JP2016220383A - Cooling structure of heating element and power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device in which thermal resistance of a thermal connection part is reduced.CONSTITUTION: A cooling structure of a heating element includes: the heating element having at least one cooling surface formed by protruding a protrusion part; a heat receiving spacer for forming an insertion part into which the protrusion part is inserted; a holding member for pressing and holding the heat receiving spacer and the heating element; and a cooler for cooling the heat receiving spacer. In a fitting state where the heating element and the heat receiving spacer are fitted by the holding member, the distance between the cooling surface and the end surface of the protrusion part is smaller than that between the cooling surface and the surface opposite to the holding member of the heat receiving spacer.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a heating element cooling structure and a power converter.

  An uninterruptible power supply system (UPS) is a device for stably supplying power to a load without interruption when an abnormality occurs in a commercial power supply or the like that is a steady power supply. With recent innovations in IT utilization, there is an increasing demand for UPS in data centers and the like. Since UPS for data centers is laid in the suburbs of cities with high land prices, reduction of installation area, that is, downsizing of devices is desired.

  In order to reduce the size of the UPS, it is important to reduce the size of the UPS components. Among them, the power conversion device has a large occupied volume, so that the effect of miniaturization is great. In order to advance the miniaturization of the power conversion device, a small and efficient cooling method is required for the cooling mechanism of the power semiconductor module which is a heating element.

  As an air cooling method for a power semiconductor module, for example, Patent Document 1 discloses that “a first heat sink 25 is mounted on a CPU 23 via a heat transfer sheet 26. A plurality of heat transfer portions 25 a are mounted on the first heat sink 25. A second heat sink 27 is disposed on the first heat sink 25. The second heat sink 27 has an opening 29 into which the heat transfer portion 25a can be inserted with a gap. The heat transfer portion 25a and the opening 29 are filled with thermally conductive grease. "

JP 2000-269671 A

  In patent document 1, while reducing the load concerning an electronic component, the thermal radiation area can be expanded by the connection of a convex part and an opening part, and the thermal resistance of a heat conductive grease layer can be reduced. However, since the heat once conducted to the holding member is conducted to the back surface side of the heat generating member and radiated to the substrate, the heat resistance of conduction is large and the heat radiation performance is limited.

  The objective of this invention is providing the power converter device reduced in size by reducing the thermal resistance of a thermal connection part and improving heat dissipation performance.

  In order to achieve the above object, for example, a heating element having at least one cooling surface formed by projecting a convex part, a heat receiving spacer in which an insertion part into which the convex part is inserted is formed, the heat receiving spacer, and the heating element In the fitted state where the heating element and the heat receiving spacer are fitted by the holding member, the cooling surface and the end surface of the convex portion The cooling element cooling structure is smaller than the distance between the cooling surface and the surface of the heat receiving spacer facing the holding member.

  According to the present invention, since the convex portion is connected to the cooler via the heat conductive material, the heat from the power semiconductor module can be efficiently transmitted to the cooler.

It is a circuit diagram of a power converter concerning one embodiment of the present invention. It is a circuit diagram of the converter of a power converter device. It is a circuit diagram of the inverter of a power converter device. It is a circuit diagram of the charging / discharging chopper of a power converter device. It is a circuit diagram of the double-sided cooling power module used in this embodiment. It is an external view of the double-sided cooling power module used in this embodiment. It is a perspective view of a heat receiving spacer. It is a figure which shows the state which attached the heat receiving spacer to the double-sided cooling power module. FIG. 9 is a cross-sectional view taken along line AA ′ in FIG. 8. It is a perspective view of the state which mounted | wore the cooler with two double-sided cooling power modules. The exploded view of the area | region B enclosed with the broken line shown by FIG. 10 is shown. FIG. 12 is a cross-sectional view along CC ′ in FIG. 11. It is an enlarged view of the D section shown in FIG. This is a second embodiment of the present invention, in which the heat connection portion of the first embodiment is configured by a heat conductive sheet 451. It is an enlarged view of the E section of FIG. It is a 3rd Example of this invention, and is the form which comprised the power semiconductor module of Example 1 with the single-sided cooling power module. It is an enlarged view of the F section of FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a circuit diagram of a power converter 1 according to an embodiment of the present invention.

  This system assuming UPS is a constant inverter power supply system that can continue power supply without interruption in the event of a power failure. The three-phase AC power from the commercial power source 2 is supplied to the converter 11 through the stationary power source side switch 21 and the input filter circuit 17 for removing harmonics, and is converted from AC to DC by the converter 11 which is a rectifier circuit. Converted. After the rectification in the converter 11, the DC voltage 4 smoothed by the capacitor 20 is applied to the inverter 12, and reversely converted into an AC having a desired voltage and frequency. After the reverse conversion, the three-phase AC power 5 output from the inverter 12 is supplied to the load 3 via the load-side switch 24 after the harmonic component is removed by the output filter circuit 18. In the constant inverter power supply system, the three-phase AC commercial power supply 2 always supplies power to the load 3 via the converter 11 and the inverter 12. Therefore, when voltage fluctuations such as a momentary voltage drop occur in the commercial power supply 2, the converter 11 and the inverter 12 are controlled to stably supply power equivalent to that of a normal commercial power supply. The operations of the converter 11 and the inverter 12 and ON and OFF of the steady power supply side switch 21 and the load side switch 24 are controlled by signals from the host control circuit 201.

  On the other hand, a charge / discharge chopper 13 is connected to the previous stage of the inverter 12. When the commercial power supply is normal, the charge / discharge chopper 13 operates as a step-down chopper that steps down the DC voltage 4 and outputs the charge power 7 for charging the storage battery 14. The unsteady power supply side switch 22 has a role of connecting a power path when power from the storage battery 14 is sent to the converter 11. The storage battery protection switch 23 has a role of protecting the battery from overcurrent or the like. The charge / discharge chopper 13, the unsteady power supply side switch 22, and the storage battery protection switch 23 are controlled by signals from the upper control circuit 201.

  The converter 11, the inverter 12, and the charge / discharge chopper 13 generate heat during their operation, and the temperature rises. In order to suppress this temperature rise, the cooling air 10 generated by the cooling fan 9 (blower) is sent into the power converter 1 and cooled.

  FIG. 2 is a circuit diagram of the converter 11 constituting the power conversion device 1.

  The converter 11 converts the three-phase AC voltage of the commercial power source 2 into a DC voltage 4. When the commercial power supply is normal, the input three-phase AC power is supplied to the AC terminals 41r, 41s, and 41t of the converter 11, and the switching elements 31 and the rectifying elements 33 of the upper arm and the switching of the lower arm provided in each phase. Rectification is performed using the element 32 and the rectifying element 34. In this embodiment, an IGBT (Insulated Gate Bipolar Transistor) is used as a switching element and a diode is used as a rectifying element. However, the present invention is not limited to these, and other types of elements can be applied (the same applies hereinafter). . Switching elements 31 and 32 of converter 11 are driven by a signal from control circuit 202.

  FIG. 3 is a circuit diagram of the inverter 12 constituting the power conversion device 1.

  The inverter 12 converts DC power smoothed by a capacitor (not shown) into three-phase AC power. The DC voltage converted by the converter 11 is converted into a three-phase AC voltage using the upper arm switching element 31 and the rectifying element 33 and the lower arm switching element 32 and the rectifying element 34 provided in each phase. , And output to AC terminals 42u, 42v, 42w. The switching elements 31 and 32 of the inverter 12 are driven by a signal from the control circuit 203. The inverter 12 converts a DC voltage into an AC voltage regardless of the state of the commercial power supply 2 and outputs rated power to the output filter circuit 18.

  FIG. 4 is a circuit diagram of the charge / discharge chopper 13 constituting the power conversion device 1.

  The charge / discharge chopper 13 steps down the DC voltage and outputs the charge power when the commercial power supply 2 is normal. First, while the upper arm switching element 31 is ON, electromagnetic energy is stored in a reactor (not shown) connected between the storage battery 14 and the charge / discharge chopper 13. Next, when the switching element 31 of the upper arm is turned OFF, the electromagnetic energy of the reactor that generates back electromotive force is released, and the storage battery 14 is charged. On the other hand, when the commercial power supply is abnormal, the charge / discharge chopper 13 converts the low-voltage DC voltage of the storage battery 14 into a high-voltage DC voltage. First, the discharge power of the storage battery 14 is supplied to the reactor, and electromagnetic energy is accumulated in the reactor while the lower arm switching element 32 is ON. Next, when the switching element 32 of the lower arm is turned off, the rectifying element 33 of the upper arm is turned on by the counter electromotive force of the reactor. As a result, since the added voltage of the DC voltage of the storage battery 14 and the back electromotive force of the reactor appears at the output terminal of the charge / discharge chopper 13, the voltage is boosted as a result. The switching elements 31 and 32 of the charge / discharge chopper 13 are driven by a signal from the control circuit 204. In the present embodiment, the legs of the charge / discharge chopper 13 are arranged in two parallels, but the number of parallels is determined by the power supply amount during discharge to the charge / discharge chopper 13.

  From the above, the converter 11, the inverter 12, and the charge / discharge chopper 13 mounted on the power conversion device 1 of the present embodiment are the upper arm switching element 31 and the rectifying element 33, and the lower arm switching element 32 and the rectifying element 34. The basic configuration is a leg 35 connected in series. When the power supplied to the load 3 exceeds the rated power of the power conversion device 1, the rated power is increased by increasing the number of parallel legs 35 of the converter 11, the inverter 12, and the charge / discharge chopper 13.

  In the converter 11, the inverter 12, and the charge / discharge chopper 13, loss occurs due to resistances built in the switching elements 31 and 32 and the rectifying elements 33 and 34 when energized. Further, loss occurs when switching from the energized state to the blocked state. Since heat is generated during the operation with this loss, the temperatures of the converter 11, the inverter 12, and the charge / discharge chopper 13 rise.

  FIG. 5 is a circuit diagram of the double-sided cooling power module 100 used in the present embodiment. The double-sided cooling power module 100 includes switching elements 31 and 32 and rectifying elements 33 and 34 mounted on an insulator 112. Each semiconductor element is connected so as to constitute a leg 35 shown in FIGS. Further, the insulator 112 is provided with a P terminal 113P (DC positive terminal), an N terminal 113N (DC negative terminal), an AC terminal 113AC (AC terminal), and a gate terminal 111 for controlling on / off of the switching element. .

  FIG. 6 is an external view of a double-sided cooling power module 100 used in the present embodiment. The double-sided cooling power module 100 includes a substantially rectangular parallelepiped main body portion 101, a substantially rectangular parallelepiped flange portion 102 formed so as to expand one side surface of the main body portion 101, and a surface facing the main body portion 101 in the flange portion 102. It is comprised from the terminal part 103 which protrudes and consists of a some terminal. The terminals constituting the terminal portion 103 are configured by the P terminal 113P, the N terminal 113N, the AC terminal 113AC, and the gate terminal 111 shown in FIG.

  A large number (for example, a total of about 200 or more) of pin fins 122A, which are minute cylindrical protrusions, protrude from one surface 121A of the main body 101. Also, the same number of pin fins 122B (not shown) are formed on the other surface 121B of the main body 101 that faces the surface 121A. Hereinafter, the generic name of the pin fins 122A and 122B is referred to as “pin fin 122”. In addition to the pin fin shape as shown in the figure, the pin fin 122 may be a convex portion protruding from the surfaces 121A and 121B. The main body 101 has cooling surfaces 121A and 121B, which are regions where the pin fins 122 are formed on the surfaces 121A and 121B. Cooling surfaces 121A and 121B are collectively referred to as “cooling surfaces”. The thickness of the main body 101 excluding the pin fins 122, that is, the distance between the cooling surfaces 121A and 121B is defined as “d1”.

  FIG. 7 is a perspective view of the heat receiving spacer. A pair of heat receiving spacers 300 </ b> A and 300 </ b> B are abutted against the cooling surfaces 121 </ b> A and 121 </ b> B of the double-sided cooling power module 100. The heat receiving spacer 300A includes a substantially rectangular plate-shaped heat receiving portion 301A and a pair of space securing portions 302A having a substantially rectangular parallelepiped shape protruding from both ends of the heat receiving portion 301A toward the heat receiving spacer 300B. The heat receiving portion 301A has a large number of cylindrical through holes 303A (concave portions). These through holes 303A are formed at positions facing the pin fins 122A on the cooling surface 121A, and have a diameter slightly larger than the diameter of the pin fins 122A. Similarly to the heat receiving spacer 300A, the heat receiving spacer 300B includes a substantially rectangular plate-shaped heat receiving portion 301B and a pair of substantially rectangular parallelepiped space securing portions 302B protruding from both ends of the heat receiving portion 301B toward the heat receiving spacer 300B. It is composed of Although the heat receiving spacer 300B has a vertically symmetrical shape as a whole with respect to the heat receiving spacer 300A, the heat receiving portion 301B is opposed to the pin fins 122B protruding from the cooling surface 121B of the double-sided cooling power module 100, respectively. A through hole 303B is formed at the position.

  When attaching the heat receiving spacers 300A, 300B to the double-sided cooling power module 100, apply heat conduction grease to the cooling surfaces 121A, 121B, and align the positions of the through holes 303A, 303B with the pin fins 122, while maintaining the space securing portions 302A, 302B is collided. FIG. 8 shows a state where the heat receiving spacers 300A and 300B are attached to the double-sided cooling power module 100 in this way. As shown in the figure, the end surface 101a of the main body 101 is exposed, but most of the cooling surfaces 121A and 121B are covered with the heat receiving spacers 300A and 300B.

  FIG. 9 shows a cross-sectional view taken along the line AA ′ in FIG. When the space securing portions 302A and 302B are brought into contact with each other, the surfaces of the heat receiving portions 301A and 301B that face the heating elements face each other with a distance of d2. That is, the heat receiving spacers 300A and 300B are formed so that the distance d2 is slightly longer than the thickness d1 of the main body 101 of the double-sided cooling power module 100. As a result, gaps 310A and 310B are formed between the heat receiving part 301A and the main body part 101 and between the heat receiving part 301B and the main body part 101, respectively. Since the double-sided cooling power module 100 has play with respect to the heat receiving spacers 300A and 300B, the widths of the gaps 310A and 310B are not necessarily the same.

  When the space securing portions 302A and 302B are brought into contact with each other, heat conduction grease (not shown) applied to the pin fins 122 penetrates so as to be pushed out into the gaps 310A and 310B, and the gaps 310A and 310B also heat without gaps. Filled with conductive grease. Further, if the thickness of the main body 101 including the tip of the pin fin 122A to the tip of the pin fin 122B is d4, and the total width when the heat receiving spacers 300A and 300B are abutted is d5, the width d5 is the thickness d4. The heat receiving spacers 300A and 300B are formed so as to be slightly wider. Thus, gaps 311A and 311B are formed between the upper surface of heat receiving spacer 300A and the tip of pin fin 122A and between the lower surface of heat receiving spacer 300B and the tip of pin fin 122B, respectively. As described above, since the double-sided cooling power module 100 has play with respect to the heat receiving spacers 300A and 300B, the widths of the gaps 311A and 311B are not necessarily the same.

  When the heat receiving spacers 300A and 300B are attached to the cooler 400 (details will be described later), a pressing force 320 as indicated by hatched arrows is applied. This pressing force 320 is applied to the abutting portions of the space securing portions 302A and 302B. That is, the space securing portions 302A and 302B form gaps 310A and 310B between the main body 101 and the heat receiving spacers 300A and 300B, and furthermore, gaps 311A and 311B are also formed at the tip portions of the pin fins 122A and 122B. Therefore, the pressing force 320 is not applied to the main body 101.

  FIG. 10 is a perspective view of a state in which two double-sided cooling power modules 100 are mounted on the cooler 400. The cooler 400 includes a pair of coolers 400A and 400B. The coolers 400A and 400B have sandwiching members 410A and 410B each formed in a substantially rectangular parallelepiped block shape, and two double-sided cooling power modules in which the heat receiving spacers 300A and 300B are mounted on the sandwiching members 410A and 410B, respectively. 100 is sandwiched.

  The clamping members 410A and 410B are fastened to each other by a plurality of fixtures 420, and a pressing force 320 is applied to the clamping members 410A and 410B in the direction indicated by the hatched arrows. However, as described with reference to FIG. 9, the pressing force 320 is applied to the heat receiving spacers 300 </ b> A and 300 </ b> B but is not applied to the double-sided cooling power module 100. Note that a general bolt and nut can be used as the fixture 420.

  In FIG. 10, four heat pipes 430 protrude from the holding member 410A in the y-axis direction with an inclination of about 10 ° with respect to the xy plane (horizontal plane) formed by the x-axis and the y-axis. A plurality of plate-like heat radiation fins 440 are welded in the radial direction of the heat pipes 430. Accordingly, each radiating fin 440 is inclined by about 10 ° with respect to the xz plane (vertical plane) formed by the x-axis and the z-axis. The cooler 400B is configured similarly to the cooler 400A. By mounting the two double-sided cooling power modules 100 on the cooler 400 as described above, the air-cooled double-sided cooling power unit 500 is configured.

  When the double-sided cooling power module 100 generates heat, the heat is propagated to the holding members 410A and 410B via the heat receiving spacers 300A and 300B, and further propagated backward (in the y-axis direction) by the heat pipe 430. Then, when the cooling air 441 directed from the bottom to the top (toward the z-axis direction) is blown to the air-cooled double-sided cooling power unit 500, the cooling air 441 escapes upward while cooling the radiation fins 440. Heat is quickly discharged. Such a heat propagation path is indicated by an arrow 431 in the figure. The heat propagation in the direction orthogonal to the cooling air 441 is mainly propagation through the heat pipe 430.

  FIG. 11 shows an exploded view of a region B surrounded by a broken line shown in FIG. In FIG. 11, thermal conductive grease 450 is applied between the heat receiving spacer 300A and the holding member 410A and between the heat receiving spacer 300B and the holding member 410B. When the clamping members 410A and 410B are tightened by the fixture 420, the heat conduction grease 450 expands along the opposing surface of the heat receiving spacer 300A and the clamping member 410A and the opposing surface of the heat receiving spacer 300B and the clamping member 410B. It becomes a thin film layer like. At that time, the heat conduction grease 450 penetrates into the gaps 311A and 311B (see FIG. 9) at the tip portions of the pin fins 122A and 122B, and the heat conduction grease 450 penetrates into the outer surfaces of the pin fins 122A and 122B.

  FIG. 12 is a cross-sectional view taken along the line CC ′ in FIG. By attaching the clamping member 410A to the upper surface of the heat receiving spacer 300A, the interface between the two becomes a thermal connection surface. In order to efficiently transfer the heat of the double-sided cooling power module 100 to the pinching member 410A, the tip end of the pin fin 122A and the heat receiving portion 301A of the heat receiving spacer 300A must be smoothly connected to the pinching member 410A.

  FIG. 13 is an enlarged view of a portion D shown in FIG. In the present embodiment, the heat conduction grease 450 is filled in a region (a hatched portion in FIG. 11) formed by the cooling surface 121A, the pin fins 122A, the heat receiving portion 301A, and the clamping member 410A. At this time, the heat of the double-sided cooling power module 100 is transmitted to the clamping member 410A through the heat radiation paths 130, 131, and 132 indicated by broken lines. The heat dissipation path 130 is a path through which heat is transferred from the main body 101 to the clamping member 410A via the heat receiving part 301A. The heat radiation path 131 is a path through which heat is conducted from the main body 101 to the pin fins 122 </ b> A and is transmitted to the clamping member 410 </ b> A through the heat conduction grease 450. The heat radiation path 132 is a path through which heat is transferred from the pin fin 122A to the heat receiving portion 301A and then to the clamping member 410A. If it is this embodiment, the heat of double-sided cooling power module 100 can be radiated using the whole surface of pin fin 122A. Thus, in this embodiment, since heat can be radiated by a plurality of paths via the thermal conductive grease, it is possible to radiate heat efficiently.

  Further, when the power module 100 that is a heating element is viewed from a direction parallel to the direction in which the convex portions formed on the power module protrude (that is, from the −X axis direction to the + X axis direction in FIG. 13). 100), the filling area filled with the heat conductive material between the heat receiving spacer 300A and the clamping member 410A is between the through hole 303A and the pin fin 122A and between the cooling surface 121A and the heat receiving portion 301A. It is larger than the filling area between which the heat conductive material is filled. When heat is transferred from the heat receiving spacer 300A to the clamping member 410A, the heat spreads in the heat receiving spacer 300A, so that the filling area is increased in order to transfer heat more efficiently. With such a configuration, when heat from the heating element diffuses through the pin fins 122A and the heat receiving spacer 300A, heat can be radiated more effectively. It should be noted that the same configuration can be adopted in Example 2 and Example 3 described later, and the same effect can be obtained.

  Further, when the main body 101 expands due to thermal deformation of the double-sided cooling power module 100, stress during expansion is released due to fluid deformation of the heat conduction grease 450. At this time, since the gap 315 between the tip of the pin fin 122A and the pinching member 410A is larger than the gap 311A between the top surface of the heat receiving spacer 300A and the tip of the pin fin 122A, the tip of the pin fin 122A does not contact the pinching member 410A. Good thermal connection is maintained. The sandwiching member 410B side is configured in the same manner as the sandwiching member 410A side.

  FIG. 14 shows a second embodiment of the present invention, in which the heat connecting portion of the first embodiment is configured with a heat conductive sheet 451.

  FIG. 15 is an enlarged view of a portion E in FIG. The heat receiving portion 301A of the heat receiving spacer 300A and the sandwiching member 410A and the heat receiving portion 301A and the cooling surface 121A of the double-sided cooling power module 100 are thermally connected by a sheet-like heat conductive sheet 451. The general heat conductive sheet 451 has low fluidity as compared with the heat conductive grease 450, but its heat conductive performance is high. Therefore, even if the pin fin 122A and the heat receiving portion 301A cannot be connected by the heat conductive sheet 451, the heat dissipation performance is supplemented by the heat transfer on the heat dissipation paths 130 and 131. In FIG. 15, two heat conductive sheets 451 are stacked at the tip of the pin fin 122 </ b> A. However, the heat conductive sheet 451 may be formed of a single sheet using the deformability in the thickness direction.

  FIG. 16 shows a third embodiment of the present invention, in which the power semiconductor module of the first embodiment is configured by a single-sided cooling power module 600. The single-sided cooling power module 600 includes an element mount portion 651 on which an element is mounted and a base 652 to which an insulating substrate for electrical insulation is attached. The element mount portion 651 and the base 652 are not connected to each other. Joined by attaching.

  FIG. 17 is an enlarged view of a portion F in FIG. The thermal connection part of this configuration includes the heat receiving part 611 of the heat receiving spacer 610 and the base 652, the through hole 612 of the heat receiving spacer 610 and the pin fin 653 of the base 652, and the heat receiving part 611 and the clamping member 410. Between. In the present embodiment, as in the first embodiment, the heat connection portion 450 is filled with the heat conductive grease 450 and the entire surface of the pin fin 653 can be used to dissipate heat, so that heat from the heating element can be efficiently transmitted. .

1: Power converter 2: Commercial power supply 3: Load 4: DC voltage 5: Three-phase AC power 7: Charging power 9: Cooling fan 10: Cooling air 11: Converter 12: Inverter 13: Charge / discharge chopper 14: Storage battery 16: Reactor 17: Input filter circuit 18: Output filter circuit 20: Capacitor 21: Steady power supply side switch 22: Unsteady power supply side switch 23: Storage battery protection switch 24: Load side switch 31: Upper arm switching element 32: Lower Arm switching element 33: Upper arm rectifying element 34: Lower arm rectifying element 35: Leg 41r: R phase AC terminal 41s: S phase AC terminal 41t: T phase AC terminal 42u: U phase AC terminal 42v: V phase AC Terminal 42w: W-phase AC terminal 43: Charge / discharge chopper DC terminal 100: Double-sided cooling power module (heating element)
101: main body 101a: end face 102 of main body: flange 103: terminal 111: gate terminal 112: insulator 113P: P terminal 113N: N terminal 113AC: AC terminals 121, 121A, 121B: cooling surfaces 122, 122A 122B: Pin fin 130: Heat dissipation path 1 from the heating element
131; Heat dissipation path 2 from the heating element
132: Heat dissipation path 3 from the heating element
201: Host control circuit 202: Converter control circuit 203: Inverter control circuit 204: Charge / discharge chopper control circuit 300A, 300B: Heat receiving spacers 301A, 301B: Heat receiving portion (heat receiving plate)
302A, 302B: Space securing portions 303A, 303B: Through holes (concave portions)
310A, 310B, 311A, 311B, 315: gap 320: pressing force 400, 400A, 400B: cooler 410, 410A, 410B: clamping member 420: fixture 430: heat pipe 431: heat propagation direction of heat pipe 440: heat dissipation Fin 441: Cooling air 450 passing through the cooler 450: Thermal conductive grease 451: Thermal conductive sheet 500: Air-cooled double-sided cooling power unit 600: Single-sided cooling power module (heating element)
610: Single-sided cooling heat receiving spacer 611: Heat receiving portion 612: Through hole 620, 621: Air gap 651: Element mount portion 652: Base 653: Pin fin

Claims (8)

A heating element having at least one cooling surface formed by projecting a convex portion;
A heat receiving spacer in which an insertion part into which the convex part is inserted is formed;
A clamping member that clamps the heat receiving spacer and the heating element while pressing,
A cooler for cooling the heat receiving spacer,
In the fitting state in which the heating element and the heat receiving spacer are fitted by the holding member, the distance between the cooling surface and the end surface of the convex portion is the cooling surface and the surface of the heat receiving spacer facing the holding member. Heating element cooling structure smaller than the distance.   When the convex portion of the heating element is fitted to the insertion portion of the heat receiving spacer, the first heat conductive material is filled in the gap formed between the convex portion and the insertion portion. 2. The cooling structure for a heating element according to claim 1, wherein:   The cooling structure for a heating element according to claim 1 or 2, wherein a second heat conductive material is filled in a gap formed between the holding member and a surface of the heat receiving spacer facing the holding member.   When the heating element is viewed from a direction parallel to the direction in which the convex portion protrudes, the filling area filled with the second heat conductive material is filled with the first heat conductive material. The heating element cooling structure according to claim 3, wherein the cooling structure is larger than the area.   The heating element cooling structure according to claim 1, wherein the insertion portion is a through hole.   The heating structure cooling structure according to claim 1, wherein the second heat conductive material is heat conductive grease. The sandwiching member sandwiches and presses the pair of heat receiving spacers against two opposing surfaces of the heating element, and cools the heating element by contacting a heat pipe,
The heat generating body cooling structure according to claim 1, wherein the heat pipe is provided with a radiation fin. A heating element having at least one cooling surface formed by projecting a convex portion;
A heat receiving spacer in which an insertion part into which the convex part is inserted is formed;
A sandwiching member that sandwiches the heat receiving plate and the heating element while pressing,
A cooler for cooling the heat receiving plate;
A heat pipe in contact with the clamping member;
Radiating fins provided in the heat pipe;
Have
In the fitting state in which the heating element and the heat receiving spacer are fitted by the holding member, the distance between the cooling surface and the end surface of the convex portion faces the holding member of the cooling surface and the heat receiving plate. A power converter that is smaller than the distance to the surface.

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