US20160341487A1 - Structure for Cooling Heat Generator and Power Conversion Equipment - Google Patents
Structure for Cooling Heat Generator and Power Conversion Equipment Download PDFInfo
- Publication number
- US20160341487A1 US20160341487A1 US15/143,705 US201615143705A US2016341487A1 US 20160341487 A1 US20160341487 A1 US 20160341487A1 US 201615143705 A US201615143705 A US 201615143705A US 2016341487 A1 US2016341487 A1 US 2016341487A1
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- US
- United States
- Prior art keywords
- heat
- heat receiving
- heat generator
- receiving spacer
- clamping members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/08—Fastening; Joining by clamping or clipping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Definitions
- the present invention relates to a structure for cooling a heat generator and power conversion equipment.
- UPS Uninterruptible Power-supply System
- a first heat sink 25 is mounted on a CPU 23 with the intermediate positioning of a heat transfer sheet 26 .
- a plurality of heat transfer portions 25 a are formed on the first heat sink 25 .
- a second heat sink 27 is placed on the first heat sink 25 .
- openings 29 are formed such that the heat transfer portions 25 a can be inserted therein with a gap.
- the gaps between the heat transfer portions 25 a and the openings 29 are filled with heat conductive grease.”
- the air-cooling method described in Japanese Unexamined Patent Application Publication No. 2000-269671 enables expanding heat dissipation areas by the connections between the convex portions and the openings and reducing the thermal resistance of a heat conductive grease layer, while reducing the load applied to an electronic part.
- heat that has once been conducted to a holding member is allowed to conduct up to the rear surface of a heat generating member and dissipated to a substrate, there is large thermal resistance in conduction, and heat dissipation performance is limited.
- An object of the present invention is to provide power conversion equipment downsized by reducing the thermal resistance of thermal connections and improving heat dissipation performance.
- a structure for cooling a heat generator including, for example, a heat generator having at least one cooled surface having protruding convex portions formed thereon, a heat receiving spacer in which hollow portions into which the convex portions are inserted are formed, clamping members which press and clamp the heat receiving space and the heat generator sandwiched therebetween, and a cooler which cools the heat receiving spacer.
- a distance between the cooled surface and the end faces of the convex portions is smaller than a distance between the cooled surface and a face, facing either of the clamping members, of the heat receiving spacer.
- the convex portions are connected to the cooler via a heat conductive material and, therefore, heat from a power semiconductor module can be transferred to the cooler efficiently.
- FIG. 1 is a circuit diagram of power conversion equipment pertaining to one embodiment of the present invention
- FIG. 2 is a circuit diagram of a converter in the power conversion equipment
- FIG. 3 is a circuit diagram of an inverter in the power conversion equipment
- FIG. 4 is a circuit diagram of a charging/discharging chopper in the power conversion equipment
- FIG. 5 is a circuit diagram of a dual-side cooled power module which is used in the present embodiment
- FIG. 6 is an external view of the dual-side cooled power module which is used in the present embodiment
- FIG. 7 is a perspective view of a heat receiving spacer
- FIG. 8 is a diagram depicting a state in which heat receiving spacers are attached to the dual-side cooled power module
- FIG. 9 is a cross-sectional view through line A-A′ in FIG. 8 ;
- FIG. 10 is a perspective view depicting a state in which two dual-side cooled power modules are attached to a cooler
- FIG. 11 is an exploded view of region B surrounded by dashed lines presented in FIG. 10 ;
- FIG. 12 is a cross-sectional view through line C-C′ in. FIG. 11 ;
- FIG. 13 is an enlarged view of portion D presented in FIG. 12 ;
- FIG. 14 depicts a second embodiment of the present invention, in which thermal connections in the first embodiment are provided by heat conductive sheets 451 ;
- FIG. 15 is an enlarged view of portion E in FIG. 14 ;
- FIG. 16 depicts a third embodiment of the present invention, in which the power semiconductor module of the first embodiment is configured as a one side cooled power module;
- FIG. 17 is an enlarged view of portion F in FIG. 16 .
- FIG. 1 is a circuit diagram of power conversion, equipment 1 pertaining to one embodiment of the present invention.
- This system assumed to operate as UPS is an uninterrupted inverter-fed power supply system which can continue to supply electric power without instantaneous interruption in case of electric power outage.
- Three-phase AC voltage from a utility power source 2 is supplied through a steady power source side switch 21 and a filtering circuit for input 17 for eliminating harmonics and to a converter 11 and converted from AC to DC by the converter 11 which is a rectification circuit.
- a DC voltage 4 smoothed by a capacitor 20 is applied to an inverter 12 and inversely converted to AC of a desired voltage and frequency.
- three-phase AC voltage 5 which is output by the inverter 12 , after its harmonic components are eliminated by a filtering circuit for output 18 , is supplied via a load side switch 24 to a load 3 .
- the utility power source 2 of three-phase AC voltage constantly supplies power via the converter 11 and inverter 12 to the load 3 . Therefore, in case a voltage fluctuation such as instantaneous voltage drop occurs with the utility power source 2 , it is enabled to stably supply power that is equivalent to normal utility power by controlling the converter 11 and inverter 12 .
- the operations of the converter 11 and inverter 12 and ON/OFF of the steady power source side switch 21 and the load side switch are controlled by a signal from a higher level control circuit 201 .
- a charging/discharging chopper 13 is connected to a stage preceding the inverter 12 .
- the charging/discharging chopper 13 operates as a step-down chopper which decreases the DC voltage 4 and outputs charging power 7 for charging a battery 14 .
- a non-steady power source side switch 22 has a role to make connections to power feeding paths when feeding power from the battery 14 to the converter 11 .
- a battery protecting switch 23 has a role to protect the battery from overcurrent or the like. The charging/discharging chopper 13 , non-steady power source side switch 22 , and battery protecting switch 23 are controlled by a signal from the higher level control circuit 201 .
- the converter 11 , inverter 12 , and charging/discharging chopper 13 generate heat during their operation and their temperature rises.
- cooling wind 10 generated by a cooling fan 9 air blower is fed in to circulate and cool the inside of the power conversion equipment 1 .
- FIG. 2 is a circuit diagram of the converter 11 which is a component of the power conversion equipment 1 .
- the converter 11 converts a three-phase AC voltage from the utility power source 2 to a DC voltage 4 .
- incoming three-phase AC power is supplied to AC terminals 41 r , 41 s , 41 t of the converter 11 and rectified with switching elements 31 and rectification elements 33 in an upper arm and switching elements 32 and rectification elements 34 in a lower arm, these elements being provided for the respective phases.
- IGBTs Insulated Gate Bipolar Transistors
- the switching elements 31 , 32 of the converter 11 are driven by a signal from a control circuit 202 .
- FIG. 3 is a circuit diagram of the inverter 12 which is a component of the power conversion equipment 1 .
- the inverter 12 converts DC power smoothed by the capacitor which is not depicted to three-phase AC power.
- DC voltage produced by the converter 11 is converted to a three-phase AC voltage with switching elements 31 and rectification elements 33 in an upper arm and switching elements 32 and rectification elements 34 in a lower arm, these elements being provided for the respective phases, and the three-phase AC voltage is output to AC terminals 42 u , 42 v , 42 w .
- the switching elements 31 , 32 of the inverter 12 are driven by a signal from a control circuit 203 .
- the inverter 12 converts a DC voltage to an AC voltage regardless of condition of the utility power source 2 and outputs rated electric power to the filtering circuit for output 18 .
- FIG. 4 is a circuit diagram of the charging/discharging chopper 13 which is a component of the power conversion equipment 1 .
- the charging/discharging chopper 13 decrease the DC voltage and outputs charging power, when normal utility power is supplied by the utility power source 2 . While switching elements 31 in an upper arm are ON, first, electromagnetic energy is accumulated in a reactor, which is not depicted, connected between the battery 14 and the charging/discharging chopper 13 . Then, upon switching of the switching elements 31 in the upper arm to OFF, counter electromotive force is generated in the reactor and the electromagnetic energy in the reactor is discharged to charge the battery 14 . On the other hand, when abnormal condition occurs with the utility power source, the charging/discharging chopper 13 converts a low DC voltage to a high DC voltage.
- the converter 11 , inverter 12 , and charging/discharging chopper 13 which are installed in the power conversion equipment 1 of the present embodiment are basically configured with legs 35 in which the switching elements 31 and the rectification elements 33 are connected in series in the upper arm and the switching elements 32 and the rectification elements 34 are connected in series in the lower arm.
- the rated power should be increased by increasing the number of parallel legs 35 in the converter 11 , inverter 12 , and charging/discharging chopper 13 .
- the resistors incorporated in the switching elements 31 , 32 and the rectification elements 33 , 34 give rise to loss, when these components carry current. Besides, switching from a current carrying state to a current blocking state gives rise to loss. Because heat is generated during operation entailing this loss, the temperature of the converter 11 , inverter 12 , and charging/discharging chopper 13 rises.
- FIG. 5 is a circuit diagram of a dual-side cooled power module 100 which is used in the present embodiment.
- switching elements 31 , 32 and rectification elements 33 , 34 mounted on an insulator 112 are included. Respective semiconductors are interconnected to form a leg 35 which is depicted in FIGS. 2 to 4 .
- a P terminal 113 P DC positive terminal
- an N terminal 113 N DC negative terminal
- 113 AC AC terminal
- a gate terminal 111 for ON/OFF control of the switching elements are attached.
- FIG. 6 is an external view of the dual-side cooled power module 100 which is used in the present embodiment.
- the dual-side cooled power module 100 is comprised of a substantially cuboidal main body part 101 , a substantially cuboidal flange part 102 formed to expand one lateral side of the main body part 101 , and a terminal block part 103 which is comprised of a plurality of terminals, protruding from a face of the flange part 102 on the side opposite to the main body part 101 .
- Terminals constituting the terminal block part 103 are as follows: P terminal 113 P, N terminal 113 N, AC terminal 113 AC, and gate terminal 111 depicted in FIG. 5 .
- One face 121 A of the main body part 101 has a great number (e.g., a total of approx. 200 or more) of protruding pin fins 122 A which are very small, columnar projections.
- On another face 121 B of the main body part 101 opposite to the face 121 A, as many pin fins 122 B (not depicted) as the number of the pin fins 122 A are also formed.
- the pin fins 122 A and 122 B will be collectively termed “pin fins 122 ”.
- the pin fins 122 may be any convex portions formed to protrude from the faces 121 A, 121 B, besides the form of pin fins as depicted in this drawing.
- the main body part 101 has cooled surfaces 121 A, 121 B which are regions where the pin fins 122 are formed on the faces 121 A, 121 B.
- the cooled surfaces 121 A and 121 B are collectively termed “cooled surfaces”.
- the thickness of the main body part 101 with the exception of the pin fins 122 that is, the distance between the cooled surfaces 121 , 121 B is denoted by “d 1 ”.
- FIG. 7 is a perspective view of a heat receiving spacer.
- a pair of heat receiving spacers 300 A, 300 B is fit onto the cooled surfaces 300 A, 300 B of the dual-side cooled power module 100 .
- a heat receiving spacer 300 A is comprised of a heat receiving part 301 A which has a substantially rectangular plate form and a pair of hollow space providing sections 302 A which have a substantially cuboidal form, protruding toward a heat receiving spacer 300 B from both edges of the heat receiving part 301 A.
- a great number of columnar through holes 303 A (concave portions) are formed.
- the heat receiving spacer 300 B is also comprised, of a heat receiving part 301 B which has a substantially rectangular plate form and a pair of hollow space providing sections 302 B which have a substantially cuboidal form, protruding toward the heat receiving spacer 300 B from both edges of the heat receiving part 301 B.
- the heat receiving spacer 300 B has a shape that is upside down symmetrical with respect to the heat receiving spacer 300 A, but, in the heat receiving part 301 B, through holes 303 B are formed in positions facing the respective pin fins 122 B protruding from the cooled surface 121 B of the dual-side cooled power module 100 .
- FIG. 9 is a cross-sectional view through line A-A′ in FIG. 8 .
- the hollow space providing sections 302 A, 302 B are put abutting against each other, the surfaces, facing a heat generator, of the heat receiving parts 301 A, 301 B face with each other with an interval as long as a distance d 2 between them. That is, the heat receiving spacers 300 A, 300 B are formed so that the distance d 2 is slightly longer than the thickness d 1 of the main body part 101 of the dual-side cooled power module 100 .
- gaps 310 A, 310 B are formed between the heat receiving part 301 A and the main body part 101 and between the heat receiving part 301 B and the main body part 101 , respectively.
- the gaps 310 A, 310 B do not necessarily have an equal width, since the dual-side cooled power module 100 has play with respect to the heat receiving spacers 300 A, 300 B.
- heat conductive grease (not depicted) applied over the pin fins is pushed to enter the gaps 310 A, 310 B and the gaps 310 A, 310 B are also filled with heat conductive grease without space.
- d 4 denotes the thickness of the main body part 101 from the tips of the pin fins 122 A to the tips of the pin fins 122 B
- d 5 denotes the entire width when the heat receiving spacers 300 A, 300 B are put abutting against each other
- the heat receiving spacers 300 A, 300 B are formed so that the width d 5 will be slightly wider than the thickness d 4 .
- gaps 311 A, 311 B are formed between the upper surface of the heat receiving spacer 300 A and the tips of the pin fins 122 A and between the lower surface of the heat receiving spacer 300 B and the tips of the pin fins 122 B in the drawing, respectively.
- the gaps 311 A, 311 B do not necessarily have an equal width, since the dual-side cooled power module 100 has play with respect to the heat receiving spacers 300 A, 300 B as described previously.
- pressing force 320 is applied, as indicated by hatched arrows.
- This pressing force 320 is applied to portions where hollow space providing sections 302 A, 302 B abut against each other. That is, this pressing force 320 is not applied to the main body part 101 , since the gaps 310 A, 310 B are formed between the main body part 101 and the heat receiving spacers 300 A, 300 B and the gaps 311 A, 311 B are formed in the portions adjacent to the tips of the pin fins 122 A, 122 B, these gaps being made by the hollow space providing sections 302 A and 302 B.
- FIG. 10 is a perspective view depicting a state in which two dual-side cooled power modules 100 are attached to the cooler 400 .
- the cooler 400 is comprised of a pair of coolers 400 A, 400 B.
- the coolers 400 A, 400 B have clamping members 410 A, 410 B formed in a substantially cuboidal block, respectively.
- Two dual-side cooled power modules 100 to each of which the heat receiving spacers 300 A, 300 B are attached, are sandwiched between and clamped by these clamping members 410 A, 410 B.
- the clamping members 410 A, 410 B are mutually tightened with a plurality of fasteners 420 and pressing force 320 is applied to the clamping members 410 A, 410 B in a direction indicated by hatched arrows. However, as described for FIG. 9 , this force 320 is applied to the heat receiving spacers 300 A, 300 B, but is not applied to the dual-side cooled power modules 100 .
- the fasteners 420 bolts and nuts which are commonly used can be used.
- each heat radiation fin 440 slants at an angle of about 10° with respect to an x-z plane (vertical plane) formed by x and z axes.
- a cooler 400 B is configured in the same way as for the cooler 400 A. By thus mounting two dual-side cooled power modules 100 to the cooler 400 , an air-cooled dual-side cooled power unit 500 is configured.
- the heat is transferred via the heat receiving spacers 300 A, 300 B to the clamping members 410 A, 410 B and further transferred backward (in the y-axis direction) through the heat pipes 430 .
- cooling wind 441 directed from bottom to top is blown into this air-cooled dual-side cooled power unit 500 , the cooling wind 441 moves upward, while cooling the heat radiation fins 440 and, thus, the heat is expelled rapidly. Paths of such heat transfer are indicated by arrows 431 in the drawing. Heat transfer in a direction perpendicular to the direction of the cooling wind 441 is mainly due to the heat pipes 430 .
- FIG. 11 is an exploded view of region B surrounded by dashed lines presented in FIG. 10 .
- heat conductive grease 450 is applied between the heat receiving spacer 300 A and the clamping member 410 A and between the heat receiving spacer 300 B and the clamping member 410 B, respectively.
- the heat conductive grease 450 spreads over an interface plane between the heat receiving spacer 300 A and the clamping member 410 A and an interface plane between the heat receiving spacer 300 B and the clamping member 410 B and makes thin film layers as depicted.
- the heat conductive grease 450 also enters the gaps 311 A, 311 B in the portions adjacent to the tips of the pin fins 122 A, 122 B (see FIG. 9 ) and the outsides of the pin fins 122 A, 122 B are immersed in the heat conductive grease 450 .
- FIG. 12 is a cross-sectional view through line C-C′ in FIG. 11 .
- Placing the clamping member 410 A on the upper surface of the heat receiving spacer 300 A provides a thermal connection surface at the interface between both.
- the tips of the pin fins 122 A and the heat receiving part 301 A of the heat receiving spacer 300 A must connect with the clamping member 410 A in a smooth condition.
- FIG. 13 is an enlarged view of portion D presented in FIG. 12 .
- a region (which is hatched in FIG. 13 ) that is formed by the cooled surface 121 A, pins fins 122 A, heat receiving part 301 A, and clamping member 410 A is filled with heat conductive grease 450 .
- heat of the dual-side cooled power module 100 is transferred to the clamping member 410 A through heat dissipation paths 130 , 131 , 132 indicate by dashed lines.
- a heat dissipation path 130 is a path through which heat is transferred from the main body part 101 via the heat receiving part 301 A to the clamping member 410 A.
- a heat dissipation path 131 is a path through which heat is conducted from the main body part 101 to the pin fin 122 A and transferred via the heat conductive grease 450 to the clamping member 410 A.
- a heat dissipation path 132 is a path through which heat migrates from the pin fin 122 A to the heat receiving part 301 A and then the heat is transferred to the clamping member 410 A.
- the present embodiment enables dissipating heat of the dual-side cooled power module 100 through making effective use of the entire outer surfaces of the pin fins 122 A. As described above, it is enabled to dissipate heat through a plurality of paths via heat conductive grease in the present embodiment, and, therefore, heat can be dissipated efficiently.
- a filler area where the heat conductive material is filled between the heat receiving spacer 300 A and the clamping member 410 A is larger than a filler area where the heat conductive material is filled between the through hole 303 A and the pin fin 122 A and between the cooled surface 121 A and the heat receiving part 301 A.
- the main body part 101 has swollen by thermal deformation of the dual-side cooled power module 100 , swelling stress is released by fluid deformation of the heat conductive grease 450 .
- the gap 315 between the tips of the pin fins 122 A and the clamping member 410 A is larger than the gap 311 A between the upper surface of the heat receiving spacer 300 A and the tips of the pin fins 122 A, the tips of the pins fins 122 A do not abut against the clamping member 410 A and a good thermal connection condition is maintained.
- the side of the clamping member 410 B is configured in the same way as for the side of the clamping member 410 A.
- FIG. 14 depicts a second embodiment of the present invention, in which thermal connections in the first embodiment are provided by heat conductive sheets 451 .
- FIG. 15 is an enlarged view of portion E in FIG. 14 .
- the heat receiving part 301 A of the heat receiving spacer 300 A and the clamping member 410 A as well as the heat receiving part 301 A and the cooled surface 121 A of the dual-side cooled power module 100 are thermally connected by heat conductive sheets 451 which are of sheet form.
- Commonly used heat conductive sheets 451 have a lower fluidity than heat conductive grease 450 , but their heat conduction performance is high. Therefore, even though it is impossible to connect each pin fin 122 A and the heat receiving part 301 A by a heat conductive sheet 451 , heat dissipation performance is compensated by heat transfer through heat dissipation paths 130 , 131 .
- two heat conductive sheets 151 are layered over the tips of the pin fins 122 A in FIG. 15 , this layer may be configured with one sheet, making effective use of the deformability of a heat conductive sheet 451 in its thickness direction.
- FIG. 16 depicts a third embodiment of the present invention, in which the power semiconductor module of the first embodiment is configured as a one side cooled power module 600 .
- the one side cooled power module 600 is comprised of an element mount part 651 in which elements are installed and a base 652 in which an insulation substrate providing electrical insulation is installed.
- the element mount part 651 and the base 652 are bonded by brazing, for example.
- FIG. 17 is an enlarged view of portion F in FIG. 16 .
- gaps are filled with heat conductive grease 450 to provide the thermal connections, enabling heat dissipation making effective use of the entire outer surfaces of the pin fins 653 . Therefore, it is possible to transfer heat from the heat generator efficiently.
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Abstract
The disclosed invention provides power conversion equipment in which the thermal resistance of thermal connections is reduced. A structure for cooling a heat generator includes a heat generator having at least one cooled surface having protruding convex portions formed thereon, a heat receiving spacer in which hollow portions into which the convex portions are inserted are formed, clamping members which press and clamp the heat receiving space and the heat generator sandwiched therebetween, and a cooler which cools the heat receiving spacer. In an engagement state in which the heat generator and the heat receiving spacer are engaged by the clamping members, a distance between the cooled surface and the end faces of the convex portions is smaller than a distance between the cooled surface and a face, facing either of the clamping members, of the heat receiving spacer.
Description
- The present invention relates to a structure for cooling a heat generator and power conversion equipment.
- An Uninterruptible Power-supply System (hereinafter abbreviated to UPS) is equipment for stable supply of electric power to a load without interruption in case abnormal condition occurs with a utility power source or the like which is a steady power source. There is a high demand of UPS for application in, inter alia, data centers along with ongoing innovation of IT utilization. Because UPSs for data centers center are installed in urban neighborhood where land prices are high, reduction in installation area, in other words, equipment downsizing is hoped for.
- To downsize an UPS, it is important to downsize the components of the UPS. Above all, power conversion equipment occupies a large physical volume and, therefore, its downsizing is significantly effective. To pursue downsizing of the power conversion equipment, what is required is downsizing of a mechanism for cooling a power semiconductor module which is a heat generator and a more efficient cooling method through that mechanism.
- As a method for air-cooling a power semiconductor module, for example, in Japanese Unexamined Patent Application Publication No. 2000-269671, there is the following description. “A first heat sink 25 is mounted on a
CPU 23 with the intermediate positioning of a heat transfer sheet 26. A plurality of heat transfer portions 25 a are formed on the first heat sink 25. A second heat sink 27 is placed on the first heat sink 25. On the second heat sink 27, openings 29 are formed such that the heat transfer portions 25 a can be inserted therein with a gap. The gaps between the heat transfer portions 25 a and the openings 29 are filled with heat conductive grease.” - The air-cooling method described in Japanese Unexamined Patent Application Publication No. 2000-269671 enables expanding heat dissipation areas by the connections between the convex portions and the openings and reducing the thermal resistance of a heat conductive grease layer, while reducing the load applied to an electronic part. However, since heat that has once been conducted to a holding member is allowed to conduct up to the rear surface of a heat generating member and dissipated to a substrate, there is large thermal resistance in conduction, and heat dissipation performance is limited.
- An object of the present invention is to provide power conversion equipment downsized by reducing the thermal resistance of thermal connections and improving heat dissipation performance.
- In order to achieve the above object, a structure for cooling a heat generator is provided, including, for example, a heat generator having at least one cooled surface having protruding convex portions formed thereon, a heat receiving spacer in which hollow portions into which the convex portions are inserted are formed, clamping members which press and clamp the heat receiving space and the heat generator sandwiched therebetween, and a cooler which cools the heat receiving spacer. In an engagement state in which the heat generator and the heat receiving spacer are engaged by the clamping members, a distance between the cooled surface and the end faces of the convex portions is smaller than a distance between the cooled surface and a face, facing either of the clamping members, of the heat receiving spacer.
- According to the present invention, the convex portions are connected to the cooler via a heat conductive material and, therefore, heat from a power semiconductor module can be transferred to the cooler efficiently.
-
FIG. 1 is a circuit diagram of power conversion equipment pertaining to one embodiment of the present invention; -
FIG. 2 is a circuit diagram of a converter in the power conversion equipment; -
FIG. 3 is a circuit diagram of an inverter in the power conversion equipment; -
FIG. 4 is a circuit diagram of a charging/discharging chopper in the power conversion equipment; -
FIG. 5 is a circuit diagram of a dual-side cooled power module which is used in the present embodiment; -
FIG. 6 is an external view of the dual-side cooled power module which is used in the present embodiment; -
FIG. 7 is a perspective view of a heat receiving spacer; -
FIG. 8 is a diagram depicting a state in which heat receiving spacers are attached to the dual-side cooled power module; -
FIG. 9 is a cross-sectional view through line A-A′ inFIG. 8 ; -
FIG. 10 is a perspective view depicting a state in which two dual-side cooled power modules are attached to a cooler; -
FIG. 11 is an exploded view of region B surrounded by dashed lines presented inFIG. 10 ; -
FIG. 12 is a cross-sectional view through line C-C′ in.FIG. 11 ; -
FIG. 13 is an enlarged view of portion D presented inFIG. 12 ; -
FIG. 14 depicts a second embodiment of the present invention, in which thermal connections in the first embodiment are provided by heatconductive sheets 451; -
FIG. 15 is an enlarged view of portion E inFIG. 14 ; -
FIG. 16 depicts a third embodiment of the present invention, in which the power semiconductor module of the first embodiment is configured as a one side cooled power module; and -
FIG. 17 is an enlarged view of portion F inFIG. 16 . - In the following, embodiments for carrying out the present invention will be described with reference to the drawings.
-
FIG. 1 is a circuit diagram of power conversion,equipment 1 pertaining to one embodiment of the present invention. - This system assumed to operate as UPS is an uninterrupted inverter-fed power supply system which can continue to supply electric power without instantaneous interruption in case of electric power outage. Three-phase AC voltage from a
utility power source 2 is supplied through a steady powersource side switch 21 and a filtering circuit forinput 17 for eliminating harmonics and to aconverter 11 and converted from AC to DC by theconverter 11 which is a rectification circuit. After rectification at theconverter 11, aDC voltage 4 smoothed by acapacitor 20 is applied to aninverter 12 and inversely converted to AC of a desired voltage and frequency. After inverse conversion, three-phase AC voltage 5 which is output by theinverter 12, after its harmonic components are eliminated by a filtering circuit foroutput 18, is supplied via aload side switch 24 to aload 3. In the uninterrupted inverter-fed power supply system, theutility power source 2 of three-phase AC voltage constantly supplies power via theconverter 11 and inverter 12 to theload 3. Therefore, in case a voltage fluctuation such as instantaneous voltage drop occurs with theutility power source 2, it is enabled to stably supply power that is equivalent to normal utility power by controlling theconverter 11 andinverter 12. The operations of theconverter 11 and inverter 12 and ON/OFF of the steady powersource side switch 21 and the load side switch are controlled by a signal from a higherlevel control circuit 201. - In the meantime, a charging/
discharging chopper 13 is connected to a stage preceding theinverter 12. When normal utility power is supplied, the charging/dischargingchopper 13 operates as a step-down chopper which decreases theDC voltage 4 and outputs charging power 7 for charging abattery 14. A non-steady powersource side switch 22 has a role to make connections to power feeding paths when feeding power from thebattery 14 to theconverter 11. Abattery protecting switch 23 has a role to protect the battery from overcurrent or the like. The charging/discharging chopper 13, non-steady powersource side switch 22, andbattery protecting switch 23 are controlled by a signal from the higherlevel control circuit 201. - The
converter 11, inverter 12, and charging/dischargingchopper 13 generate heat during their operation and their temperature rises. To suppress this temperature rise, coolingwind 10 generated by a cooling fan 9 (air blower) is fed in to circulate and cool the inside of thepower conversion equipment 1. -
FIG. 2 is a circuit diagram of theconverter 11 which is a component of thepower conversion equipment 1. - The
converter 11 converts a three-phase AC voltage from theutility power source 2 to aDC voltage 4. When normal utility power is supplied, incoming three-phase AC power is supplied toAC terminals converter 11 and rectified withswitching elements 31 andrectification elements 33 in an upper arm andswitching elements 32 andrectification elements 34 in a lower arm, these elements being provided for the respective phases. In the present embodiment, Insulated Gate Bipolar Transistors (IGBTs) are used as the switching elements and diodes are used as the rectification elements; however, these are non-limiting and other types of elements can also be applied (the same applies hereinafter). Theswitching elements converter 11 are driven by a signal from acontrol circuit 202. -
FIG. 3 is a circuit diagram of theinverter 12 which is a component of thepower conversion equipment 1. - The
inverter 12 converts DC power smoothed by the capacitor which is not depicted to three-phase AC power. DC voltage produced by theconverter 11 is converted to a three-phase AC voltage with switchingelements 31 andrectification elements 33 in an upper arm and switchingelements 32 andrectification elements 34 in a lower arm, these elements being provided for the respective phases, and the three-phase AC voltage is output toAC terminals elements inverter 12 are driven by a signal from acontrol circuit 203. Theinverter 12 converts a DC voltage to an AC voltage regardless of condition of theutility power source 2 and outputs rated electric power to the filtering circuit foroutput 18. -
FIG. 4 is a circuit diagram of the charging/dischargingchopper 13 which is a component of thepower conversion equipment 1. - The charging/discharging
chopper 13 decrease the DC voltage and outputs charging power, when normal utility power is supplied by theutility power source 2. While switchingelements 31 in an upper arm are ON, first, electromagnetic energy is accumulated in a reactor, which is not depicted, connected between thebattery 14 and the charging/dischargingchopper 13. Then, upon switching of the switchingelements 31 in the upper arm to OFF, counter electromotive force is generated in the reactor and the electromagnetic energy in the reactor is discharged to charge thebattery 14. On the other hand, when abnormal condition occurs with the utility power source, the charging/dischargingchopper 13 converts a low DC voltage to a high DC voltage. First, electric power discharged by thebattery 14 is supplied to the reactor and electromagnetic energy is accumulated in the reactor, while switchingelements 32 in a lower arm are ON. Then, upon switching of the switchingelements 32 in the lower arm to OFF,rectification elements 33 in the upper arm are turned ON by counter electromotive force of the reactor. Thereby, a voltage that is the sum of the DC voltage of thebattery 14 and the counter electromotive voltage of the reactor appears at the output terminal of the charging/dischargingchopper 13, which thus results in a voltage increase. The switchingelements chopper 13 are driven by a signal from acontrol circuit 204. Although, in the present embodiment, there are two parallel legs in the charging/dischargingchopper 13, the number of parallel legs is determined by the amount of electric power to be supplied to the charging/dischargingchopper 13 when discharging takes place. - As will be noted from the foregoing, the
converter 11,inverter 12, and charging/dischargingchopper 13 which are installed in thepower conversion equipment 1 of the present embodiment are basically configured withlegs 35 in which theswitching elements 31 and therectification elements 33 are connected in series in the upper arm and theswitching elements 32 and therectification elements 34 are connected in series in the lower arm. In a case where electric power that is supplied to theload 3 exceeds rated power of thepower conversion equipment 1, the rated power should be increased by increasing the number ofparallel legs 35 in theconverter 11,inverter 12, and charging/dischargingchopper 13. - In the
converter 11,inverter 12, and charging/dischargingchopper 13, the resistors incorporated in theswitching elements rectification elements converter 11,inverter 12, and charging/dischargingchopper 13 rises. -
FIG. 5 is a circuit diagram of a dual-side cooledpower module 100 which is used in the present embodiment. In the dual-side cooledpower module 100, switchingelements rectification elements insulator 112 are included. Respective semiconductors are interconnected to form aleg 35 which is depicted inFIGS. 2 to 4 . Onto theinsulator 112, aP terminal 113P (DC positive terminal), anN terminal 113N (DC negative terminal), an AC terminal. 113AC (AC terminal), and agate terminal 111 for ON/OFF control of the switching elements are attached. -
FIG. 6 is an external view of the dual-side cooledpower module 100 which is used in the present embodiment. The dual-side cooledpower module 100 is comprised of a substantially cuboidalmain body part 101, a substantiallycuboidal flange part 102 formed to expand one lateral side of themain body part 101, and aterminal block part 103 which is comprised of a plurality of terminals, protruding from a face of theflange part 102 on the side opposite to themain body part 101. Terminals constituting theterminal block part 103 are as follows:P terminal 113P,N terminal 113N, AC terminal 113AC, andgate terminal 111 depicted inFIG. 5 . - One
face 121A of themain body part 101 has a great number (e.g., a total of approx. 200 or more) of protrudingpin fins 122A which are very small, columnar projections. On anotherface 121B of themain body part 101, opposite to theface 121A, asmany pin fins 122B (not depicted) as the number of thepin fins 122A are also formed. Hereinafter, thepin fins faces main body part 101 has cooledsurfaces faces main body part 101 with the exception of the pin fins 122, that is, the distance between the cooledsurfaces 121, 121B is denoted by “d1”. -
FIG. 7 is a perspective view of a heat receiving spacer. A pair ofheat receiving spacers power module 100. A heat receiving spacer 300A is comprised of aheat receiving part 301A which has a substantially rectangular plate form and a pair of hollowspace providing sections 302A which have a substantially cuboidal form, protruding toward aheat receiving spacer 300B from both edges of theheat receiving part 301A. In theheat receiving part 301A, a great number of columnar throughholes 303A (concave portions) are formed. These throughholes 303A are formed in positions facing thepin fins 122A of the cooledsurface 121A and have a diameter that is slightly larger than the diameter of apin fin 122A. Like the heat receiving spacer 300A, theheat receiving spacer 300B is also comprised, of aheat receiving part 301B which has a substantially rectangular plate form and a pair of hollowspace providing sections 302B which have a substantially cuboidal form, protruding toward theheat receiving spacer 300B from both edges of theheat receiving part 301B. Theheat receiving spacer 300B has a shape that is upside down symmetrical with respect to the heat receiving spacer 300A, but, in theheat receiving part 301B, throughholes 303B are formed in positions facing therespective pin fins 122B protruding from the cooledsurface 121B of the dual-side cooledpower module 100. - When attaching the
heat receiving spacers power module 100, apply heat conductive grease over the cooled surfaces 121A, 121B and put the hollowspace providing sections holes spacers power module 100 in this way is depicted inFIG. 8 . As depicted, the cooled surfaces 121A, 121B of themain body part 101 are mostly covered by theheat receiving spacers -
FIG. 9 is a cross-sectional view through line A-A′ inFIG. 8 . When the hollowspace providing sections heat receiving parts heat receiving spacers main body part 101 of the dual-side cooledpower module 100. In consequence,gaps heat receiving part 301A and themain body part 101 and between theheat receiving part 301B and themain body part 101, respectively. Thegaps power module 100 has play with respect to theheat receiving spacers - When the hollow
space providing sections gaps gaps main body part 101 from the tips of thepin fins 122A to the tips of thepin fins 122B and d5 denotes the entire width when theheat receiving spacers heat receiving spacers gaps pin fins 122A and between the lower surface of the heat receiving spacer 300B and the tips of thepin fins 122B in the drawing, respectively. Thegaps power module 100 has play with respect to theheat receiving spacers - When the
heat receiving spacers force 320 is applied, as indicated by hatched arrows. Thispressing force 320 is applied to portions where hollowspace providing sections pressing force 320 is not applied to themain body part 101, since thegaps main body part 101 and theheat receiving spacers gaps pin fins space providing sections -
FIG. 10 is a perspective view depicting a state in which two dual-side cooledpower modules 100 are attached to the cooler 400. The cooler 400 is comprised of a pair ofcoolers coolers members power modules 100, to each of which theheat receiving spacers members - The clamping
members fasteners 420 and pressingforce 320 is applied to theclamping members FIG. 9 , thisforce 320 is applied to theheat receiving spacers power modules 100. As thefasteners 420, bolts and nuts which are commonly used can be used. - In
FIG. 10 , fourheat pipes 430 protrude from the clampingmember 410A, slanting at an angle of about 10° with respect to an x-y plane (horizontal plane) formed by x and y axes. A plurality of plate-likeheat radiation fins 440 is welded to theseheat pipes 430 in their radial direction. Therefore, eachheat radiation fin 440 slants at an angle of about 10° with respect to an x-z plane (vertical plane) formed by x and z axes. A cooler 400B is configured in the same way as for the cooler 400A. By thus mounting two dual-side cooledpower modules 100 to the cooler 400, an air-cooled dual-side cooledpower unit 500 is configured. - When the dual-side cooled
power modules 100 generate heat, the heat is transferred via theheat receiving spacers clamping members heat pipes 430. When coolingwind 441 directed from bottom to top (directed in the z-axis direction) is blown into this air-cooled dual-side cooledpower unit 500, thecooling wind 441 moves upward, while cooling theheat radiation fins 440 and, thus, the heat is expelled rapidly. Paths of such heat transfer are indicated byarrows 431 in the drawing. Heat transfer in a direction perpendicular to the direction of thecooling wind 441 is mainly due to theheat pipes 430. -
FIG. 11 is an exploded view of region B surrounded by dashed lines presented inFIG. 10 . InFIG. 11 , heatconductive grease 450 is applied between the heat receiving spacer 300A and the clampingmember 410A and between the heat receiving spacer 300B and the clampingmember 410B, respectively. When theclamping members fasteners 420, the heatconductive grease 450 spreads over an interface plane between the heat receiving spacer 300A and the clampingmember 410A and an interface plane between the heat receiving spacer 300B and the clampingmember 410B and makes thin film layers as depicted. At the same time, the heatconductive grease 450 also enters thegaps pin fins FIG. 9 ) and the outsides of thepin fins conductive grease 450. -
FIG. 12 is a cross-sectional view through line C-C′ inFIG. 11 . Placing the clampingmember 410A on the upper surface of the heat receiving spacer 300A provides a thermal connection surface at the interface between both. To transfer heat of the dual-side cooledpower module 100 to the claimingmember 410A efficiently, the tips of thepin fins 122A and theheat receiving part 301A of the heat receiving spacer 300A must connect with the clampingmember 410A in a smooth condition. -
FIG. 13 is an enlarged view of portion D presented inFIG. 12 . In the present embodiment, a region (which is hatched inFIG. 13 ) that is formed by the cooledsurface 121A, pinsfins 122A,heat receiving part 301A, and clampingmember 410A is filled with heatconductive grease 450. At this time, heat of the dual-side cooledpower module 100 is transferred to the clampingmember 410A throughheat dissipation paths heat dissipation path 130 is a path through which heat is transferred from themain body part 101 via theheat receiving part 301A to the clampingmember 410A. Aheat dissipation path 131 is a path through which heat is conducted from themain body part 101 to thepin fin 122A and transferred via the heatconductive grease 450 to the clampingmember 410A. Aheat dissipation path 132 is a path through which heat migrates from thepin fin 122A to theheat receiving part 301A and then the heat is transferred to the clampingmember 410A. The present embodiment enables dissipating heat of the dual-side cooledpower module 100 through making effective use of the entire outer surfaces of thepin fins 122A. As described above, it is enabled to dissipate heat through a plurality of paths via heat conductive grease in the present embodiment, and, therefore, heat can be dissipated efficiently. - When viewing the
power module 100 which is a heat generator from a direction parallel to a direction in which the convex portions formed on the power module protrude (that is, when viewing thepower module 100 from −X axis direction toward +X axis direction inFIG. 13 ), a filler area where the heat conductive material is filled between the heat receiving spacer 300A and the clampingmember 410A is larger than a filler area where the heat conductive material is filled between the throughhole 303A and thepin fin 122A and between the cooledsurface 121A and theheat receiving part 301A. When heat is transferred from theheat receiving spacer 300A to the clampingmember 410A, heat will spread inside theheat receiving spacer 300A; therefore, the filler area between the heat receiving spacer 300A and the clampingmember 410A is enlarged for transferring heat more efficiently. This configuration makes it possible to dissipate heat more effectively, when heat diffuses from the heat generator via thepin fins 122A and theheat receiving spacer 300A. The same configuration can be adopted also in second and third embodiments which will be described later and the same advantageous effect can be obtained. - Moreover, if the
main body part 101 has swollen by thermal deformation of the dual-side cooledpower module 100, swelling stress is released by fluid deformation of the heatconductive grease 450. At this time, because thegap 315 between the tips of thepin fins 122A and the clampingmember 410A is larger than thegap 311A between the upper surface of the heat receiving spacer 300A and the tips of thepin fins 122A, the tips of thepins fins 122A do not abut against the clampingmember 410A and a good thermal connection condition is maintained. The side of the clampingmember 410B is configured in the same way as for the side of the clampingmember 410A. -
FIG. 14 depicts a second embodiment of the present invention, in which thermal connections in the first embodiment are provided by heatconductive sheets 451. -
FIG. 15 is an enlarged view of portion E inFIG. 14 . Theheat receiving part 301A of the heat receiving spacer 300A and the clampingmember 410A as well as theheat receiving part 301A and the cooledsurface 121A of the dual-side cooledpower module 100 are thermally connected by heatconductive sheets 451 which are of sheet form. Commonly used heatconductive sheets 451 have a lower fluidity than heatconductive grease 450, but their heat conduction performance is high. Therefore, even though it is impossible to connect eachpin fin 122A and theheat receiving part 301A by a heatconductive sheet 451, heat dissipation performance is compensated by heat transfer throughheat dissipation paths pin fins 122A inFIG. 15 , this layer may be configured with one sheet, making effective use of the deformability of a heatconductive sheet 451 in its thickness direction. -
FIG. 16 depicts a third embodiment of the present invention, in which the power semiconductor module of the first embodiment is configured as a one side cooledpower module 600. The one side cooledpower module 600 is comprised of anelement mount part 651 in which elements are installed and a base 652 in which an insulation substrate providing electrical insulation is installed. The element mountpart 651 and the base 652 are bonded by brazing, for example. -
FIG. 17 is an enlarged view of portion F inFIG. 16 . In the present configuration, there are thermal connections between aheat receiving part 611 of aheat receiving spacer 610 and thebase 652, between a throughhole 612 of theheat receiving spacer 610 and apin fin 653 of thebase 610, and between theheat receiving part 611 and a clampingmember 410. In the present embodiment, gaps are filled with heatconductive grease 450 to provide the thermal connections, enabling heat dissipation making effective use of the entire outer surfaces of thepin fins 653. Therefore, it is possible to transfer heat from the heat generator efficiently.
Claims (8)
1. A structure for cooling a heat generator comprising:
a heat generator having at least one cooled surface having protruding convex portions formed thereon;
a heat receiving spacer in which hollow portions into which the convex portions are inserted are formed;
clamping members which press and clamp the heat receiving spacer and the heat generator sandwiched therebetween; and
a cooler which cools the heat receiving spacer,
wherein, in an engagement state in which the heat generator and the heat receiving spacer are engaged by the clamping members, a distance between the cooled surface and the end faces of the convex portions is smaller than a distance between the cooled surface and a face, facing either of the clamping members, of the heat receiving spacer.
2. The structure for cooling a heat generator according to claim 1 , wherein, in an engagement state in which the convex portions of the heat generator have been engaged in the hollow portions of the heat receiving spacer, gaps formed between the convex portions and the hollow portions are filled with a first heat conductive material.
3. The structure for cooling a heat generator according to claim 1 , wherein gaps formed between one of the clamping members and a face, facing the one of the clamping members, of the heat receiving spacer are filled with a second heat conductive material.
4. The structure for cooling a heat generator according to claim 3 , wherein, when viewing the heat generator from a direction parallel to a direction in which the convex portions protrude, a filler area where the second heat conductive material is filled is larger than a filler area where the first heat conductive material is filled.
5. The structure for cooling a heat generator according to claim 1 , wherein the hollow portions are through holes.
6. The structure for cooling a heat generator according to claim 2 , wherein the heat conductive material is heat conductive grease.
7. The structure for cooling a heat generator according to claim 1 ,
wherein the clamping members clamp a pair of heat receiving spacers, each facing either of dual opposite sides of the heat generator, sandwiched therebetween and cools the heat generator by contacting heat pipes, and
wherein the heat pipes are provided with heat radiation fins.
8. Power conversion equipment comprising:
a heat generator having at least one cooled surface having protruding convex portions formed thereon;
a heat receiving spacer in which hollow portions into which the convex portions are inserted are formed;
clamping members which press and clamp the heat receiving spacer and the heat generator sandwiched therebetween;
a cooler which cools the heat receiving spacer;
heat pipes brought in contact with the camping members; and
heat radiation fins provided on the heat pipes,
wherein, in an engagement state in which the heat generator and the heat receiving spacer are engaged by the clamping members, a distance between the cooled surface and the end faces of the convex portions is smaller than a distance between the cooled surface and a face, facing either of the clamping members, of the heat receiving spacer.
Applications Claiming Priority (2)
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JP2015-102367 | 2015-05-20 | ||
JP2015102367A JP2016220383A (en) | 2015-05-20 | 2015-05-20 | Cooling structure of heating element and power conversion device |
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US20160341487A1 true US20160341487A1 (en) | 2016-11-24 |
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US15/143,705 Abandoned US20160341487A1 (en) | 2015-05-20 | 2016-05-02 | Structure for Cooling Heat Generator and Power Conversion Equipment |
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JP (1) | JP2016220383A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10685900B2 (en) * | 2018-10-22 | 2020-06-16 | Deere & Company | Packaging of a semiconductor device with phase-change material for thermal performance |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2208937A1 (en) * | 1972-02-25 | 1973-09-06 | Siemens Ag | HEAT PIPE COOLING ARRANGEMENT FOR FLAT SEMI-CONDUCTOR COMPONENTS |
JPS6376462A (en) * | 1986-09-19 | 1988-04-06 | Hitachi Ltd | Heat transfer device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574988A (en) * | 1991-09-13 | 1993-03-26 | Nec Corp | Cooler of intergrated circuit |
JPH0573961U (en) * | 1992-03-13 | 1993-10-08 | 三菱電線工業株式会社 | Heat pipe cooler |
JP3634480B2 (en) * | 1996-02-06 | 2005-03-30 | 株式会社日立製作所 | Method for sealing liquid refrigerant in module |
JP3420945B2 (en) * | 1998-08-14 | 2003-06-30 | 株式会社東芝 | Power converter |
JP3941704B2 (en) * | 2003-02-05 | 2007-07-04 | 株式会社デンソー | Heat dissipation structure for electronic components |
WO2014132399A1 (en) * | 2013-02-28 | 2014-09-04 | 三菱電機株式会社 | Heat dissipating structure |
-
2015
- 2015-05-20 JP JP2015102367A patent/JP2016220383A/en active Pending
-
2016
- 2016-05-02 US US15/143,705 patent/US20160341487A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2208937A1 (en) * | 1972-02-25 | 1973-09-06 | Siemens Ag | HEAT PIPE COOLING ARRANGEMENT FOR FLAT SEMI-CONDUCTOR COMPONENTS |
JPS6376462A (en) * | 1986-09-19 | 1988-04-06 | Hitachi Ltd | Heat transfer device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10685900B2 (en) * | 2018-10-22 | 2020-06-16 | Deere & Company | Packaging of a semiconductor device with phase-change material for thermal performance |
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