IL206256A0 - Method of, and apparatus for separating wafers from a wafer stack - Google Patents

Method of, and apparatus for separating wafers from a wafer stack

Info

Publication number
IL206256A0
IL206256A0 IL206256A IL20625610A IL206256A0 IL 206256 A0 IL206256 A0 IL 206256A0 IL 206256 A IL206256 A IL 206256A IL 20625610 A IL20625610 A IL 20625610A IL 206256 A0 IL206256 A0 IL 206256A0
Authority
IL
Israel
Prior art keywords
wafer stack
separating wafers
wafers
separating
wafer
Prior art date
Application number
IL206256A
Other languages
English (en)
Original Assignee
Schmid Gmbh & Co Geb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmid Gmbh & Co Geb filed Critical Schmid Gmbh & Co Geb
Publication of IL206256A0 publication Critical patent/IL206256A0/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/02—De-stacking from the top of the stack
    • B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/02—De-stacking from the top of the stack
    • B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
    • B65G59/045—De-stacking from the top of the stack by suction or magnetic devices with a stepwise upward movement of the stack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
IL206256A 2007-12-11 2010-06-08 Method of, and apparatus for separating wafers from a wafer stack IL206256A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007061410A DE102007061410A1 (de) 2007-12-11 2007-12-11 Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel
PCT/EP2008/010527 WO2009074317A1 (de) 2007-12-11 2008-12-11 Verfahren und vorrichtung zum vereinzeln von wafern von einem waferstapel

Publications (1)

Publication Number Publication Date
IL206256A0 true IL206256A0 (en) 2010-12-30

Family

ID=40514053

Family Applications (1)

Application Number Title Priority Date Filing Date
IL206256A IL206256A0 (en) 2007-12-11 2010-06-08 Method of, and apparatus for separating wafers from a wafer stack

Country Status (11)

Country Link
US (1) US20110008145A1 (enExample)
EP (1) EP2229265A1 (enExample)
JP (1) JP2011507242A (enExample)
KR (1) KR20100100957A (enExample)
CN (1) CN102006976B (enExample)
AU (1) AU2008334890A1 (enExample)
CA (1) CA2707804A1 (enExample)
DE (1) DE102007061410A1 (enExample)
IL (1) IL206256A0 (enExample)
TW (1) TW201001601A (enExample)
WO (1) WO2009074317A1 (enExample)

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DE102008060012A1 (de) 2008-11-24 2010-05-27 Gebr. Schmid Gmbh & Co. Verfahren zum Drehen eines zersägten Waferblocks und Vorrichtung dafür
DE102008060014A1 (de) 2008-11-24 2010-05-27 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Handhabung eines zersägten Waferblocks
JP5368222B2 (ja) * 2009-09-14 2013-12-18 日鉄住金ファインテック株式会社 ウエハ搬送方法およびウエハ搬送装置
JP5254114B2 (ja) * 2009-04-07 2013-08-07 日鉄住金ファインテック株式会社 ウエハ搬送方法およびウエハ搬送装置
JP2011029390A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
JP2011061120A (ja) * 2009-09-14 2011-03-24 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
CN102473666B (zh) * 2009-07-24 2014-09-03 住友金属精密科技股份有限公司 晶片输送方法和晶片输送装置
JP5405947B2 (ja) * 2009-09-04 2014-02-05 日本文化精工株式会社 ウエハ搬送装置、および、ウエハ搬送方法
JP5457113B2 (ja) * 2009-09-14 2014-04-02 日鉄住金ファインテック株式会社 ウエハ搬送方法およびウエハ搬送装置
WO2011032567A1 (de) * 2009-09-15 2011-03-24 Rena Gmbh Vorrichtung und verfahren zum berührungslosen aufnehmen und halten sowie zum fördern von flachen gegenständen
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KR101162684B1 (ko) 2009-11-09 2012-07-05 주식회사 케이씨텍 웨이퍼 분리장치
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JP5502503B2 (ja) * 2010-01-21 2014-05-28 日鉄住金ファインテック株式会社 ウエハ搬送装置およびウエハ搬送方法
RU2527623C2 (ru) 2010-05-03 2014-09-10 Инова Лисец Технологицентрум Гмбх Устройство для перемещения плоских элементов
WO2012005344A1 (ja) * 2010-07-08 2012-01-12 株式会社エクサ ウエハ分離装置、ウエハ分離搬送装置、ウエハ分離方法、ウエハ分離搬送方法及び太陽電池用ウエハ分離搬送方法
CN101950778A (zh) * 2010-09-02 2011-01-19 董维来 太阳能硅片湿法自动分片方法
DE102010045098A1 (de) * 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
KR101102428B1 (ko) * 2011-05-24 2012-01-05 주식회사 에이에스이 웨이퍼 분리 및 반출장치
DE202011102453U1 (de) 2011-06-24 2011-08-29 Schmid Technology Systems Gmbh Vorrichtung zum Entnehmen von einzelnen Wafern von einem Stapel solcher Wafer aus einer Aufnahmevorrichtung
JP2013149703A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置
JP5600692B2 (ja) * 2012-01-18 2014-10-01 日鉄住金ファインテック株式会社 ウエハ搬送装置
JP5995089B2 (ja) * 2012-05-31 2016-09-21 パナソニックＩｐマネジメント株式会社 シリコンウェハ剥離方法、およびシリコンウェハ剥離装置
DE102012221452A1 (de) 2012-07-20 2014-01-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Separieren von Wafern
ITUD20120207A1 (it) * 2012-12-03 2014-06-04 Applied Materials Italia Srl Apparecchiatura e metodo per trasportare un substrato
CN103199044B (zh) * 2013-03-06 2015-06-24 北京自动化技术研究院 一种硅片传送装置
CN104658954A (zh) * 2015-02-13 2015-05-27 苏州博阳能源设备有限公司 一种硅片插片机
CN105417168A (zh) * 2015-12-31 2016-03-23 苏州博阳能源设备有限公司 一种用于硅片插片机的供料槽
CN105460612A (zh) * 2015-12-31 2016-04-06 苏州博阳能源设备有限公司 一种硅片分片机构
CN106180111A (zh) * 2016-08-24 2016-12-07 高佳太阳能股份有限公司 一种硅片自动插片机的上料装置
CN108408402A (zh) * 2018-04-04 2018-08-17 杭州利珀科技有限公司 太阳能电池片连续吸附系统和连续吸附方法
CN110391149B (zh) * 2018-04-19 2024-05-28 无锡市南亚科技有限公司 硅片分片及吸片送片装置以及硅片分片吸片送片的方法
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CN110451268A (zh) * 2019-07-24 2019-11-15 广州复雅机械设备有限公司 全自动放盘机
DE102019217033B4 (de) * 2019-11-05 2022-06-30 Asys Automatisierungssysteme Gmbh Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem
KR102751035B1 (ko) * 2019-12-19 2025-01-07 삼성디스플레이 주식회사 박리 장치 및 그를 이용한 표시 장치의 제조 방법
CN113651123A (zh) * 2021-08-09 2021-11-16 张家港市超声电气有限公司 用于硅片的分片装置
KR102528896B1 (ko) * 2021-10-21 2023-05-08 주식회사 유성에프에이 기판 버퍼장치
CN114476674A (zh) * 2022-03-24 2022-05-13 深圳市蓝际工业技术有限公司 一种叶片上料设备及片状材料输送设备
CN114733795A (zh) * 2022-05-09 2022-07-12 苏州天准科技股份有限公司 碎料检测剔除装置、检测剔除方法和分选系统
JP2024047292A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2024091136A (ja) * 2022-12-23 2024-07-04 株式会社Sumco ウェーハ分離装置及び方法並びにシリコンウェーハの製造方法
JP7624466B2 (ja) * 2023-01-27 2025-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム
JP2025007099A (ja) * 2023-06-30 2025-01-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム
CN116872368A (zh) * 2023-07-21 2023-10-13 安徽省恒泰新材料有限公司 反式浇筑石膏板生产设备
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Also Published As

Publication number Publication date
DE102007061410A1 (de) 2009-06-18
US20110008145A1 (en) 2011-01-13
CN102006976B (zh) 2017-05-31
CN102006976A (zh) 2011-04-06
TW201001601A (en) 2010-01-01
CA2707804A1 (en) 2009-06-18
EP2229265A1 (de) 2010-09-22
WO2009074317A1 (de) 2009-06-18
JP2011507242A (ja) 2011-03-03
AU2008334890A1 (en) 2009-06-18
KR20100100957A (ko) 2010-09-15

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