CN103931094A

CN103931094A - Power conversion device

Info

Publication number: CN103931094A
Application number: CN201280055474.5A
Authority: CN
Inventors: 柴田美里; 田中泰仁
Original assignee: Fuji Electric Co Ltd
Current assignee: Fuji Electric Co Ltd
Priority date: 2011-12-13
Filing date: 2012-11-14
Publication date: 2014-07-16
Also published as: WO2013088642A1

Abstract

Provided is a power conversion device capable of preventing the occurrence of heat pockets by activating natural convection between mounted substrates. A power conversion device (1) is provided with a semiconductor power module (11) having one surface joined to a cooling body (3), and a plurality of mounted substrates (22, 23) laminated on the other surface of said semiconductor power module via an air layer and having mounted thereon circuit components including a heating circuit component (28) for driving said semiconductor power module. Said plurality of mounted substrates is tilted with respect to a flat surface orthogonal to the direction of gravity.

Description

Power conversion device

Technical field

The present invention relates to a kind of power conversion device, in this power conversion device, on the semi-conductor power module that is built-in with power transfer thyristor, be supported with installation base plate in the mode of guaranteeing predetermined distance, described installation base plate is provided with the circuit elements device that comprises the heating circuit components and parts that drive above-mentioned thyristor.

Background technology

As this power conversion device, the known power conversion device that has patent documentation 1 to record.In this power conversion device, in housing, dispose water-cooling jacket, on this water-cooling jacket, dispose semi-conductor power module cooling so that this semi-conductor power module is carried out, described semi-conductor power module is built-in with the IGBT as power transfer thyristor.In addition, in housing, in a side contrary with water-cooling jacket of semi-conductor power module, dispose control circuit substrate in the mode that keeps predetermined distance, the heat that this control circuit substrate is produced conducts to the metal base plate of supporting control circuit substrate via radiating component, and further the heat that conducts to metal base plate is conducted to water-cooling jacket via the sidewall of the housing of this metal base plate of supporting.

In addition, in patent documentation 2, record: in the assembly forming at recorded installation semi-conductor power module, by parallel semiconductor module and be configured obliquely and be arranged in housing.

Prior art document

Patent documentation

Patent documentation 1: No. 4657329 communique of Japan Patent

Patent documentation 2: No. 2004/086836 publication of International Publication

Summary of the invention

Invent technical problem to be solved

But in the conventional example of recording at above-mentioned patent documentation 1, the heat that control circuit substrate produces is dispelled the heat along the such path of control circuit substrate → radiating component → metal base plate → housing → water-cooling jacket.Therefore, there is following an open question:, owing to housing being used as to a part for thermally conductive pathways, thereby also require housing to there is good thermal conductivity, thereby material is restricted to the metal that pyroconductivity is high, therefore requiring, in the light-weighted power conversion device of miniaturization, cannot to select the lighter materials such as resin, thereby be difficult to realize lightweight.

In addition, for housing, owing in most of the cases requiring waterproof and dustproof, therefore, between metal base plate and housing, between housing and water-cooling jacket, be generally coated with liquid sealant or sandwich rubber filler processed etc.Therefore also there is following an open question:, the pyroconductivity of liquid sealant or rubber filler processed is generally lower, these material clips can be caused in hot cooling path thermal resistance increase, thereby cause cooling effectiveness to decline.

In addition, multiple installation base plates are configured abreast, the heat that the heating circuit components and parts of downside installation base plate produce can be converted to hot gas and rise, if but the hot gas rising arrives the lower surface of upside installation base plate, hot gas cannot spread at upside, therefore there is following an open question:, thereby the circuit elements device of the installation base plate of heat build-up to upside has a negative impact.

And, in the conventional example of recording at above-mentioned patent documentation 2, due to parallel to multiple semi-conductor power modules and be configured obliquely respectively in housing, therefore the plate that is useful on installation semi-conductor power module is all configured obliquely, therefore, in requiring to there is sufficient space in housing, be difficult to each semi-conductor power module to be configured for separately and semi-conductor power module to be carried out to the cooling bodies such as cooling water-cooling jacket.

Therefore, an open question that the present invention is conceived to above-mentioned conventional example completes, and its object is to provide a kind of power conversion device, and this power conversion device can prevent by the free convection between reinforcement installation base plate the generation of heat build-up.

The technical scheme that technical solution problem adopts

For achieving the above object, the first method of power conversion device involved in the present invention is, comprising: semi-conductor power module, and the one side of this semi-conductor power module engages with cooling body; And multiple installation base plates, the plurality of installation base plate is layered in the another side side of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described semi-conductor power module is installed on the plurality of installation base plate.And, make multiple described installation base plates with respect to tilting with the orthogonal plane of weight direction.

According to this structure, because installation base plate tilts, therefore in the time that the hot gas being sent by the heating circuit components and parts that are arranged on the installation base plate of downside arrives the lower surface of installation base plate of upside, because the lower surface of the installation base plate of this upside is inclined plane, therefore hot gas rises on inclined plane.Thus, can strengthen the free convection between installation base plate, thereby prevent reliably the generation of heat build-up.

In addition, the second method of power conversion device involved in the present invention is, comprise: semi-conductor power module, is built-in with the thyristor that power transfer is used, and is formed with the cooling component contacting with cooling body on a face of this casing in the casing of this semi-conductor power module; And multiple installation base plates, the plurality of installation base plate is stacked and be configured in a side contrary with the cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate.And, make described installation base plate to be supported with respect to the mode tilting with the orthogonal plane of gravity direction.

In addition, the Third Way of power conversion device involved in the present invention is, comprise: semi-conductor power module, is built-in with the thyristor that power transfer is used, and is formed with the cooling component contacting with cooling body on a face of this casing in the casing of this semi-conductor power module; Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate; And housing, this housing at least surrounds described semi-conductor power module and multiple described installation base plate.And, make described installation base plate to be supported with respect to the mode tilting with the orthogonal plane of gravity direction.

According to this structure, can and above-mentioned execution mode 1 similarly strengthen the free convection between installation base plate, prevent the generation of heat build-up, thereby can eliminate the non-uniform temperature in housing.

In addition, the cubic formula of power conversion device involved in the present invention is, described semi-conductor power module is configured to and the plane parallel that is orthogonal to gravity direction, and utilizes supporting member that multiple described installation base plates are supported to respect to tilting with the orthogonal plane of gravity direction.

According to this structure, due to semi-conductor power module is configured in horizontal plane, itself is supported installation base plate obliquely, therefore, tilts by the upper surface that makes the supporting member that supports installation base plate, can easily support obliquely installation base plate.

In addition, the 5th mode of power conversion device involved in the present invention is, the face contacting with cooling component described semiconductor module described cooling body is formed as, with respect to the inclined plane tilting with the orthogonal plane of gravity direction, disposing abreast described semi-conductor power module and multiple described installation base plate on this inclined plane.

According to this structure, by only the upper surface of cooling body being formed as to inclined plane, just can making installation base plate tilt, thereby can simplify the structure for installation base plate is tilted.

In addition, the 6th mode of power conversion device involved in the present invention is, described housing is by the upper body of outer peripheral face of upper surface that covers described cooling body, form with outer peripheral face and the inner lower case that capacitor is installed of the lower surface that covers described cooling body, the upper surface of described lower case is formed as, with respect to the inclined plane tilting with the orthogonal plane of gravity direction, disposing abreast described cooling body, described semi-conductor power module and multiple described installation base plate on this inclined plane.

According to this structure, by only the upper surface of lower case being formed as to inclined plane, just can making installation base plate tilt, thereby can simplify the structure for installation base plate is tilted.

In addition, the 7th mode of power conversion device involved in the present invention is, the free convection with from described installation base plate of described inner walls face relative to position on be formed with radiating part.

According to this structure, according to this structure, the hot gas transporting by free convection arrives radiating part, utilizes this radiating part to carry out heat exchange with outside, thereby can suppress the temperature rise in housing.

In addition, power conversion device involved in the present invention the from all directions formula be, described radiating part is made up of the radiating fin being formed on inner walls face.

According to this structure, because radiating part is made up of radiating fin, therefore can increase surface area, thereby effectively dispel the heat.

In addition, the 9th mode of power conversion device involved in the present invention is, described radiating part is made up of the multiple slot parts that are formed on inner walls face.

According to this structure, because radiating part is made up of multiple slot parts, therefore identical with radiating fin, can increase surface area, thereby effectively dispel the heat.

In addition, the tenth mode of power conversion device involved in the present invention is, multiple described installation base plates are supported by heat conduction supporting board across heat conduction member, the casing of described semi-conductor power module is formed as having the flat rectangular shape of rectangular planes, described heat conduction supporting board surrounds the two the heat conduction path of housing of described semi-conductor power module and each described installation base plate and is connected with described cooling body by being independent of, and described heat conduction path is configured to by the side of the long side of described casing.

According to this structure, the heating that is arranged on the heating circuit components and parts on installation base plate can be dispelled the heat to cooling body by heat conduction member, heat conduction supporting board and heat conduction path, therefore can effectively dispel the heat to the heating of heating circuit components and parts.Now, because heat conduction path is independent of housing, therefore can in the case of not considering the pyroconductivity of housing, form housing, thereby improve design freedom.

In addition, the 11 mode of power conversion device involved in the present invention is, described heat conduction path is made up of the heat conduction support side board that links described heat conduction supporting board and described cooling body.

According to this structure, can widen the width of hot support side board, increase heat-conducting section long-pending, thereby can increase the heat of heat conduction.

In addition, the 12 mode of power conversion device involved in the present invention is, described heat conduction supporting board and described heat conduction support side board are made up of the high metal material of pyroconductivity.

According to this structure, because installation base plate is made up of the high aluminium of pyroconductivity, aluminium alloy, copper etc., therefore can more effectively carry out the heat radiation to cooling body.

In addition, the 13 mode of power conversion device involved in the present invention is, in the situation that being supported with upper and lower a pair of installation base plate, described heat conduction support side board is connected with the upper end side of heat conduction supporting board of the described installation base plate of supporting downside, and is connected with the lower end side of the heat conduction supporting board of the described installation base plate of supporting upside.

According to this structure, the hot gas rising along heat conduction supporting board can not blocked by heat conduction support side board, thereby can effectively form free convection.

In addition, the tenth cubic formula of power conversion device involved in the present invention is, described heat conduction supporting board and heat conduction supporting board form as one.

According to this structure, because heat conduction supporting board and heat conduction support side board form as one, therefore there is no seam between the two, thereby can reduce thermal resistance, improve heat-conducting effect.

In addition, the 15 mode of power conversion device involved in the present invention is, comprise: semi-conductor power module, is built-in with the thyristor that power transfer is used, and is formed with the cooling component contacting with cooling body on a face of this casing in the casing of this semi-conductor power module; Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate; And housing, this housing at least surrounds described semi-conductor power module and multiple described installation base plate, and described housing is configured obliquely, to make multiple described installation base plate in this housing with respect to tilting with the orthogonal plane of gravity direction.

According to the 15 mode, as long as power conversion device itself is made as to common structure, and only housing itself is configured obliquely, just can make installation base plate tilt, thereby can more simplify the structure for installation base plate is tilted.

In addition, the 16 mode of power conversion device involved in the present invention is, described housing have the free convection with from described installation base plate of the inner wall surface thereof of being formed on relative to locational radiating part.

According to this structure, the hot gas transporting by free convection arrives radiating part, utilizes this radiating part to carry out heat exchange with outside, thereby can suppress the temperature rise in housing.

In addition, the 17 mode of power conversion device involved in the present invention is, described radiating part is made up of the radiating fin being formed on inner walls face.

In addition, power conversion device involved in the present invention the tenth from all directions formula be, described radiating part is made up of the multiple slot parts that are formed on inner walls face.

In addition, the 19 mode of power conversion device involved in the present invention is, multiple described installation base plates are supported by heat conduction supporting board across heat conduction member, the casing of described semi-conductor power module is formed as having the flat rectangular shape of rectangular planes, described heat conduction supporting board surrounds the two the heat conduction path of housing of described semi-conductor power module and each described installation base plate and is connected with described cooling body by being independent of, and described heat conduction path is configured to by the side of the long side of described casing.

In addition, the 20 mode of power conversion device involved in the present invention is, described heat conduction path is made up of the heat conduction support side board that links described heat conduction supporting board and described cooling body.

In addition, the 21 mode of power conversion device involved in the present invention is, described heat conduction supporting board and described heat conduction support side board are made up of the high metal material of pyroconductivity.

In addition, the 22 mode of power conversion device involved in the present invention is, in the situation that being supported with upper and lower a pair of installation base plate, described heat conduction support side board is connected with the upper end side of heat conduction supporting board of the described installation base plate of supporting downside, and is connected with the lower end side of the heat conduction supporting board of the described installation base plate of supporting upside.

In addition, the 23 mode of power conversion device involved in the present invention is, described heat conduction supporting board and heat conduction supporting board form as one.

Invention effect

According to the present invention, installation base plate is to be supported with respect to the state tilting with the orthogonal plane of gravity direction, even therefore in the case of multiple installation base plates that heating circuit components and parts are installed are configured abreast, the hot gas being produced by downside installation base plate rises and arrives the installation base plate of upside, due to the installation base plate of this upside with respect to the orthogonal plane of gravity direction be that horizontal plane tilts, therefore hot gas rises along the lower surface of the installation base plate of upside.Thus, can strengthen free convection, thereby prevent reliably the generation of heat build-up.

Brief description of the drawings

Fig. 1 is the integrally-built cutaway view that represents the execution mode 1 of power conversion device involved in the present invention.

Fig. 2 is the amplification view that represents the major part of execution mode 1.

Fig. 3 is front view and the vertical view that represents the supporting member of installation base plate.

Fig. 4 is the vertical view of the omission mounting related components of installation base plate.

Fig. 5 is the integrally-built cutaway view that represents the power conversion device of conventional example.

Fig. 6 is the amplification view of the major part of Fig. 5.

Fig. 7 is the amplification view corresponding with Fig. 2 that represents the variation of execution mode 1.

Fig. 8 is the integrally-built schematic sectional view that represents embodiments of the present invention 2.

Fig. 9 is the schematic sectional view that represents the Convection states of execution mode 2.

Figure 10 is the integrally-built schematic sectional view that represents embodiments of the present invention 3.

Figure 11 is the integrally-built schematic sectional view that represents the variation of embodiments of the present invention 3.

Figure 12 is the integrally-built schematic sectional view that represents embodiments of the present invention 4.

Figure 13 is the integrally-built schematic sectional view that represents embodiments of the present invention 5.

Figure 14 is the amplification view of embodiments of the present invention 6.

Figure 15 is the integrally-built schematic sectional view that represents embodiments of the present invention 7.

Figure 16 is the integrally-built schematic sectional view that represents embodiments of the present invention 8.

Figure 17 represents the inclination of the installation base plate in execution mode 8 and the figure of the interior Temperature Distribution of housing.

Figure 18 is the block diagram that represents the inclination of the installation base plate in execution mode 8 and the temperature ratio of epimere substrate, stage casing substrate and hypomere substrate.

Figure 19 is the amplification view that represents embodiments of the present invention 9.

Figure 20 is the amplification view that represents the variation of execution mode 6～9.

Embodiment

Below, utilize accompanying drawing, embodiments of the present invention are described.

Fig. 1 is the integrally-built cutaway view that represents power conversion device involved in the present invention.

In figure, label 1 is power conversion device, and this power conversion device 1 is accommodated in housing 2.Housing 2 is made up of synthetic resin material or the high raw material of heat conductivity, and this housing 2 forms by clipping the lower case 2A and the upper body 2B that have the cooling body 3 of water-cooling jacket structure and be divided into top and the bottom.

Lower case 2A is by there being end square tube body to form.The open upper part cooled body 3 of this lower case 2A covers, and its inside is accommodated with film capacitor 4 for filtering.

Upper body 2B comprises the square tube body 2a that top and bottom are open and seals the lid 2b of the party cylindrical shell 2a upper end.And the lower end cooled body 3 of square tube body 2a seals.Though not shown, between the lower end and cooling body 3 of the party's cylindrical shell 2a, there is the encapsulant that is coated with liquid sealant or accompanies rubber filler processed etc.

Cooling body 3 is formed as lower surface and upper surface, and that to be tabular surface flat is rectangular-shaped.In this cooling body 3, the water inlet 3a of cooling water and the direct opening of discharge outlet 3b, to the outside of housing 2, form cooling water path 3c between these water inlets 3a and discharge outlet 3b.

These water inlets 3a for example provides source to be connected via flexible hose with not shown cooling water with discharge outlet 3b.This cooling body 3 is for example by forming aluminium high pyroconductivity, aluminium alloy injection molding.In addition, form patchhole 3d on cooling body 3, this patchhole 3d inserts up and down for the positive and negative splicing ear 4a that is insulated covering of the film capacitor 4 that is held in lower case 2A.

Simultaneously known with reference to Fig. 2, power conversion device 1 comprises semi-conductor power module 11, and this semi-conductor power module 11 is built-in with for example igbt (IGBT) and is used as forming the thyristor of for example inverter circuit that power transfer uses.

In this semi-conductor power module 11, in flat rectangular-shaped insulating properties casing 12, be built-in with IGBT, on the lower surface of casing 12, be formed with metal cooling component 13.In casing 12 and cooling component 13, while observation from upper surface, on four angles, be formed with patchhole 15, this patchhole 15 is for inserting the hold-down screw 14 as fixed component.In addition, on the upper surface of casing 12, the outstanding substrate fixed part 16 that is formed with specified altitude on four positions of patchhole 15 inner sides.

Be fixed with drive circuit substrate 21 in the upper end of this substrate fixed part 16, this drive circuit substrate 21 is provided with drive circuit that the IGBT to being built in semi-conductor power module 11 drives etc.In addition, above drive circuit substrate 21, to guarantee to have the mode of predetermined distance between the two, and taking with respect to the predetermined angular of the orthogonal horizontal plane of the gravity direction tilt angle theta in the scope of 5～20 ° for example, for example fix obliquely control circuit substrate 22 to upper left side, this control circuit substrate 22 is as the installation base plate that the control circuit that comprises the heating circuit components and parts that caloric value is relatively large or heat generation density is larger of controlling the IGBT that is built in semi-conductor power module 11 etc. is installed.

And, above control circuit substrate 22, similarly to guarantee to have the mode of fixed intervals between the two, and with control circuit substrate 22 parastates, taking with respect to the tiltangleθ in the scope of for example 5 °～20 ° with the angle of the orthogonal horizontal plane of gravity direction, for example support obliquely power circuit substrate 23 to upper left side, this power circuit substrate 23 comprises as being provided with the installation base plate that the power circuit etc. of the heating circuit components and parts of power supply is provided to the IGBT that is built in semi-conductor power module 11.

Herein, on the internal thread part 16a forming in the upper end of a pair of substrate fixed part 16 in the front and back in left side, be screwed into a pair of thread spindle 17a, and extend in vertical direction.In addition, on the internal thread part 16b forming in the upper end of a pair of substrate fixed part 16 in the front and back on right side, be screwed into a pair of thread spindle 17b, and extend in vertical direction.

So, being formed under the state of the patchhole 21a in drive circuit substrate 21 at 4 thread spindle 17a and 17b insertion, the lower surface of drive circuit substrate 21 contacts with the upper end of substrate fixed part 16.

Under this state, cylindric distance piece 18a different length and 18b are arranged on thread spindle 17a and 17b, make thread spindle 17a and 17b insert the inner peripheral surface of this distance piece 18a and 18b.As shown in Figure 2, the length setting of distance piece 18a is the length that is greater than distance piece 18b for these distance pieces 18a and 18b.Here, as shown in Fig. 3 (a), the lower surface of each distance piece 18a and 18b is formed as to horizontal plane Fh, upper surface is formed as to the above-mentioned inclined plane Fi with tiltangleθ.

So the lower surface of control circuit substrate 22 contacts with the inclined plane Fi of the upper surface of each distance piece 18a and 18B.As shown in Figure 4, on four angles of control circuit substrate 22, form slotted hole 22a and the 22b for thread spindle 17a and 17b insertion.So, by making control circuit substrate 22 decline thread spindle 17a and 17b are inserted in slotted hole 22a and 22b from the top of thread spindle 17a and 17b downwards, thereby control circuit substrate 22 is contacted with the inclined plane Fi of the upper end of distance piece 18a and 18b.Thus, as shown in Figure 2, the mode that control circuit substrate 22 tilts with tiltangleθ and to upper left side is installed.

And, the distance piece 19a identical with distance piece 18a and 18b and 19b are installed to from the outstanding thread spindle 17a and 17b of control circuit substrate 22.These distance pieces 19a and 19b are as shown in Fig. 3 (b), and its upper surface and lower surface form respectively the inclined plane Fi with tiltangleθ.In addition, distance piece 19a and 19b are set as to equal height.

Then, from the top of thread spindle 17a and 17b, power circuit substrate 23 is dropped to from distance piece 19a and outstanding thread spindle 17a and the 17b of 19b, thread spindle 17a and 17b are inserted in the slotted hole 23a and 23b identical with above-mentioned control circuit substrate 22, thereby the lower surface of this power circuit substrate 23 and the inclined plane Fi of the upper end of distance piece 19a and 19b are contacted.Thus, as shown in Figure 2, the mode that power circuit substrate 23 also tilts with tiltangleθ and to upper left side is installed, thereby parallels with control circuit substrate 22.

In addition, from the outstanding thread spindle 17a of power circuit substrate 23 and 17b, distance piece 20a and the 20b as supporting member is being installed.As shown in Fig. 3 (c), these distance pieces 20a and 20b are formed as cylindric, and its lower surface is formed as the inclined plane Fi tilting with tiltangleθ, and upper surface is formed as horizontal plane Fh.So the inclined plane Fi of the lower surface by making distance piece 20a and 20b contacts with power circuit substrate 23, makes the horizontal plane Fh of upper surface become level.

Then, by nut 24a and 24b being screwed togather and be tightened in from thread spindle 17a and 17b that distance piece 20a and 20b give prominence to upward, thereby drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 are fixed and be bearing on the substrate fixed part 16 of semi-conductor power module 11.

Here, supporting member is made up of thread spindle 17a, 17b, distance piece 18a, 18b, 19a, 19b, 20a, 20b and nut 24a, 24b.

In addition, in said structure, situation about thread spindle 17a and 17b being screwed on the internal thread part 16a of substrate fixed part 16 of the casing 12 that is fixed on semi-conductor power module 11 is illustrated, but is not limited to this, also thread spindle 17a and 17b and substrate fixed part 16 can be formed as one.In this case, can only be integrally formed vertical axis from distance piece 20a and the outstanding part of 20b, to replace thread spindle 17a and 17b, wherein, on this vertical axis, be formed with external thread part.

Then, the action of above-mentioned execution mode 1 is described.

In above-mentioned execution mode 1, be configured in the housing 2 on horizontal plane and dispose cooling body 3 with level, on this cooling body 3, this semi-conductor power module 11 of state configuration contacting with the upper surface of cooling body 3 with the cooling component 13 of the lower surface of semi-conductor power module 11.

On the upper surface of the casing 12 of this semi-conductor power module 11, when drive circuit substrate 21 is configured to level, the mode tilting with tiltangleθ and to upper left side configures control circuit substrate 22 and power circuit substrate 23.On these control circuit substrates 22 and power circuit substrate 23, heating circuit components and parts are installed.

Then, as shown in Figure 1, bus 50 is connected with the sub-11a of positive and negative direct-flow input end of semi-conductor power module 11, and utilizes hold-down screw 51 that the positive and negative electrode 4a of the film capacitor 4 that runs through cooling body 3 is connected with the other end of this bus 50.And, utilize hold-down screw 54 crimp type terminal 53 that is fixed on connecting line 52 front ends that are connected with external rectifier (not shown) to be fixed on to the sub-11a of direct-flow input end of semi-conductor power module 11.

And, utilize hold-down screw 56 that bus 55 is connected with the three-phase alternating current lead-out terminal 11b of semi-conductor power module 11, and at the middle part of this bus 55 configuration current sensor 57.Then, utilize hold-down screw 60 crimp type terminal 59 of front end that is fixed on the motor stube cable 58 being connected with outside threephase motor (not shown) to be fixed and is connected in the other end of bus 55.

Under this state, providing the galvanic while from external rectifier (not shown), make to be arranged on power circuit on power circuit substrate 23, be arranged on control circuit on control circuit substrate 22 in operate condition, via the drive circuit being arranged in drive circuit substrate 21, signal, for example pulse-width signal are offered to semi-conductor power module 11 by control circuit.Thus, the IGBT that is built in semi-conductor power module 11 is controlled, and direct current is converted to alternating current.Via bus 55, the alternating current conversion is offered to motor stube cable 58 from three-phase alternating current lead-out terminal 11b, thereby threephase motor (not shown) is driven to control.

Now, the IGBT that is built in semi-conductor power module 11 can generate heat.Because the cooling component 13 being formed on semi-conductor power module 11 directly contacts with cooling body 3, therefore utilize the cooling water that cooling body 3 provides to carry out cooling to the heat of this generation.

On the other hand, be installed in the control circuit of control circuit substrate 22 and power circuit substrate 23 and power circuit and include heating circuit components and parts 28, these heating circuit components and parts 28 can produce heating.Now, heating circuit components and parts 28 are installed on the upper surface side of control circuit substrate 22 and power circuit substrate 23.

Therefore, as shown in Figure 2, on control circuit substrate 22 and power circuit substrate 23, the hot gas producing because of the heating of heating circuit components and parts 28 rises, in drive circuit substrate 21, even if caloric value is very little, but the hot gas producing because of the heating of circuit elements device also can rise.So the hot gas occurring because of the heat producing on drive circuit substrate 21 and control circuit substrate 22 rises, and arrive the lower surface of control circuit substrate 22 and power circuit substrate 23.These control circuit substrates 22 and power circuit substrate 23 for example, tilt with tiltangleθ (5～20 °).Thus, the hot gas that arrives control circuit substrate 22 and power circuit substrate 23 rises along the lower surface of control circuit substrate 22 and power circuit substrate 23, thereby has strengthened free convection.

Strengthen by the way free convection, make on the lower surface of control circuit substrate 22 and power circuit substrate 23, not produce heat build-up, eliminated the non-uniform temperature in upper body 2B.

Incidentally, in the prior embodiment, as shown in Figures 5 and 6, drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 are configured in the upper surface side of the casing 12 of semi-conductor power module 11 abreast.Therefore, the hot gas producing because of the heating of the heating circuit substrate of the upper surface side of drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 rises, and this hot gas arrives the lid 2b of control circuit substrate 22, power circuit substrate 23 and upper body 2B.

Now, control circuit substrate 22, power circuit substrate 23 and lid 2b are in level.Therefore, the hot gas that arrives control circuit substrate 22, power circuit substrate 23 and lid 2b is dispersed nowhere, thereby causes heat build-up and cause hot cooling effectiveness to decline.Therefore, only have the surrounding of drive circuit substrate 21, control circuit substrate 22, power circuit substrate 23 and lid 2b to become high temperature, cooling in relatively low low temperature because of cooling body 3 of the outside at these positions, thus in upper body 2B, produce non-uniform temperature.

Thus, even if form multiple ribs or radiating fin etc. to form radiating part on the internal face of upper body 2B, can not produce free convection, therefore cannot carry out effectively cooling to the high-temperature portion of the surrounding of drive circuit substrate 21, control circuit substrate 22, power circuit substrate 23 and lid 2b yet.

But, in above-mentioned execution mode 1, by make control circuit substrate 22 and power circuit substrate 23 all with respect to the orthogonal plane inclination predetermined angular θ of gravity direction, thereby can strengthen free convection.Thus, can prevent from, on drive circuit substrate 21, control circuit substrate 22, power circuit substrate 23 and lid 2b, heat build-up occurs, reduce the temperature in upper body 2B, and then can make temperature distribution homogenization.

In addition, in above-mentioned execution mode 1, the fixing situation of carrying out drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 by the topmost that nut 24a and 24b is screwed on to thread spindle 17a and 17b is illustrated.But the present invention is not limited to said structure, also can adopt the structure shown in Fig. 7.

; from the outstanding thread spindle 17a of control circuit substrate 22 and 17b, distance piece 25a and the 25b identical with distance piece 20a and 20b are being installed, then nut 26a and 26b are being screwed togather and be fastened on from the outstanding thread spindle 17a and 17b of the horizontal plane Fh of the upper end of these distance pieces 25a and 25b.

Then, the distance piece 27a identical with distance piece 25a and 25b and 27b are arranged on from nut 26a and the outstanding thread spindle 17a and 17b of 26b in reverse up and down mode.Power circuit substrate 23 is arranged on from the outstanding thread spindle 17a and 17b of the horizontal plane Fh of this distance piece 27a and 27b, then distance piece 20a and 20b are arranged on from the outstanding thread spindle 17a and 17b of this power circuit substrate 23, finally nut 24a and 24b are screwed togather and are fastened on thread spindle 17a and 17b.

According to this structure of Fig. 7, utilize the temporary transient fastening fixing control circuit substrate 22 of nut 26a and 26b, then side is utilized nut 24a and 24b fastening fixed power source circuit substrate 23 again at an upper portion thereof.Thus, can be fixed control circuit substrate 22 and power circuit substrate 23 securely, thereby can improve the shock resistance for up-down vibration or lateral shake etc.

Then, use Fig. 8 to describe embodiments of the present invention 2.

In present embodiment 2, make the integral inclination of housing 2 to replace the situation that only makes control circuit substrate and power circuit substrate tilt.

; in execution mode 2; the same with the conventional example of above-mentioned Fig. 5 and Fig. 6; adopt following structure:; semi-conductor power module 11 is configured in level in the upper body 2B that forms housing 2; and on the substrate fixed part 16 of semi-conductor power module 11 flatly configuration driven circuit substrate 21, control circuit substrate 22 and power circuit substrate 23, and the interval of guaranteeing to have between each substrate regulation.

So, in the time that the housing 2 with said structure is installed on the fixed parts such as vehicle body 30 as shown in Figure 8, utilize for example bolt 33 and nut 34 that outstanding direction to the left and right holder housing 31a and the 31b being formed on lower case 2A is fixed on stationary housing 32a and 32b, this stationary housing 32a and 32b are arranged on fixed part 30, and for example, to there is the planar extension of installation of the tiltangleθ (5～30 °) described in above-mentioned execution mode 1.

According to this execution mode 2, with respect to the state of the orthogonal horizontal plane inclination tiltangleθ of gravity direction, housing 2 is fixed on fixed part 30.Thus, drive circuit substrate 21, control circuit substrate 22, power circuit substrate 23 and lid 2b all tilt with tiltangleθ.

Therefore, as shown in Figure 9, identical with above-mentioned execution mode 1, when the hot gas producing in the heating of the heating circuit components and parts because of drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 rises, because control circuit substrate 22, power circuit substrate 23 and lid 2b tilt with tiltangleθ, therefore the hot gas rising rises along the lower surface of control circuit substrate 22, power circuit substrate 23 and lid 2b, thereby strengthens free convection.

Consequently, even also can strengthen free convection in narrow space between the drive circuit substrate 21 being laminated, control circuit substrate 22 and power circuit substrate 23, thereby can prevent reliably the generation of heat build-up between substrate.

And, by circulation between drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23, in whole upper body 2B, form circulated air, thereby reduced the temperature difference of air in upper body 2B.

And, by the free convection between reinforcing laminated substrate, can in the case of do not adopt use the forced circulation mode of fin, carry out cooling, thereby can reduce the miniaturization of components and parts number, implement device.

Thus, as above-mentioned execution mode 2, in the situation that whole housing 2 is tilted, can only make housing 2 itself be applicable to conventional example by holder housing and stationary housing are set, thereby without special supporting member for substrate, can make to simplify the structure.

Then, use Figure 10 to describe embodiments of the present invention 3.

In present embodiment 3, the bottom surface of cooling body 3 is made as to the inclined plane tilting to upper right side, to replace the situation that whole housing 2 is tilted.

,, in execution mode 3, as shown in figure 10, the bottom surface 3e of cooling body 3 is formed as to the inclined plane tilting to upper right side with above-mentioned tiltangleθ.Thus, in the situation that lower case 2A is configured on horizontal plane, due to upper body, 2B tilts with tiltangleθ, therefore in the state identical with above-mentioned execution mode 2.

According to execution mode 3, because upper body 2B and above-mentioned execution mode 2 tilt in the same manner, therefore the action effect identical with above-mentioned execution mode 2 can be obtained, the free convection between drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 can be strengthened.Thus, in the heat build-up of eliminating between substrate, can also in housing, form circulated air.

In addition, in above-mentioned execution mode 3, the situation that the opposite face of cooling body 3 is tilted is illustrated, but is not limited to this, also can be as shown in figure 11, square neck is oblique to left down to make the lower surface 2Aa of lower case 2A.In this case, upper body 2B also tilts in the same manner with above-mentioned execution mode 2, therefore can obtain the action effect identical with execution mode 3 with execution mode 2.

Then, use Figure 12 to describe embodiments of the present invention 4.

Present embodiment 4 can be brought into play than the effect of temperature in the larger reduction housing of above-mentioned execution mode 1.

; in execution mode 4; as shown in figure 12; in the structure of Fig. 1 of above-mentioned execution mode 1; the lower surface position that forms internal face the lid 2b of the upper body 2B arriving except transporting via free convection at the hot gas starting from control circuit substrate 22 and the power circuit substrate 23 of tilted configuration disposes the radiating fin 41 that forms radiating part, has the structure identical with Fig. 1.Therefore, in Figure 12, the part corresponding with Fig. 1 marked to identical label, and description is omitted at this.

According to present embodiment 4, the hot gas starting at the control circuit substrate 22 from tilted configuration and power circuit substrate 23 transports via free convection and the position of the lid 2b that reaches maximum temperature in the upper body 2B that arrives disposes the radiating fin 41 as radiating part.Therefore, owing to having configured radiating fin 41, thereby can make the surface area of the upper space of assembling the upper body 2B that has lighter hot-air increase.Therefore, owing to having configured radiating fin 41, thereby can and outside between carry out energetically heat exchange, and then the internal gas temperature in upper body 2B is minimized.

And, because cooling body 3 is connected with upper body 2B, therefore upper body 2B is cooled to uniform temperature, can more effectively reduce internal gas temperature.

In addition, in above-mentioned execution mode 4, application radiating fin 41 is illustrated as the situation of radiating part, but is not limited to this, also can form multiple grooves or ridge by least one in the inwall of lid 2b and square tube body 2a, thereby form the radiating part that surface area is increased.

Then, use Figure 13 to describe embodiments of the present invention 5.

Present embodiment 5 can be brought into play the effect of the reduction temperature larger than above-mentioned execution mode 2.

; in execution mode 5; as shown in figure 13; in the structure of Fig. 8 of above-mentioned execution mode 2; the inwall of the square tube body 2a arriving except transporting via free convection at the hot gas starting from control circuit substrate 22 and power circuit substrate 23 disposes the radiating fin 42 that forms radiating part, has the structure identical with Fig. 8.Therefore, in Figure 13, the part corresponding with Fig. 8 marked to identical label, and description is omitted at this.

According to present embodiment 5, transport via free convection and the top position of the square tube body 2a that reaches maximum temperature in the upper body 2B that arrives disposes the radiating fin 42 as radiating part at the control circuit substrate 22 of the inclination of the housing 2 from being built in tilted configuration and hot gas that power circuit substrate 23 starts.

Therefore, owing to having configured radiating fin 42, thereby can make the surface area of assembling the link position between upper body 2B and the square tube body 2a that has lighter hot-air increase.Therefore, owing to having configured radiating fin 42, thereby can and outside between carry out energetically heat exchange, and then the internal gas temperature in upper body 2B is minimized.

In addition, in above-mentioned execution mode 5, radiating fin 42 is illustrated with the situation that cooling body 3 is connected via square tube body 2a, but is not limited to this, also can between radiating fin 42 and cooling body 3, configure heat carrier, to form the independently thermally conductive pathways with square tube body 2a.In this case, due to radiating fin 42 is formed to special thermally conductive pathways, therefore can further improve the cooling effect of radiating fin 42.

In addition, in above-mentioned execution mode 5, application radiating fin 42 is illustrated as the situation of radiating part, but is not limited to this, also can form multiple grooves or ridge by least one in the inwall of lid 2b and square tube body 2a, thereby form the radiating part that surface area is increased.

Then, use Figure 14 to describe embodiments of the present invention 6.

Present embodiment 6 can further improve the radiating effect of the heating circuit components and parts of installing on the control circuit substrate of described execution mode 1 and power circuit substrate.

,, in execution mode 6, as shown in figure 14, in the structure of Fig. 2 of above-mentioned execution mode 1, control circuit substrate 22 is supported by heat conduction supporting member 62 across heat conduction member 61.The heat conduction support side board 62c that this heat conduction supporting member 62 comprises the heat conduction supporting board 62a that contacts with heat conduction member 61, is connected with the connecting portion 62b of the right-hand member side of this heat conduction supporting board 62a.And the lower end of heat conduction support side board 62c contacts with cooling body 3.

Similarly, for power circuit substrate 23, also supported by heat conduction supporting member 65 across heat conduction member 64.The heat conduction support side board 65c that this heat conduction supporting member 65 comprises the heat conduction supporting board 65a that contacts with heat conduction member 61, is connected with the connecting portion 65b of the right-hand member side of this heat conduction supporting board 65a.And the lower end of heat conduction support side board 65c contacts with cooling body 3.

And the heat conduction support side board 62c in heat conduction supporting member 62 and 65 and the lower end of 65c connect to one by shared base plate 66.This base plate 66 is accommodated in the endless groove 67 of square box shape of the upper surface that is formed on cooling body 3, and is fixed together with cooling body 3 by hold-down screw 14.

Here, as heat conduction member 61 and 64, can application examples as by sandwiching as elastomeric silica gel inside the material that metal charge is brought into play insulation property and improved thermal conductivity.By these heat conduction members 61 and 64 are compressed, for example, to thickness direction compression 5～30% left and right, can reduce thermal resistance, bring into play efficient heat-conducting effect.Thus, in the time utilizing hold-down screw 68 to be fixed with heat conduction supporting board 62a accompanying the control circuit substrate 22 of heat conduction member 61, with the compression ratio of 5～30% left and right, heat conduction member 61 is compressed and fixed.Similarly, in the time utilizing hold-down screw 69 to be fixed with heat conduction supporting board 65a accompanying the power circuit substrate 23 of heat conduction member 64, with the compression ratio of 5～30% left and right, heat conduction member 64 is compressed and fixed.

In addition, for heat conduction supporting member 65, near the peristome that preferably formation is discharged laterally for the hot gas of free convection the linking part being connected with heat conduction supporting board 65a of heat conduction support side board 65c.

According to execution mode 6, control circuit substrate 22 and power circuit substrate 23 that heating circuit components and parts are installed are supported by heat conduction supporting board 62a and 65a across heat conduction member 61 and 64 respectively, and these heat conduction supporting board 62a and 65a are connected via heat conduction support side board 62c and 65c and cooling body 3.Thus, the heating that is arranged on the heating circuit components and parts on control circuit substrate 22 is transmitted to heat conduction supporting board 62a across heat conduction member 61, and is transmitted to cooling body 3 from this heat conduction supporting board 62a via heat conduction support side board 62c and dispels the heat.

Similarly, the heating that is arranged on the heating circuit components and parts on power circuit substrate 23 is transmitted to heat conduction supporting board 65a across heat conduction member 64, and is transmitted to cooling body 3 from this heat conduction supporting board 65a via heat conduction support side board 65c and dispels the heat.

Therefore, form the thermally conductive pathways that is independent of upper body 2B that the heating of the heating circuit components and parts of control circuit substrate 22 and power circuit substrate 23 is dispelled the heat to cooling body 3, therefore can more effectively dispel the heat to the heating of control circuit substrate 22 and power circuit substrate 23.Thus, can effectively reduce the temperature rise in upper body 2B.Therefore, can reduce the hot gas from control circuit substrate 22 and power circuit substrate 23, thereby suppress significantly the temperature rise in upper body 2B.

And, because heat conduction support side board 62c and 65c form as one by shared base plate 66, therefore, between heat conduction support side board 62c and 65c and base plate 66, there is not the seam between components and parts, thereby can suppress thermal resistance.

And, due to the control circuit substrate 22 from heating circuit components and parts are installed till the heat dissipation path of cooling body 3 is independent of upper body 2B, therefore upper body 2B does not need to use the metal such as aluminium with high thermoconductivity, and can be formed by synthetic resin material, therefore can realize lightweight.

In addition, due to heat dissipation path and do not rely on housing 2, can in power conversion device 1, form heat dissipation path individually, therefore, the power conversion device 1 being made up of semi-conductor power module 11, drive circuit substrate 21, control circuit substrate 22 can be applied to housing 2 and the cooling body 3 of various different modes.

Then, use Figure 15 to describe embodiments of the present invention 7.

This execution mode 7 is applied to above-mentioned execution mode 3 by above-mentioned execution mode 6 and obtains.

,, in execution mode 7, as shown in figure 15, the control circuit substrate 22 of above-mentioned execution mode 3 and power circuit substrate 23 are supported by heat conduction supporting member 62 and 65 across heat conduction member 61 and 64 respectively.These heat conduction supporting members 62 and 65 comprise heat conduction supporting board 62a and the 65a contacting with heat conduction member 61 and 64 and be connected to this heat conduction supporting board 62a and 65a and cooling body 3 between heat conduction support side board 62c and 65c, heat conduction support side board 62c and 65c link mutually by shared base plate 66.

In present embodiment 8, the heating that is arranged on the heating circuit components and parts on control circuit substrate 22 and power circuit substrate 23 is transmitted to heat conduction supporting board 62a and 65a across heat conduction member 61 and 64, and is further transmitted to cooling body 3 via heat conduction support side board 62c and 65c and dispels the heat.

Therefore, can reduce the hot gas from control circuit substrate 22 and power circuit substrate 23, thereby suppress significantly the temperature rise in upper body 2B.

Then, use Figure 18 to describe embodiments of the present invention 8.

This execution mode 8 is applied to above-mentioned execution mode 2 by above-mentioned execution mode 6 and obtains.

In present embodiment 8, in the structure of Fig. 8 of above-mentioned execution mode 2, control circuit substrate 22 and power circuit substrate 23 are also supported by heat conduction supporting member 62 and 65 across heat conduction member 61 and 64 respectively.These heat conduction supporting members 62 and 65 comprise heat conduction supporting board 62a and the 65a contacting with heat conduction member 61 and 64 and be connected to this heat conduction supporting board 62a and 65a and cooling body 3 between heat conduction support side board 62c and 65c, heat conduction support side board 62c and 65c link mutually by shared base plate 66.

About above-mentioned execution mode 2, carry out, after hot analytic simulation, can obtaining the result shown in Figure 17.In this hot analytic simulation, as shown in Figure 17, to whole housing 2 being made as to the horizontal positioned of level, and inclination angle is set as to the slant setting of 5 ° carries out hot analytic simulation.

As shown in figure 17, in the case of the horizontal positioned identical with conventional example, as shown in Figure 17 (a), between substrate, there is heat build-up, and in housing, produced the inhomogeneous of Temperature Distribution in the result of this hot analytic simulation.

Unlike this, inclination angle is being made as to 5 ° and whole housing 2 is tilted in the situation that, as shown in Figure 17 (b), can eliminate the heat build-up between substrate, and can make the mean temperature decline 6.7K between substrate.

And, if the temperature rise when by the horizontal positioned of conventional example is made as 100%, above-mentioned hot analysis mode result is expressed as to the temperature lapse rate of drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23, as shown in figure 18.

As shown in Figure 18, the in the situation that of 5 ° of housing 2 integral inclinations, can make the temperature at each substrate place of drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 30% left and right that declines.

Result by Figure 17 and Figure 18 can be verified, by making housing 2 integral inclinations, can strengthen the free convection between substrate, thereby eliminates the heat build-up between substrate, also can eliminate temperature distributing disproportionation in housing 2 even.

Therefore, in the situation that only making control circuit substrate 22 and power circuit substrate 23 tilt as described in above-mentioned execution mode 1,4 and 6, as as described in execution mode 2 and execution mode 5, make in the situation of housing 2 integral inclinations, as as described in execution mode 3 and execution mode 7, make in the situation of cooling body 3 or lower case 2A inclination, owing to supporting obliquely control circuit substrate 22 and power circuit substrate 23, therefore can strengthen free convection, similarly also can eliminate heat build-up, thereby improve the cooling effect of control circuit substrate 22 and power circuit substrate 23.

Then, use Figure 19 to describe embodiments of the present invention 9.

This execution mode 9 is that above-mentioned execution mode 6 is improved and obtained.

That is, in execution mode 9, in the structure of Figure 14 of above-mentioned execution mode 6, form linking part 62b at the left end of the heat conduction supporting board 62a that supports control circuit substrate 22 across heat conduction member 61, this connecting portion 62b and heat conduction support side board 62c are connected.In addition, form linking part 65b at the right-hand member of the heat conduction supporting board 65a that supports power circuit substrate 23 across heat conduction member 64, this linking part 65b and heat conduction support side board 65c are connected.Except said structure, this execution mode 9 has the structure identical with Figure 14, the part corresponding with Figure 14 marked to identical label, and description is omitted.

According to this execution mode 9, the heat conduction supporting board 62a that supporting is provided with the control circuit substrate 22 of the downside of heating circuit components and parts is connected at the left end and the heat conduction support side board 62c that become upper end side, similarly, the heat conduction supporting board 65a of power circuit substrate 23 that supporting is provided with the upside of heating circuit components and parts is connected at the right-hand member and the heat conduction support side board 65c that become lower end side.Thus, the left end side between control circuit substrate 22 and power circuit substrate 23 is in open state, not because heat conduction supporting member 65 seals.

The hot gas of therefore, discharging from the larger control circuit substrate 22 of caloric value can move to the upper left quarter of upper body 2B swimmingly.Therefore, can improve the cooling effect of control circuit substrate 22 and power circuit substrate 23, and realize the reduction of air drag, and then free convection is further intensified.

In addition, in above-mentioned execution mode 6～9, to forming the heat conduction supporting board 62a of heat conduction supporting member 62 and 65 in the mode of split and the situation of 65a and heat conduction support side board 62c and 65c is illustrated.But the present invention is not limited to said structure, also can be as shown in figure 20, heat conduction supporting board 62a and 65a and heat conduction support side board 62c and 65c are configured to one.In this case, owing to can not forming seam between heat conduction supporting board 62a and 65a and heat conduction support side board 62c and 62c, therefore, more effectively dispel the heat thereby can reduce thermal resistance.

And in above-mentioned execution mode 1～9, the situation that application film capacitor 4 is used as to capacitor for filter is illustrated, but is not limited to this, also can apply columniform electrolytic capacitor.

In addition, in above-mentioned execution mode 1～9, the situation that power conversion device of the present invention is applied to electric automobile is illustrated, but is not limited to this, the present invention is also applicable to the rolling stock that travels on track, also applicable to electro-motive vehicle arbitrarily.In addition, be not limited to electro-motive vehicle as power conversion device, the actuator of the motor in driving other industries equipment etc., also can apply power conversion device of the present invention.

Industrial practicality

According to the present invention, a kind of power conversion device can be provided, this power conversion device can by make to be provided with multiple installation base plates of the circuit elements device that comprises heating circuit components and parts with respect to the orthogonal plane run-off the straight of gravity direction, strengthen the free convection between installation base plate, thereby prevent the generation of heat build-up.

Label declaration

1 ... power conversion device, 2 ... housing, 2A ... lower case, 2B ... upper body, 3 ... cooling body, 4 ... film capacitor, 11 ... semi-conductor power module, 12 ... casing, 13 ... radiating component, 16 ... substrate fixed part, 17a, 17b ... thread spindle, 18a, 18b, 19a, 19b, 20a, 20b ... distance piece, 21 ... drive circuit substrate, 22 ... control circuit substrate, 23 ... power circuit substrate, 24a, 24b ... nut, 25a, 25b ... distance piece, 26a, 26b ... nut, 27a, 27b ... distance piece, 30 ... fixed part, 31a, 31b ... holder housing, 32a, 32b ... stationary housing, 41, 42 ... radiating fin, 61, 64 ... heat conduction member, 62 ... heat conduction supporting member, 62a ... heat conduction supporting board, 62b ... linking part, 62c ... heat conduction support side board, 65 ... heat conduction supporting member, 65a ... heat conduction supporting board, 65b ... linking part, 65c ... heat conduction support side board, 66 ... base plate

Claims

1. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, a face of this semi-conductor power module engages with cooling body; And

Multiple installation base plates, the plurality of installation base plate is layered in the another side side of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described semi-conductor power module is installed on the plurality of installation base plate,

Multiple described installation base plates are with respect to tilting with the orthogonal plane of weight direction.

2. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing; And

Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate

Described installation base plate is to be supported with respect to the mode tilting with the orthogonal plane of gravity direction.

3. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing;

Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate; And

Housing, this housing at least surrounds described semi-conductor power module and multiple described installation base plate,

4. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

Described semi-conductor power module is configured to and the plane parallel that is orthogonal to gravity direction, and utilizes supporting member that multiple described installation base plates are supported to respect to tilting with the orthogonal plane of gravity direction.

5. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

The face contacting with cooling component described semiconductor module described cooling body is formed as, with respect to the inclined plane tilting with the orthogonal plane of gravity direction, disposing abreast described semi-conductor power module and multiple described installation base plate on this inclined plane.

6. power conversion device as claimed in claim 3, is characterized in that,

Described housing is by the upper body of outer peripheral face of upper surface that covers described cooling body, and the outer peripheral face and the inner lower case that capacitor is installed that cover the lower surface of described cooling body form,

The upper surface of described lower case is formed as, with respect to the inclined plane tilting with the orthogonal plane of gravity direction, disposing abreast described cooling body, described semi-conductor power module and multiple described installation base plate on this inclined plane.

7. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

The free convection with from described installation base plate of described inner walls face relative to position on be formed with radiating part.

8. power conversion device as claimed in claim 7, is characterized in that,

Described radiating part is made up of the radiating fin being formed on inner walls face.

9. power conversion device as claimed in claim 7, is characterized in that,

Described radiating part is made up of the multiple slot parts that are formed on inner walls face.

10. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

Multiple described installation base plates are supported by heat conduction supporting board across heat conduction member, the casing of described semi-conductor power module is formed as having the flat rectangular shape of rectangular planes, described heat conduction supporting board surrounds the two the heat conduction path of housing of described semi-conductor power module and each described installation base plate and is connected with described cooling body by being independent of, and described heat conduction path is configured to by the side of the long side of described casing.

11. power conversion devices as claimed in claim 10, is characterized in that,

Described heat conduction path is made up of the heat conduction support side board that links described heat conduction supporting board and described cooling body.

12. power conversion devices as claimed in claim 11, is characterized in that,

Described heat conduction supporting board and described heat conduction support side board are made up of the high metal material of pyroconductivity.

13. power conversion devices as claimed in claim 11, is characterized in that,

In the situation that being supported with upper and lower a pair of installation base plate, described heat conduction support side board is connected with the upper end side of heat conduction supporting board of the described installation base plate of supporting downside, and is connected with the lower end side of the heat conduction supporting board of the described installation base plate of supporting upside.

14. power conversion devices as claimed in claim 11, is characterized in that,

Described heat conduction supporting board and heat conduction supporting board form as one.

15. 1 kinds of power conversion devices, is characterized in that, comprising:

Described housing is configured obliquely, to make multiple described installation base plate in this housing with respect to tilting with the orthogonal plane of gravity direction.

16. power conversion devices as claimed in claim 15, is characterized in that,

17. power conversion devices as claimed in claim 16, is characterized in that,

18. power conversion devices as claimed in claim 16, is characterized in that,

19. power conversion devices as described in any one of claim 15 to 18, is characterized in that,

20. power conversion devices as claimed in claim 15, is characterized in that,

21. power conversion devices as claimed in claim 16, is characterized in that,

22. power conversion devices as claimed in claim 20, is characterized in that,

23. power conversion devices as claimed in claim 20, is characterized in that,