JPH04322108A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent degradation of service life by reducing inductance of wiring and suppressing overvoltage at the time of switch OFF of semiconductor element thereby suppressing loss and temperature rise. CONSTITUTION:An open chamber 7 is disposed on the vehicle center side of a box 5 installed underfloor of the vehicle and an enclosed chamber 13 is disposed on the outside of vehicle with respect to the open chamber. The enclosed chamber 13 is provided with heat dissipation fins 4 projecting into the open chamber. A freely opening/closing capacitor unit case 6 is disposed on the outside of vehicle with respect to the enclosed chamber and a capacitor unit is contained therein.

Description

[Detailed description of the invention]

[Object of the invention]

0002

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounted under the floor of a train or the like.

0003

2. Description of the Related Art FIG. 11 shows a main circuit connection diagram of a semiconductor device for an auxiliary power supply that is mounted under the floor of a train and uses a gate turn-off thyristor (hereinafter referred to as a GTO thyristor) as a semiconductor element. In the figure, loads such as lighting equipment and air conditioning equipment are connected to the AC output side, and GTO thyristors GTO11, GTO12, and the like are connected to the bridge.
A capacitor unit 2 with a built-in filter capacitor FC is connected to the power supply side of GTO21 and GTO22.
Among these, GTO thyristor GTO11 and GTO thyristor GTO12 and a capacitor of a snubber circuit (not shown),
A semiconductor stack 1A, which will be described later, includes a diode, and a semiconductor stack 1B, which will also be described later, includes a snubber circuit capacitor and a diode, as well as the GTO thyristors GTO21 and GTO22.

FIG. 12 shows these semiconductor stacks 1A,
1B is a vertical cross-sectional view showing a state in which a conventional semiconductor device including a capacitor unit 2 of a filter capacitor FC and the like is installed under the floor of a vehicle. In the figure, punched iron plates 63A and 63B are attached to the center of a box 60, which is composed of a substantially inverted U-shaped ceiling plate 61, a bottom plate 62, etc., to form an open chamber 15 inside. On the lower surface of the ceiling plate 61, a mounting plate 64A is vertically provided on the left end of a stamped iron plate 63A, and on the upper surface of the bottom plate 62, a mounting plate 65A is provided upright on the left end of a stamped iron plate 63B. Also, on the right end of the punched iron plate 63A and the punched iron plate 63B,
A partition plate 66 is also erected in the direction perpendicular to the plane of the drawing, and on the right side of the partition plate 66 there is a mounting plate 64 on the lower surface of the ceiling plate 61.
B is provided vertically, and a mounting plate 65B is also provided upright on the upper surface of the bottom plate 62.

Among these, an insulating plate 68A is provided between the mounting plate 64A and the mounting plate 65A, and an insulating plate 68A is provided between the mounting plate 64B and the mounting plate 65A.
Insulating plates 68B are respectively attached between the
Of these, semiconductor stacks 1A and 1B housing GTO thyristors GTO11, GTO12, GTO21, GTO22 and capacitors and diodes of a snubber circuit (not shown) are placed on the left side of the insulating plate 68A, and semiconductor stacks 1A and 1B are placed on the right side of the insulating plate 68A. A snubber resistor 3 is attached to the top, and cooling fins 4 (details omitted) are attached to the bottom.

On the other hand, filter units 2 containing filter capacitors are attached to the insulating plate 68B vertically with the connection terminals on the right side, and the electric wires 69 connected on one side to the connection terminals of the filter units 2 are attached to the bottom plate 62. After the upper surface of the partition plate 66 was placed to the left, the right side of the lower end of the partition plate 66 was placed in the direction perpendicular to the plane of the paper in the figure, and the end of the punched iron plate 63B in the direction perpendicular to the plane of the figure was placed to the left ( In other words, in the plan view (not shown), it is bent into a convex shape)
It rises rearward and upward and is connected to the cable connection terminal 70 of the semiconductor stack 1A. In addition, the ceiling plate 61 and the bottom plate 62
Between the left ends of is a left door 67A that is opened and closed using the upper end as a fulcrum.
are attached vertically via packing, and a right door 67B is similarly attached between the right ends of the ceiling plate 61 and the bottom plate 62.

[0007] In the semiconductor device configured as described above, the mounting work of the semiconductor stack 1A, snubber resistor 3, cooling fins 4, and capacitor unit 2 is carried out through the left and right doors 6.
7A and the right door 67B are opened, and the arrangement and connection of the electric wires 69 are performed in the same manner.

The cooling fins 4 and the snubber resistor 3 are cooled by cooling air guided inside from the punched iron plate 63B at the lower end of the open chamber 15, and this cooling air is supplied to the punched iron plate 63B at the upper end.
It is released to the outside from 3A.

Next, FIG. 13 shows a vertical cross-sectional view of a semiconductor device for an auxiliary power source, which is different from that shown in FIG. 12 and is also mounted under the floor of a train. In the same figure, a partition plate 74 is provided vertically in the middle part between a ceiling plate 71 and a bottom plate 72 in a direction perpendicular to the plane of the figure, and a partition plate 74 is bent into an L-shape at the right end of the ceiling plate 71, that is, on the side of the vehicle. A punched ceiling board 73 is attached,
Between the right end of the punched ceiling plate 73A and the right end of the bottom plate 72, a punched door 76 which can be opened and closed outward using the upper end as a fulcrum is attached to form an open room 78. Also, ceiling board 7
An insulating plate 77 is removably attached between the lower right end of 1 and the right end of the bottom plate 72, and a door 75 that is opened and closed using the upper end as a fulcrum is attached between the left end of the ceiling plate 71 and the left end of the bottom plate 72. .

Among these, the heat pipe 2 is mounted on the insulating plate 77.
The lower part of the heat pipe 22 is fixed, and a semiconductor element 32 is attached to the heat receiving part of the heat pipe 22. Further, on the left side of the partition plate 74, peripheral circuit supplies 79 other than the snubber resistor are stored on the upper surface of the plate 72, and the snubber resistor 3 is attached to the lower part of the punched ceiling plate 73.

In the semiconductor device configured as described above, the snubber resistor 3 is a sheathed wire resistor with heat radiation fins in consideration of heat radiation. Moreover, the heat receiving part 24 is
The heat pipe 22 is cooled by cooling air that flows into the interior from the bottom 76a of the punched door 76 and rises through the cooling fins, and a part of the cooling air warmed by the heat pipe 22 2 rises as it is, cools the snubber resistor 3, and is discharged to the outside from the ceiling plate 73, and the other part is discharged to the outside from the upper part of the punched door 76.

Next, FIG. 14 is a longitudinal cross-sectional view of a conventional semiconductor device for an auxiliary power source, which is also mounted under the floor of a train and is different from FIGS. 12 and 13. In the figure, a partition plate 84 is vertically installed on the lower surface of the middle of the ceiling plate 81.
A slightly inclined mounting plate 85 is fixed with bolts between the lower end of 4 and the right end of the bottom plate 82.

Furthermore, a punched cover 83 is provided between the right end of the ceiling plate 81 on the outside of the vehicle in the figure and the right end of the bottom plate 82.
A door 42, which can be opened and closed using the upper end as a fulcrum, is attached via a packing (not shown) between the left end of the ceiling plate 81 facing the center of the vehicle and the left end of the bottom plate 82. Vehicle supplies (not shown) are mounted on the left side of the vehicle, leaving a space between them and other equipment (not shown) that a worker can enter by opening the door during maintenance inspection.

Among these, the snubber resistor 3 is fixed to the right side of the partition plate 84 with its terminal protruding to the left, and the heat receiving part 24 of the heat pipe 22 is connected to the mounting plate 85 via an insulating block (not shown). is fixed, and this heat receiving part 24 has
In the figure, the semiconductor element 32 is attached to the left side, the flywheel diode 87 is attached to the right side, and the mounting plate 85
A through hole (not shown) that penetrates from side to side is provided in the middle part of the heat pipe 22, and the heat pipe 22 protrudes from this through hole to the right side.

A snubber diode 30 is fixed to the upper center surface of the heat dissipation block 24, and is fixed to the heat receiving section 24 above the right side of the snubber diode 30 via an insulating base (not shown). Furthermore, a gate amplifier 50 is fixed to the upper surface of the left end of the bottom plate 82, and peripheral circuit supplies 54 are housed above the snubber capacitor 51.

By the way, in recent years, in such semiconductor devices, semiconductor elements have become larger and have been turned on and off at higher frequencies, so the amount of heat generated by semiconductor elements and snubber circuit components has decreased. is also increasing. Therefore, cooling of these semiconductor devices and snubber circuit components is becoming increasingly important in order to maintain desired characteristics and prevent reduction in service life.

Furthermore, in order to suppress the overvoltage that occurs when the current in the semiconductor element is turned off, it is required that the wiring connecting the semiconductor element and the filter capacitor be as short as possible.

Furthermore, it is necessary that the conductive part is not exposed to the outside of the device, that insulation is prevented from deteriorating due to dust that enters with the cooling air, and that maintainability is good.

[0019]

[Problem to be solved by the invention] However, among these,
In the semiconductor device shown in FIG. 12, the wiring 69 connecting the snubber capacitor 2 and the semiconductor stacks 1A and 1B is
It descends from the terminal of the snubber capacitor 2 protruding to the right side of the insulating plate 68B at the right end of the box body 61, and after being placed on the upper surface of the bottom plate 62, it is moved toward the end of the punched iron plate 63B in the direction perpendicular to the plane of the drawing. Since the wire is bent and detoured and placed on the left side of the partition plate 65A, the length of the wire becomes longer.

[0020] Then, the inductance due to the wiring 69 becomes large, and the overvoltage generated when the semiconductor element is turned off becomes high, which not only increases switching loss but also increases the temperature rise of the filter capacitor 2. When used, the lifespan is particularly shortened.

On the other hand, in the semiconductor device shown in FIG. 13, the semiconductor element 32 fixed to the heat receiving portion 78 of the heat pipe 22 is cooled by the heat pipe 22, so the cooling characteristics are excellent. In order to cool a shaped semiconductor element, the number of cooling fins increases and the size becomes larger, and as a result, the semiconductor device also becomes larger.

[0022] Furthermore, the sheathed wire resistor used as the snubber resistor 3 is not suitable as shown in the figure because its surface becomes hot due to the heat it generates and its dielectric strength cannot be maintained very high. Since it is placed separately from the semiconductor element 32, the switching loss of the semiconductor element 32 due to the reactance of the wiring also increases.

Furthermore, in the semiconductor device shown in FIG. 14, the internal wiring is done after the heat pipe 22 is installed, which not only makes the work difficult, but also causes variations in the wiring, resulting in variations in reactance, etc. There are also variations in the characteristics of semiconductor devices.

Furthermore, since the gate amplifier 50 and the like are attached to the center of the vehicle body, it is difficult to carry out maintenance and inspections because it is necessary to crawl under the floor of the vehicle.

[0025] Accordingly, an object of the first invention is to provide a semiconductor device which can reduce wiring inductance, suppress overvoltage when a semiconductor element is switched off, reduce loss, and prevent shortening of life. A second object of the invention is to provide a semiconductor device that can be made smaller and lighter by reducing wiring inductance and increasing the cooling effect of semiconductor elements. Furthermore, a third object of the invention is to obtain a semiconductor device that is easy to assemble and maintain, and can prevent variations in characteristics. [Structure of the invention]

[0026]

[Means and effects for solving the problem] The first invention is
In a semiconductor device in which a semiconductor stack and a capacitor unit are housed in a box installed under the floor of a vehicle, an open chamber is provided on the center side of the box through which outside air flows in and out, and a heat dissipation section is provided outside the vehicle in this open chamber. By attaching the semiconductor stack protruding into an open room and providing a capacitor unit case that can be opened and closed on the outside of the vehicle, the terminals of the capacitor unit and semiconductor stack can be located in the same sealed room, reducing wiring inductance. This is a semiconductor device that suppresses overvoltage when the semiconductor element is switched off, reduces loss, and prevents shortening of life.

Further, in the second invention, the semiconductor stack and the snubber resistor are housed in a box provided under the floor of the vehicle, and an open chamber through which outside air flows in and out is provided on the outside of the box. In a semiconductor device in which a heat pipe is installed inside a vehicle with a heat dissipating part protruding into an open room, a snubber resistor is attached to the top surface of the heat receiving part of the heat pipe with the heat generating part protruding into the open room, and a semiconductor stack is installed on the side of the heat receiving part. By installing this, the snubber resistor and the semiconductor element are connected, increasing the rising speed of the cooling air in the open room, reducing the reactance of the wiring, increasing the cooling effect of the semiconductor element, and making the semiconductor device smaller and lighter.

Furthermore, the third invention is such that a semiconductor stack, a gate amplifier, and a snubber capacitor are housed in a box provided under the floor of a vehicle, and an open chamber through which outside air flows in and out is provided on the outside of the box. In this semiconductor device in which a heater pipe is provided with a heat dissipation part protruding into the open room inside the vehicle, a unit is installed inside the vehicle in the open room, and a semiconductor stack is installed in the heat receiving part of the heat pipe inside this unit. By housing the gate amplifier and snubber capacitor in the unit, it is a semiconductor device that allows unit assembly and unit testing, making assembly and maintenance easier, and preventing variations in characteristics.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal cross-sectional view showing a semiconductor device of the first invention. In the same figure, in the center of the lower surface of the ceiling of the box 5, there is a
A mounting plate 5a is installed vertically, a mounting plate 5b is installed upright on the upper surface of the bottom, and punched plates 5d are installed on the ceiling and bottom of the mounting plates 5a and 5b on the right side (i.e., the center side of the vehicle body), respectively. A side plate 5c is provided on the right side of this punched plate 5d.

Among these, the upper and lower mounting plates 5a and 5b have
An insulating plate 10 is fixed with bolts, and an open chamber 7 through which outside air flows in and out is formed inside this insulating plate 10, the upper and lower mounting plates 5a and 5b, the punched plate 5d, and the side plate 5c. A semiconductor stack 1 containing snubber circuit supplies except the GTO thyristor and the snubber resistor is attached to the left side of the insulating plate 10 , and a snubber resistor 3 is attached to the upper part of the right side of the insulating plate 10 . The heat radiation fins 4 of the semiconductor stack 1 are attached to the lower part. Further, the terminal block 9 of the semiconductor stack 1 is attached to the lower left side of the insulating base 10.

On the other hand, a hinge 8 is provided at the lower end of the left side surface of the box body 5, and the lower end of the capacitor unit case 6, which is approximately inverted U-shaped, is attached to the hinge 8 via a pin. The right end of the upper surface of the capacitor unit case 6 is removably fixed to the upper end of the left side of the box 5 via a packing, and the right end of the lower surface of the capacitor unit case 6 also abuts the lower end of the left side of the box 5 via the packing. ing.

Mounting plates 6a are vertically provided on the inner surfaces of the upper and lower ends of the capacitor unit case 6, and an insulating plate 11 is attached to the right side of the mounting plate 6a. Capacitor units 2, each containing a filter capacitor therein, are attached above and below an insulating plate 11 with connection terminals protruding to the right side. Wiring 1 is connected to the terminal protruding from the right end of these capacitor units 2.
2 is connected to one side, and the other side of this wiring 12 is connected to the terminal block 9.
It is connected to the.

In the semiconductor device configured as described above, the terminal block 9 of the semiconductor stack 1 and the terminals of the capacitor unit 2 both protrude inside the sealed chamber 13 surrounded by the insulating base 10 and the capacitor unit case 6. Since the wiring 12 is provided, the wiring 12 can be shortened, overvoltage due to the inductance of the wiring 12 can be suppressed,
The life of the O thyristor can be extended. Furthermore, since the energy consumed by the snubber circuit components can be reduced, the snubber circuit components can be made smaller, and the radiation fins for cooling the snubber diode can also be made smaller, so the semiconductor stack 1 can be made smaller.

Furthermore, the heat generation of the snubber circuit components can be reduced, the capacitor unit 2 is separated from the semiconductor stack 1 by an insulating plate 4, and the heat dissipation area of the capacitor unit case 6 located on the side of the vehicle can be increased. , the temperature rise of the filter capacitor of the capacitor unit 2 can be reduced, even electrolytic capacitors can be used for a long period of time, and the frequency of replacement can be reduced, making maintenance easier. Furthermore, since the capacitor unit case 6 can be flipped downward via the pin 8 at the lower end, it is easy to inspect the semiconductor stack 1 and other items inside the sealed chamber 13, and when the filter capacitor is an electrolytic capacitor, , it becomes easy to measure the capacitance value for determining its lifespan.

Next, FIG. 2 is a longitudinal sectional view showing another embodiment of the semiconductor device of the first invention. In the same figure, a tulip contact type contact part 19, the details of which are shown in FIG. Male contact terminal 18a at the lower end of the bus 18 connecting the terminals
is inserted.

By providing such a contact portion 19, the terminals of the capacitor unit 2 and the terminal block 9 of the semiconductor stack 1 are located in the sealed chamber 13, so that the length of the wiring between the capacitor unit 2 and the semiconductor stack 1 can be reduced. can be further reduced, the life of GTO thyristors and filter capacitors can be extended, snubber circuit components can be downsized, and energy consumption due to overvoltage can be reduced.

Next, FIG. 3 is a longitudinal sectional view showing a semiconductor device according to a second invention, and FIG. 4 is a detailed view taken in the direction of arrow A in FIG. Figure 3
In FIG. 4, the heat receiving block 2 of the heat pipe 22
Semiconductor elements 21 are attached to both sides of the heat receiving block 24, and a terminal portion 23b on one side of the snubber resistor 23 is fixed to the upper surface of the heat receiving block 24 via an insulating seat 29A. Terminal portion 23a on the other side of snubber resistor 23 is fixed via 29B. This snubber resistor 23 is formed in a U-shape, and a sheathed wire resistor is used to increase the heat dissipation effect.The majority of the U-shape protrudes to the right side of the insulating plate 29, and its protruding length is set downwardly. It is almost equal to the heat pipe 22 of the semiconductor element 21 which has been heated. In addition, the inverted L-shaped door 28 removably attached to the right end of the box body 25 has a punched plate 2 only on the bottom surface.
7a is provided.

In the semiconductor device constructed in this manner, the arrow 3 flowing into the door 28 from the punching plate 27a
The cooling air indicated by 0 is heated by the heat pipe 22 and rises, but is further heated by the snubber resistor 23 located at the upper part of the heat pipe 22, so the temperature is further increased and accelerated, and the upper end of the box body 25 is heated. Punching board 2 extended horizontally on the right end
It rises from 6a and is released to the outside. Therefore, the flow rate of the cooling air flowing in and rising from the punching plate 27a is accelerated, so that the cooling of the heat pipe 22 is also accelerated, and the cooling of the semiconductor element 21 is also accelerated. Therefore, the heat dissipation section of the heat pipe 22 can be made smaller than the conventional heat pipe shown in FIG. 13.

On the other hand, the snubber resistor 23 has terminal portions 23a,
23b is fixed adjacent to the heat receiving block 24 of the heat pipe 22 via the insulators 29A and 29B, the length of the wiring connecting the snubber resistor 23 and the semiconductor element 21 can be shortened, and overvoltage due to reactance can be reduced. This makes it possible to suppress the possibility of variations in characteristics due to variations in wiring. Moreover, the snubber resistor 23 and the semiconductor element 2
1 and the like form a unit that is attached to the insulating plate 77, making assembly easy.

Next, FIG. 5 is a longitudinal sectional view showing another embodiment of the semiconductor device of the second invention, and FIG. 6 is a detailed view taken in the direction of arrow B in FIG. In FIGS. 5 and 6, the heat pipe 22
On the left side of the heat receiving part 24, there is a snubber diode 3 at the top.
0 has a snubber capacitor 31 attached to its lower part, and semiconductor elements 32A, 3 are attached to the heat receiving part 24 in the direction perpendicular to the plane of the paper in FIG.
2B is installed.

In this case, by attaching all of the semiconductor elements 32A, 32B and snubber circuit supplies to the heat dissipation block 24, the connection between the semiconductor elements 32A, 32B and the snubber circuit supplies can be made as short as possible, thereby reducing heat generation. suppress,
The lifespan of parts can be extended, and a semiconductor device with uniform characteristics and good maintainability can be obtained. Moreover, semiconductor elements 32A, 32B
By attaching the and its peripheral parts to the heat receiving part 24 to form a unit, assembly becomes easy, and even when the number of elements stored per stack changes, the same unit can be used, standardizing assembly. can.

FIG. 7 is a longitudinal sectional view showing another embodiment of the semiconductor device of the second invention, and FIG.
A cross-sectional view is shown. 7 and 8, a wind tunnel 33 is provided around the heat pipe 22 and the snubber resistor 23, which is bent into a U-shape in FIG. 7 and an inverted U-shape in FIG.

This wind tunnel 33 has punched plates 3 on the upper and lower surfaces.
3a and 33b are attached respectively. In this case, the rise of the cooling air by the cooling air heated by the snubber resistor 23 can be further promoted, and the cooling of the semiconductor elements and snubber components can also be further promoted, so that the heat pipe 22 can be further downsized. Not only can you
When the semiconductor stack is removed from the box body 25 and placed on the floor, etc., the heat dissipation part of the heat pipe 22 and the snubber resistor 23
It can also be used as a cover to protect the heat generating part.

Next, FIG. 9 is a longitudinal sectional view showing a semiconductor device according to the third invention. In the same figure, a partition plate 41a is vertically provided on the lower surface of the center of the ceiling of a box body 41, which is fixed to a mounting frame 40 of a vehicle (not shown) by an L-beam 41c disposed horizontally at the upper end. 41a and the right end of the bottom plate 41b of the box body 41, a unit case 43 is fixed from the right side in FIG. 9, and an inspection cover 44 is attached to the lower part of the right side of the unit case 43 in the figure.

A heat receiving section 47 of a heat pipe 46 whose heat dissipating section protrudes from the right side of the unit case 43 is housed inside the unit case 43.
A GTO thyristor 48 is attached to the left side, a flywheel diode 49 is attached to the right side, and a snubber diode 52 is attached to the lower left side of the heat receiving part 47 on both sides in the direction orthogonal to the plane of the figure.

A snubber capacitor 51 is housed below the snubber diode 52, a gate amplifier 50 is housed on the right side of the snubber capacitor 51, and peripheral circuit supplies 54 are housed above the heat receiving block 47. ,
A snubber resistor 53 is attached to the right side of this peripheral circuit component 54 with its terminals inside.

On the other hand, at the upper left end of the box body 41, there is a terminal block 5.
6 is fixed, and to this terminal block 56, the upper ends of bus bars 55A, 55B whose lower ends are connected to the GTO thyristor 48 are connected, and on the upper surface of the bottom plate 41b, a gate amplifier 50 is connected.
A wire bundle 57 connected to is disposed.

In the semiconductor device constructed in this manner, most of the parts can be mounted from both sides of the unit case 43 placed on the workbench for assembly, and the snubber capacitor 51 and snubber diode 5 and GT
The connection with the O thyristor 48 and the connection between the GTO thyristor 48 and the gate amplifier 50 can also be made in the unit case 43 placed on the workbench, and the unit case 43 with these installations and wiring completed is assembled into the box body 41. Since it is only necessary to connect the bus bars 55A, 55B and the wire bundle 57, assembly is easy and the length of the wiring can be shortened, as well as variations in characteristics can be reduced.

Furthermore, when checking the gate amplifier 50 during maintenance and inspection, the inspection cover 44 is removed and a plug is inserted into the test terminal provided on the gate amplifier 50 to easily check the gate. be able to.

FIG. 10 is a longitudinal sectional view showing another embodiment of the semiconductor device of the third invention. In the figure, the unit case 58 does not have the inspection cover 44 shown in FIG.
A snubber diode 52 is attached to the center of the lower surface of the heat receiving part 47, and a snubber capacitor 51 is housed in the lower right of this snubber diode 52.
A gate amplifier 50 is housed on the left side. In this case, there is an advantage that it can be applied when inspection of the gate circuit is relatively unnecessary.

[0051]

As described above, according to the first invention, in a semiconductor device in which a semiconductor stack and a capacitor unit are housed in a box provided under the floor of a vehicle, outside air flows in and out of the box toward the center of the vehicle. An open chamber is provided, a semiconductor stack is attached to the outside of the vehicle with a heat dissipation section protruding into the open chamber, and a capacitor unit case that can be opened and closed is provided on the outside of the vehicle in the box body, thereby making it possible to easily connect the terminals of the capacitor unit and semiconductor stack. Since they are located and connected in the same sealed room, it is possible to obtain a semiconductor device that can reduce wiring inductance, suppress overvoltage when the semiconductor element is switched off, reduce loss, and prevent shortening of life.

According to the second invention, the semiconductor stack and the snubber resistor are housed in a box provided under the floor of the vehicle, and an open chamber through which outside air flows in and out is provided on the outside of the box. In a semiconductor device in which a heat pipe is provided with a heat dissipating part protruding into the open room inside the vehicle in an open room, a snubber resistor is attached to the top surface of the heat receiving part with the heat generating part protruding into the open room, and a semiconductor stack is attached to the side of the heat receiving part. By attaching the snubber resistor to the semiconductor element, the rising speed of the cooling air in the open room is increased, which reduces wiring inductance, improves the cooling effect of the semiconductor element, and allows semiconductor devices to be made smaller and lighter. Obtainable.

Furthermore, according to the third aspect of the invention, the semiconductor stack, the gate amplifier, and the snubber capacitor are housed in a box provided under the floor of the vehicle, and an open chamber is provided outside the box to allow outside air to flow in and out. In a semiconductor device in which a heat pipe is provided with a heat dissipating part protruding into the open room inside the vehicle, a unit is installed inside the vehicle in the open room, and the semiconductor is installed in the heat receiving part of the heat pipe inside this unit. By attaching the stack and storing the gate amplifier and snubber capacitor in the unit, the unit can be assembled.
Since unit testing is enabled, it is possible to obtain a semiconductor device that is easy to assemble and maintain, and can prevent variations in characteristics.

[Brief explanation of drawings]

FIG. 1 is a longitudinal cross-sectional view showing an embodiment of a semiconductor device of a first invention.

FIG. 2 is a longitudinal sectional view showing another embodiment of the semiconductor device of the first invention.

FIG. 3 is a longitudinal sectional view showing an embodiment of the semiconductor device of the second invention.

FIG. 4 is an enlarged detailed view in the direction of arrow A in FIG. 3;

FIG. 5 is a longitudinal sectional view showing another embodiment of the semiconductor device of the second invention.

FIG. 6 is an enlarged detailed view in the direction of arrow B in FIG. 5;

FIG. 7 is a longitudinal sectional view showing another different embodiment of the semiconductor device of the second invention.

FIG. 8 is a view along the line CC in FIG. 7;

FIG. 9 is a vertical cross-sectional view showing an embodiment of a semiconductor device according to a third invention.

FIG. 10 is a longitudinal sectional view showing another embodiment of the semiconductor device of the third invention.

FIG. 11 is a wiring diagram showing the main circuit of this type of semiconductor device.

FIG. 12 is a vertical cross-sectional view showing an example of a conventional semiconductor device.

FIG. 13 is a longitudinal cross-sectional view showing an example of a conventional semiconductor device different from FIG. 12;

FIG. 14 is a longitudinal cross-sectional view showing an example of a conventional semiconductor device different from FIGS. 12 and 13.

[Explanation of symbols] 1... Semiconductor stack, 2... Capacitor unit, 3... Snubber resistor, 4... Radiation fin, 5, 25, 41... Box, 6
...Capacitor unit case, 7...Open chamber, 8...Hinge, 9...Terminal block, 10, 11, 29...Disconnected base, 21...
Semiconductor element, 22, 46... Heat pipe, 23, 53...
Snubber resistor, 24, 47...heat receiving block, 42...door, 4
3... Unit case, 44... Inspection cover, 45... Sampling cover, 48... GTO thyristor, 49... Flywheel diode, 50... Gate amplifier, 51... Snubber capacitor, 52... Snubber diode.

Claims (3)

[Claims] Claim 1: In a semiconductor device in which a semiconductor stack and a capacitor unit are housed in a box provided under the floor of a vehicle, an open chamber through which outside air flows in and out is provided on the vehicle center side of the box, and A semiconductor device, characterized in that a semiconductor stack is attached to the outside of the vehicle with a heat dissipation part protruding into the open chamber, and a capacitor unit case that can be opened and closed is provided on the outside of the box. [Claim 2] A semiconductor stack and a snubber resistor are housed in a box provided under the floor of the vehicle, and an open chamber through which outside air flows in and out is provided on the outside of the box, and heat is dissipated to the inside of the vehicle. In the semiconductor device, the snubber resistor is attached to the top surface of the heat receiving part of the heat pipe with the heat generating part protruding into the open chamber, and the semiconductor device is attached to the side surface of the heat receiving part. A semiconductor device characterized by having a stack attached thereto. 3. A semiconductor stack, a gate amplifier, and a snubber capacitor are housed in a box provided under the floor of the vehicle, and an open chamber is provided outside the box through which outside air flows in and out of the vehicle. In a semiconductor device in which a heat pipe is attached with a heat dissipating part protruding inside the open chamber, a unit is attached to the inside of the vehicle in the open chamber, and the semiconductor stack is attached to the heat receiving part of the heat pipe inside the unit. A semiconductor device characterized by being attached.