JP3420945B2 - Power converter - Google Patents
Power converterInfo
- Publication number
- JP3420945B2 JP3420945B2 JP22984298A JP22984298A JP3420945B2 JP 3420945 B2 JP3420945 B2 JP 3420945B2 JP 22984298 A JP22984298 A JP 22984298A JP 22984298 A JP22984298 A JP 22984298A JP 3420945 B2 JP3420945 B2 JP 3420945B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cooler
- semiconductor element
- open
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、平形半導体素子と
冷却器とを積層した半導体スタックを有する電力変換装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter having a semiconductor stack in which flat semiconductor elements and a cooler are stacked.
【０００２】[0002]
【従来の技術】従来、電気車の電力変換装置に用いられ
る半導体素子は、発生する熱を効率良く逃がすために何
らかの冷却手段を必要とするため、対向する両面が電極
面かつ放熱面となる平形半導体素子を採用し、その両面
に冷却器の受熱部が圧接するように半導体素子と冷却器
とを交互に積層した半導体スタック構造にして、装置本
体内に収容している。2. Description of the Related Art Conventionally, a semiconductor element used in a power conversion device for an electric vehicle requires some cooling means in order to efficiently dissipate generated heat. A semiconductor stack structure is adopted in which semiconductor elements are adopted, and the semiconductor elements and the coolers are alternately laminated so that the heat receiving portions of the coolers are in pressure contact with both surfaces of the semiconductor elements, and the semiconductor stack structure is housed in the apparatus main body.
【０００３】冷却器の冷却方式は、主に半導体素子より
発生する損失により決まるが、ヒートパイプ式冷却器に
代表される冷媒の相変化を利用した冷却方式がとられる
ことが多い。The cooling system of the cooler is mainly determined by the loss generated from the semiconductor element, but a cooling system utilizing the phase change of the refrigerant represented by a heat pipe type cooler is often adopted.
【０００４】図１１及び図１２は、従来の電力変換装置
の断面構造を示している。平形半導体素子１より発生す
る熱を、冷媒の相変化を利用して冷却器２の受熱部３か
ら放熱部４へ輸送し、放熱部４より大気へ熱放散する
が、一般に半導体素子１及び冷却器受熱部３は積層圧接
された状態で装置本体５の密閉部分６内に置かれる。一
方、冷却器放熱部４は、装置本体５の外気と連通した開
放部分７内に置かれ、放熱性能を高めるのが一般的であ
る。さらに、高い放熱性能を要求する場合には、この開
放部分７を風洞にして送風機によって強制冷却すること
もある。11 and 12 show a sectional structure of a conventional power converter. The heat generated from the flat semiconductor element 1 is transferred from the heat receiving portion 3 of the cooler 2 to the heat radiating portion 4 by utilizing the phase change of the refrigerant, and the heat is radiated from the heat radiating portion 4 to the atmosphere. The vessel heat receiving portion 3 is placed in the sealed portion 6 of the apparatus main body 5 in a state of being laminated and pressure-welded. On the other hand, the cooler heat radiating section 4 is generally placed in the open portion 7 of the apparatus main body 5 which communicates with the outside air to enhance the heat radiating performance. Further, when high heat dissipation performance is required, the open portion 7 may be used as a wind tunnel and forcedly cooled by a blower.
【０００５】また鉄道車両駆動用の電力変換装置は、図
１３及び図１４に示す形態で車体９の床下に取り付けら
れる。この場合、装置本体５の開放部分７を装置の正面
側（車体９に取り付けた状態で車体側方側）に位置する
配置にして、自然対流で放熱冷却を行うようにする。こ
れは排熱が車体床下にこもるのを防ぎ、また車両走行風
を活用して冷却効果を高めるためである。The electric power converter for driving the railway vehicle is mounted under the floor of the vehicle body 9 in the form shown in FIGS. 13 and 14. In this case, the open portion 7 of the apparatus main body 5 is arranged so as to be located on the front side of the apparatus (on the side of the vehicle body when it is attached to the vehicle body 9), and heat radiation cooling is performed by natural convection. This is to prevent exhaust heat from staying under the floor of the vehicle body and to enhance the cooling effect by utilizing the vehicle running wind.
【０００６】このように、冷却器放熱部４を外気と通ず
る装置本体５の開放部分７に配置した場合には、その環
境にもよるが、導電性の異物がこの開放部分７に入り込
むことによって放熱部４と接地電位部分との短絡（地
絡）の不具合の発生、あるいは装置正面側に開放部分７
が存在することによって保守点検作業時の作業員の触手
の発生を防止する必要がある。As described above, when the cooler heat radiating portion 4 is arranged in the open portion 7 of the apparatus body 5 which communicates with the outside air, conductive foreign matter may enter the open portion 7 depending on the environment. Occurrence of a short circuit (ground fault) between the heat dissipation part 4 and the ground potential part, or an open part 7 on the front side of the device.
It is necessary to prevent the tentacles of workers from being generated during the maintenance and inspection work due to the presence of.
【０００７】そこで、従来は冷却器２の受熱部３と放熱
部４とを接続するヒートパイプ８の蒸発部（金属ブロッ
クに挿入され、受熱部３となる）と凝縮部（多数の放熱
フィンが設けられた放熱部４となる）との中間部分にセ
ラミックス製の絶縁管１０を接続し、ヒートパイプ８の
内部に封入する冷媒には絶縁冷媒を使った電気絶縁形の
ヒートパイプ式冷却器を採用していた。Therefore, conventionally, the evaporation part (inserted into the metal block and becoming the heat receiving part 3) and the condensing part (a large number of heat radiating fins) of the heat pipe 8 connecting the heat receiving part 3 and the heat radiating part 4 of the cooler 2 have been conventionally used. An insulating tube 10 made of ceramics is connected to an intermediate portion between the heat radiating section 4 and the heat radiating section 4 provided, and an electrically insulating heat pipe cooler using an insulating refrigerant is used as a refrigerant to be sealed inside the heat pipe 8. Had adopted.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、近年、
オゾン層の破壊や地球温暖化の環境問題から、絶縁冷媒
として使用されてきたＣＦＣ，ＰＦＣといった冷媒の使
用を排除する必要があり、冷媒として自然界に存在する
水を使用する傾向となってきている。However, in recent years,
Due to environmental problems such as destruction of the ozone layer and global warming, it is necessary to exclude the use of refrigerants such as CFC and PFC that have been used as insulating refrigerants, and there is a tendency to use water existing in nature as the refrigerant. .
【０００９】ところが、水を冷媒として使用するヒート
パイプ式冷却器では、ＣＦＣ，ＰＦＣのような電気絶縁
性がないために、従来と同様の使い方をする場合は冷却
器全体を半導体素子と電気絶縁する必要性がある。図１
５に、水冷媒ヒートパイプ式冷却器を冷却器として用
い、かつ、このような電気絶縁を考慮した構造の電力変
換装置を示している。However, since the heat pipe type cooler using water as a refrigerant does not have electric insulation like CFC and PFC, the whole cooler is electrically insulated from the semiconductor element when used in the same manner as the conventional one. There is a need to. Figure 1
FIG. 5 shows a power conversion device having a structure in which a water-refrigerant heat pipe cooler is used as a cooler and such electric insulation is taken into consideration.
【００１０】この従来の電力変換装置は、熱伝導性が良
く、電気絶縁体であるセラミックス板１１を半導体素子
１と冷却器受熱部３との間に挟み込み、冷却器２の全体
を半導体素子１から電気的に絶縁し、積層圧接する構造
になっている。そして、平形半導体素子１はその圧接面
が電極となっているので、セラミックス板１１と半導体
素子１との圧接面との間に電極取出し用の導電板１２を
挟み込んでいる。In this conventional power converter, the ceramic plate 11 as an electric insulator has good heat conductivity and is sandwiched between the semiconductor element 1 and the cooler heat receiving portion 3, and the entire cooler 2 is included in the semiconductor element 1. It is electrically insulated from each other and has a structure in which laminated pressure welding is performed. Since the pressure contact surface of the flat semiconductor element 1 serves as an electrode, a conductive plate 12 for electrode extraction is sandwiched between the ceramic plate 11 and the pressure contact surface of the semiconductor element 1.
【００１１】一方、半導体スイッチング回路では、電流
遮断時の半導体素子間にかかる電圧を素子定格電圧以下
に抑える必要があるため、半導体素子及びその周辺回路
の実装インダクタンスを低減することが重要である。特
に、最近の電圧駆動形の高周波スイッチング可能な平形
半導体素子では、このインダクタンス低減は特に重要で
あり、特願平１０−２１２５４号の特許出願に示したよ
うに、低インダクタンスに実装することによって従来の
スナバ回路を大幅に簡略化できる利点がある。On the other hand, in the semiconductor switching circuit, the voltage applied between the semiconductor elements when the current is cut off must be suppressed to the element rated voltage or less, so it is important to reduce the mounting inductance of the semiconductor element and its peripheral circuits. In particular, in a recent voltage-driven flat semiconductor element capable of high-frequency switching, this reduction in inductance is particularly important, and as shown in the patent application of Japanese Patent Application No. 10-21254, it is possible to reduce the inductance by mounting it in a low inductance. There is an advantage that the snubber circuit can be greatly simplified.
【００１２】しかしながら、半導体スタックの構造が２
個の直列接続された平形半導体素子１の中間点は、電極
面同士を電気良導体である銅又はアルミニウム製の冷却
器ブロック３を間に挟んできわめて近づけた配置構造で
あるにもかかわらず、冷却器２を絶縁するセラミックス
板１１が２個の半導体素子１の電極面間に介在してしま
うため、その分だけ低インダクタンス実装が損なわれる
問題点があった。However, the structure of the semiconductor stack is two.
Although the intermediate points of the flat semiconductor elements 1 connected in series are arranged so that the electrode surfaces are very close to each other with the cooler block 3 made of copper or aluminum, which is a good electrical conductor, interposed therebetween, Since the ceramic plate 11 that insulates the container 2 is interposed between the electrode surfaces of the two semiconductor elements 1, there is a problem that low inductance mounting is impaired accordingly.
【００１３】本発明は、このような従来の問題点に鑑み
てなされたもので、水を冷媒とした冷却器を用いて、電
気的には低インダクタンス実装が可能な半導体スタック
構造の電力変換装置を提供することを目的とする。The present invention has been made in view of the above-mentioned conventional problems, and uses a cooler using water as a coolant to electrically implement a low-inductance semiconductor stack structure power converter. The purpose is to provide.
【００１４】[0014]
【課題を解決するための手段】請求項１の発明の電力変
換装置は、外気と通ずる開放部分と外気から遮断された
密閉部分とを有する装置本体に対して、その密閉部分内
に複数の平形半導体素子を収容し、当該平形半導体素子
に対して、前記密閉部分内で排熱する冷却器と、前記開
放部分に放熱部が配置された冷却器とを前記平形半導体
素子と共に積層圧接したものであり、これによって、冷
却器のすべてを半導体素子と電気絶縁する必要がなくな
り、装置の大形化を避けることができる。According to a first aspect of the present invention, there is provided a power converter having a plurality of flat shapes in the sealed portion of an apparatus body having an open portion communicating with the outside air and a sealed portion shielded from the outside air. A semiconductor device is housed in the flat semiconductor element, and a cooler for exhausting heat in the sealed portion and a cooler having a heat dissipation portion arranged in the open portion are laminated and pressure-bonded together with the flat semiconductor element. Therefore, it is not necessary to electrically insulate the entire cooler from the semiconductor element, and the size of the device can be prevented.
【００１５】つまり、装置本体の開放部分に置かれる部
品は、その部品に電圧が印加されないように電気絶縁を
とる必要があるが、装置本体の密閉部分内に排熱する冷
却器は直接に平形半導体素子に積層圧接し、冷却器に電
圧がかかった状態での使用が可能であり、その周辺部品
との絶縁距離は密閉部分の条件で定まるため、冷却器周
辺で装置が大形化することはない。That is, it is necessary to electrically insulate parts placed in the open part of the apparatus main body so that no voltage is applied to the parts, but the cooler for exhausting heat inside the closed part of the apparatus main body is directly flat. It can be used in a state where the semiconductor element is laminated and pressure contacted and the cooler is applied with a voltage, and the insulation distance from its surrounding parts is determined by the condition of the sealed part, so the device must be large around the cooler. There is no.
【００１６】請求項２の発明の電力変換装置は、保守点
検時に触手の可能性のない位置で外気と通ずる第１の開
放部分と、前記保守点検時に触手の可能性のある位置で
外気と通ずる第２の開放部分と、それらの開放部分の間
にあって外気から遮断された密閉部分とを有する装置本
体に対して、その密閉部分内に複数の平形半導体素子を
収容し、当該平形半導体素子に対して、その放熱部が前
記第１の開放部分に配置された冷却器とその放熱部が前
記第２の開放部分に配置された冷却器とを前記平形半導
体素子と共に積層圧接したものであり、これによって、
冷却器のすべてを半導体素子と電気絶縁する必要がなく
なり、装置の大形化を避けることができる。According to another aspect of the power conversion device of the present invention, the first open portion communicates with the outside air at a position where the tentacles are not likely to be present during maintenance and inspection, and the outside air is communicated at a position where the tentacles are likely to be present during the maintenance inspection. A device main body having a second open portion and a sealed portion between the open portions and shielded from the outside air, and a plurality of flat semiconductor elements are accommodated in the sealed portion, and the flat semiconductor element is provided. A heat sink whose heat radiating portion is arranged in the first open portion and a heat radiator whose heat radiating portion is arranged in the second open portion are laminated and pressure-bonded together with the flat semiconductor element. By
It is not necessary to electrically insulate all of the cooler from the semiconductor element, and it is possible to avoid making the device large.
【００１７】つまり、保守点検時に触手の可能性のある
位置で外気と通ずる装置本体の第２の開放部分に放熱部
が配置された冷却器では、その受熱部を平形半導体素子
と絶縁する必要があるが、保守点検時に触手の可能性の
ない位置で外気と通ずる装置本体の第１の開放部分に放
熱部が配置された冷却器では、その放熱部に保守点検時
の触手の可能性がなく、また周辺環境からの導電性異物
の混入の恐れもないので、通常使用時の絶縁距離の確保
を考慮すればよく、半導体素子から電気絶縁する必要が
なくなる。したがって、第１の開放部分に放熱部が配置
された冷却器は、直接に平形半導体素子に積層圧接し、
冷却器に電圧がかかった状態での使用が可能であり、冷
却器周辺で装置が大形化することはない。That is, in the cooler in which the heat radiating portion is arranged in the second open portion of the main body of the apparatus which communicates with the outside air at the position where there is a possibility of tentacles during maintenance and inspection, it is necessary to insulate the heat receiving portion from the flat semiconductor element. Although there is a tentacle during maintenance and inspection, there is no possibility of tentacles during maintenance and inspection in a cooler that has a heat radiating portion located in the first open part of the device body that communicates with the outside air at a position where there is no possibility of tentacles during maintenance and inspection. In addition, since there is no fear that conductive foreign matter will be mixed from the surrounding environment, it is only necessary to consider ensuring the insulation distance during normal use, and it is not necessary to electrically insulate the semiconductor element. Therefore, the cooler in which the heat dissipation portion is arranged in the first open portion is directly laminated and pressure-contacted with the flat semiconductor element,
The cooler can be used with voltage applied, and the device does not become large around the cooler.
【００１８】請求項３の発明は、請求項１に記載の電力
変換装置において、前記開放部分に放熱部が配置された
冷却器が、前記平形半導体素子と共に積層される受熱部
と、放熱フィンの設けられた放熱部と、これらの間を接
続するヒートパイプにより構成され、水が作動液として
当該ヒートパイプ内に封入されたヒートパイプ式冷却器
であって、前記平形半導体素子と当該ヒートパイプ式冷
却器の受熱部とを熱伝導性の良い絶縁板を介して積層圧
接され、前記密閉部分内で排熱する冷却器が熱伝導性の
良い金属により形成され、前記平形半導体素子に直接圧
接されたものである。According to a third aspect of the present invention, in the power converter according to the first aspect, a cooler having a heat radiating portion arranged in the open portion includes a heat receiving portion laminated with the flat semiconductor element and a heat radiating fin. A heat pipe type cooler configured by a heat radiating unit provided and a heat pipe connecting between them, wherein water is sealed in the heat pipe as a working fluid, wherein the flat semiconductor element and the heat pipe type The heat receiving portion of the cooler is laminated and pressure-bonded via an insulating plate having good heat conductivity, and the cooler for discharging heat in the sealed portion is formed of metal having good heat conductivity and is directly pressure-contacted to the flat semiconductor element. It is a thing.
【００１９】請求項３の発明の電力変換装置では、外気
と通ずる装置本体の開放部分に放熱部が配置される冷却
器には、水を作動液とするために電気絶縁をとるのが困
難なヒートパイプ式冷却器を採用しても、このような構
造の冷却器だけではなく、装置本体の密閉部分内に排熱
する冷却器も採用し、それらを平形半導体素子に積層圧
接した構造なので、装置の大形化を招かず、かつ環境へ
の影響が少ない冷却構造になる。In the power converter of the third aspect of the present invention, it is difficult to electrically insulate the cooler in which the heat radiating portion is arranged in the open portion of the main body of the device which communicates with the outside air, because water is used as the working fluid. Even if a heat pipe type cooler is adopted, not only a cooler of such a structure but also a cooler for exhausting heat to the inside of the sealed portion of the main body of the device is adopted, and it is a structure in which they are laminated and pressure-bonded to the flat semiconductor element. The cooling structure does not increase the size of the device and has little impact on the environment.
【００２０】請求項４の発明は、請求項１又は３に記載
の電力変換装置において、前記密閉部分内で排熱する冷
却器として、熱伝導性の良い金属でできた空冷の冷却フ
ィン又は熱伝導性の良い金属製の中空のプレート状のコ
ンテナに作動液として水を封入した平板形ヒートパイプ
を用いて、電極取出し用の導体を兼用したものであり、
環境への影響がより少ない冷却構造である。According to a fourth aspect of the present invention, in the electric power converter according to the first or third aspect, as a cooler for exhausting heat in the sealed portion, an air-cooling cooling fin or heat made of metal having high heat conductivity is used. Using a flat plate heat pipe in which water is sealed as a working fluid in a metal-made hollow plate-shaped container with good conductivity, it also serves as a conductor for electrode extraction,
The cooling structure has less impact on the environment.
【００２１】請求項５の発明は、請求項１に記載の電力
変換装置において、前記開放部分に放熱部が配置された
冷却器が、前記平形半導体素子と共に積層される受熱部
と、放熱フィンの設けられた放熱部と、これらの間を接
続するヒートパイプにより構成され、水が作動液として
当該ヒートパイプ内に封入されたヒートパイプ式冷却器
であって、前記平形半導体素子と当該ヒートパイプ式冷
却器の受熱部とを熱伝導性の良い絶縁板を介して積層圧
接され、前記密閉部分内で排熱する冷却器が、前記平形
半導体素子と共に積層される受熱部と、放熱フィンの設
けられた放熱部と、これらの間を接続するヒートパイプ
により構成され、水が作動液として当該ヒートパイプ内
に封入されたヒートパイプ式冷却器であって、前記平形
半導体素子と当該ヒートパイプ式冷却器の受熱部とを直
接に積層圧接したものである。According to a fifth aspect of the present invention, in the power converter according to the first aspect, a cooler having a heat radiating portion arranged in the open portion includes a heat receiving portion laminated with the flat semiconductor element and a heat radiating fin. A heat pipe type cooler configured by a heat radiating unit provided and a heat pipe connecting between them, wherein water is sealed in the heat pipe as a working fluid, wherein the flat semiconductor element and the heat pipe type A cooler that is laminated and pressure-bonded to the heat receiving portion of the cooler via an insulating plate having good thermal conductivity and that discharges heat in the sealed portion is provided with a heat receiving portion that is laminated together with the flat semiconductor element and a heat radiation fin. A heat radiating section and a heat pipe connecting between them, wherein the heat pipe type cooler has water sealed as working fluid in the heat pipe, wherein the flat semiconductor element and Topaipu is obtained by directly laminating press the heat receiving portion of the cooler.
【００２２】請求項５の発明の電力変換装置では、すべ
ての冷却器に水を作動液とするヒートパイプ式冷却器を
採用することによって環境に対する影響を少なくし、し
かもそれらの冷却器の一部は装置本体の密閉部分内に排
熱する構造とすることによって平形半導体素子と直接に
積層圧接できるようにし、絶縁板の使用枚数を削減し、
大形化を避けることができる。In the power converter of the fifth aspect of the present invention, the heat pipe type cooler in which water is used as the working fluid is adopted for all the coolers to reduce the influence on the environment, and a part of those coolers. Has a structure in which heat is exhausted inside the sealed part of the device body so that it can be directly laminated and pressure contacted with a flat semiconductor element, reducing the number of insulating plates used,
It is possible to avoid upsizing.
【００２３】請求項６の発明は、請求項５に記載の電力
変換装置において、前記開放部分に放熱部が配置された
冷却器と比べて、前記密閉部分内に排熱する冷却器の熱
抵抗を大きく設定したものであり、装置本体の密閉部分
内への排熱量を抑制し、装置内部の温度上昇を抑制す
る。According to a sixth aspect of the present invention, in the power conversion device according to the fifth aspect, the heat resistance of the cooler that exhausts heat into the closed portion is higher than that of the cooler in which the heat radiation portion is arranged in the open portion. Is set to a large value to suppress the amount of heat exhausted into the sealed portion of the device body and suppress the temperature rise inside the device.
【００２４】請求項７の発明は、請求項５又は６に記載
の電力変換装置において、前記開放部分に放熱部が配置
された冷却器に採用されている放熱フィンに対して、前
記密閉部分内に排熱する冷却器に採用されている放熱フ
ィンの間隔を大きくしたものであり、装置本体の密閉部
分内への排熱量を抑制し、装置内部の温度上昇を抑制す
る。According to a seventh aspect of the present invention, in the power conversion device according to the fifth or sixth aspect, the inside of the closed portion is provided with respect to a radiation fin used in a cooler having a radiation portion arranged in the open portion. The distance between the radiation fins used in the cooler for exhausting heat is increased to suppress the amount of heat exhausted into the sealed portion of the apparatus body and suppress the temperature rise inside the apparatus.
【００２５】請求項８の発明は、請求項２に記載の電力
変換装置において、前記冷却器各々が、前記平形半導体
素子と共に積層される受熱部と、放熱フィンの設けられ
た放熱部と、これらの間を接続するヒートパイプにより
構成され、水が作動液として当該ヒートパイプ内に封入
されたヒートパイプ式冷却器であり、前記第２の開放部
分に放熱部が配置された冷却器がその受熱部を前記平形
半導体素子と熱伝導性の良い絶縁板を介して積層圧接さ
れ、前記第１の開放部分に放熱部が配置された冷却器が
その受熱部を前記平形半導体素子と直接に積層圧接され
たものである。According to an eighth aspect of the present invention, in the power converter according to the second aspect, each of the coolers has a heat receiving portion laminated with the flat semiconductor element, a heat radiating portion provided with heat radiating fins, and these heat radiating portions. Is a heat pipe type cooler in which water is sealed as a working fluid in the heat pipe, and the cooler in which a heat radiating portion is arranged in the second open portion receives the heat. Part is pressure-laminated with the flat semiconductor element via an insulating plate having good thermal conductivity, and a cooler having a heat radiating portion arranged in the first open portion directly pressure-laminates the heat receiving portion with the flat semiconductor element. It was done.
【００２６】請求項８の発明の電力変換装置では、同じ
構造の水を作動液としたヒートパイプ式冷却器を使用す
ることによって環境に対する影響を少なくし、しかも装
置本体の第１の開放部分に放熱部が配置される冷却器は
その受熱部を直接に平形半導体素子と積層圧接すること
ができて装置の大形化が避けられる。In the power converter of the eighth aspect of the present invention, by using the heat pipe type cooler using water of the same structure as the working fluid, the influence on the environment is reduced and the first open portion of the main body of the device is used. In the cooler in which the heat radiating portion is arranged, the heat receiving portion can be directly laminated and pressure contacted with the flat semiconductor element, so that the size of the device can be prevented.
【００２７】請求項９の発明は、請求項８に記載の電力
変換装置において、前記第２の開放部分に放熱部が配置
された冷却器と比べて、前記第１の開放部分に放熱部が
配置された冷却器の熱抵抗を大きく設定したものであ
り、装置本体の第１の開放部分への排熱量を抑制して熱
のこもりを防ぎ、装置の温度上昇を抑制する。According to a ninth aspect of the present invention, in the power converter according to the eighth aspect, the heat radiating portion is provided in the first open portion as compared with the cooler in which the heat radiating portion is arranged in the second open portion. The heat resistance of the placed cooler is set to be large, and the amount of heat exhausted to the first open portion of the device body is suppressed to prevent heat from staying in the device, thereby suppressing an increase in the temperature of the device.
【００２８】請求項１０の発明は、請求項８又は９に記
載の電力変換装置において、前記第２の開放部分に放熱
部が配置された冷却器に採用されている放熱フィンに対
して、前記第１の開放部分に放熱部が配置された冷却器
に採用されている放熱フィンの間隔を大きくしたもので
あり、装置本体の第１の開放部分への排熱量を抑制して
熱のこもりを防ぎ、装置の温度上昇を抑制する。According to a tenth aspect of the present invention, in the power converter according to the eighth or ninth aspect, the radiator fins used in a cooler in which a radiator portion is arranged in the second open portion are used. The distance between the heat radiating fins adopted in the cooler in which the heat radiating portion is arranged in the first open portion is increased, and the amount of heat exhausted to the first open portion of the apparatus main body is suppressed to keep heat from remaining. Prevent and suppress the temperature rise of the device.
【００２９】請求項１１の発明は、請求項１〜１０のい
ずれかに記載の電力変換装置において、当該電力変換装
置が電圧駆動形の高周波スイッチング可能な平形半導体
素子を２個直列接続した半導体スイッチング回路を構成
し、前記直列接続された半導体素子群の両端に熱伝導性
の良い絶縁板を介して前記開放部分に放熱部が配置され
た冷却器又は前記第２の開放部分に配置された冷却器を
積層圧接し、前記直列接続された半導体素子群の中間に
絶縁板を介さずに直接に、前記密閉部内で排熱する冷却
器又は前記第１の開放部分に配置された冷却器を挟み込
んで積層圧接したものであり、これにより、冷却器が電
気絶縁なしに直接に半導体素子間に積層される部分での
半導体素子間の実装上のインダクタンスが低減し、スナ
バ回路の簡素化が図れる。According to an eleventh aspect of the present invention, in the power converter according to any one of the first to tenth aspects, the power converter is a semiconductor switching device in which two voltage-driven flat semiconductor elements capable of high-frequency switching are connected in series. A cooler in which a circuit is formed, and a heat radiating portion is arranged in the open portion at both ends of the semiconductor element groups connected in series via insulating plates having good thermal conductivity, or cooling arranged in the second open portion. Are stacked and pressure-contacted, and a cooler for discharging heat in the sealed portion or a cooler arranged in the first open portion is directly sandwiched between the semiconductor element groups connected in series without an insulating plate. In this way, the mounting inductance between the semiconductor elements is reduced in the part where the cooler is directly laminated between the semiconductor elements without electrical insulation, which simplifies the snubber circuit. It is.
【００３０】請求項１２の発明は、電圧駆動形の高周波
スイッチング可能な平形半導体素子を２個直列接続した
半導体スイッチング回路を構成する電力変換装置におい
て、前記直列接続された半導体素子のプラス側には、熱
伝導性の良い絶縁板を介して水冷媒を採用したヒートパ
イプ式冷却器をその放熱部が装置本体の外気に接触する
開放部分に位置するように積層し、前記直列接続された
半導体素子のマイナス側には、水冷媒を採用したヒート
パイプ式冷却器をその放熱部が前記装置本体の外気に接
触する開放部分に位置するように直接に積層し、前記直
列接続された半導体素子の中間には、直接に冷却器を挟
み込み、当該の冷却器の放熱部は前記装置本体の密閉部
分内に、又は前記装置本体の開放部分以外の保守作業時
に触手の可能性のない位置に位置させたものである。According to a twelfth aspect of the present invention, in a power conversion device that constitutes a semiconductor switching circuit in which two voltage-driven flat semiconductor elements capable of high-frequency switching are connected in series, the positive side of the semiconductor elements connected in series is provided. , A heat pipe type cooler adopting a water refrigerant through an insulating plate having good thermal conductivity is laminated so that its heat radiation portion is located at an open portion in contact with the outside air of the apparatus main body, and the semiconductor elements connected in series On the negative side of, a heat pipe type cooler using a water refrigerant is directly laminated so that its heat dissipation portion is located at an open portion in contact with the outside air of the main body of the device, and an intermediate portion of the semiconductor elements connected in series. , The cooler is directly sandwiched, and the heat radiating part of the cooler is inside the sealed part of the device body, or there is a possibility of tentacles during maintenance work other than the open part of the device body. It is obtained by position in the stomach position.
【００３１】請求項１２の発明の電力変換装置では、半
導体素子群のマイナス側に積層される冷却器は絶縁板を
介在させることなく直接に半導体素子と積層することに
より、この部分での温度差が小さくなり、冷却器の小形
化が可能である。しかも、半導体素子のマイナス側の電
位は、入力が直流電源の場合、装置本体と共にアース電
位となるので電気絶縁をとらなくても安全性を保つこと
ができる。In the power converter of the twelfth aspect of the present invention, the cooler laminated on the minus side of the semiconductor element group is directly laminated with the semiconductor element without interposing an insulating plate, so that the temperature difference in this portion. Is smaller, and the cooler can be downsized. Moreover, when the input is a DC power supply, the potential on the minus side of the semiconductor element becomes the ground potential together with the apparatus main body, so that safety can be maintained without electrical insulation.
【００３２】[0032]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて詳説する。図１は本発明の第１の実施の形態の
電力変換装置の構造を示し、図２はその回路を示してい
る。図１及び図２に示した回路は、２個の平形半導体素
子１が直列接続され、その両端が本装置の入力となる直
流電源へ接続され、２個の半導体素子１の中間接続点が
交流出力となる回路であり、電力変換装置としてのイン
バータ回路の１相分の回路である。ここで、半導体素子
１には電圧駆動形の高周波スイッチング可能な平形半導
体素子、例えば、ＧＴＯサイリスタ（Gate Turn-off サ
イリスタ）やＩＧＢＴ（Insulated Gate Bipolar Trans
istor）が用いられる。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows the structure of a power converter according to a first embodiment of the present invention, and FIG. 2 shows its circuit. In the circuits shown in FIGS. 1 and 2, two flat semiconductor elements 1 are connected in series, both ends of which are connected to a DC power source that is an input of this device, and an intermediate connection point of the two semiconductor elements 1 is an AC. It is a circuit that becomes an output, and is a circuit for one phase of an inverter circuit as a power conversion device. Here, the semiconductor element 1 is a voltage-driven flat semiconductor element capable of high-frequency switching, such as a GTO thyristor (Gate Turn-off thyristor) or an IGBT (Insulated Gate Bipolar Transistor).
istor) is used.
【００３３】半導体素子１はその発生熱損失を効率良く
外部へ取出し、半導体素子１の温度を定格値以下に抑え
るため、冷却器と交互に積層され、半導体スタックを構
成する。In order to efficiently take out the generated heat loss to the outside and keep the temperature of the semiconductor element 1 below the rated value, the semiconductor element 1 is alternately laminated with a cooler to form a semiconductor stack.
【００３４】２個直列に接続された半導体素子１のプラ
ス側（上アーム）のものの正極側には、熱伝導性が良
く、かつ電気絶縁性のセラミックス板２１を挟んで、当
該半導体素子１の電極面（放熱面を兼用する）とヒート
パイプ式冷却器２の受熱部３が積層圧接されている。セ
ラミックス板２１と半導体素子１との間には導体２２が
挿入されていて、この導体２２が半導体素子１の電極取
出しとして用いられる。On the positive side of the positive side (upper arm) of the two semiconductor elements 1 connected in series, a ceramic plate 21 having good thermal conductivity and electrical insulation is sandwiched, and the semiconductor elements 1 of the semiconductor element 1 are connected. The electrode surface (which also serves as a heat radiation surface) and the heat receiving portion 3 of the heat pipe cooler 2 are laminated and pressure contacted. A conductor 22 is inserted between the ceramic plate 21 and the semiconductor element 1, and this conductor 22 is used as an electrode lead out of the semiconductor element 1.
【００３５】冷却器２は受熱部３と放熱部４とをヒート
パイプ８で接続したヒートパイプ式冷却器であり、ヒー
トパイプ８内には作動液として水が封入されている。こ
の冷却器２の放熱部４は装置本体５の開放部分７に置か
れる。The cooler 2 is a heat pipe type cooler in which the heat receiving portion 3 and the heat radiating portion 4 are connected by a heat pipe 8, and the heat pipe 8 is filled with water as a working fluid. The heat dissipation portion 4 of the cooler 2 is placed in the open portion 7 of the device body 5.
【００３６】装置本体５は仕切り１７によって密閉部分
６と開放部分７とが仕切られた構造である。そしてこの
装置本体５の密閉部分６の内部において、２個の直列接
続された半導体素子１のマイナス側（下アーム）のもの
の負極側にも、同様のセラミックス板２１と導体２２と
を挟んで、当該半導体素子１の電極面と冷却器２の受熱
部３が積層圧接されている。２個の直列接続された半導
体素子１の中間接続点には冷却器２０が積層されている
が、この冷却器２０は冷媒の相変化により受熱部から放
熱部へ熱輸送する方式のものではなく、銅あるいはアル
ミニウム製の熱伝導が良い金属で製作された自然空冷用
のヒートシンクであり、半導体素子１間に直接に挟み込
まれている。The apparatus main body 5 has a structure in which a partition 17 divides the closed portion 6 and the open portion 7. Inside the sealed portion 6 of the device body 5, the same ceramic plate 21 and conductor 22 are sandwiched between the negative side of the minus side (lower arm) of the two semiconductor elements 1 connected in series. The electrode surface of the semiconductor element 1 and the heat receiving portion 3 of the cooler 2 are laminated and pressure contact. A cooler 20 is laminated at an intermediate connection point between the two semiconductor elements 1 connected in series, but this cooler 20 is not of a system in which heat is transferred from the heat receiving portion to the heat radiating portion due to a phase change of the refrigerant. A heat sink for natural air cooling, which is made of a metal such as copper or aluminum having good heat conduction, and is directly sandwiched between the semiconductor elements 1.
【００３７】この冷却器２０は、半導体素子１に圧接す
る相対する平行な２面とフィン部を有していて、熱伝導
によって半導体素子１の発熱を中央部で受熱し、周囲の
フィン部から放散する。冷却器２０はこの熱放散を行う
と共に、その一部に形成された電極取出し部２０ａから
半導体素子１間の交流電力を取出すようになっている。This cooler 20 has two parallel parallel faces that are in pressure contact with the semiconductor element 1 and a fin portion, and receives heat generated by the semiconductor element 1 at the central portion by heat conduction, and receives heat from the surrounding fin portion. Dissipate. The cooler 20 dissipates this heat, and at the same time, extracts the AC power between the semiconductor elements 1 from the electrode lead-out portion 20a formed in a part thereof.
【００３８】そしてこれらの半導体素子１とヒートパイ
プ式冷却器２の受熱部３とヒートシンク冷却器２０とを
積層圧接させて半導体スタックを構成するため、圧接力
を出すばね部２４、偏荷重防止機構２５、押え板２６，
２７が半導体素子１等と同一軸上に積層され、スタッド
ボルト２８を締め付けることによって所定の圧力で押圧
されている。Since the semiconductor element 1, the heat receiving portion 3 of the heat pipe cooler 2 and the heat sink cooler 20 are laminated and pressure-contacted to form a semiconductor stack, a spring portion 24 which exerts a pressure contact force and an eccentric load prevention mechanism are provided. 25, the holding plate 26,
27 is stacked on the same axis as the semiconductor element 1 and the like, and is pressed with a predetermined pressure by tightening a stud bolt 28.
【００３９】次に、上記の構成の第１の実施の形態の電
力変換装置の動作を説明する。半導体素子１はスイッチ
ング回路として通電されることにより、発熱する。この
熱は半導体素子１の両側の放熱面よりヒートパイプ式冷
却器２の受熱部３とヒートシンク冷却器２０の胴部に熱
伝導により伝わる。このとき、受熱部３には間に積層さ
れたセラミックス板２１、導体２２を介して半導体素子
１から熱伝導される。一方、ヒートシンク冷却器２０側
では半導体素子１の放熱面より直接に熱伝導される。Next, the operation of the power conversion system of the first embodiment having the above-mentioned configuration will be described. The semiconductor element 1 generates heat by being energized as a switching circuit. This heat is transferred from the heat radiation surfaces on both sides of the semiconductor element 1 to the heat receiving portion 3 of the heat pipe cooler 2 and the body portion of the heat sink cooler 20 by heat conduction. At this time, heat is conducted from the semiconductor element 1 to the heat receiving portion 3 via the ceramic plate 21 and the conductor 22 which are laminated between them. On the other hand, on the heat sink cooler 20 side, heat is directly conducted from the heat radiation surface of the semiconductor element 1.
【００４０】ヒートパイプ式冷却器２の受熱部３に伝わ
った熱はヒートパイプ８により放熱部４へと熱輸送さ
れ、放熱部４は装置本体５の開放部分７に置かれている
ので、放熱部４から外気へこの熱が放散される。一方、
ヒートシンク冷却器２０に伝わった熱は、その周囲のフ
ィン部から装置本体５の密閉部分６内の空間に放散され
る。The heat transmitted to the heat receiving portion 3 of the heat pipe cooler 2 is transferred to the heat radiating portion 4 by the heat pipe 8, and the heat radiating portion 4 is placed in the open portion 7 of the apparatus main body 5, so that the heat radiating is performed. This heat is dissipated from the section 4 to the outside air. on the other hand,
The heat transmitted to the heat sink cooler 20 is dissipated from the fins around the heat sink cooler 20 to the space inside the sealed portion 6 of the apparatus body 5.
【００４１】電気回路上、２個直列接続された半導体素
子１の両端は導体２２により入力の直流電源に接続さ
れ、ヒートシンク冷却器２０に設けられた電極取出し部
２０ａが中間接続点の交流出力の端子となる。On the electric circuit, the two ends of the two semiconductor elements 1 connected in series are connected to the input DC power source by the conductors 22, and the electrode lead-out portion 20a provided in the heat sink cooler 20 serves as the AC output of the intermediate connection point. It becomes a terminal.
【００４２】以上のように第１の実施の形態の電力変換
装置では、ヒートパイプ式冷却器２の放熱部３がセラミ
ックス板２１によって電気回路から電気絶縁され、電圧
が印加されることはなく、したがって、ヒートパイプ式
冷却器２のヒートパイプ８を介して装置本体５の開放部
分７に置かれている放熱部４に電気が流れ、電圧が印加
されることはなく、保守点検作業時に作業員の触手があ
っても安全であり、また走行中に導電性異物が外気に開
放されているこの開放部分７内の放熱部４に付着しても
地絡が発生することがない。As described above, in the power converter according to the first embodiment, the heat radiating portion 3 of the heat pipe cooler 2 is electrically insulated from the electric circuit by the ceramic plate 21, and no voltage is applied. Therefore, electricity does not flow through the heat pipe 8 of the heat pipe type cooler 2 to the heat radiating portion 4 placed in the open portion 7 of the apparatus body 5, and no voltage is applied. Is safe even if there is a tentacle, and a ground fault does not occur even if the conductive foreign matter adheres to the heat radiating portion 4 in the open portion 7 which is open to the outside air while traveling.
【００４３】また、半導体素子１間に直接に積層されて
いるヒートシンク冷却器２０は半導体素子１間を最短で
電気接続していて、この部分でのインダクタンスは考え
得る最小の値に構成することができ、さらに、半導体素
子１の内部には複数のチップが配列されているが、それ
らに対しても、半導体スタックの同一軸上で積層接続さ
れる構造であるので、チップ間の電流バランスも均一に
なる。Further, the heat sink cooler 20 directly laminated between the semiconductor elements 1 electrically connects the semiconductor elements 1 in the shortest distance, and the inductance in this portion may be set to the smallest possible value. In addition, a plurality of chips are arranged inside the semiconductor element 1, and the chips are also stacked and connected on the same axis of the semiconductor stack, so that the current balance between the chips is uniform. become.
【００４４】また、直列接続される半導体素子１間は絶
縁板を介することなく直接に導電性のヒートシンク冷却
器２０に圧接されているので、低インダクタンスで実装
でき、スナバ回路の簡略化が可能となり、大幅に部品点
数の減った回路構成が実現できる。Further, since the semiconductor elements 1 connected in series are directly pressure-contacted to the conductive heat sink cooler 20 without an insulating plate, they can be mounted with low inductance and the snubber circuit can be simplified. A circuit configuration with a significantly reduced number of parts can be realized.
【００４５】さらにまた、冷却器として水冷媒のヒート
パイプ式冷却器と冷媒を使わないヒートシンク冷却器を
併用しており、いずれも環境への影響がない。Furthermore, a heat pipe type cooler of water refrigerant and a heat sink cooler which does not use a refrigerant are used together as a cooler, and both have no influence on the environment.
【００４６】次に、本発明の第２の実施の形態の電力変
換装置を図３に基づいて説明する。第１の実施の形態で
は直列接続された半導体素子１の中間接続点に挿入、積
層される冷却器２０として自然冷却形の、冷媒を用いな
いヒートシンク冷却器を採用したが、この第２の実施の
形態の電力変換装置では、平板形ヒートパイプ冷却器３
０を使用した点に特徴がある。なお、その他の部分の構
成は、図１に示した第１の実施の形態と共通する。Next, a power converter according to a second embodiment of the present invention will be described with reference to FIG. In the first embodiment, a natural cooling type heat sink cooler that does not use a refrigerant is adopted as the cooler 20 inserted and stacked at the intermediate connection point of the semiconductor elements 1 connected in series. In the power conversion device of the embodiment, the flat plate heat pipe cooler 3
The feature is that 0 is used. The configuration of the other parts is the same as that of the first embodiment shown in FIG.
【００４７】この平板形ヒートパイプ冷却器３０は、銅
あるいはアルミニウム製の中空の平板形ヒートパイプ
（そのプレートの内部に冷媒通路が形成されている）に
水を作動液として封入したものであり、この冷却器３０
が装置本体５の密閉部分６内に配置され、半導体素子１
と積層圧接されている部分より入熱し、それ以外の部分
で密閉部分６内の空間へ放熱する働きをする。The flat plate heat pipe cooler 30 is a hollow flat plate heat pipe made of copper or aluminum (a refrigerant passage is formed inside the plate) and water is sealed as a working fluid. This cooler 30
Is placed in the sealed portion 6 of the device body 5, and the semiconductor element 1
The heat is input from the portion that is laminated and pressure contacted, and the heat is released to the space inside the sealed portion 6 in the other portion.
【００４８】この平板形ヒートパイプ冷却器３０はその
形状に自由度があり、導体としての外部との電気的接続
もそのどの部分ででも行うことができ、その間のすべて
が放熱部として用いられることになる。The flat-plate heat pipe cooler 30 has a degree of freedom in its shape, and can be electrically connected to the outside as a conductor at any part thereof, and the whole space between them can be used as a heat radiation part. become.
【００４９】この第２の実施の形態で採用した平板形ヒ
ートパイプ冷却器３０の場合、第１の実施の形態で採用
したヒートシンク冷却器２０に比べて、熱輸送能力に優
れ、放熱部の配置の自由度があり、装置内部への熱放散
性能をヒートパイプ長さを変えることで（それがそのま
ま放熱面積を変えることとなるので）選択決定可能であ
る。また、直列接続された半導体素子１の中間接続点で
平板形ヒートパイプ冷却器３０はその厚みを薄くするこ
とができるので、より低インダクタンスで半導体素子の
実装が可能である。In the case of the flat plate heat pipe cooler 30 adopted in the second embodiment, the heat transport capacity is superior to that of the heat sink cooler 20 adopted in the first embodiment, and the arrangement of the heat radiating portion is arranged. There is a degree of freedom, and the heat dissipation performance inside the device can be selected and determined by changing the length of the heat pipe (since it directly changes the heat radiation area). Further, since the flat plate heat pipe cooler 30 can be thinned at the intermediate connection point of the semiconductor elements 1 connected in series, the semiconductor element can be mounted with lower inductance.
【００５０】次に、本発明の第３の実施の形態の電力変
換装置を図４及び図５に基づいて説明する。第３の実施
の形態は、同じ形式の水冷媒のヒートパイプ式冷却器
２，２′を採用し、第１、第２の実施の形態と同様に上
アームの半導体素子１の正極側、下アームの半導体素子
１の負極側それぞれに積層する冷却器２については、熱
良導性、かつ電気絶縁性のセラミックス板２１と導体２
２を介してその受熱部３を積層圧接し、一方、半導体素
子１間の中間接続点に積層する冷却器２′については、
その受熱部３′を半導体素子１に絶縁体を介さずに直接
に積層圧接し、ただし、この後者の冷却器２′について
は、その放熱部４′も装置本体５の密閉部分６内に配置
した構成を特徴としている。なお、その他の構成は第
１、第２の実施の形態と共通である。Next, a power converter according to a third embodiment of the present invention will be described with reference to FIGS. 4 and 5. In the third embodiment, the heat pipe type coolers 2 and 2'of the same type of water refrigerant are adopted, and similarly to the first and second embodiments, the positive electrode side and the lower side of the semiconductor element 1 of the upper arm are arranged. Regarding the cooler 2 laminated on each of the negative electrode side of the semiconductor element 1 of the arm, the ceramic plate 21 and the conductor 2 having good thermal conductivity and electrical insulation are provided.
With respect to the cooler 2 ′, the heat receiving portion 3 of which is laminated and pressure-bonded to the semiconductor element 1 via the layer 2, and the intermediate connection point between the semiconductor elements 1 is laminated,
The heat receiving portion 3'is directly laminated and pressure-contacted to the semiconductor element 1 without interposing an insulator. However, with respect to the latter cooler 2 ', the heat radiating portion 4'is also arranged in the sealed portion 6 of the apparatus body 5. It is characterized by the configuration. It should be noted that other configurations are common to the first and second embodiments.
【００５１】この第３の実施の形態の電力変換装置は、
図４に示したように鉄道車両駆動用として車体９の床下
に設置して使用するが、その場合には、装置本体５の開
放部分７を正面側（車両側方側）にし、密閉部分６を背
面側（車両中央側）にして設置することにより、開放部
分７には車両の走行風が通流してヒートパイプ式冷却器
２の放熱部４から効果的に熱放散させることができる。
そして、この開放部分７に放熱部４が配置されている側
の冷却器２は、第１、第２の実施の形態と同様にその受
熱部３が半導体素子１とセラミックス板２１によって絶
縁されているので、保守点検作業時に作業員が開放部分
７に手を入れて放熱部４に触手しても安全であり、また
走行中にこの放熱部４に導電性の異物が付着することが
あっても地絡が発生することもない。The power converter of the third embodiment is
As shown in FIG. 4, it is used by being installed under the floor of the vehicle body 9 for driving a railroad vehicle. In that case, the open portion 7 of the device main body 5 is on the front side (vehicle side) and the sealed portion 6 is used. Is installed on the rear side (vehicle center side), the traveling wind of the vehicle flows through the open portion 7 and heat can be effectively dissipated from the heat radiating portion 4 of the heat pipe cooler 2.
Then, in the cooler 2 on the side where the heat dissipation portion 4 is arranged in the open portion 7, the heat receiving portion 3 is insulated by the semiconductor element 1 and the ceramic plate 21 as in the first and second embodiments. Therefore, it is safe for an operator to put his / her hand in the open portion 7 and touch the heat radiating portion 4 during maintenance and inspection, and conductive foreign matter may adhere to the heat radiating portion 4 during traveling. Also, no ground fault will occur.
【００５２】そしてヒートパイプ式冷却器２′側はその
受熱部３′も放熱部４′も共に装置本体５の密閉部分６
に収容されているので、この冷却器２′を第１、第２の
実施の形態と同様に直接に半導体素子１の中間接続点に
積層圧接することができ、半導体素子１の直列接続を低
インダクタンスで実装することができる。On the side of the heat pipe type cooler 2 ', both the heat receiving portion 3'and the heat radiating portion 4'are both sealed portions 6 of the apparatus main body 5.
Since the cooler 2'is housed in the semiconductor device 1, the cooling device 2'can be directly laminated and pressure-contacted to the intermediate connection point of the semiconductor element 1 as in the first and second embodiments, and the series connection of the semiconductor element 1 can be reduced. It can be implemented with inductance.
【００５３】次に、本発明の第４の実施の形態を図６及
び図７に基づいて説明する。第４の実施の形態は、鉄道
車両駆動用の電力変換装置である。装置本体５は車体９
の床下において、外気に通ずる開放部分７ａ，７ｂを密
閉部分６の両側に有している。そして一方の開放部分７
ａは正面側（車両側方側）に位置し、他方の開放部分７
ｂは背面側（車両中央側）に位置する設定である。Next, a fourth embodiment of the present invention will be described with reference to FIGS. 6 and 7. The fourth embodiment is a power conversion device for driving a railway vehicle. The device body 5 is a vehicle body 9
Under the floor, open parts 7a and 7b communicating with the outside air are provided on both sides of the closed part 6. And one open part 7
a is located on the front side (vehicle side) and the other open portion 7
b is a setting located on the back side (vehicle center side).
【００５４】同じ水冷媒のヒートパイプ式冷却器が３台
使用され、そのうちの両外側の２台のヒートパイプ式冷
却器２それぞれは、第１〜第３の実施の形態それぞれと
同様に、半導体素子１に対して絶縁セラミック板２１と
導体２２とを介してその受熱部３を積層圧接され、その
放熱部４を装置本体５の正面側の開放部分７ａに配置さ
れている。残りの中央の１台のヒートパイプ式冷却器２
ａは、その受熱部３ａが２個直列接続される半導体素子
１の中間接続点に絶縁板を介さずに直接に積層圧接さ
れ、その放熱部４ａが装置本体５の背面側の開放部分７
ｂに配置されている。Three heat pipe type coolers of the same water refrigerant are used, and the two heat pipe type coolers 2 on both outer sides are the same as in the first to third embodiments. The heat receiving portion 3 is laminated and pressure contacted with the element 1 via the insulating ceramic plate 21 and the conductor 22, and the heat radiating portion 4 is arranged in the open portion 7a on the front side of the apparatus body 5. Remaining central heat pipe cooler 2
a is directly laminated and pressure-bonded to the intermediate connection point of the semiconductor element 1 in which two heat receiving portions 3a are connected in series without an insulating plate, and the heat radiating portion 4a is an open portion 7 on the back side of the apparatus body 5.
It is located at b.
【００５５】この第４の実施の形態では、第３の実施の
形態の場合のように中央部のヒートパイプ式冷却器２ａ
が装置本体５の密閉部分６内に排熱せず、開放部分７ｂ
において外気に熱放散する構造であるので、密閉部分６
の温度上昇を抑えることができる。しかも、この中央位
置の冷却器２ａは半導体素子１に直接に積層圧接されて
いて電圧が放熱部４ａにかかるが、この放熱部４ａは車
両の中央側に位置する開放部分７ｂに位置しているの
で、保守点検作業時に作業員が触手する恐れが少なく、
安全性を保つことができ、また異物の侵入、付着の可能
性も少ないので地絡の発生の恐れも少ない。In the fourth embodiment, as in the case of the third embodiment, the heat pipe cooler 2a at the central portion is used.
Does not dissipate heat into the closed portion 6 of the device body 5, and the open portion 7b
Since it has a structure that dissipates heat to the outside air at
The temperature rise can be suppressed. Moreover, the cooler 2a at the central position is directly laminated and pressure-contacted to the semiconductor element 1 and a voltage is applied to the heat radiating portion 4a. The heat radiating portion 4a is located at the open portion 7b located on the central side of the vehicle. As a result, there is less risk of workers touching it during maintenance and inspection work.
The safety can be maintained, and the possibility of foreign matter entering or adhering is low, so there is little risk of occurrence of a ground fault.
【００５６】次に、本発明の第５の実施の形態を図８及
び図９に基づいて説明する。この第５の実施の形態の電
力変換装置は、図４及び図５に示した第３の実施の形態
において採用した中央位置の冷却器２′に代えて、放熱
部４ｂにそのフィンピッチが両側の冷却器２の放熱部４
のフィンピッチよりも大きいもの、したがってフィン数
が少ないヒートパイプ式冷却器２ｂを採用したことを特
徴とする。Next, a fifth embodiment of the present invention will be described with reference to FIGS. 8 and 9. In the power converter of the fifth embodiment, instead of the cooler 2'in the central position adopted in the third embodiment shown in FIGS. 4 and 5, the heat radiating portion 4b has both fin pitches on both sides. Radiator 4 of the cooler 2
The heat pipe cooler 2b having a larger fin pitch than the above, and thus a small number of fins, is adopted.
【００５７】この第５の実施の形態の場合、装置本体５
の密閉部分６でのフィン間の空気流速が開放部分７での
空気流速よりも小さくなることを考慮して、空気流速が
遅くてもフィン間を効率良く空気が流れるようフィンピ
ッチを変えているのである。In the case of the fifth embodiment, the apparatus main body 5
Considering that the air flow velocity between the fins in the closed portion 6 is smaller than the air flow velocity in the open portion 7, the fin pitch is changed so that the air can efficiently flow between the fins even if the air flow velocity is slow. Of.
【００５８】また第５の実施の形態の場合、密閉部分６
内に配置されるヒートパイプ式冷却器２ｂの放熱部４ｂ
のフィンを開放部分７に放熱部４が配置されるヒートパ
イプ式冷却器２のフィンよりも面積が大きいものを採用
している。これは、フィンピッチを大きくしたことでフ
ィン枚数が減ることを補う目的である。Further, in the case of the fifth embodiment, the sealing portion 6
Heat radiation part 4b of heat pipe type cooler 2b arranged inside
The fin has a larger area than the fin of the heat pipe type cooler 2 in which the heat radiating portion 4 is arranged in the open portion 7. This is to compensate for the fact that the number of fins is reduced by increasing the fin pitch.
【００５９】なお、図６及び図７に示した第４の実施の
形態においても、装置本体５の中央側の開放部分７ｂに
配置される冷却器２ａに代えて、第５の実施の形態にお
ける冷却器２ｂを採用することもできる。Also in the fourth embodiment shown in FIGS. 6 and 7, instead of the cooler 2a arranged in the open portion 7b on the center side of the apparatus body 5, a fifth embodiment is used. The cooler 2b can also be adopted.
【００６０】次に、本発明の第６の実施の形態の電力変
換装置を図１０に基づいて説明する。インバータ回路で
のマイナス側（下アーム）の半導体素子１の負極側の電
位は、入力が直流電源である場合には接地電位となるの
で、通電時に高電圧が印加される恐れはない。そこで、
第６の実施の形態では、そのマイナス側（下アーム）の
半導体素子１の負極側に積層するヒートパイプ式冷却器
２は、その受熱部３を絶縁セラミックス板を介在させる
ことなく直接に半導体素子１に積層圧接させた構造にし
ている。なお、その他の構成は図１及び図２に示した第
１の実施の形態と共通する。Next, a power conversion system according to a sixth embodiment of the present invention will be described with reference to FIG. Since the potential on the negative side of the semiconductor element 1 on the negative side (lower arm) in the inverter circuit is the ground potential when the input is a DC power source, there is no fear of applying a high voltage during energization. Therefore,
In the sixth embodiment, the heat pipe cooler 2 laminated on the negative side of the semiconductor element 1 on the minus side (lower arm) of the semiconductor element is directly connected to the heat receiving portion 3 without interposing an insulating ceramic plate. 1 is laminated and pressure contacted. The rest of the configuration is common to the first embodiment shown in FIGS. 1 and 2.
【００６１】この第６の実施の形態の場合、マイナス側
の半導体素子１の負極側とそれに積層圧接するヒートパ
イプ式冷却器２との間に絶縁セラミックス板２１と導体
２２を介在させる必要がないので部品点数の削減が図
れ、また熱除去の性能も高まる。In the case of the sixth embodiment, it is not necessary to interpose the insulating ceramic plate 21 and the conductor 22 between the negative side of the semiconductor element 1 on the minus side and the heat pipe type cooler 2 which is laminated and pressure contacted with the negative side. Therefore, the number of parts can be reduced and the heat removal performance can be improved.
【００６２】[0062]
【発明の効果】以上のように請求項１の発明によれば、
外気と通ずる開放部分と外気から遮断された密閉部分と
を有する装置本体に対して、その密閉部分内に複数の平
形半導体素子を収容し、当該平形半導体素子に対して、
密閉部分内で排熱する冷却器と、放熱部が開放部分に配
置された冷却器とを平形半導体素子と共に積層圧接した
ので、冷却器のすべてを半導体素子と電気絶縁する必要
がなく、装置の大形化を避けることができる。As described above, according to the invention of claim 1,
With respect to the apparatus main body having an open portion communicating with the outside air and a sealed portion shielded from the outside air, a plurality of flat semiconductor elements are housed in the sealed portion, and with respect to the flat semiconductor element,
Since the cooler that exhausts heat in the sealed part and the cooler in which the heat dissipation part is arranged in the open part are laminated and pressure-bonded together with the flat semiconductor element, it is not necessary to electrically insulate the entire cooler from the semiconductor element. It is possible to avoid upsizing.
【００６３】請求項２の発明によれば、保守点検時に触
手の可能性のない位置で外気と通ずる第１の開放部分
と、保守点検時に触手の可能性のある位置で外気と通ず
る第２の開放部分と、それらの開放部分の間にあって外
気から遮断された密閉部分とを有する装置本体に対し
て、その密閉部分内に複数の平形半導体素子を収容し、
当該平形半導体素子に対して、その放熱部が第１の開放
部分に配置された冷却器とその放熱部が第２の開放部分
に配置された冷却器とを平形半導体素子と共に積層圧接
したので、冷却器のすべてを半導体素子と電気絶縁する
必要がなくなり、装置の大形化を避けることができる。According to the second aspect of the present invention, the first open portion that communicates with the outside air at a position where the tentacles are not possible during maintenance and inspection, and the second open portion that communicates with the outside air at the position where the tentacles are possible during maintenance and inspection. With respect to the device main body having an open portion and a closed portion which is between the open portions and is shielded from the outside air, a plurality of flat semiconductor elements are housed in the closed portion,
With respect to the flat semiconductor element, the cooler having the heat radiating portion arranged in the first open portion and the cooler having the heat radiating portion arranged in the second open portion are pressure-laminated together with the flat semiconductor element. It is not necessary to electrically insulate all of the cooler from the semiconductor element, and it is possible to avoid making the device large.
【００６４】請求項３の発明によれば、外気と通ずる装
置本体の開放部分に放熱部が配置される冷却器として、
水を作動液とするために電気絶縁をとるのが困難なヒー
トパイプ式冷却器を採用しても、このような構造の冷却
器だけではなく、装置本体の密閉部分内に排熱する冷却
器も採用し、それらを平形半導体素子に積層圧接した構
造なので、装置の大形化を招かず、かつ環境への影響が
少ない冷却構造にすることができる。According to the third aspect of the invention, as the cooler in which the heat radiating portion is arranged at the open portion of the apparatus body communicating with the outside air,
Even if a heat pipe type cooler, which is difficult to electrically insulate because water is used as the working fluid, is adopted, not only the cooler with such a structure but also a cooler that exhausts heat into the sealed part of the device body Also, since it is a structure in which they are laminated and pressure-bonded to a flat semiconductor element, a cooling structure that does not cause an increase in the size of the device and has little influence on the environment can be obtained.
【００６５】請求項４の発明によれば、請求項１又は３
の電力変換装置において、密閉部分内で排熱する冷却器
として、熱伝導性の良い金属製の中空のプレート状のコ
ンテナに作動液として水を封入した平板形ヒートパイプ
を用いたので、環境への影響がより少ない冷却構造にす
ることができる。According to the invention of claim 4, claim 1 or 3
In the power converter of the above, as a cooler that exhausts heat in the sealed part, a flat plate heat pipe in which water is enclosed as a working fluid in a metal hollow plate-shaped container with good thermal conductivity is used. The cooling structure can be less affected by.
【００６６】請求項５の発明によれば、すべての冷却器
に水を作動液とするヒートパイプ式冷却器を採用するこ
とによって環境に対する影響を少なくし、しかもそれら
の冷却器の一部を装置本体の密閉部分内に排熱する構造
とすることによって平形半導体素子と直接に積層圧接で
きるようにしたので、絶縁板の使用枚数を削減し、大形
化を避けることができる。According to the invention of claim 5, the heat pipe type cooler using water as a working fluid is adopted for all the coolers to reduce the influence on the environment, and a part of the coolers is used as an apparatus. Since the heat is exhausted into the sealed portion of the main body so that the flat semiconductor elements can be directly laminated and pressure-contacted with each other, it is possible to reduce the number of insulating plates to be used and to avoid upsizing.
【００６７】請求項６の発明によれば、請求項５の電力
変換装置において、開放部分に放熱部が配置された冷却
器と比べて、密閉部分内に排熱する冷却器の熱抵抗を大
きく設定したので、請求項５の効果に加えて、装置本体
の密閉部分内への排熱量を抑制し、装置内部の温度上昇
を抑制することができる。According to the sixth aspect of the present invention, in the power converter of the fifth aspect, the heat resistance of the cooler exhausting heat in the sealed portion is larger than that of the cooler in which the heat radiating portion is arranged in the open portion. Since the setting is made, in addition to the effect of the fifth aspect, it is possible to suppress the amount of heat exhausted into the sealed portion of the apparatus body and suppress the temperature rise inside the apparatus.
【００６８】請求項７の発明によれば、請求項５又は６
の電力変換装置において、開放部分に放熱部が配置され
た冷却器に採用されている放熱フィンに対して、密閉部
分内に排熱する冷却器に採用されている放熱フィンの間
隔を大きくし、かつ採用枚数を少なくしたので、請求項
５又は６の効果に加えて、装置本体の密閉部分内への排
熱量を抑制し、装置内部の温度上昇を抑制することがで
きる。According to the invention of claim 7, claim 5 or 6
In the power conversion device of, the gap between the heat radiation fins used in the cooler that discharges heat in the sealed portion is increased with respect to the heat radiation fins used in the cooler in which the heat radiation portion is arranged in the open portion, Moreover, since the number of adopted sheets is reduced, in addition to the effect of claim 5 or 6, in addition to suppressing the amount of heat exhausted into the sealed portion of the apparatus body, it is possible to suppress the temperature rise inside the apparatus.
【００６９】請求項８の発明によれば、同じ構造の水を
作動液としたヒートパイプ式冷却器を使用することによ
って環境に対する影響を少なくし、しかも装置本体の第
２の開放部分に放熱部が配置される冷却器はその受熱部
を直接に平形半導体素子と積層圧接することができて、
装置の大形化が避けられる。According to the eighth aspect of the present invention, by using the heat pipe type cooler using water having the same structure as the working fluid, the influence on the environment is reduced, and the heat radiating portion is provided in the second open portion of the apparatus main body. The cooler in which the heat receiving part can be directly laminated and pressure contacted with the flat semiconductor element,
The size of the device can be avoided.
【００７０】請求項９の発明によれば、請求項８の電力
変換装置において、第２の開放部分に放熱部が配置され
た冷却器と比べて、第１の開放部分に放熱部が配置され
た冷却器の熱抵抗を大きく設定したので、請求項８の効
果に加えて、装置本体の第１の開放部分への排熱量を抑
制して熱のこもりを防ぎ、装置の温度上昇を抑制するこ
とができる。According to the ninth aspect of the invention, in the power converter of the eighth aspect, the heat radiating portion is arranged in the first open portion as compared with the cooler in which the heat radiating portion is arranged in the second open portion. Since the heat resistance of the cooler is set to be large, in addition to the effect of claim 8, the amount of heat exhausted to the first open portion of the device body is suppressed to prevent heat from staying in the device and suppress the temperature rise of the device. be able to.
【００７１】請求項１０の発明によれば、請求項８又は
９の電力変換装置において、第２の開放部分に放熱部が
配置された冷却器に採用されている放熱フィンに対し
て、第１の開放部分に放熱部が配置された冷却器に採用
されている放熱フィンの間隔を大きくし、かつ採用枚数
を少なくしたので、請求項８又は９の効果に加えて、装
置本体の第１の開放部分への排熱量を抑制して熱のこも
りを防ぎ、装置の温度上昇を抑制することができる。According to the tenth aspect of the invention, in the power converter of the eighth or ninth aspect, the first heat-dissipating fin is used in the cooler having the heat-dissipating portion arranged in the second open portion. In addition to the effect of claim 8 or 9, since the interval of the heat radiation fins used in the cooler in which the heat radiation part is arranged in the open part of the device is increased and the number of heat dissipation fins is reduced, It is possible to suppress the amount of heat exhausted to the open portion, prevent the heat from staying warm, and suppress the temperature rise of the device.
【００７２】請求項１１の発明によれば、請求項１〜１
０のいずれかの電力変換装置において、当該電力変換装
置が電圧駆動形の高周波スイッチング可能な平形半導体
素子を２個直列接続した半導体スイッチング回路を構成
し、直列接続された半導体素子群の両端に熱伝導性の良
い絶縁板を介して冷却器を積層圧接し、直列接続された
半導体素子群の中間に絶縁板を介さずに直接に、冷却器
を挟み込んで積層圧接したので、冷却器が電気絶縁なし
に直接に半導体素子間に積層される部分での半導体素子
間の実装上のインダクタンスが低減し、スナバ回路の簡
素化が図れる。According to the invention of claim 11, claims 1 to 1
In any one of the power conversion devices of No. 0, the power conversion device constitutes a semiconductor switching circuit in which two voltage-driven flat-type semiconductor elements capable of high-frequency switching are connected in series, and heat is applied to both ends of the series-connected semiconductor element group. The cooler is laminated and pressure-bonded via an insulating plate with good conductivity, and the cooler is directly sandwiched and sandwiched in the middle of the series-connected semiconductor device group without an insulating plate, so the cooler is electrically insulated. Without this, the mounting inductance between the semiconductor elements in the portion directly laminated between the semiconductor elements is reduced, and the snubber circuit can be simplified.
【００７３】請求項１２の発明によれば、半導体素子群
のマイナス側に積層される冷却器は絶縁板を介在させる
ことなく直接に半導体素子と積層することにより、この
部分での温度差が小さくなり、冷却器の小形化が可能で
ある。しかも、半導体素子のマイナス側の電位は、入力
が直流電源の場合、装置本体と共にアース電位となるの
で電気絶縁をとらなくても安全性を保つことができる。According to the twelfth aspect of the invention, the cooler laminated on the minus side of the semiconductor element group is directly laminated with the semiconductor element without interposing the insulating plate, so that the temperature difference in this portion is small. Therefore, it is possible to downsize the cooler. Moreover, when the input is a DC power supply, the potential on the minus side of the semiconductor element becomes the ground potential together with the apparatus main body, so that safety can be maintained without electrical insulation.
【図１】本発明の第１の実施の形態の構造を示す断面
図。FIG. 1 is a sectional view showing a structure of a first embodiment of the present invention.
【図２】上記の実施の形態の回路図。FIG. 2 is a circuit diagram of the above embodiment.
【図３】本発明の第２の実施の形態の構造を示す断面
図。FIG. 3 is a cross-sectional view showing the structure of the second embodiment of the present invention.
【図４】本発明の第３の実施の形態の構造を示す断面
図。FIG. 4 is a cross-sectional view showing the structure of the third embodiment of the present invention.
【図５】図４におけるＸ１−Ｘ１線矢視図。5 is a view taken along line X1-X1 in FIG.
【図６】本発明の第４の実施の形態の構造を示す断面
図。FIG. 6 is a sectional view showing a structure of a fourth embodiment of the present invention.
【図７】図６におけるＸ２−Ｘ２線矢視図。FIG. 7 is a view taken along line X2-X2 in FIG.
【図８】本発明の第５の実施の形態の構造を示す断面
図。FIG. 8 is a sectional view showing the structure of the fifth embodiment of the present invention.
【図９】図８におけるＸ３−Ｘ３線矢視図。9 is a view taken along line X3-X3 in FIG.
【図１０】本発明の第６の実施の形態の構造を示す断面
図。FIG. 10 is a sectional view showing a structure of a sixth embodiment of the present invention.
【図１１】従来例の構造を示す断面図。FIG. 11 is a cross-sectional view showing a structure of a conventional example.
【図１２】図１１におけるＸ４−Ｘ４線矢視図。12 is a view taken along line X4-X4 in FIG.
【図１３】他の従来例の構造を示す断面図。FIG. 13 is a sectional view showing the structure of another conventional example.
【図１４】図１３におけるＸ５−Ｘ５線矢視図。14 is a view taken along line X5-X5 in FIG.
【図１５】さらに他の実施の形態の構造を示す断面図。FIG. 15 is a cross-sectional view showing the structure of still another embodiment.
１ 半導体素子 ２，２′，２ａ，２ｂ 冷却器 ３，３′，３ａ，３ｂ 受熱部 ４，４′，４ａ，４ｂ 放熱部 ５ 装置本体 ６ 密閉部分 ７，７ａ，７ｂ 開放部分 ８ ヒートパイプ ９ 車体 ２０ 冷却器 ２１ セラミックス板 ２２ 導体 ３０ 冷却器 1 Semiconductor element 2, 2 ', 2a, 2b cooler 3, 3 ', 3a, 3b Heat receiving part 4,4 ', 4a, 4b Heat dissipation part 5 Device body 6 Sealed part 7,7a, 7b open part 8 heat pipe 9 car body 20 cooler 21 Ceramic plate 22 conductor 30 cooler
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−322108（ＪＰ，Ａ) 特開 平６−21289（ＪＰ，Ａ) 特開 平７−277187（ＪＰ，Ａ) 特開 平11−220869（ＪＰ，Ａ) 特開 平７−142655（ＪＰ，Ａ) 特開 平８−78587（ＪＰ，Ａ) 特開 平７−15976（ＪＰ，Ａ) 特開 昭57−147257（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H02M 1/00 B60L 9/00 H02M 7/5387 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-4-322108 (JP, A) JP-A-6-21289 (JP, A) JP-A-7-277187 (JP, A) JP-A-11- 220869 (JP, A) JP 7-142655 (JP, A) JP 8-78587 (JP, A) JP 7-15976 (JP, A) JP 57-147257 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H02M 1/00 B60L 9/00 H02M 7/5387
Claims (12)
れた密閉部分とを有する装置本体に対して、その密閉部
分内に複数の平形半導体素子を収容し、当該平形半導体
素子に対して、前記密閉部分内に収容され、当該密閉部
分内のみで排熱する第１の冷却器と、前記開放部分に放
熱部が配置され、前記密閉部分内に受熱部が収容された
第２の冷却器とを前記平形半導体素子と共に積層圧接し
て成る電力変換装置。1. A device main body having an open portion communicating with outside air and a sealed portion shielded from the outside air, wherein a plurality of flat semiconductor elements are housed in the sealed portion, and the flat semiconductor element is provided with Housed in a sealed part, the sealed part
A first cooler that exhausts heat only within the minute portion, a heat radiating portion is arranged in the open portion, and a heat receiving portion is housed in the closed portion.
A power converter comprising a second cooler and the flat semiconductor element, which are laminated and pressure-bonded to each other.
外気と通ずる第１の開放部分と、保守点検時に触手の可
能性のある位置で外気と通ずる第２の開放部分と、それ
らの開放部分の間にあって外気から遮断された密閉部分
とを有する装置本体に対して、その密閉部分内に複数の
平形半導体素子を収容し、その放熱部が前記第１の開放
部分に配置され、受熱部が前記密閉部分に収容された第
１の冷却器と、その放熱部が前記第２の開放部分に配置
され、受熱部が前記密閉部分に収容された第２の冷却器
とを前記平形半導体素子と共に積層圧接して成る電力変
換装置。A first open portion communicating with wherein <br/> outside air during maintenance with no possibility of the position of the feeler, and a second opening portion communicating with the outside air in a position where they can tentacles during maintenance , A plurality of flat semiconductor elements are housed in the device body having a sealed part between the open parts and shielded from the outside air, and the heat dissipation part is arranged in the first open part. And the heat receiving part is housed in the sealed part.
1. A power converter comprising a cooler No. 1 and a second cooler in which a heat radiating portion thereof is arranged in the second open portion and a heat receiving portion is housed in the hermetically sealed portion, together with the flat semiconductor element by pressure lamination. .
て、 前記開放部分に放熱部が配置された第２の冷却器は、前
記平形半導体素子と共に積層される受熱部と、放熱フィ
ンの設けられた放熱部と、これらの間を接続するヒート
パイプにより構成され、水が作動液として当該ヒートパ
イプ内に封入されたヒートパイプ式冷却器であって、前
記平形半導体素子と当該ヒートパイプ式冷却器の受熱部
とを熱伝導性の良い絶縁板を介して積層圧接し、 前記密閉部分内で排熱する第１の冷却器は、熱伝導性の
良い金属により形成したもので、前記平形半導体素子に
直接圧接したことを特徴とする電力変換装置。3. The power converter according to claim 1, wherein the second cooler having a heat radiation portion arranged in the open portion is provided with a heat receiving portion laminated with the flat semiconductor element and a heat radiation fin. A heat pipe type cooler configured by a heat radiating section and a heat pipe connecting between the heat radiating section and water, wherein water is sealed as working fluid in the heat pipe, the flat semiconductor element and the heat pipe type cooler. The first cooler, which is pressure-laminated with the heat- receiving part of the heat- insulating part via an insulating plate having good thermal conductivity and discharges heat in the sealed part, is formed of a metal having good thermal conductivity. A power conversion device characterized by being directly pressure-contacted with the flat semiconductor element.
おいて、前記密閉部分内で排熱する第１の冷却器とし
て、熱伝導性の良い金属でできた空冷の冷却フィン又は
熱伝導性の良い金属製の中空のプレート状のコンテナに
作動液として水を封入した平板形ヒートパイプを用い
て、電極取出し用の導体を兼用したことを特徴とする電
力変換装置。4. The power converter according to claim 1 or 3, wherein the first cooler for discharging heat in the closed portion is an air-cooling cooling fin or a heat conductive member made of a metal having good heat conductivity. A power converter characterized by using a flat plate heat pipe in which water as a working fluid is enclosed in a good metal hollow plate-shaped container and also serving as a conductor for electrode extraction.
て、 前記開放部分に放熱部が配置された第２の冷却器は、前
記平形半導体素子と共に積層される受熱部と、放熱フィ
ンの設けられた放熱部と、これらの間を接続するヒート
パイプにより構成され、水が作動液として当該ヒートパ
イプ内に封入されたヒートパイプ式冷却器であって、前
記平形半導体素子と当該ヒートパイプ式冷却器の受熱部
とを熱伝導性の良い絶縁板を介して積層圧接し、 前記密閉部分内で排熱する第１の冷却器は、前記平形半
導体素子と共に積層される受熱部と、放熱フィンの設け
られた放熱部と、これらの間を接続するヒートパイプに
より構成され、水が作動液として当該ヒートパイプ内に
封入されたヒートパイプ式冷却器であって、前記平形半
導体素子と当該ヒートパイプ式冷却器の受熱部とを直接
に積層圧接したことを特徴とする電力変換装置。5. The power converter according to claim 1, wherein the second cooler in which a heat dissipation part is arranged in the open part is provided with a heat receiving part laminated with the flat semiconductor element and a heat dissipation fin. A heat pipe type cooler configured by a heat radiating section and a heat pipe connecting between the heat radiating section and water, wherein water is sealed as working fluid in the heat pipe, the flat semiconductor element and the heat pipe type cooler. The first cooler, which is pressed against the heat receiving part of the above through an insulating plate having a good thermal conductivity and discharges heat in the sealed part, includes a heat receiving part which is stacked together with the flat semiconductor element. A heat pipe type cooler configured by a heat radiating portion provided with heat radiating fins and a heat pipe connecting between the heat radiating fins, and water sealed in the heat pipe as a working liquid, wherein the flat semiconductor element and the flat semiconductor element Hi Power converter according to claim directly to laminated press the heat receiving portion of the heat pipe cooler.
て、前記開放部分に放熱部が配置された第２の冷却器と
比べて、前記密閉部分内に排熱する第１の冷却器の熱抵
抗を大きく設定したことを特徴とする電力変換装置。6. The power converter according to claim 5, wherein the heat of the first cooler that exhausts heat into the sealed portion is higher than that of the second cooler in which a heat radiating portion is arranged in the open portion. A power converter characterized by having a large resistance.
おいて、前記開放部分に放熱部が配置された第２の冷却
器に採用されている放熱フィンに対して、前記密閉部分
内に排熱する第１の冷却器に採用されている放熱フィン
の間隔を大きくしたことを特徴とする電力変換装置。7. The power converter according to claim 5 or 6, wherein a heat radiating fin employed in a second cooler having a heat radiating portion arranged in the open portion is discharged into the sealed portion. An electric power conversion device characterized in that an interval between radiating fins adopted in a first cooler for heating is increased.
て、 前記第１、第２の冷却器各々は、前記平形半導体素子と
共に積層される受熱部と、放熱フィンの設けられた放熱
部と、これらの間を接続するヒートパイプにより構成さ
れ、水が作動液として当該ヒートパイプ内に封入された
ヒートパイプ式冷却器であり、前記第１の開放部分に放熱部が配置された第１の冷却器
は、その受熱部を前記平形半導体素子と直接に積層圧接
し、 前記第２の開放部分に放熱部が配置された第２の冷却器
は、その受熱部を前記平形半導体素子と熱伝導性の良い
絶縁板を介して積層圧接し たことを特徴とする電力変換
装置。8. The power conversion device according to claim 2, wherein each of the first and second coolers includes a heat receiving portion that is stacked together with the flat semiconductor element, and a heat radiating portion provided with a heat radiating fin. A heat pipe type cooler configured by a heat pipe connecting between them, in which water is enclosed as a working fluid in the heat pipe, and a heat radiating portion is arranged in the first open portion. vessel
Directly presses the heat-receiving part directly onto the flat semiconductor device.
And a second cooler in which a heat dissipation portion is arranged in the second open portion
Has good heat conductivity in its heat receiving portion with the flat semiconductor element.
A power conversion device characterized by being laminated and pressure-bonded via an insulating plate .
て、前記第２の開放部分に放熱部が配置された第２の冷
却器と比べて、前記第１の開放部分に放熱部が配置され
た第１の冷却器の熱抵抗を大きく設定したことを特徴と
する電力変換装置。9. The power converter according to claim 8, in comparison with the second cold <br/>却器heat radiating portion in said second open portion is disposed, the first open portion A power converter in which a thermal resistance of a first cooler in which a heat radiation section is arranged is set to be large.
において、前記第２の開放部分に放熱部が配置された第
２の冷却器に採用されている放熱フィンに対して、前記
第１の開放部分に放熱部が配置された第１の冷却器に採
用されている放熱フィンの間隔を大きくしたことを特徴
とする電力変換装置。10. The power conversion device according to claim 8 or 9, wherein a heat radiating portion is arranged in the second open portion .
For the radiation fin used in the cooler of No. 2,
An electric power conversion device characterized in that a space between radiating fins adopted in a first cooler having a heat radiating portion arranged in a first open portion is increased.
力変換装置において、当該電力変換装置は、電圧駆動形
の高周波スイッチング可能な平形半導体素子を２個直列
接続した半導体スイッチング回路を構成し、 前記直列接続された半導体素子群の両端に熱伝導性の良
い絶縁板を介して前記開放部分に放熱部が配置された第
２の冷却器又は前記第２の開放部分に配置された第２の
冷却器を積層圧接し、前記直列接続された半導体素子群
の中間に絶縁板を介さずに直接に、前記密閉部内で排熱
する第１の冷却器又は前記第１の開放部分に配置された
第１の冷却器を挟み込んで積層圧接したことを特徴とす
る電力変換装置。11. The power conversion device according to claim 1, wherein the power conversion device constitutes a semiconductor switching circuit in which two voltage-driven flat semiconductor elements capable of high-frequency switching are connected in series. A first heat dissipating portion is disposed at the open portion via insulating plates having good thermal conductivity at both ends of the semiconductor element group connected in series .
The second <br/> cooler disposed cooler or the second open portion 2 are laminated press, directly without going through the intermediate insulating plate of the series-connected semiconductor element group, wherein Disposed in the first cooler or the first open portion that exhausts heat in the sealed portion
An electric power conversion device, wherein the first cooler is sandwiched and pressure-laminated.
な平形半導体素子を２個直列接続した半導体スイッチン
グ回路を構成する電力変換装置において、前記直列接続された半導体素子の中間には、直接に第１
の冷却器を挟み込み、当該第１の冷却器の放熱部は前記
装置本体の密閉部分内に、又は前記装置本体の外気に接
触する開放部分以外の保守作業時に触手の可能性のない
位置に位置させ、 前記直列接続された半導体素子のプラス側には、熱伝導
性の良い絶縁板を介して水冷媒を採用したヒートパイプ
式の第２の冷却器をその放熱部が前記開放部分に位置す
るように積層し、 前記直列接続された半導体素子のマイナス側には、水冷
媒を採用したもう１つのヒートパイプ式の第２の冷却器
をその放熱部が前記装置本体の外気に接触する開放部分
に位置するように積層し て成る電力変換装置。12. In a power conversion device that constitutes a semiconductor switching circuit in which two voltage-driven flat semiconductor elements capable of high-frequency switching are connected in series, in the middle of the semiconductor elements connected in series, the first semiconductor element is directly connected.
The heat sink of the first cooler is sandwiched between
Contact the inside of the device body inside or the outside air of the device body.
There is no possibility of tentacles during maintenance work other than the open parts to be touched.
The semiconductor elements connected in series to the positive side of the
Heat pipe adopting water refrigerant through insulating plate with good properties
A second cooler of the formula, the heat dissipating part of which is located in the open part
So that the semiconductor elements connected in series are water-cooled on the negative side.
Another heat pipe type second cooler using a medium
The open part where the heat dissipation part comes into contact with the outside air of the device body
A power conversion device that is stacked so that it is located at .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22984298A JP3420945B2 (en) | 1998-08-14 | 1998-08-14 | Power converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22984298A JP3420945B2 (en) | 1998-08-14 | 1998-08-14 | Power converter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000060106A JP2000060106A (en) | 2000-02-25 |
| JP3420945B2 true JP3420945B2 (en) | 2003-06-30 |
Family
ID=16898546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22984298A Expired - Fee Related JP3420945B2 (en) | 1998-08-14 | 1998-08-14 | Power converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3420945B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006101681A (en) * | 2004-09-30 | 2006-04-13 | Toshiba Mitsubishi-Electric Industrial System Corp | Inverter unit and power conversion apparatus using the same |
| KR101234503B1 (en) | 2006-12-20 | 2013-02-18 | 현대중공업 주식회사 | IGBT stack of plugin form |
| JP5099431B2 (en) * | 2008-02-15 | 2012-12-19 | アイシン・エィ・ダブリュ株式会社 | Inverter unit |
| DE112009005359T5 (en) | 2009-11-11 | 2012-11-29 | Kabushiki Kaisha Toshiba | Heatsink, heat sink assembly, semiconductor module and semiconductor device with a cooling device |
| EP2887787A3 (en) | 2013-12-13 | 2015-08-19 | Hitachi, Ltd. | Cooling structure for heating element and power converter |
| JP2016220383A (en) * | 2015-05-20 | 2016-12-22 | 株式会社日立製作所 | Cooling structure of heating element and power conversion device |
| EP3396801B1 (en) * | 2017-04-24 | 2020-10-21 | Fujikura Ltd. | High voltage terminal cooling structure |
| KR102047852B1 (en) * | 2019-10-29 | 2019-11-22 | 현대일렉트릭앤에너지시스템(주) | Propulsion Apparatus for the High Speed Railway having Converter and Inverter Power Stack Using the Module Type IGBT for the High Speed Railway |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147257A (en) * | 1981-03-06 | 1982-09-11 | Toshiba Corp | Cooler |
| JPH04322108A (en) * | 1991-04-19 | 1992-11-12 | Toshiba Corp | Semiconductor device |
| JP3067399B2 (en) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | Semiconductor cooling device |
| JP2903950B2 (en) * | 1993-06-22 | 1999-06-14 | 株式会社日立製作所 | Power converter |
| JPH07142655A (en) * | 1993-11-12 | 1995-06-02 | Fuji Electric Co Ltd | Heat pipe cooling material |
| JPH07277187A (en) * | 1994-04-08 | 1995-10-24 | Toshiba Corp | Control box for electric rolling stock |
| JPH0878587A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Transport Eng Kk | Power semiconductor device cooling device |
| JP3447543B2 (en) * | 1998-02-02 | 2003-09-16 | 東芝トランスポートエンジニアリング株式会社 | Power converter |
-
1998
- 1998-08-14 JP JP22984298A patent/JP3420945B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000060106A (en) | 2000-02-25 |
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