CN104040865A - Power conversion apparatus - Google Patents
Power conversion apparatus Download PDFInfo
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- CN104040865A CN104040865A CN201380005264.XA CN201380005264A CN104040865A CN 104040865 A CN104040865 A CN 104040865A CN 201380005264 A CN201380005264 A CN 201380005264A CN 104040865 A CN104040865 A CN 104040865A
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- Prior art keywords
- heat conduction
- insulation
- region
- power conversion
- base plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Provided is a power conversion apparatus, which is made compact as a whole, while eliminating insufficiency of insulating distance. The power conversion apparatus (1) is provided with: a semiconductor power module (11) having one surface thereof bonded to a cooling body (3); a plurality of mounting substrates (22, 23), each of which has mounted thereon circuit components including a heat generating circuit component that drives the semiconductor power module; heat transmitting supporting members (32, 33), which transmit heat of the mounting substrates to the cooling body; and an insulation ensuring region (43), which is formed in an insulating distance insufficient region where the insulating distance is insufficient between the mounting substrates.
Description
Technical field
The present invention relates to power conversion device, this power conversion device supports multiple installation base plates across compartment of terrain on the semi-conductor power module that is built-in with the thyristor that power transfer uses, and the plurality of installation base plate is provided with the circuit elements device that comprises the heating circuit components and parts that above-mentioned thyristor is driven.
Background technology
As this power conversion device, known have such having shown in patent documentation 1 that the installation base plate that heating circuit components and parts are installed is connected with cooling body via housing, and the heat that installation base plate is produced is to the power conversion device of the structure of cooling body heat radiation.
In the power conversion device of recording at this patent documentation 1, as shown in Figure 7, dispose semi-conductor power module 101 on cooling body 100, this semi-conductor power module 101 is built-in with the thyristor that power transfer is used.In the upper surface side of this semi-conductor power module 101, installation base plate 102 is supported by the heat conduction supporting member 106 being connected with housing 105 via the Heat Conduction Material 104 that is arranged at its bottom surface.Thus, the heat that installation base plate 102 produces can, along the path heat radiation of Heat Conduction Material 104 → heat conduction supporting member 106 → housing 105 → cooling body 100, therefore, can carry out cooling to installation base plate.In addition, 107 for being configured in the capacitor of the bottom in housing 105.In addition, 108 for being arranged on the auxiliary equipment inverter bottom cooling body.
Prior art document
Patent documentation
Patent documentation 1: No. 4657329 communique of Japan Patent
Summary of the invention
Invent technical problem to be solved
But in the conventional example of recording at above-mentioned patent documentation 1, the heat that control circuit substrate produces dispels the heat along the such path of control circuit substrate → radiating component → metal base plate → housing → water-cooling jacket.Therefore, there is following an open question:, owing to housing being used as to a part for thermally conductive pathways, thereby also require housing to there is good thermal conductivity, thereby material is restricted to the metal that pyroconductivity is higher, therefore requiring, in the light-weighted power conversion device of miniaturization, cannot to select the lighter materials such as resin, thereby be difficult to realize lightweight.
In addition, for housing, owing in most of the cases requiring waterproof and dustproof, therefore, between metal base plate and housing, between housing and water-cooling jacket, be generally coated with liquid sealant or sandwich rubber filler processed etc.Therefore also there is following an open question:, the pyroconductivity of liquid sealant or rubber filler processed is generally lower, these material clips can be caused in hot cooling path thermal resistance increase, thereby cause cooling effectiveness to decline.
On the other hand, require the densification of power conversion device.If carry out this densification, the heat generation density in housing improves, and along with temperature rise, the possibility that is arranged on the durability decline of the electronic devices and components that drive, control on installation base plate uprises.In order to prevent this situation, by employing guarantee cooling performance structure so that the temperature in housing do not raise, thereby can try hard to the densification of implement device.But the cooling capacity improving in housing is limited, tries hard on this basis realize the height that densification needs power-limiting conversion equipment.For this reason, the distance being configured between the each installation base plate in housing becomes problem.
The circuit elements device that setting height(from bottom) is different between each installation base plate, therefore, determines that under the state of mounting circuit components and parts not the distance between installation base plate is nonsensical, needs supposition that the installation base plate of circuit elements device is installed.Now, for the distance between installation base plate, in the case of highly maximum circuit elements device is set as required insulation distance with the distance between other installation base plates relative with it, no problem aspect insulation, but for the distance between installation base plate, as long as while there is the circuit elements device of an insulation distance deficiency, will coordinate this circuit elements device to determine distance, distance between each installation base plate is elongated, and it is large-scale that housing also becomes.
On the other hand, in order to ensure insulation distance, consider installing insulating sheet material on the opposite face of another installation base plate relative with the circuit elements device that is installed on an installation base plate, in the case, also no problem aspect insulation, but there is following an open question:, the thermal conductivity of insulation sheet material is lower, be difficult to the heat that conduction produces from heating circuit components and parts, the heat that heating circuit components and parts produce is trapped between installation base plate, and cooling capacity declines.
Therefore, an open question that the present invention is conceived to above-mentioned conventional example completes, and its object is to provide a kind of power conversion device, and this power conversion device can be eliminated insulation distance deficiency and make overall compact.
The technical scheme that technical solution problem adopts
In order to achieve the above object, the 1st mode of power conversion device of the present invention comprises:
A semi-conductor power module that face engages with cooling body; Multiple installation base plates, the plurality of installation base plate is provided with the circuit elements device that comprises the heating circuit components and parts that described semi-conductor power module is driven; The heat of multiple installation base plates is conducted to the heat conduction supporting member to described cooling body; And between described multiple installation base plates, the insulation that is formed at the not enough region of insulation distance of insulation distance deficiency guarantees region.
According to the 1st mode, in the case of the local not enough region of insulation distance that produces insulation distance deficiency between multiple installation base plates, on the installation base plate of the not mounting circuit components and parts relative with the not enough region of this insulation distance, form insulation and guarantee region.Guarantee region as this insulation, on the installation base plate relative with the not enough region of this insulation, local installing insulating sheet material is to guarantee insulation distance, or a part of removing the heat conduction supporting member that dispels the heat to cooling body of heat that heating circuit components and parts are produced to be to guarantee insulation distance, or becoming heat conduction member that between the circuit elements device in the not enough region of insulation and relative installation base plate, folder is inserted insulating properties to guarantee insulation distance.
Thus, even in the subregion between mounting circuit substrate insulation distance deficiency, also can utilize insulation deficiency to guarantee that region guarantees insulation distance, can make the distance between installation base plate shorter than required insulation distance, make compact overall structure.
In addition,, in the 2nd mode of power conversion device of the present invention, described insulation guarantees that region is made as the region of guaranteeing insulation at the folder slotting insulating properties heat conduction member in position relative with the not enough region of described insulation distance.
According to the 2nd mode, insert the heat conduction member of insulating properties by folder between installation base plate and heat conduction supporting member, thereby can carry out reliably the insulation between installation base plate and heat conduction supporting member, and improve radiating effect.
In addition,, in the 3rd mode of power conversion device of the present invention, described insulation guarantees that region is made as the region of guaranteeing insulation at the position configuration insulation sheet material relative with the not enough region of described insulation distance.
According to the 3rd mode, insulation sheet material is only configured in and the relative position, not enough region of insulating, instead of the whole surface of heat conduction supporting member, therefore, except dispose insulation sheet material region heat conduction supporting member expose to the heating circuit components and parts of relative configuration.Therefore, can absorb the heat that the heating circuit components and parts relative with heat conduction supporting member produce, prevent that reliably produced heat is trapped between installation base plate.
In addition,, in the 4th mode of power conversion device of the present invention, described insulation guarantees that region is made as the region that the described heat conduction supporting member of the position relative with the not enough region of described insulation distance is removed to guarantee insulation.
According to the 4th mode, the heat conduction supporting member relative with the not enough region of insulation distance can be removed to guarantee insulation distance.In the case, even if remove heat conduction supporting member, and between installation base plate, also there is the heat conduction member of insulating properties, therefore, can guarantee the insulation distance of growing.
In addition, in the 5th mode of power conversion device of the present invention, described heat conduction supporting member is made up of with the heat conduction support side board side of this heat conduction supporting board being linked and be connected with described cooling body the heat conduction supporting board described installation base plate being supported across heat conduction member.
According to the 5th mode, heat conduction supporting member is made up of heat conduction supporting board and heat conduction support side board, therefore, in the time of the assembly operation of installation base plate, heat conduction supporting board and the configuration of installation base plate one, heat conduction support side board is configured to be connected with cooling body, finally heat conduction supporting board and heat conduction support side board is linked, thereby can form heat conduction supporting member.
In addition,, in the 6th mode of power conversion device of the present invention, described heat conduction supporting board and described heat conduction support side board are integrally formed.
According to the 6th mode, heat conduction supporting board and heat conduction support side board are integrally formed, and therefore, do not have seam between the two, can thermal resistance be suppressed lowlyer, thereby can improve radiating effect.
In addition,, in the 7th mode of power conversion device of the present invention, described heat conduction member is made up of the insulator with insulating properties.
According to the 7th mode, heat conduction member has insulating properties, therefore, can carry out reliably the insulation between installation base plate and heat conduction supporting member.
In addition, in the 8th mode of power conversion device of the present invention, utilize clamp structure, the heat conduction supporting board of described installation base plate and described heat conduction supporting member is fixed across described heat conduction member.
According to the 8th mode, under the state that accompanies heat conduction member between installation base plate and the heat conduction supporting board of heat conduction supporting member, utilize clamp structure to be fixed, therefore, can easily assemble.
In addition,, in the 9th mode of power conversion device of the present invention, be inserted with the distance maintaining between described installation base plate and the heat conduction supporting board of described heat conduction supporting member is adjusted to member at the interval of setting at folder around described clamp structure.
According to the 9th form, be in elastomeric situation at heat conduction member, can correctly specify the compression ratio of heat conduction member.
Invention effect
According to the present invention, even in the case of the local not enough region of insulation distance that is formed with insulation distance deficiency between installation base plate, also can utilize insulation guarantee region guarantee insulation, this insulation is guaranteed to area configurations is in the not enough region of insulation distance, therefore, in the position relative with heating circuit components and parts, heat conduction supporting member is exposed, the heat that the heating circuit components and parts of opposite face side produce can dispel the heat and can not be detained to cooling body.Therefore, can improve radiating effect, and, can make the distance between installation base plate shorter than required insulation distance, can make housing densification.
And, owing to not requiring that housing has good thermal conductivity, therefore, can use to housing the lighter materials such as resin, thereby can alleviate the weight of housing, cheap power conversion device is provided.
Brief description of the drawings
Fig. 1 is the integrally-built cutaway view that represents the execution mode 1 of power conversion device of the present invention.
Fig. 2 is the figure that represents installation base plate to be installed to the installation method of heat conduction supporting member.
Fig. 3 is the cutaway view that represents installation base plate to be installed to the state after heat conduction supporting member.Installation base plate
Fig. 4 is the cutaway view that represents the major part of the execution mode 2 of power conversion device of the present invention.
Fig. 5 is the cutaway view that represents the major part of the execution mode 3 of power conversion device of the present invention.
Fig. 6 is the upward view that represents the notch state of the heat conduction supporting board of execution mode 3.
Fig. 7 is the cutaway view that represents conventional example.
Embodiment
Below, based on brief description of the drawings embodiments of the present invention.
Fig. 1 is the integrally-built cutaway view that represents power conversion device of the present invention.
In figure, 1 is power conversion device, and this power conversion device 1 is accommodated in housing 2.Housing 2 is obtained by synthetic resin material forming, forms by clipping the lower case 2A and the upper body 2B that have the cooling body 3 of water-cooling jacket structure and be partitioned into up and down.
Lower case 2A is by there being end square tube body to form.The open upper part cooled body 3 of this lower case 2A covers, and its inside is accommodated with the film capacitor 4 that filtering is used.
Upper body 2B comprises the square tube body 2a that top and bottom are open and seals the lid 2b of the party cylindrical shell 2a upper end.And the lower end cooled body 3 of square tube body 2a seals.Though not shown, between the lower end and cooling body 3 of the party's cylindrical shell 2a, there is the encapsulant that is coated with liquid sealant or accompanies rubber gasket etc.
The feed water inlet 3a of the cooling water of cooling body 3 and discharge outlet 3b are towards housing 2 outer openings.These feed water inlets 3a for example provides source to be connected via flexible hose with not shown cooling water with discharge outlet 3b.This cooling body 3 for example forges integrally formed by aluminium higher pyroconductivity, aluminium alloy by die casting etc.And the lower surface of cooling body 3 is tabular surface, the remainder except central portion 3c of upper surface is formed with all groove 3d of square frame shape.
Power conversion device 1 comprises semi-conductor power module 11, and this semi-conductor power module 11 is being built-in with for example igbt (IGBT) and is used as forming the thyristor of for example inverter circuit that power transfer uses.For this semi-conductor power module 11, in the casing 12 of flat rectangular-shaped insulating properties, be built-in with IGBT, on the lower surface of casing 12, be formed with metal radiating component 13.In casing 12 and radiating component 13, while overlooking, on four angles, be formed with patchhole 15, the hold-down screw 14 that this patchhole 15 is provided as fixed component inserts.In addition, at the upper surface of casing 12, the outstanding substrate fixed part 16 with specified altitude that forms on four positions of patchhole 15 inner sides.
Be fixed with drive circuit substrate 21 in the upper end of this substrate fixed part 16, this drive circuit substrate 21 is provided with drive circuit that the IGBT to being built in semi-conductor power module 11 drives etc.In addition, above control circuit substrate 21, be fixed with control circuit substrate 22 across predetermined distance, this control circuit substrate 22 is provided with control circuit etc. as installation base plate, comprises the heating circuit components and parts that caloric value is relatively large or heat generation density is larger that the IGBT to being built in semi-conductor power module 11 controls in this control circuit.And, above control circuit substrate 22, be fixed with power circuit substrate 23 across predetermined distance, this power circuit substrate 23 is provided with power circuit etc. as installation base plate, comprises the heating circuit components and parts that the IGBT to being built in semi-conductor power module 11 powers in this power circuit.
And, drive circuit substrate 21 is fixed in the following manner:, the external thread part 24a of joint screw 24 is inserted in the patchhole 21a that is formed on the position relative with substrate fixed part 16, this external thread part 24a and the internal thread part 16a that is formed at substrate fixed part 16 upper surfaces are screwed togather.
In addition, control circuit substrate 22 is fixed in the following manner:, the external thread part 25a of joint screw 25 is inserted in patchhole 22a, this patchhole 22a is formed on the position relative with internal thread part 24b, this internal thread part 24b is formed at the upper end of joint screw 24, then the internal thread part 24b of this external thread part 25a and joint screw 24 is screwed togather.
And, power circuit substrate 23 is fixed in the following manner:, hold-down screw 26 is inserted in patchhole 23a, this patchhole 23a is formed at the position relative with internal thread part 25a, this internal thread part 25a is formed on the upper end of joint screw 25, then this hold-down screw 26 is screwed togather with the internal thread part 25a of joint screw 25.
In addition, the heat dissipation path that control circuit substrate 22 and power circuit substrate 23 utilize heat conduction supporting member 32 and 33 independently to form to dispel the heat to cooling body 3 and not via housing 2.These heat conduction supporting members 32 and 33 are formed by the higher metal of pyroconductivity, for example aluminum or aluminum alloy.
Heat conduction supporting member 32 and 33 is configured in all groove 3d of the cooling body 3 that control circuit substrate 22 is supported, and has the shared base plate 34 that is square frame shape that becomes cooling body contact board.Therefore, heat conduction supporting member 32 and 33 is linked and is integrated by base plate 34.And, heat conduction supporting member 32 and 33 and base plate 34 there is the surface of black.For make these heat conduction supporting members 32 and 33 and the surface of base plate 34 become black, smear at surface-coated black resin or with blacking.
Thus, make heat conduction supporting member 32 and 33 and the surface of base plate 34 become black, thereby compared with the original color of metal, can increase thermal emissivity rate, increase radiation heat conduction amount.Therefore, can promote heat conduction supporting member 32 and 33 and base plate 34 dispel the heat towards periphery, make control circuit substrate 22 and power circuit substrate 23 carry out efficiently heat cooling.In addition, also can only the surface of heat conduction supporting member 32 and 33 be become to black and the surface of base plate 34 do not become to black.
Heat conduction supporting member 32 is made up of the heat conduction supporting board 32a on flat board and heat conduction support side board 32c, and this heat conduction support side board 32c is fixed on the right-hand member side on the long limit along semi-conductor power module 11 of this heat conduction supporting board 32a by hold-down screw 32b.In addition the board 32c of heat conduction support side, and shared base plate 34 are connected.
Control circuit substrate 22 is fixed on heat conduction supporting board 32a across heat conduction member 35 by hold-down screw 36.Heat conduction member 35 is configured to the overall dimension identical with power circuit substrate 23 by the elastomer with retractility.As this heat conduction member 35, be suitable for by metallic stuffing being set in the inside of silica gel, bring into play insulation property and improve the material of thermal conductivity.
Heat conduction support side board 32c is by linking board 32d and upper plate portion 32e forms, its cross section is contrary L font, wherein, this link board 32d links and is integrated and extends upward with the outward flange of long side that is disposed at the shared base plate 34 in all groove 3d of cooling body 3, and this upper plate portion 32e extends to the left from the upper end of this link board 32d.Linking board 32d extends upward by the right flank of the long side of semi-conductor power module 11.
Heat conduction supporting member 33 is made up of the heat conduction supporting board 33a on flat board and heat conduction support side board 33c, and this heat conduction support side board 33c is fixed on the left end side on the long limit along semi-conductor power module 11 of this heat conduction supporting board 33a by hold-down screw 33b.And heat conduction support side board 33c and shared base plate 34 are connected.
On heat conduction supporting board 33a, utilize hold-down screw 38 to be fixed with power circuit substrate 23 across the heat conduction member 37 identical with above-mentioned heat conduction member 35.
In addition, heat conduction support side board 33c is by linking board 33d and upper plate portion 33e forms, its cross section is contrary L font, wherein, this link board 33d links and is integrated and extends along top with the outward flange of long side that is disposed at the shared base plate 34 in all groove 3d of cooling body 3, and this upper plate portion 33e extends to the left from the upper end of this link board 33d.Linking board 33d extends upward by the left surface of the long side of semi-conductor power module 11.
And, the linking part that links board 33d and base plate 34 and upper plate portion 33e is for example formed as flexure plane 33f and the 33g of a part for barrel surface.By like this linking part that links board 33d and base plate 34 and upper plate portion 33e being formed as to flexure plane 33f cylindraceous and 33g, thereby can improve the vibration resistance to up-down vibration or lateral shake etc., can relax when power conversion device 1 is transmitted to up-down vibration or lateral shake, link the stress producing on the linking part of board 33d and base plate 34 and upper plate portion 33e concentrated.
In addition, the linking part that links board 33d and base plate 34 and upper plate portion 33e is formed as to flexure plane 33f cylindraceous and 33g, thereby with will link board 33d and the linking part of base plate 34 and upper plate portion 33e and be formed as compared with the situation of L font at right angle, can shortening heat conducting path.Thus, by shortening the heat conduction path from heat conduction supporting board 33a to cooling body 3, can realize efficient heat cooling.
In addition, as shown in Figures 2 and 3, on control circuit substrate 22 and power circuit substrate 23, in upper surface one side, heating circuit components and parts 39 are installed.
And, as shown in Figure 2 by control circuit substrate 22 and power circuit substrate 23, link with heat conduction member 35,37 and heat conduction supporting board 32a, 33a.For these control circuit substrates 22 and power circuit substrate 23, and heat conduction supporting board 32a and 33a between link, except reversed left to right, be in fact identical, therefore, describe taking power circuit substrate 23 and heat conduction supporting board 33a as representative.
In the link of this power circuit substrate 23 and heat conduction supporting board 33a, as shown in Figures 2 and 3, use the packing ring 40 as interval adjustment member with the heat conduction board management height H less than the thickness T of heat conduction member 37.This packing ring 40 is temporarily fixed on the outer circumferential side of the internal thread part 41 screwing togather for hold-down screw 38 forming on heat conduction supporting board 33a by bonding grade.Here, the heat conduction board management height H of packing ring 40 is set, made the compression ratio of heat conduction member 37 become 5～30% left and right.Thus, by by heat conduction member 37 boil down to 5～30% left and right, can reduce thermal resistance, bring into play efficient heat-conducting effect.
On the other hand, on heat conduction member 37, be formed with the patchhole 37a that can insert for joint screw 25 and the patchhole 37b that can insert for packing ring 40.
And, heat conduction member 37 is placed on heat conduction supporting board 33a, so that the packing ring 40 that is temporarily fixed on heat conduction supporting board 33a is inserted in patchhole 37b, and it is upper that power circuit substrate 23 is placed on to this heat conduction supporting board 33a, so that heating circuit components and parts 39 and heat conduction member 37 are joined.
In this state, make hold-down screw 38 by the patchhole 23b of power circuit substrate 23, and then screw togather by the central opening of packing ring 40 and the internal thread part 41 of heat conduction supporting board 33a.Then, tighten hold-down screw 38, until the upper surface of the upper surface of heat conduction member 37 and packing ring 40 is basically identical.
Therefore, by the compression ratio with 5～30% left and right, heat conduction member 37 is compressed, can reduce thermal resistance, bring into play efficient heat-conducting effect.Now, because the compression ratio of heat conduction member 37 manages according to the height H of packing ring 40, therefore, can suitably carry out fastening, and can not occur fastening deficiency or fastening excessively.
Control circuit substrate 22 also links across heat conduction member 35 in the same manner as described above with heat conduction supporting board 32a.
In addition, about the distance between control circuit substrate 22 and power circuit substrate 23, be arranged on the circuit elements device 42 as benchmark that height on control circuit substrate 22 is lower upper end, and the lower surface of the heat conduction supporting board 33a of the heat conduction supporting member 33 of power circuit substrate 23 between distance be set as the insulation distance L1 needing.
Therefore, for the circuit elements device 42 of benchmark of heating circuit components and parts 39 will be high as to(for) aspect ratio, become the distance L 2 shorter than required insulation distance L1, between the heat conduction supporting board 33a of these heating circuit components and parts 39 and power circuit substrate 23, become the not enough region of insulation distance.
If kept intact in not enough this insulation distance region, can cause defective insulation, therefore, be formed with insulation in the not enough region of insulation distance and guarantee region.Guarantee region as this insulation, in the structure of Fig. 1, heat conduction supporting board 33a by the insulation sheet material 43 larger than the flat shape of heating circuit components and parts 39 being pasted on to the power circuit substrate 23 relative with the upper surface of heating circuit components and parts 39 etc. configures.Thus, by the heat conduction supporting board 33a configuration insulation sheet material 43 relative with the not enough region of insulation distance, thereby can eliminate insulation distance deficiency, can be by insulation reliably between the most outstanding heating circuit components and parts 39 and heat conduction supporting board 33a corresponding thereto.
In addition, as shown in Figures 2 and 3, in the shared base plate 34 of heat conduction supporting member 32 and 33, on the relative position of the patchhole 15 with inserting hold-down screw 14 of semi-conductor power module 11, be formed with fixed component patchhole 34a.And, at the upper surface of base plate 34 and be formed between the lower surface of radiating component 13 of semi-conductor power module 11 and accompany tabular elastic component 45.
Then, by making hold-down screw 14 insert the patchhole 15 of semi-conductor power module 11 and radiating component 13 and the fixed component patchhole 34a of base plate 34, and this hold-down screw 14 and the internal thread part 3f that is formed at cooling body 3 are screwed togather, semi-conductor power module 11 and base plate 34 are fixed on cooling body 3.
Then, the assemble method of the power conversion device 1 to above-mentioned execution mode 1 describes.
First, in Fig. 2, as described above, make the heat conduction supporting board 33a overlaid of power circuit substrate 23 across heat conduction member 37 and heat conduction supporting member 33, under the state of the compression ratio compression heat conduction member 37 with 5～30% left and right, utilize hold-down screw 38 to be fixed power circuit substrate 23, heat conduction member 37 and heat conduction supporting board 33a, be pre-formed as shown in Figure 3 thus power circuit unit U3.
Similarly, make the heat conduction supporting board 32a overlaid of control circuit substrate 22 across heat conduction member 35 and heat conduction supporting member 32, under the state of the compression ratio compression heat conduction member 35 with 5～30% left and right, utilize hold-down screw 36 to be fixed control circuit substrate 22, heat conduction member 35 and heat conduction supporting board 32a, be pre-formed thus control circuit unit U2.
On the other hand, in all groove 3d of cooling body 3, at the upper surface of heat conduction supporting member 32 and 33 shared base plate 34 and be formed between the lower surface of radiating component 13 of semi-conductor power module 11 and accompany under the state of tabular elastic component 45, utilize hold-down screw 14 to be fixed together with semi-conductor power module 11 this base plate 34.Like this, the shared base plate 34 of semi-conductor power module 11 and heat conduction supporting member 32 and 33 can be fixed on to cooling body 3 simultaneously, therefore, can reduce assembling procedure number.
In addition, in the time that base plate 34 is fixed on to cooling body 3, tabular elastic component 45 is clipped between base plate 34 and the radiating component 13 of semi-conductor power module 11, therefore, utilize this tabular elastic component 45 by base plate 34 by the bottom of all groove 3d that is pressed in cooling body 3, base plate 34 is contacted with cooling body 3 reliably, thereby can guarantee larger contact area.
In addition, for semi-conductor power module 11, before being fixed on cooling body 3 or after fixing, on the substrate fixed part 16 on surface formed thereon, place drive circuit substrate 21.Then, utilize four joint screws 24 that this drive circuit substrate 21 is fixed on to substrate fixed part 16 from the upper side.Then, with hold-down screw 32b, heat conduction supporting board 32a and heat conduction support side board 32c are connected.
Then, place the control circuit substrate 22 of control circuit unit U2 at the upper surface of joint screw 24, utilize four joint screws 25 to be fixed.Then, place the power circuit substrate 23 of power circuit unit U3 at the upper surface of joint screw 25, and utilize four hold-down screws 26 to be fixed.Then, with hold-down screw 33b, heat conduction supporting board 33a and heat conduction support side board 33c are connected.
Afterwards, though not shown, the DC power supply such as rectifier and outside the positive and negative direct-flow input end of semi-conductor power module 11 are connected, and are connected with the positive and negative terminal of film capacitor 4.
In addition, the threephase motor even load outside with the three-phase alternating current lead-out terminal (not shown) of semi-conductor power module 11 is connected.
Afterwards, lower case 2A and upper body 2B are fixed on to lower surface and the upper surface of cooling body 3 across encapsulant, thereby complete the assembling of power conversion device 1.
Under this state, providing the galvanic while from external rectifier (not shown), make to be installed on power circuit substrate 23 power circuit, to be installed on control circuit on control circuit substrate 22 in running order, via the drive circuit being arranged on drive circuit substrate 21, the signal for example being formed by pulse-width signal offered to semi-conductor power module 11 from control circuit.Thus, the IGBT that is built in semi-conductor power module 11 is controlled, and direct current is converted to alternating current.Alternating current after conversion drives control from three-phase alternating current lead-out terminal to threephase motor even load (not shown).
Now, the IGBT that is built in semi-conductor power module 11 can generate heat.Owing to being formed at the radiating component 13 of semi-conductor power module 11 and the central portion 3c of cooling body 3 directly contacts, the cooling water that therefore utilizes cooling body 3 to provide carries out cooling to this heating.
On the other hand, be installed in the control circuit of control circuit substrate 22 and power circuit substrate 23 and power circuit and include heating circuit components and parts 39, these heating circuit components and parts 39 can heating.Now, heating circuit components and parts 39 are installed on the upper surface side of control circuit substrate 22 and power circuit substrate 23.
And, in the lower face side of these control circuit substrates 22 and power circuit substrate 23, higher and there is flexible heat conduction member 35 and 37 and be provided with heat conduction supporting board 32a and the 33a of heat conduction supporting member 32 and 33 across pyroconductivity.
The heat that therefore, heating circuit components and parts 39 can be produced conducts to heat conduction member 35 and 37 efficiently.And, because heat conduction member 35 and 37 compresses with the compression ratio of 5～30% left and right itself, pyroconductivity is improved, and therefore, the heat that is transmitted to heat conduction member 35 and 37 can be transmitted to efficiently to heat conduction supporting board 32a and the 33a of heat conduction supporting member 32 and 33.
And owing to being linked with heat conduction support side board 32c and 33c on heat conduction supporting board 32a and 33a, therefore, the heat that conducts to heat conduction supporting board 32a and 33a can conduct to shared base plate 34 by heat conduction support side board 32c and 33c.In all groove 3d due to this base plate 34 and cooling body 3, directly contact, the heat that therefore conduction is come dispels the heat to cooling body 3.
And the heat that is transmitted to base plate 34 conducts to the radiating component 13 of semi-conductor power module 11 via tabular elastic component 45 from the upper surface side of base plate 34, and conduct to the central portion 3c of cooling body 3 and dispel the heat via this radiating component 13.
Like this, according to above-mentioned execution mode 1, because the heat that the heating circuit components and parts 39 that are installed on control circuit substrate 22 and power circuit substrate 23 can be produced conducts to heat conduction member 35 and 37 via control circuit substrate 22 and power circuit substrate 23, therefore, can dispel the heat efficiently.
Then, the heat that conducts to heat conduction member 35 and 37 conducts to heat conduction supporting board 32a and 33a, and then conducts to heat conduction support side board 32c and 33c.Now, heat conduction support side board 32c and 33c arrange along the long limit of semi-conductor power module 11.
Therefore, heat-conducting area can be increased, and wider heat dissipation path can be guaranteed.And, due to the bend of heat conduction support side board 32c and 33c is made as to bend cylindraceous, therefore, compared with bend being made as to the situation of L font, can shorten to the heat conduction distance of cooling body 3.Here, heat conveying capacity Q can use with following formula (1) and represent.
Q＝λ×(A/L)×T…………(1)
Wherein, λ is pyroconductivity [W/m DEG C], T be temperature difference [DEG C] substrate temperature T1-cooling body temperature T 2, A is heat conduction minimum sectional area [m
2], L is heat conduction length [m].
From this formula (1), if heat conduction length L shortens, heat conveying capacity Q can increase, thereby can bring into play good cooling effect.
In addition, due to the heat conduction support side board 32c of heat conduction supporting member 32 and 33 and 33c and shared base plate 34 integrated, therefore, between heat conduction support side board 32c and 33c and base plate 34, there is not the seam between components and parts, thereby can suppress thermal resistance.
In addition, owing to not comprising housing 2 from control circuit substrate 22 and power circuit substrate 23 that heating circuit components and parts 39 are installed to the heat dissipation path of cooling body 3, therefore, to the not requirement of the thermal conductivity of housing 2.Therefore, needn't use the metal of the high thermoconductivities such as aluminium to be used as the constituent material of housing 2, can form housing 2 with synthetic resin material, thereby can try hard to realize lightweight.
In addition, because heat dissipation path does not depend on housing 2, can form separately heat dissipation path with power conversion device 1, therefore, the power conversion device 1 being made up of semi-conductor power module 11, drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 can be applied to housing 2 and the cooling body 3 of various different shapes.
In addition,, owing to being fixed with metal heat conduction supporting board 32a and 33a on control circuit substrate 22 and power circuit substrate 23, therefore, can improve the rigidity of control circuit substrate 22 and power circuit substrate 23.Therefore, even in the case of as using power conversion device 1 as driving Vehicle Driving Cycle situation about using with the motor drive circuit of motor, up-down vibration or lateral shake act on power conversion device 1, also can utilize heat conduction supporting member 32 and 33 to improve rigidity.Therefore, can provide the less power conversion device 1 of impact that is subject to up-down vibration, lateral shake etc.
And, being installed on the heat that the heating circuit components and parts 39 of the upper surface of control circuit substrate 22 produce also dispels the heat to the space between control circuit substrate 22 and power circuit substrate 23, this radiator portion is absorbed by the heat conduction supporting board 33a of relative power circuit substrate 23, and by heat conduction support side board, 33c dispels the heat to cooling body 3.Therefore, the heat that heating circuit components and parts 39 produce can not be trapped between control circuit substrate 22 and power circuit substrate 23, and dispels the heat to cooling body 3.
Herein, about the distance between control circuit substrate 22 and power circuit substrate 23, as setting required insulation distance L1 between the upper surface of circuit elements device 42 of benchmark and the heat conduction supporting board 33a of power circuit substrate 23.Therefore,, although can guarantee insulation between the heat conduction supporting board 33a of circuit elements device 42 and power circuit substrate 23, for this circuit elements device 42 as benchmark of aspect ratio is wanted high circuit elements device 39, cannot guarantee insulation distance.
But, in the present embodiment, in the time producing the not enough region of insulation distance, dispose insulation sheet material 43 at the opposite face of the heat conduction supporting board of the power circuit substrate 23 relative with the not enough region of insulation distance, therefore, utilize this insulation sheet material 43 can guarantee required heat conduction distance.
Therefore, distance between control circuit substrate 22 and power circuit substrate 23 is that the height of the circuit elements device 42 as benchmark is added to the distance after required insulation distance L1, and the height of the shortest heating circuit components and parts 39 of insulation distance is added to the distance phase specific energy after required insulation distance L1 is enough short.
Therefore, can shorten from semi-conductor power module 11 till the distance of higher level's power circuit substrate 23, also can reduce the height of the upper body 2B that surrounds them, therefore, can realize densification.
In addition, in above-mentioned execution mode 1, to existing two kinds of situations that the substrate of heating circuit components and parts 39 is installed to be illustrated.But the present invention is not limited to said structure, in the case of be provided with the substrate of heating circuit components and parts 39 be only for example the situation of a control circuit substrate 22 or have more than three, also can adopt the present invention.
Then, use Fig. 4 to describe embodiments of the present invention 2.
In this execution mode 2, at the height of installed circuit elements device, compared with high and produce the not enough region of insulation, in the region relative with the not enough region of insulation, folder is inserted insulating properties heat conduction member, to guarantee insulation.
; in execution mode 2; as shown in Figure 4; omit the insulation sheet material 43 in above-mentioned execution mode 1; replace; in insulation distance between the highest circuit elements device 39 of the height that is installed on control circuit substrate 22 and the heat conduction supporting board 33a of power circuit substrate 23 is corresponding thereto not enough region, folder is inserted the insulating properties heat conduction member 51 with the insulating properties identical with heat conduction member 35,37 in above-mentioned execution mode 1, to guarantee region as insulation.In addition structure is identical with above-mentioned execution mode 1, therefore, in Fig. 4, to marking same numeral with the corresponding part of Fig. 1, in it describes in detail, omits this part.
In this execution mode 2, the not enough region of insulation distance folder between the highest circuit elements device 39 of the height between control circuit substrate 22 and power circuit substrate 23 and the heat conduction supporting board 33a of power circuit substrate 23 is inserted with insulating properties heat conduction member 51, therefore, can utilize this insulating properties heat conduction member 51, guarantee the insulation in the not enough region of insulation distance.
And, in the case, between the heat conduction supporting board 33a of circuit elements device 39 and power circuit substrate 23, folder is inserted with insulating properties heat conduction member 51, therefore, can not only guarantee insulation, insulating properties heat conduction member 51 can also be used as to heat dissipation path, be heating circuit components and parts at highly the highest circuit elements device 39, the heat of its generation can be directly conducted to heat conduction supporting board 33a via insulating properties heat conduction member 51, thereby can more effectively carry out the heat radiation of heating circuit components and parts.
In addition, in above-mentioned execution mode 2, application insulating properties heat conduction member 51 is used as to insulation and guarantees that the situation in region is illustrated, but be not limited to this, also can apply the insulating component that pyroconductivity is lower.
Then, use Fig. 5 and Fig. 6 to describe embodiments of the present invention 3.
In this execution mode 3, guarantee region as insulation, the heat conduction supporting board 33a of the power circuit substrate 23 relative with the not enough region of insulation distance is removed.
, in execution mode 3, as shown in Figure 5, in the not enough region of insulation distance between the upper end of the highest circuit elements device 39 of the height that is installed on control circuit substrate 22 and the heat conduction supporting board 33a of power circuit substrate 23, for the heat conduction supporting board 33a of the position relative with circuit elements device 39, as Fig. 6 (a) or (b), form the cut portion 61a of the rectangle larger than the flat shape of circuit elements device 39 or the circular cut portion 61b larger than the flat shape of circuit elements device 39, so that heat conduction member 37 exposes, thereby guarantee insulation distance.
About other structures, owing to thering is the structure identical with above-mentioned execution mode 1 and execution mode 2, therefore, to marking same numeral with the corresponding part of Fig. 1 and Fig. 4, in it describes in detail, omit this part.
According to this execution mode 3, in the not enough region of insulation distance between the upper surface of the highest circuit elements device 39 of the height that is installed on control circuit substrate 22 and the heat conduction supporting board 33a of power circuit substrate 23, excise heat conduction supporting board 33a so that heat conduction member 37 exposes, therefore, can utilize the insulating properties of this heat conduction member 37 to guarantee insulation distance.Therefore, can obtain the action effect identical with above-mentioned execution mode 1 and execution mode 2.In addition, without insulation sheet material 43, insulating properties heat conduction member 51, only excise heat conduction supporting board 33a, therefore, can not spend components and parts cost, can reduce costs.
In addition, in above-mentioned execution mode 3, the situation that the excision of heat conduction supporting board 33a is shaped as to rectangle or circle is illustrated, but is not limited to this, as long as can guarantee the insulation distance of regulation, can be arbitrary shape.
In addition, in above-mentioned execution mode 1～3, to existing two kinds of situations that the substrate of heating circuit components and parts 39 is installed to be illustrated.But the present invention is not limited to said structure, in the case of be provided with the substrate of heating circuit components and parts 39 be only for example the situation of a control circuit substrate 22 or more than three, also can adopt the present invention.
In addition, in above-mentioned execution mode 1～3, the situation that heat conduction supporting member 32,33 is made up of heat conduction supporting board 32a, 33a and heat conduction support side board 32c, the 33c of different component is illustrated, but be not limited to this, also heat conduction supporting board 32a, 33a and heat conduction support side board 32c, 33c can be formed as one.In the case, between heat conduction supporting board 32a, 33a and heat conduction support side board 32c, 33c, do not form seam, therefore, can reduce thermal resistance, further improve radiating effect.
In addition, in above-mentioned execution mode 1～3, the situation that power conversion device of the present invention is applied to electric automobile is illustrated, but is not limited to this, the present invention is also applicable to the rolling stock that travels on track, also applicable to electro-motive vehicle arbitrarily.In addition, be not limited to electro-motive vehicle as power conversion device, the actuators such as the motor in driving other industries equipment, also can apply power conversion device of the present invention.
Industrial practicality
According to the present invention, a kind of power conversion device can be provided, even in the case of the local not enough region of insulation distance that is formed with insulation distance deficiency between installation base plate, also utilize insulation guarantee region guarantee insulation, therefore, in the position relative with heating circuit components and parts, heat conduction supporting member is exposed, the heat that the heating circuit components and parts of opposite face side produce can dispel the heat and can not be detained to cooling body, thereby raising radiating effect, and, can make the distance between installation base plate shorter than required insulation distance, can make housing densification.
Label declaration
1 power conversion device
2 housings
3 cooling bodies
4 film capacitors
11 semi-conductor power modules
12 casings
13 radiating components
21 drive circuit substrate
22 control circuit substrates
23 power circuit substrates
24,25 joint screws
32 heat conduction supporting members
32a heat conduction supporting board
32b hold-down screw
32c heat conduction support side board
33 heat conduction supporting members
33a heat conduction supporting board
33b hold-down screw
33c heat conduction support side board
34 base plate
35,37 heat conduction members
39 heating circuit components and parts
40 packing rings (interval adjustment member)
The 42 circuit elements devices as benchmark
43 insulation sheet materials
45 tabular elastic components
51 insulating properties heat conduction members
61a, 61b cut portion
Claims (9)
1. a power conversion device, is characterized in that, comprising:
A semi-conductor power module that face engages with cooling body;
Multiple installation base plates, the plurality of installation base plate is provided with the circuit elements device that comprises the heating circuit components and parts that described semi-conductor power module is driven;
The heat of multiple installation base plates is conducted to the heat conduction supporting member to described cooling body; And
Between multiple described installation base plates, region is guaranteed in the insulation being formed in the not enough region of insulation distance of insulation distance deficiency.
2. power conversion device as claimed in claim 1, is characterized in that,
Described insulation guarantees that region is made as the region of guaranteeing insulation at the position insertion insulating properties heat conduction member relative with the not enough region of described insulation distance.
3. power conversion device as claimed in claim 1, is characterized in that,
Described insulation guarantees that region is made as the region of guaranteeing insulation at the position configuration insulation sheet material relative with the not enough region of described insulation distance.
4. power conversion device as claimed in claim 1, is characterized in that,
Described insulation guarantees that region is made as the described heat conduction supporting member of removing the position relative with the not enough region of described insulation distance and guarantees the region of insulating.
5. the power conversion device as described in any one in claim 1 to 4, is characterized in that,
Described heat conduction supporting member forms by the heat conduction supporting board described installation base plate being supported across heat conduction member and by the side link of this heat conduction supporting board the heat conduction support side board being connected with described cooling body.
6. power conversion device as claimed in claim 5, is characterized in that,
Described heat conduction supporting board and described heat conduction support side board form as one.
7. power conversion device as claimed in claim 5, is characterized in that,
Described heat conduction member is made up of the insulator with insulating properties.
8. power conversion device as claimed in claim 5, is characterized in that,
Utilize clamp structure, the heat conduction supporting board of described installation base plate and described heat conduction supporting member is fixed across described heat conduction member.
9. power conversion device as claimed in claim 8, is characterized in that,
Around described clamp structure, be inserted with the distance maintaining between described installation base plate and the heat conduction supporting board of described heat conduction supporting member at the interval of setting adjustment member.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-073284 | 2012-03-28 | ||
| JP2012073284 | 2012-03-28 | ||
| PCT/JP2013/000165 WO2013145508A1 (en) | 2012-03-28 | 2013-01-16 | Power conversion apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104040865A true CN104040865A (en) | 2014-09-10 |
Family
ID=49258837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380005264.XA Pending CN104040865A (en) | 2012-03-28 | 2013-01-16 | Power conversion apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2013145508A1 (en) |
| CN (1) | CN104040865A (en) |
| WO (1) | WO2013145508A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856375A (en) * | 2015-12-04 | 2017-06-16 | 富士电机株式会社 | DC-to-AC converter |
| CN110178302A (en) * | 2017-01-17 | 2019-08-27 | 日立汽车系统株式会社 | Power inverter |
| CN110417309A (en) * | 2019-08-02 | 2019-11-05 | 北斗航天汽车（北京）有限公司 | Novel motor controller, electric machine controller manufacturing method and electric car |
| CN110959239A (en) * | 2017-04-07 | 2020-04-03 | 法雷奥西门子新能源汽车(深圳)有限公司 | Voltage converter for use in electric or hybrid vehicles |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112015003244T5 (en) * | 2014-09-25 | 2017-04-13 | Hitachi Automotive Systems, Ltd. | power converter |
| JP7151361B2 (en) | 2018-10-15 | 2022-10-12 | 富士電機株式会社 | semiconductor equipment |
| JP7516294B2 (en) | 2021-03-08 | 2024-07-16 | 株式会社日立製作所 | Power conversion unit and power conversion device |
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| US5995370A (en) * | 1997-09-01 | 1999-11-30 | Sharp Kabushiki Kaisha | Heat-sinking arrangement for circuit elements |
| CN101640495A (en) * | 2008-07-29 | 2010-02-03 | 株式会社日立制作所 | Power conversion apparatus and electric vehicle |
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| JP3378174B2 (en) * | 1997-06-30 | 2003-02-17 | 株式会社ピーエフユー | Heat dissipation structure of high heating element |
| JP4816036B2 (en) * | 2005-12-01 | 2011-11-16 | 株式会社Ｉｈｉ | Inverter device |
| JP4434181B2 (en) * | 2006-07-21 | 2010-03-17 | 株式会社日立製作所 | Power converter |
| JP4909712B2 (en) * | 2006-11-13 | 2012-04-04 | 日立オートモティブシステムズ株式会社 | Power converter |
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- 2013-01-16 CN CN201380005264.XA patent/CN104040865A/en active Pending
- 2013-01-16 JP JP2014507349A patent/JPWO2013145508A1/en active Pending
- 2013-01-16 WO PCT/JP2013/000165 patent/WO2013145508A1/en active Application Filing
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| JPS63209197A (en) * | 1987-02-25 | 1988-08-30 | 松下電器産業株式会社 | Control equipment |
| US5995370A (en) * | 1997-09-01 | 1999-11-30 | Sharp Kabushiki Kaisha | Heat-sinking arrangement for circuit elements |
| CN101640495A (en) * | 2008-07-29 | 2010-02-03 | 株式会社日立制作所 | Power conversion apparatus and electric vehicle |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856375A (en) * | 2015-12-04 | 2017-06-16 | 富士电机株式会社 | DC-to-AC converter |
| CN106856375B (en) * | 2015-12-04 | 2020-07-24 | 富士电机株式会社 | Inverter device |
| CN110178302A (en) * | 2017-01-17 | 2019-08-27 | 日立汽车系统株式会社 | Power inverter |
| CN110178302B (en) * | 2017-01-17 | 2021-09-10 | 日立汽车系统株式会社 | Power conversion device |
| CN110959239A (en) * | 2017-04-07 | 2020-04-03 | 法雷奥西门子新能源汽车(深圳)有限公司 | Voltage converter for use in electric or hybrid vehicles |
| CN110959239B (en) * | 2017-04-07 | 2021-09-14 | 法雷奥西门子新能源汽车(深圳)有限公司 | Voltage converter for use in electric or hybrid vehicles |
| CN110417309A (en) * | 2019-08-02 | 2019-11-05 | 北斗航天汽车（北京）有限公司 | Novel motor controller, electric machine controller manufacturing method and electric car |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013145508A1 (en) | 2013-10-03 |
| JPWO2013145508A1 (en) | 2015-12-10 |
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Application publication date: 20140910 |