the lower arm side.
It is insulated and attached via the, and is installed in the lower part of the box body 7 so that the heat radiating portion 4 faces downward. Also, the semiconductor element 2 on the lower arm side
a is a power conversion circuit having a plurality of phases, and the potential of the cooler becomes the ground potential in all the phases, and it is possible to combine them into the same cooler, and the semiconductor element 2a on the upper arm side also cools its positive side. It goes without saying that if the heat receiving portion 3i of 1i is pressed, the same potential is obtained in the plurality of phases, and the coolers can be integrated. (Operation) Radiating fins 6i and 6j of the coolers 1i and 1j are installed on the side and the lower side of the vehicle body, which are portions where the running wind when the vehicle is running can be effectively utilized. It is the same as the above-described embodiments that the cooling can be effectively performed by flowing the traveling wind.

Regarding the electrical insulation, regarding the semiconductor element 2a on the lower arm side, the potential on the cooler side is the ground potential, and the radiation fin 6j of the cooler 1j is located on the side of the vehicle body. This is similar to the seventh embodiment. on the other hand,
Since the semiconductor device 2a on the upper arm side is directly pressed to the cooler, the cooler 1i has a potential, but is insulated and attached to the box body 7 by the insulator 12, so that there is no fear of installation accident. . Further, since the cooler 1i is arranged on the lower side of the vehicle body where there is no fear of tentacles by attaching the cooler 1i to the lower portion of the box body 7, the product is considered in terms of product safety. (Effects) Cooling by using the running wind when the vehicle is running has the same effects as those of the embodiments described above, but in addition,
It is possible to reduce the number of parts when using flat elements (no ceramic insulating plate is required) and to downsize the cooler by directly mounting the semiconductor elements on both the upper and lower arms to the cooler. Further, the semiconductor elements on the upper arm side and the lower arm side are three-dimensionally arranged inside the box body 7, and the conductors can be electrically connected to each other by a shorter conductor, and the three-dimensional inductance mounting around the elements can be performed. (Ninth Embodiment) (Corresponding to Claims 1 and 2 ) FIG. 9 shows a sectional view of a semiconductor cooler according to a ninth embodiment of the present invention.

In the present embodiment, the semiconductor element 2 is attached to the heat receiving portion 3k of the cooler 1k and the heat radiating portion 4 is provided on the side of the vehicle body. However, the heat radiating fins 6k of the cooler 1k are arranged.
Is not horizontal, but is tilted so that its tip side is upward.

In addition to the use of the running wind when the vehicle is running, the air between the heat radiating fins 6k is made to easily flow upward along the surface of the heat radiating fins to the tip side, thereby improving the cooling effect during natural cooling. is there. (Tenth Embodiment) (Corresponding to Claim 7 ) FIG. 10 is a perspective view showing a state in which a semiconductor cooler according to a tenth embodiment of the present invention is incorporated in a power conversion device and is mounted under the floor of a vehicle body. .

In this embodiment, a plurality of coolers 1l are arranged side by side and installed in the box body 7. As the heat radiation fins 6l, plate-like fins are horizontally installed at a certain interval. The width on the side is smaller than the width on the root side (on the side of the heat receiving portion 3l), and between the radiator fins 6l of the respective coolers 1l,
It is provided with an interval that widens toward the side of the vehicle body.

As described in the first embodiment, the natural cooling effect in the state where sufficient traveling wind cannot be obtained when the vehicle is running at low speed is increased by this interval portion. Regarding the intake of running wind into the heat dissipation fins, the distance between adjacent heat dissipation fins is wider toward the side of the vehicle body, so it is easy for the travel air to enter the heat receiving side of the cooler and the heat dissipation fins on the base side. There are advantages. Also, in terms of fin efficiency of the radiation fins, the tip side contributes less to cooling than the root side, and in that sense, the fin shape is efficient. (Eleventh Embodiment) FIG. 11 is a perspective view of a semiconductor cooler unit according to an eleventh embodiment of the present invention.

In this embodiment, the radiation fin 6 of the cooler 1m is used.
This is an example in which a hole 13 is provided in m.

Regarding the use of traveling wind when the vehicle is traveling, the same effects as those of the above-described embodiments are obtained, and the heat receiving portion 3 is used.
The heat transmitted from the m side can be radiated effectively, but in addition the hole 1
By providing 3 on the radiation fin 6m, the rising airflow at the time of natural convection also passes through the heat radiation portion 4 and prevents performance degradation when the vehicle is running at low speed and sufficient running wind is not obtained. Further, in the present embodiment, since the positions of the holes 13 are not the same in the vertically adjacent radiating fins 6m but deviate from each other, the ascending air current flows upward while flowing over the surface of the radiating fins 6m. The heat radiation effect of is improved. (Twelfth Embodiment) FIG. 12 shows a perspective view of a semiconductor cooler unit according to a twelfth embodiment of the present invention.

In this embodiment, the heat radiating fins 6n of the cooler 1n are provided with the cut-and-raised parts 14 to improve the cooling effect during natural convection as in the eleventh embodiment. The cut-and-raised part 14 is formed by hollowing out a part of the radiating fin with one side left and bending only that part with respect to the radiating fin 6n.
It constitutes the cut-and-raised part 14.

Naturally, the heat generated from the semiconductor element is transferred from the base side of the heat radiation fin 6n, that is, the heat receiving portion 3n side to the tip side of the fin by heat conduction.
Is better in terms of heat transport of the radiating fins 6n if one side of the fin base side is left and the fin tip side is bent. Also, due to the cut-and-raised parts 14, the air rises up the hollow portion (hole 14n) provided in the radiation fin 6n, but in order to efficiently pass through the fin surface without blocking the flow of this air, The raising 14 is bent upward at an angle of 90 degrees or less. The angle is set to 90 degrees or less in consideration of the fact that the running wind flows into the fin base side, so that the wind does not become a resistance against it.

In this embodiment, similar to the eleventh embodiment,
It is possible for air to flow up and down the heat dissipation fin group,
The cooling performance during natural cooling is also secured. Further, the cut-and-raised part 14 has a merit that the cooling effect is further improved because the heat radiation area is not reduced unlike a simple hole. In addition, in the present embodiment, the cut-and-raised parts 14 are provided at the same position of the heat-radiating fins 6n. A configuration in which the air moving upward can efficiently flow on the fin surface is also possible. (Thirteenth Embodiment) FIG. 13 shows a perspective view of a semiconductor cooling device alone according to a thirteenth embodiment of the present invention.

In this embodiment, the radiator fin 6o of the cooler 1o is provided with a slit 15 extending from the root side near the heat receiving section 3o to the tip. Also in the present embodiment, the slit 15 has a function of flowing air in the vertical direction, like the hole 13 in the eleventh embodiment and the hole 14n in the hollow portion of the cut-and-raised portion 14 in the twelfth embodiment. This will ensure the heat dissipation performance during natural cooling. (Fourteenth Embodiment) FIG. 14 is a perspective view of a semiconductor cooler unit according to a fourteenth embodiment of the present invention.

In the cooler 1p of this embodiment, in addition to the structure of the thirteenth embodiment, the heat radiation fin 6p divided by the slit 15 is partially bent from the root of the slit 15 near the heat receiving portion 3p. The bending angle is different between the adjacent divided radiation fin portions. In this case, in addition to the effect described in the thirteenth embodiment, there is a turbulent flow effect in the divided fin portions having different angles due to the bending of the heat radiation fin 6p, and the heat radiation performance is further improved. (Fifteenth Embodiment) FIG. 15 is a perspective view of a semiconductor cooler unit according to a fifteenth embodiment of the present invention.

In the present embodiment, by connecting the tip ends of the large number of heat radiation fins 6q of the cooler 1q with the rod 16 having good thermal conductivity (for example, a metal round rod typified by aluminum alloy or copper), This has the effect of making the temperature rise value uniform for a large number of heat radiation fins 6q.

Since the heat generated from the semiconductor element is transferred to the radiation fin 6q through the heat receiving portion 3q by heat conduction, the cooling effect of the radiation fin 6q located far from the mounting portion of the semiconductor element is reduced. According to the above, heat conduction is also performed by the rod 16 to the heat radiation fin 6q, and the cooling capacity can be improved.

Further, since a large number of heat radiation fins 6q are mechanically constrained to each other by the rod 16 on the tip side, the rigidity of the heat radiation fin group is increased, and mechanical destruction or the like is caused against vibration conditions when the vehicle is running. It also has the function of preventing the generation of noise due to vibration. (Sixteenth Embodiment) (Corresponding to Claim 8 ) FIG. 16A is a vertical sectional view of a semiconductor cooler according to a sixteenth embodiment of the present invention. FIG. 16B shows A of FIG.
The detailed sectional drawing of 16 parts is shown.

In this embodiment, the cooler 1r includes a heat receiving portion 3r to which the semiconductor element 2 is attached and a large number of heat radiation fins 6 provided therein.
r is angled so that the tip side is up,
The radiating fin 6r has a cavity 17 therein, and the coolant 18 is enclosed in the cavity 17. That is, the cavity 17 serves as a flow path for the coolant 18, and each of the heat radiation fins 6r is formed into a heat pipe.

According to this embodiment, heat changes from the root side to the tip side due to the phase change of the refrigerant 18, so that fin efficiency is improved and a high performance cooler is possible. Heat dissipation fin 6r
Has the tip tilted upward to obtain the effect described in the ninth embodiment, and, of course, only some of the radiation fins 6r are
It is also possible to form a heat pipe as in this embodiment, apply the fifteenth embodiment, and connect the tip side with a rod to improve the heat dissipation performance of the entire heat dissipation fin 6r. (At this time, of course, the rod for connecting the tip side may be a round rod-shaped heat pipe in addition to the metal round rod described in the fifteenth embodiment.) (Seventeenth embodiment) Form) (corresponding to claim 9 ) FIG. 17 is a vertical cross-sectional view of a semiconductor cooler according to a seventeenth embodiment of the present invention.

In the present embodiment, the heat receiving portion 3s of the cooler 1s.
Is not uniform in thickness so that the portion where the semiconductor element 2 is mounted has a large thickness and becomes thinner as the distance from the semiconductor element 2 increases. Of course, the surface of the heat receiving portion 3s on the side to which the semiconductor element 2 is attached is a flat surface, and
The surface on the s side is not flat, and the thickness varies. Therefore, when a large number of heat radiation fins 6s having the same fin height are attached, the degree of protrusion of the heat radiation fins 6s toward the vehicle body side differs.

In this embodiment, in consideration of the temperature gradient of the heat receiving portion 3s where the semiconductor element 2 is attached, the heat radiation fin 6s is provided.
Temperature of the semiconductor element 2 and the heat radiation fin 6s attached to that portion by thinning the thickness of the base portion at a portion distant from the semiconductor element 2 (the temperature gradient with the semiconductor element is large and the temperature is low) so as to improve the fin efficiency. It can be cooled efficiently without increasing the gradient. In addition, when using a flat-shaped semiconductor element, since it is pressed toward the cooler, bending stress is applied to the cooler, but since the thickness of the heat receiving part is large in the central part where the semiconductor element is pressed Also has the advantage that the contact pressure distribution of the semiconductor element becomes uniform. (Eighteenth Embodiment) FIG. 18 is a vertical sectional view of a semiconductor cooler according to an eighteenth embodiment of the present invention.

In the present embodiment, regarding the fin height of the heat radiation fins 6t of the cooler 1t, the lengths of the many heat radiation fins 6t are different from each other. That is, the central portion of the mounting portion (on the side of the heat receiving portion 3t) of the semiconductor element 2 is the longest,
The heat radiation fins 6t located on the side far from the semiconductor element 2 have a short length because the heat radiation fins 6t contribute to cooling differently depending on the position from the semiconductor element 2 because the heat radiation fins 6t are shortened at a position away from the semiconductor element 2. It has been miniaturized.

Not only is it possible to construct an efficient cooler as a whole, but also in this embodiment, when a flat semiconductor element is used, since it is pressed toward the cooler, bending stress is applied to the cooler. However, the radiation fin acts as a beam against this bending. The higher the fin height, the larger the cross-section coefficient of the beam, and the higher the rigidity of the cooler in the central part of the semiconductor element where the bending force is most applied. As a result, the deflection is reduced and the pressure contact force distribution of the semiconductor element becomes uniform. Hold. 19th Embodiment FIG. 19A is a front view showing a state in which a semiconductor cooler according to a 19th embodiment of the present invention is incorporated in a power conversion device and is installed under the floor of a vehicle body. 19B is a left side view of FIG. 19A, and FIG. 19C is a B19-B of FIG. 19A.
A sectional view taken along line 19 is shown.

In this embodiment, the cooler 1 has a protective cover.
19 is attached so as to cover the cooler 1, and a protective cover is provided.
A large number of holes 19a that allow ventilation inside and outside are provided in the inside 19, and a plate-shaped baffle plate 20 which is perpendicular to the ground and inclined to the cooler side is provided inside the surface of the protective cover 19 on the side of the vehicle body. Is provided. The baffle plate 20 is provided inside the protective cover 19 and near the center with respect to the traveling direction of the vehicle.
It has a plate-like shape that is bent to a side.

In this embodiment, the wind guide plate 20 is used to effectively take in the traveling wind when the vehicle is traveling to the cooler 1 side.

According to this embodiment, the traveling wind is guided to the cooler 1 side along the inner surface of the wind guide plate 20 provided on the protective cover 19 regardless of the traveling direction of the vehicle, and the traveling wind is generated. Can be sufficiently supplied to the cooler 1 on the leeward side (rear side of the apparatus). (Twentieth Embodiment) FIG. 20 (a) is a front view showing a state where the semiconductor cooler of the twentieth embodiment of the present invention is incorporated in a power conversion device and is outfitted under the floor of the vehicle body. FIG. 20B is a sectional view taken along the line B20-B20 of FIG.

In the present embodiment, a plurality of coolers 1 are arranged on the side of the power conversion device on the vehicle body side.
Multiple coolers 1 are attached to both ends (with respect to the traveling direction) of each, and a large number of holes 19a are formed in each to allow ventilation inside and outside.
Attach the protective cover 19 provided with. Protective cover
A plate-shaped air guide plate 20a that is perpendicular to the ground and is inclined toward the cooler 1 side is provided near the cooler 1 located at both ends of the device inside the surface of the vehicle body 19 that is on the side of the vehicle body. The tilting directions are symmetrical so that both ends of the power converter are on the vehicle body center side (radiation fin portion side) and the center of the power converter is on the vehicle body side. (That is, it is inclined in the direction toward the cooler 1 arranged at the end of the device.) When the vehicle is traveling, the rearmost part (the vehicle travels in either direction) in which traveling wind is the least obtainable, Of course, when the vehicle travels in any direction by the baffle plate 20a facing the cooler 1 (which becomes both ends of the power converter), the traveling wind is also supplied to the cooler at the rearmost portion in the traveling direction. As a result, the cooling can be performed by effectively using the traveling wind. (Twenty-first Embodiment) FIG. 21 shows a sectional view in the plan view direction of a power conversion device according to a twenty-first embodiment of the present invention.

In the present embodiment, the cooler 1u at the center of the plurality of coolers arranged side by side is smaller than the coolers 1 adjacent to each other at both ends thereof (the height of the radiation fins is low), and the protective cover-1
In accordance with the convex portion of the baffle plate 20 provided inside 9, the height of the radiating fins of the cooler 1u in the central portion is smaller than that of the other portions.

In addition to the direction of the baffle plate 20 being in the cooler 1 which is the rearmost part in which the running wind is hard to be obtained in the running direction, the cooler located immediately in front is small (the height of the radiation fin is high). Since the traveling wind is more likely to enter, the cooling of the traveling wind at the rearmost portion becomes more efficient. (Twenty-second embodiment) (corresponding to claims 10 , 11, and 12 )

In this embodiment, the structure described in the second embodiment is the same as that of the heat radiating section 4 of the cooler 1b.
As the semiconductor element, a flat semiconductor element 2a is used, and the ceramic insulating plate 10 and the conductor 11 are used to press between the semiconductor element 2a and the heat receiving portion 3b of the cooler 1b (this is also the seventh aspect). In addition to the configuration described in the above embodiment), a small auxiliary fin 21 is attached to the surface on the opposite side of the semiconductor element 2 as compared with the cooler described so far.

When a flat-shaped semiconductor element is applied to each of the embodiments of the present invention, one side of the semiconductor element is pressed against the cooler due to the structure of the cooler, so that single-sided cooling is performed.

Although the cooling system has a simple structure and many advantages, it is natural that the heat generated is limited. Particularly in a power conversion device for driving a railway vehicle, the generated loss is not constant and varies depending on the running of the vehicle. Although the temperature of each part also changes according to the change in loss, the response of the change changes due to the thermal time constant, and the temperature rises in the semiconductor element and in the vicinity thereof due to an instantaneous heat load. Although the required performance of the cooler 1b is determined in consideration of it, if the instantaneous temperature rise is suppressed, the maximum allowable temperature of the cooler 1b can naturally be raised, which leads to downsizing of the cooler. .

Therefore, the auxiliary fin 21 shown in the present embodiment.
By mounting on the other side of the semiconductor element, even a small cooler has a small thermal time constant compared to the cooler 1b that performs main cooling, so instantaneous overload (peak loss)
In contrast, the main cooling fin has a cooling capacity equal to or higher than that of the main cooling fin, and it is possible to suppress a transient increase in element temperature at the time of peak loss. Consequently, the required heat treatment capacity of the main cooling fins can be reduced, which leads to downsizing of the cooler and downsizing of the device.

Since the fins of the auxiliary fins 21 are cooled by the air circulating in the box 7 of the apparatus, the fin grooves 22 are provided at least vertically so that the air flows vertically. The direction of the fins is different from that of the cooler 1b for main cooling. Further, the auxiliary fin 21 is usually made of aluminum or copper, which is a metal having good thermal conductivity, and is located inside the box body. Therefore, the auxiliary fin 21 is directly pressed against the semiconductor element 2a without electrical insulation, and thus can be used as an electrode.

[0112]

According to the present invention, the traveling wind when the vehicle is traveling can be effectively utilized as the cooling wind of the cooler, which not only leads to the reduction in size and weight of the device, but also simplifies the structure of the device and makes it possible to reduce the number of parts, It is possible to realize a device with a small number of parts and improved reliability.

Further, since a cooling method which does not use a refrigerant can be adopted, a special manufacturing technique for charging the refrigerant is unnecessary,
It also leads to improved maintenance such as refrigerant leak management.
Furthermore, without considering the environment resistance such as freezing of the refrigerant, there is no influence of the refrigerant on the global environment. In addition, by reducing the types of materials, it is possible to realize a product that can be recycled without causing a problem even when the product is discarded.

[Brief description of drawings]

FIG. 1A is a perspective view showing a state in which a semiconductor cooler according to a first embodiment of the present invention is incorporated in a power conversion device and is installed under the floor of a vehicle body. 1B is a sectional view of the semiconductor cooler taken along the line A1-A1 of FIG.

FIG. 2A is a perspective view showing a state in which the semiconductor cooler of the second embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. 2B is a cross-sectional view of the semiconductor cooler taken along the line A2-A2 of FIG.

FIG. 3A is a perspective view showing a state where the semiconductor cooler of the third embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. 3B is a cross-sectional view of the semiconductor cooler taken along line A3-A3 of FIG.

FIG. 4A is a perspective view showing a state in which the semiconductor cooler of the fourth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. FIG. 4B is a perspective view of the semiconductor cooling device alone of FIG.

FIG. 5A is a perspective view showing a state where the semiconductor cooler of the fifth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. FIG. 5B is a perspective view of the semiconductor cooler alone of FIG.

FIG. 6A is a perspective view showing a state in which the semiconductor cooler of the sixth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. FIG. 6B is a perspective view of the semiconductor cooler alone of FIG.

FIG. 7A is a circuit diagram of a semiconductor cooler according to a seventh embodiment. 7B is a sectional view of a semiconductor cooler including the circuit of FIG.

FIG. 8A is a perspective view showing a state where the semiconductor cooler of the eighth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. 8B is a sectional view of the semiconductor cooler taken along line A8-A8 of FIG.

FIG. 9 is a sectional view of a semiconductor cooling device according to a ninth embodiment.

FIG. 10 is a perspective view showing a state where the semiconductor cooler of the tenth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body.

FIG. 11 is a perspective view of a single semiconductor cooler according to an eleventh embodiment.

FIG. 12 is a perspective view of a semiconductor cooling device alone according to a twelfth embodiment.

FIG. 13 is a perspective view of a single semiconductor cooler according to a thirteenth embodiment.

FIG. 14 is a perspective view of a single semiconductor cooler according to a fourteenth embodiment.

FIG. 15 is a perspective view of a semiconductor cooling device alone according to a fifteenth embodiment.

FIG. 16A is a sectional view of a semiconductor cooling device according to a sixteenth embodiment. 16B is a detailed cross-sectional view of the portion indicated by A16 in FIG.

FIG. 17 is a sectional view of a semiconductor cooler according to a seventeenth embodiment.

FIG. 18 is a sectional view of a semiconductor cooling device according to an eighteenth embodiment.

FIG. 19A is a front view showing a state where the semiconductor cooler of the nineteenth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. 19B is a side view of FIG. (C) is sectional drawing which follows the B19-B19 line of FIG. 19 (a).

FIG. 20A is a front view showing a state where the semiconductor cooler of the twentieth embodiment is incorporated in a power conversion device and is installed under the floor of a vehicle body. 20B is a sectional view taken along the line B20-B20 of FIG.

FIG. 21 is a horizontal cross-sectional view of a power conversion device according to a twenty-first embodiment.

FIG. 22 is a sectional view of a semiconductor cooler according to a twenty-second embodiment.

FIG. 23A is a perspective view showing a conventional device. 23B is a sectional view taken along the line A23-A23 of FIG. FIG. 23C is a horizontal sectional view of FIG.

[Explanation of symbols]

1, 1a-1u ... Cooler 2, 2a ... Semiconductor element 3, 3a to 3t ... Heat receiving part 4 ... Heat dissipation part 5 ... Heat pipe 6a to 6t ... Radiating fins 7 ... Box 8 ... Body 9 ... Outfitting limit 10 ... Ceramic insulation board 11 ... conductor 12 ... Insulation plate 13 ... hole 14 ... Cut and raised 15 ... Slit 16 ... stick 17 ... Cavity 18 ... Refrigerant 19 ... Protective cover 20 ... Baffle plate 21 ... Auxiliary fin

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-225548 (JP, A) Actually opened 57-53646 (JP, U) Actually opened 56-126856 (JP, U) Actually opened 55- 122362 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H02M 1/00 B60L 9/18 H02M 7/5387

Claims (12)

(57) [Claims] 1. A semiconductor cooling device including a cooler used for a power converter for driving a vehicle, which is installed under the floor of a railway vehicle, wherein a radiator fin portion of the cooler is on a side of a vehicle body of the power converter. A plurality of semiconductor elements are mounted on one inner surface of the cooler, and the mounting surface is installed so as to be inclined from the vertical such that the lower side thereof is the vehicle body center side and the upper side thereof is the vehicle body lateral side. On the outer surface on the opposite side, a plurality of heat radiation fins for heat dissipation to the atmosphere are formed at predetermined intervals in the vertical direction, and each heat radiation fin is a plate fin of the same outer shape, which is almost horizontal or at the tip. A semiconductor cooling device for a railway vehicle, wherein the semiconductor cooling devices are arranged vertically in a tilted posture so that the upper part of the semiconductor part is on the upper side. 2. A semiconductor cooling device having a cooler used for a power converter for driving a vehicle installed under the floor of a railway vehicle, wherein a radiator fin portion of the cooler is on a side of a vehicle body of the power converter. A plurality of semiconductor elements are attached to one inner surface of the cooler, and a plurality of heat radiation fins for heat dissipation to the atmosphere are formed at predetermined intervals on the outer surface on the opposite side, and each heat radiation fin has a flat plate shape. Plate fins with the same outer shape
In, nearly semiconductor cooling device for a railway vehicle according to claim alongside Dei Rukoto vertically in an inclined posture as horizontally or tip is above. 3. The cooling device according to claim 1 , wherein a semiconductor element for one phase of an inverter circuit or a converter circuit is attached to the cooling device, and three or two cooling devices are arranged side by side, and the heat radiation fin portion is provided. The semiconductor cooling device for railway vehicles is characterized in that each is grouped for each phase, and there is a space from a radiation fin portion next to each other. 4. The semiconductor device on the upper arm side of the inverter circuit or the converter circuit according to claim 1 or 2 is attached to one cooler, and the semiconductor device on the lower arm side is attached to the other cooler to cool them. A semiconductor cooling device for railway vehicles, characterized in that the containers are arranged close to each other. 5. The method of claim 4, condenser fitted with a semiconductor element of the lower arm side has a smaller outer shape than the condenser fitted with semiconductor elements on the upper arm side, a side of the vehicle body side of the power converter The cooler on the lower arm side is located below
A semiconductor cooling device for a railway vehicle, characterized in that the coolers on the upper arm side are arranged side by side so that they are located above. 6. The semiconductor device according to claim 4 , wherein one of the two coolers is on a side of a vehicle body of the power conversion device, the other cooler is below the device, and respective semiconductor elements are close to each other inside the device. A semiconductor cooling device for railway vehicles, wherein the cooling device is arranged so as to 7. The semiconductor cooling device for a railway vehicle according to claim 1 , wherein the radiation fin has a width on a tip side smaller than a width on a root side. 8. The semiconductor cooling device for a rail vehicle according to claim 1, wherein the heat radiation fin has a coolant passage formed therein, and a working fluid is sealed in the passage. . 9. The radiating fin according to claim 1 , wherein a thickness of a base portion of the cooler to which the semiconductor element is attached is not uniform, and a surface on which the semiconductor element is attached is a flat surface and is located on the opposite side. The railway is characterized in that the side surface is not flat, and the thickness is changed so that the central part of the part where the semiconductor element is attached has the largest thickness and the thickness becomes smaller at the position distant from the semiconductor element. Vehicle semiconductor cooling device. 10. The semiconductor element according to claim 1 , wherein the semiconductor element is a flat element having two opposing surfaces serving as electrode surfaces, and one surface of the semiconductor element is pressed against the cooler and the other of the semiconductor elements is pressed. A semiconductor cooling device for a railway vehicle, characterized in that one side is provided with an auxiliary radiation fin that is smaller than the main cooling device. 11. The railway according to claim 10 , wherein the auxiliary radiating fins are provided in a direction orthogonal to the radiating fins of the main cooler so that air flows vertically between the fins. Vehicle semiconductor cooling device. 12. The semiconductor cooling device for a railway vehicle according to claim 10 , wherein the auxiliary heat radiation fin is electrically connected for taking out one electrode of the semiconductor element and also serves as a conductor.