IL164363A0 - Variable temperature processes for tunable electrostatic chuck - Google Patents

Variable temperature processes for tunable electrostatic chuck

Info

Publication number
IL164363A0
IL164363A0 IL16436303A IL16436303A IL164363A0 IL 164363 A0 IL164363 A0 IL 164363A0 IL 16436303 A IL16436303 A IL 16436303A IL 16436303 A IL16436303 A IL 16436303A IL 164363 A0 IL164363 A0 IL 164363A0
Authority
IL
Israel
Prior art keywords
temperature
wafer
chuck
electrostatic chuck
variable temperature
Prior art date
Application number
IL16436303A
Other languages
English (en)
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of IL164363A0 publication Critical patent/IL164363A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/082—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being tapered via holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
IL16436303A 2002-04-02 2003-03-25 Variable temperature processes for tunable electrostatic chuck IL164363A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36977302P 2002-04-02 2002-04-02
US10/235,453 US6921724B2 (en) 2002-04-02 2002-09-04 Variable temperature processes for tunable electrostatic chuck
PCT/US2003/009153 WO2003085721A2 (en) 2002-04-02 2003-03-25 Variable temperature processes for tunable electrostatic chuck

Publications (1)

Publication Number Publication Date
IL164363A0 true IL164363A0 (en) 2005-12-18

Family

ID=28456852

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16436303A IL164363A0 (en) 2002-04-02 2003-03-25 Variable temperature processes for tunable electrostatic chuck
IL164363A IL164363A (en) 2002-04-02 2004-10-01 Variable temperature processes for tunable electrostatic chuck

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL164363A IL164363A (en) 2002-04-02 2004-10-01 Variable temperature processes for tunable electrostatic chuck

Country Status (11)

Country Link
US (1) US6921724B2 (https=)
EP (1) EP1493180B1 (https=)
JP (3) JP4698951B2 (https=)
KR (1) KR100921356B1 (https=)
CN (1) CN1323427C (https=)
AT (1) ATE362652T1 (https=)
AU (1) AU2003233432A1 (https=)
DE (1) DE60313861T2 (https=)
IL (2) IL164363A0 (https=)
TW (1) TWI281212B (https=)
WO (1) WO2003085721A2 (https=)

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US7838800B2 (en) * 2006-09-25 2010-11-23 Tokyo Electron Limited Temperature controlled substrate holder having erosion resistant insulating layer for a substrate processing system
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US9324589B2 (en) 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
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US9779974B2 (en) 2015-06-22 2017-10-03 Lam Research Corporation System and method for reducing temperature transition in an electrostatic chuck
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US10381248B2 (en) * 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
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Also Published As

Publication number Publication date
EP1493180B1 (en) 2007-05-16
DE60313861T2 (de) 2008-01-17
AU2003233432A1 (en) 2003-10-20
TW200406846A (en) 2004-05-01
JP4698951B2 (ja) 2011-06-08
DE60313861D1 (de) 2007-06-28
KR100921356B1 (ko) 2009-10-13
IL164363A (en) 2010-02-17
KR20050004834A (ko) 2005-01-12
CN1647259A (zh) 2005-07-27
US6921724B2 (en) 2005-07-26
EP1493180A2 (en) 2005-01-05
JP2005522051A (ja) 2005-07-21
JP2016096341A (ja) 2016-05-26
US20030186545A1 (en) 2003-10-02
TWI281212B (en) 2007-05-11
JP6170540B2 (ja) 2017-07-26
JP2010187023A (ja) 2010-08-26
ATE362652T1 (de) 2007-06-15
WO2003085721A3 (en) 2003-12-18
JP5881277B2 (ja) 2016-03-09
WO2003085721A2 (en) 2003-10-16
CN1323427C (zh) 2007-06-27

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