IL236957B - Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer - Google Patents

Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Info

Publication number
IL236957B
IL236957B IL236957A IL23695715A IL236957B IL 236957 B IL236957 B IL 236957B IL 236957 A IL236957 A IL 236957A IL 23695715 A IL23695715 A IL 23695715A IL 236957 B IL236957 B IL 236957B
Authority
IL
Israel
Prior art keywords
woofer
predicting
testing
manufactured
properties
Prior art date
Application number
IL236957A
Other languages
English (en)
Hebrew (he)
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL236957B publication Critical patent/IL236957B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
IL236957A 2012-08-01 2015-01-28 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer IL236957B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261678576P 2012-08-01 2012-08-01
US13/783,291 US8948495B2 (en) 2012-08-01 2013-03-02 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
PCT/US2013/053252 WO2014022682A1 (en) 2012-08-01 2013-08-01 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Publications (1)

Publication Number Publication Date
IL236957B true IL236957B (en) 2018-07-31

Family

ID=50025524

Family Applications (2)

Application Number Title Priority Date Filing Date
IL236957A IL236957B (en) 2012-08-01 2015-01-28 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
IL255772A IL255772B (en) 2012-08-01 2017-11-20 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL255772A IL255772B (en) 2012-08-01 2017-11-20 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Country Status (8)

Country Link
US (1) US8948495B2 (https=)
EP (1) EP2880427A1 (https=)
JP (4) JP6282650B2 (https=)
KR (2) KR102129826B1 (https=)
CN (1) CN104620097B (https=)
IL (2) IL236957B (https=)
TW (1) TWI591326B (https=)
WO (1) WO2014022682A1 (https=)

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US10679909B2 (en) * 2016-11-21 2020-06-09 Kla-Tencor Corporation System, method and non-transitory computer readable medium for tuning sensitivies of, and determining a process window for, a modulated wafer
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Also Published As

Publication number Publication date
KR102129826B1 (ko) 2020-07-06
IL255772A (en) 2018-01-31
EP2880427A1 (en) 2015-06-10
KR20150036789A (ko) 2015-04-07
TW201415008A (zh) 2014-04-16
KR102169564B1 (ko) 2020-10-26
WO2014022682A1 (en) 2014-02-06
IL255772B (en) 2020-09-30
JP2020057008A (ja) 2020-04-09
CN104620097B (zh) 2017-08-29
US20140037187A1 (en) 2014-02-06
US8948495B2 (en) 2015-02-03
JP2018097376A (ja) 2018-06-21
KR20200045577A (ko) 2020-05-04
JP2015527740A (ja) 2015-09-17
JP2021182162A (ja) 2021-11-25
TWI591326B (zh) 2017-07-11
CN104620097A (zh) 2015-05-13
JP6282650B2 (ja) 2018-02-21

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