JP2015115523A - Semiconductor apparatus for power conversion device, and power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor apparatus for a power conversion device that has expandability in arrangement of power modules and uses a plurality of power modules.SOLUTION: The semiconductor apparatus for the power conversion device comprises: a plurality of double-sides cooling power modules 500 each including cooling planes on both opposing surfaces and an electric terminal on one side surface in a vertical direction neighboring to the cooling planes; first and second coolers 510 each including a heat receiving block 501 holding the plurality of semiconductor modules disposed vertically between both ends, and a heat pipe 502 including a plurality of heat radiation fins 503 provided in a horizontal direction at positions higher than the semiconductor modules provided in the heat receiving block; and press contact means for bringing the double-sided cooling power modules 500 and the heat receiving block 501 into press-contact with each other. Air is blown from surface sides of the electric terminals to the heat radiation fins.

Description

  The present invention relates to an air-cooled double-sided cooling semiconductor device and a power conversion device used for a power conversion device and the like.

  The power conversion device is composed of a circuit using semiconductor elements that conduct and block current, and realizes functions such as AC / DC conversion and frequency conversion of current and voltage by controlling the switching operation of these semiconductor elements. . In the semiconductor element of the power conversion device, a loss occurs during energization and switching between on and off. When the temperature of the semiconductor element exceeds the operation limit point due to heat generated by this loss, the semiconductor element cannot cut off the current, and the power converter cannot perform a desired operation. For this reason, the apparatus which cools a semiconductor element is needed in a power converter device.

  There are several types of semiconductor elements, such as the type, external shape, and electrical characteristics of the semiconductor elements, and the cooler is designed according to each characteristic. For example, Patent Document 1 discloses a semiconductor element provided with two cooling surfaces, an electric terminal portion, and a cooler with pin-shaped protrusions in order to reduce the size of the semiconductor device and the cooler. In Patent Document 2, as in Patent Document 1, a cooler composed of a high thermal conductor and air cooling fins is provided on two cooling surfaces.

JP 2013-73964 A JP 2000-060106 A

  In Patent Document 1, cooling water is used to cool the semiconductor element, but it is necessary to separately provide a water channel, a pump, and a radiator. In addition, the power module in which the semiconductor element is housed has two surfaces for cooling the internal heat generation, and each surface has a heat radiation portion provided with a large number of fins, which makes the structure complicated. There's a problem.

  In Patent Document 2, in order to cool a semiconductor element, an attempt is made to improve the cooling performance by arranging a radiator near the element. However, the structure is complicated, and a power conversion apparatus that requires a large number of power modules. When this is applied, there is a problem that the apparatus becomes large.

  The present invention is an invention for solving the above-described problems, and is a power conversion device semiconductor device and a power conversion device that have expandability in the arrangement of power modules and can reduce the size of a power conversion device that uses a plurality of power modules. An object is to provide an apparatus.

  In order to achieve the above object, a semiconductor device for a power conversion device according to the present invention has cooling surfaces on both opposing surfaces, and an electric terminal (for example, P terminal 704P, N) on one side surface in the vertical direction adjacent to the cooling surface. A plurality of semiconductor modules (for example, double-sided cooling power module 500) having terminals 704N, AC terminals 704AC, and gate terminals 701), and a heat receiving block (for example, heat receiving block 501) sandwiching the plurality of semiconductor modules arranged above and below from both ends. And a heat pipe (for example, heat pipe 502) having a plurality of heat radiation fins (for example, heat radiation fins 503) provided in the heat receiving block and horizontally provided at a position above the semiconductor module. First and second coolers (eg, first cooler 510A and second cooler 510B) and a semiconductor Joule pressing means for pressing the heat receiving block (e.g., a bolt 504 and nut 505) and provided with, for the side of the electrical terminal, characterized in that it is blown to the heat radiation fins.

  ADVANTAGE OF THE INVENTION According to this invention, there exists an expandability in arrangement | positioning of a power module, and the power converter device which uses several power modules can be reduced in size.

It is a circuit diagram showing a power converter concerning this embodiment. It is a circuit diagram which shows the converter of a power converter device. It is a circuit diagram which shows the inverter of a power converter device. It is a circuit diagram which shows the chopper of a power converter device. It is a perspective view which shows the air-cooling type double-sided cooling power unit which has arrange | positioned several double-sided cooling power module. It is an exploded view which shows the arrangement configuration of the double-sided cooling power module in the air-cooled double-sided cooling power unit. It is explanatory drawing which shows a double-sided cooling power module, (a) is an external view, (b) is a circuit diagram. It is explanatory drawing which shows the heat transport path | route of an air-cooling type double-sided cooling power unit. It is a perspective view which shows a unit converter unit. It is an exploded view which shows the arrangement configuration of a unit converter unit. It is a circuit diagram which shows a unit converter unit. It is an external view which shows the power converter device which has arrange | positioned the several unit converter unit. It is explanatory drawing which shows the cooling method of the unit converter unit in a power converter device. It is a perspective view which shows the case where the radiation fin of the 1st and 2nd cooler is arrange | positioned in the nested state, (a) is a general view, (b) is an enlarged view. It is a perspective view which shows the case where the same radiation fin is installed in the heat pipe of a 1st and 2nd cooler, (a) is a general view, (b) is an enlarged view. It is a perspective view in case between the radiation fin of a 1st and 2nd cooler is provided and provided with the wavy rigidity relaxation part, (a) is a general view, (b) is an enlarged view.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The power converter 100 (refer FIG.1, FIG.12, FIG.13) of this embodiment is comprised from the several unit converter unit 910 (refer FIG.9, FIG.12). The unit converter unit 910 includes an air-cooled double-sided cooling power unit 520 (semiconductor device for power conversion device, see FIG. 5) on which a plurality of double-sided cooling power modules 500 (semiconductor module, see FIG. 7) are mounted. Hereinafter, each component of the power converter 100 will be described.

  FIG. 1 is a circuit diagram showing a power converter according to the present embodiment. As shown in FIG. 1, AC power adjusted to an appropriate voltage is supplied to a power converter 100 from a power receiving point 107 of a power system via a transformer 105. The supplied AC power is input to the converter 102 and converted to DC power. The DC power is input to the inverter 103 and converted into AC power. This AC power is consumed by the three-phase AC load 108.

  On the other hand, when power is not supplied to the converter 102 due to a malfunction of the power system or the like, the host control circuit 109 detects this and the chopper 104 operates. The DC power input from the storage battery 106 to the chopper 104 is adjusted to an appropriate power by the chopper 104 and input to the inverter 103. The DC power input to the inverter 103 is converted into AC power and consumed by the three-phase AC load 108.

  The above operation is determined by the host control circuit 109, and adjusted by a command signal 110C to the converter, a command signal 110I to the inverter, and a command signal 110X to the chopper. When the converter 102, the inverter 103, and the chopper 104 are operated, heat is generated and the temperature rises. In order to suppress this temperature rise, cooling air 111 generated by the cooling fan 101 (blower) is sent and cooled. Of the electrical system configured as described above, the cooling fan 101, the converter 102, the inverter 103, the chopper 104, the upper control circuit 109, and the like are accommodated in the power conversion device 100 according to the embodiment.

  FIG. 2 is a circuit diagram showing a converter of the power converter. FIG. 3 is a circuit diagram showing an inverter of the power converter. FIG. 4 is a circuit diagram showing a chopper of the power converter. A circuit of the converter 102, the inverter 103, and the chopper 104 will be described with reference to FIGS.

  The converter 102 shown in FIG. 2 includes a leg 203 (203R, 203S, 203T) including a plurality of semiconductor elements, and the leg 203 includes a plurality of switching elements 204 (for example, 204RH, 204RL) and a diode element 205 ( For example, 205RH, 205RL). Hereinafter, the leg 203, the switching element 204, and the diode element 205 are used as a general term when the entire individual elements are shown.

  Both ends of the leg 203 are connected to the capacitor 201. The upper arm of the leg 203R includes a switching element 204RH and a return diode element 205RH. The lower arm of the leg 203R includes a switching element 204RL and a return diode element 205RL. Similarly, the upper arm of the leg 203S includes a switching element 204SH and a reflux diode element 205SH. The lower arm of the leg 203S is composed of a switching element 204SL and a return diode element 205SL. The upper arm of the leg 203T includes a switching element 204TH and a return diode element 205TH. The lower arm of the leg 203T includes a switching element 204TL and a return diode element 205TL. Switching signals to the switching elements 204RH, 204RL, 204SH, 204SL, 204TH, and 204TL are controlled by the converter gate control unit 202 that is a lower-level control unit.

  In addition, the switching element of this embodiment can be used if it is an element which can switch on / off of an electric current. For example, there are an IGBT (Insulated Gate Bipolar Transistor) and a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor).

  The inverter 103 shown in FIG. 3 includes a leg 203 (203U, 203V, 203W) including a plurality of semiconductor elements, and both ends of the leg 203 are connected to a capacitor 301. The upper arm of the leg 203U includes a switching element 204UH and a reflux diode element 205UH. The lower arm of the leg 203U includes a switching element 204UL and a reflux diode element 205UL. Similarly, the upper arm of the leg 203V is composed of a switching element 204VH and a reflux diode element 205VH. The lower arm of the leg 203V includes a switching element 204VL and a reflux diode element 205VL. The upper arm of the leg 203W includes a switching element 204WH and a reflux diode element 205WH. The lower arm of the leg 203W includes a switching element 204WL and a return diode element 205WL. Switching signals to the switching elements 204UH, 204UL, 204VH, 204VL, 204WH, and 204WL are controlled by an inverter gate control unit 302 that is a lower-level control unit.

  The chopper 104 shown in FIG. 4 includes a leg 203 (203X) formed of a semiconductor element, and both ends of the leg 203 are connected to a capacitor 401. The upper arm of the leg 203X includes a switching element 204XH and a reflux diode element 205XH. The lower arm of the leg 203X includes a switching element 204XL and a reflux diode element 205XL. The connection point of the switching elements 204XH and 204XL is connected to the storage battery 106 (see FIG. 1) via the reactor 403. Switching signals to the switching elements 204XH and 204XL are controlled by a chopper gate control unit 402 which is a lower control unit.

As an example of the control operation, an example of the chopper gate control unit 402 will be described.
A switching signal applied to the chopper 104 is applied through a step-up / step-down switching circuit (not shown). These selections depend on the magnitude relationship between the DC voltage value between the converter 102 and the inverter 103 and the output voltage value of the converter 102 (rectifying function). When the output of the chopper 104 is larger than the output voltage of the converter 102, a PWM (Pulse Width Modulation) signal is transmitted to the switching element 204XL. In the opposite case, a PWM signal is transmitted to the switching element 204XH.

  When discharging the power of the storage battery 106, the switching element 204XL is switched according to the PWM signal. When the switching element is turned on, energy is stored in the reactor 403. On the other hand, when turned off, the voltage of the storage battery 106 and the energy of the reactor 403 charge a voltage higher than the voltage of the storage battery 106 to the capacitor 401 via the diode element 205XH connected to the switching element 204XH.

  When charging the storage battery 106 with electric power, the switching element 204XH is switched according to the PWM signal, and when the switching element 204XH is turned on, the electric power of the capacitor 401 is charged into the storage battery 106 via the reactor 403. When the switching element 204XH is off, the energy accumulated in the reactor 403 is circulated through the diode element 205XL connected to the switching element 204XL. With these operations, the power of the storage battery 106 can be charged and discharged.

  In the general power conversion device, the capacitors may be arranged in a lump, but in the present embodiment, the capacitors 201, 201 are used from the viewpoint of normalizing the configuration of the unit converter unit 910 (see FIG. 9) described later. 301 and 401 are divided. Specifically, the capacitors 201 and 301 are further divided for each leg 203.

  2 to 4, current is applied and blocked by the switching element 204 and the diode element 205 of the leg 203 shown in FIGS. 2 to 4, and the converter 102 performs AC to DC conversion, and the inverter 103 performs DC to AC conversion. When energized, a loss is generated by the resistance built in the switching element 204 and the diode element 205. Further, a loss occurs when switching from the energized state to the blocked state. For this reason, the operation of the power converter 100 is accompanied by heat generation.

(Air-cooled double-sided cooling power unit)
Next, the cooling structure in the air-cooled double-sided cooling power unit 520 of this embodiment will be described with reference to FIGS.
FIG. 5 is a perspective view showing an air-cooled double-sided cooling power unit in which a plurality of double-sided cooling power modules are arranged. FIG. 6 is an exploded view showing an arrangement configuration of the double-sided cooling power module in the air-cooling type double-sided cooling power unit.

  The air-cooled double-sided cooling power unit 520 basically includes a cooler 510 (first cooler 510A, second cooler 510B) and a plurality of double-sided cooling power modules 500. The cooler 510 includes a heat receiving block 501, a heat pipe 502, and heat radiating fins 503. The first cooler 510A includes a heat receiving block 501A, a heat pipe 502A, and heat radiating fins 503A. The second cooler 510B includes a heat receiving block 501B, a heat pipe 502B, and heat radiating fins 503B. The air-cooled double-sided cooling power unit 520 is characterized by having a slim and simple structure that is capable of arranging a plurality of power modules when the double-sided cooling power module 500 is mounted.

  When assembling the air-cooled double-sided cooling power unit 520, two or more double-sided cooling power modules 500 containing semiconductor elements as heat sources are sandwiched between the heat receiving blocks 501. After being sandwiched, the double-sided cooling power module 500 and the heat receiving block 501 are fixed by using a bolt 504 and a nut 505 which are press-contacting means for press-contacting. One end of one or more heat pipes 502 is connected to the inside of the heat receiving block 501. The other end of the heat pipe 502 extends upward, and is connected to the plurality of heat radiating fins 503 at a portion extending from the heat receiving block 501.

  Between the double-sided cooling power module 500 and the heat receiving blocks 501A and 501B, a high thermal conductivity, soft thermal conductive grease 506 (thermal conductive agent) is applied, and the thermal contact due to the respective surface roughness and dimensional tolerances. Defects may be reduced.

  FIG. 7 is an explanatory view showing a double-sided cooling power module, where (a) is an external view and (b) is a circuit diagram. As shown in FIG. 7B, the double-sided cooling power module 500 includes switching elements 204MH and 204ML and diode elements 205MH and 205ML. Each semiconductor element is connected so as to constitute a leg 203 (see, for example, FIG. 2).

  As shown in FIG. 7A, a P terminal 704P (DC positive terminal), an N terminal 704N (DC negative terminal), an AC terminal 704AC (AC terminal), and a gate terminal 701 for controlling on / off of the switching element; Are pulled out so that they can be connected to the outside using the insulator 703 while being electrically insulated from each other. When the above-described semiconductor element operates, electrical conduction with the outside is obtained via these electrical terminals, and simultaneously generated heat is exhausted via the cooling surface 702 in contact with the insulator 703. That is, the gate terminal 701 and the cooling surface 702 are electrically insulated, and the heat transport path and the electrical path are independent.

  The double-sided cooling power module 500 of the present embodiment has cooling surfaces 702 on both opposing surfaces, and a P terminal 704P, an N terminal 704N, which are electrical terminals of the power module, on one side surface in the vertical direction adjacent to the cooling surface 702, It is characterized by having an AC terminal 704AC and a gate terminal 701.

  FIG. 8 is an explanatory diagram showing a heat transport path of the air-cooled double-sided cooling power unit. FIG. 8 shows a cross-sectional view of FIG. In a plurality of double-sided cooling power modules 500 mounted vertically, heat generated in a plurality of built-in semiconductor elements 802 is transferred to the heat pipe 502 via the heat receiving block 501, and the heat 801 is quickly transported in the vertical direction. . The heat 801 is transmitted to the heat radiating fins 503 at the upper portion and is discharged by the cooling air 803 flowing between the heat radiating fins 503.

(Unit converter unit)
A unit converter unit 910 in the power conversion apparatus 100 according to the embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a perspective view showing the unit converter unit. FIG. 10 is an exploded view showing an arrangement configuration of unit converter units. FIG. 11 is a circuit diagram showing a unit converter unit.

  The unit converter unit 910 shown in FIG. 9 has the P terminal 704P, the N terminal 704N, and the AC terminal 704AC (see FIG. 7) of the air-cooled double-sided cooling power unit 520 described above as the P / N / AC laminated laminated bus bar 905. Connect to each of P layer, N layer, and AC layer. Further, the gate terminal 701 as an electrical terminal is connected to the gate driver substrate 904. Further, the positive terminal 902P and the negative terminal 902N of the plurality of capacitors 901 are connected to the P layer and N layer of the P / N / AC laminated bus bar 905, respectively. Further, the positive fuse 903P and the negative fuse 903N are connected to the P layer and the N layer of the P / N / AC laminated bus bar 905, respectively.

  FIG. 10 is an exploded view of FIG. The P / N / AC laminated bus bar 905 includes a P bus bar 905P, an N bus bar 905N, and an AC bus bar 905AC, and the bus bars are insulated by an insulating layer (not shown). In the unit converter unit 910, the P terminal 704P, the N terminal 704N, and the AC terminal 704AC of the double-sided cooling power module are connected to the P bus bar 905P, the N bus bar 905N, and the AC bus bar 905AC, respectively. The gate terminal 701 of the double-sided cooling power module 500 is connected to the gate driver substrate 904. Further, the P terminal of the capacitor 901 is connected to the P bus bar 905P, and the N terminal is connected to the N bus bar 905N. The above configuration is shown in an electric circuit diagram as shown in FIG.

  In the present embodiment, as shown in FIG. 9, cooling air 803 is blown to the radiation fins 503 from the surface side of the electrical terminals. Thereby, even if the unit converter units 910 are mounted side by side and densely on the power conversion device 100, there is an advantage that the cooling effect between the unit converter units 910 is not reduced. In the present embodiment, air is blown from the surface side of the electric terminal, but the present invention is not limited to this. For example, air may be blown from the opposite surface of the electric terminal to the heat radiation fin 503.

(Power converter)
FIG. 12 is an external view showing a power conversion device in which a plurality of unit converter units are arranged. FIG. 13 is an explanatory diagram illustrating a cooling method for the unit converter unit in the power conversion device.

  In the power converter 100, a converter 102, an inverter 103, and a chopper 104 are arranged side by side. The converter 102 includes unit converter units 910 corresponding to the three legs 203R, 203S, and 203T shown in FIG. The inverter 103 includes unit converter units 910 corresponding to the three legs 203U, 203V, and 203W shown in FIG. Although the chopper 104 is shown as one leg 203X in FIG. 4, the unit converter unit 910 corresponding to the two legs 203X is considered in consideration of the power capacity.

  The converter 102 comprises three unit converter units 910 by connecting a P / N laminated interphase laminated bus bar 1003 to the positive terminal 1001 and the negative terminal 1002, respectively. The inverter 103 is configured similarly to the converter 102. The chopper 104 is configured by connecting two unit converter units 910 in parallel.

  In converter 102, inverter 103, and chopper 104 having the above-described configuration, a plurality of unit converter units 907 can be connected in parallel per leg. For this reason, the rated output capacity of the power converter can be increased.

  In the cooling method of the unit converter unit 910 in the power conversion device shown in FIG. 13, the cooling air 803 is blown from the surface side of the electric terminal to the heat radiation fin 503 as in FIG. 9. Thereby, even if the unit converter units 910 are mounted side by side and densely on the power conversion device 100, there is an advantage that the cooling effect between the unit converter units 910 is not reduced. Further, when the calorific values of the converter 102, the inverter 103, and the chopper 104 are different, the wind speeds of the cooling air 803A, 803B, and 803C may be changed.

(Heat radiation structure)
Next, the radiation fin structure will be described with reference to FIGS.
FIG. 14 is a perspective view showing a case where the heat dissipating fins of the first and second coolers are arranged in a nested state, where (a) is an overall view and (b) is an enlarged view. The heat dissipating fins 503 in FIG. 14 are different in height from the heat dissipating fins 1401A of the first cooler 510A and the heat dissipating fins 1401B of the second cooler 510B, and are nested in the gaps between the heat dissipating fins. Has been placed. This is different from the heat dissipating fins 503 in FIG. Thereby, there exists an advantage which can each increase the thermal radiation area of the thermal radiation fin 1401A and the thermal radiation fin 1401B.

  FIG. 15 is a perspective view showing a case where the same heat radiation fins are installed in the heat pipes of the first and second coolers, where (a) is an overall view and (b) is an enlarged view. The heat dissipating fins 1501 in FIG. 15 are different from the heat dissipating fins 503 in FIG. 5 in that the heat dissipating fins of the first cooler 510A and the second cooler 510B are composed of the same heat dissipating fins. Thereby, even when the heat generation amounts on the first cooler 510 </ b> A side and the second cooler 510 </ b> B side are different, there is an advantage that it can be made uniform by the same heat radiation fin 1501.

  FIGS. 16A and 16B are perspective views in the case where the radiating fins of the first and second coolers are coupled with a wave-like rigidity relaxation portion, where FIG. 16A is an overall view and FIG. 16B is an enlarged view. FIG. The heat dissipating fins 1601 in FIG. 16 are coupled with the heat dissipating fins of the first cooler 510 </ b> A and the second cooler 510 </ b> B by providing a wave-like rigidity relaxation portion 1602. This is different from the heat dissipating fins 503 in FIG. Thereby, there exists an advantage which can increase the mechanical strength of the air-cooling type double-sided cooling power unit 520 comprised by the 1st cooler 510A and the 2nd cooler 510B.

Semiconductor device for power converter of this embodiment (for example, air-cooled double-sided cooling power unit 520
) Includes a first cooling surface (for example, cooling surface 702) electrically insulated from the electrical terminal and the electrical terminal, and a second cooling surface (for example, cooling surface 702) opposite to the first cooling surface. A first heat receiving block (for example, heat receiving block 501A) in which the double-sided cooling semiconductor module (for example, double-sided cooling power module 500) and the first cooling surface of the plurality of double-sided cooling semiconductor modules are in contact; One or more first heat pipes (eg, heat pipe 502A) with one end thermally connected therein and thermally connected at the other end of the first heat pipe A second heat receiving block (for example, heat receiving block 501B) in which one or more first heat radiating fins (for example, heat radiating fins 503A) and the second cooling surfaces of the plurality of double-sided cooling semiconductor modules are in contact with each other; Two heat receiving blocks and one or more second heat pipes (eg, heat pipe 502B) with one end thermally connected therein, and heat at the other end of the second heat pipe. One or more second heat radiating fins (for example, heat radiating fins 503B) connected to each other and a fixture (for example, bolt 504 and nut 505) for fixing the first heat receiving block and the second heat receiving block. I have.

  Thereby, the arrangement of the double-sided cooling power module 500 is expandable, and the air-cooled double-sided cooling power unit 520 that uses a plurality of double-sided cooling power modules 500 can be downsized. The air-cooled double-sided cooling power unit 520 shown in FIG. 5 has been described with respect to mounting of the two double-sided cooling power modules 500, but is not limited thereto. For example, in FIG. 5, two double-sided cooling power modules 500 are arranged in the vertical direction of the drawing, but three or more may be arranged.

  Summarizing the above embodiments, the power converter semiconductor device includes two or more double-sided cooling semiconductor modules having opposing flat cooling surfaces, these cooling surfaces, and electrical terminal portions electrically insulated therein. And a cooler 510 (heat radiator) that sandwiches the double-sided cooling semiconductor module from both sides. The cooler 510 includes a member called a heat receiving block 501 having a flat surface, a heat pipe 502 and a heat radiating fin 503. The semiconductor device for power converters is characterized in that the mounting of the double-sided cooling semiconductor module is scalable and has a slim and simple structure.

  The amount of heat generated in the semiconductor element 802 in the double-sided cooling semiconductor module is transmitted to the heat-receiving block 501 by contacting the cooling surface of the double-sided cooling semiconductor module and the flat surface of the heat-receiving block 501. Inside the heat receiving block 501, the heat pipe 502 is extended linearly in a direction parallel to the flat surface of the heat receiving block 501. One end of the heat pipe 502 is embedded in the heat receiving block 501, and the other end extends outside the heat receiving block 501. A heat pipe 502 extending from the heat receiving block 501 and the heat radiation fin 503 are connected. By flowing the cooling air 803 between the radiation fins 503, heat exchange is performed between the radiation fins 503 and the cooling air 803. As a result, the semiconductor element 802 in the double-sided cooling semiconductor module is cooled.

  According to the cooling structure configured as described above, the heat generation of the semiconductor element 802 can be quickly diffused through the heat pipe 502 and transmitted to the heat radiating fins 503, so that the heat radiating fin efficiency can be improved. Further, since the cooler 510 and the double-sided cooling semiconductor module are connected via the heat receiving block 501, for example, the failed double-sided cooling semiconductor module can be easily replaced.

100 Power converter 101 Cooling fan (blower)
DESCRIPTION OF SYMBOLS 102 Converter 103 Inverter 104 Chopper 105 Transformer 106 Storage battery 107 Power receiving point 108 AC load 109 Host control circuit 110I Command signal to inverter 110C Command signal to converter 110X Command signal to chopper 111 Cooling air 201, 301, 401, 901 Capacitor 202 Converter gate control unit 203 Leg 204 Switching element 205 Diode element 302 Inverter gate control unit 402 Chopper gate control unit 403 Reactor 500 Double-sided cooling power module (semiconductor module)
501 Heat receiving block 502 Heat pipe 503 Radiating fin 504 Bolt (pressure contact means)
505 Nut (pressure contact means)
506 Thermal conductive grease (thermal conductive agent)
510 cooler 520 air-cooled double-sided cooling power unit (semiconductor device for power converter)
701 Gate terminal (electrical terminal)
702 Cooling surface 704P P terminal (electrical terminal)
704N N terminal (electrical terminal)
704AC AC terminal (electrical terminal)
802 Semiconductor element 803 Cooling air 902P Positive electrode terminal 902N Negative electrode terminal 903P Positive electrode fuse 903N Negative electrode fuse 904 Gate driver substrate 905 P / N / AC laminated laminate bus bar 910 Unit converter unit 1001 Positive electrode 1002 Negative electrode 1003 P / N laminated phase laminated bus bar 1602 Rigidity Mitigation Department

Claims (9)

A plurality of semiconductor modules having cooling surfaces on opposite sides and having electrical terminals on one side surface in the vertical direction adjacent to the cooling surface;
A heat receiving block that sandwiches a plurality of semiconductor modules arranged from above and below from both ends, and a heat pipe that is provided in the heat receiving block and has a plurality of heat dissipating fins provided horizontally above the semiconductor module. First and second coolers comprising:
Press contact means for press-contacting the semiconductor module and the heat receiving block;
The semiconductor device for a power converter, wherein the air is blown from the surface side of the electrical terminal to the heat radiating fin. The cooling surface is electrically insulated from the electrical terminals of the semiconductor module;
The semiconductor device for a power converter according to claim 1, wherein the cooling surface is coated with a thermal conductive agent. 2. The semiconductor device for a power converter according to claim 1, wherein a gap is provided between the heat dissipating fins of the first and second coolers and is disposed at the same height. 2. The power conversion device according to claim 1, wherein the heat dissipating fins of the first and second coolers have different heights and are disposed so as to be nested in a gap between the heat dissipating fins. Semiconductor device. The semiconductor device for a power conversion device according to claim 1, wherein the same heat radiation fin is installed in the heat pipes of the first and second coolers. 2. The semiconductor device for a power converter according to claim 1, wherein a wave-like rigidity relaxation portion is provided between the heat dissipating fins of the first and second coolers. A plurality of the semiconductor devices for a power conversion device according to any one of claims 1 to 6 are arranged side by side. A power conversion device. The power conversion device according to claim 7, wherein the power conversion device includes a blower that blows air to the heat radiating fins from a surface side of the electric terminal inside the housing. A plurality of semiconductor modules having cooling surfaces on opposite sides and having electrical terminals on one side surface in the vertical direction adjacent to the cooling surface;
A heat receiving block that sandwiches a plurality of semiconductor modules arranged from above and below from both ends, and a heat pipe that is provided in the heat receiving block and has a plurality of heat dissipating fins provided horizontally above the semiconductor module. First and second coolers comprising:
Comprising a plurality of semiconductor devices for a power conversion device comprising pressure contact means for pressure-contacting the semiconductor module and the heat receiving block;
The surface of each electric terminal of the semiconductor devices for a plurality of power conversion devices is arranged on the same surface, and is blown from a blower to the heat radiating fin from the same surface side.

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