HK1220288A1 - 具有暴露的傳感器陣列的傳感器封裝以及製造其的方法 - Google Patents

具有暴露的傳感器陣列的傳感器封裝以及製造其的方法

Info

Publication number
HK1220288A1
HK1220288A1 HK16108207.4A HK16108207A HK1220288A1 HK 1220288 A1 HK1220288 A1 HK 1220288A1 HK 16108207 A HK16108207 A HK 16108207A HK 1220288 A1 HK1220288 A1 HK 1220288A1
Authority
HK
Hong Kong
Prior art keywords
making same
sensor
exposed
sensor array
package
Prior art date
Application number
HK16108207.4A
Other languages
English (en)
Inventor
Vage Oganesian
Zhenhua Lu
Original Assignee
Optiz Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optiz Inc filed Critical Optiz Inc
Publication of HK1220288A1 publication Critical patent/HK1220288A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0636—Integrated biosensor, microarrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0663—Whole sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0877—Flow chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Pressure Sensors (AREA)
HK16108207.4A 2013-06-03 2016-07-13 具有暴露的傳感器陣列的傳感器封裝以及製造其的方法 HK1220288A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361830563P 2013-06-03 2013-06-03
US201361831397P 2013-06-05 2013-06-05
US14/292,744 US9142695B2 (en) 2013-06-03 2014-05-30 Sensor package with exposed sensor array and method of making same
PCT/US2014/040506 WO2014197370A2 (en) 2013-06-03 2014-06-02 Sensor package with exposed sensor array and method of making same

Publications (1)

Publication Number Publication Date
HK1220288A1 true HK1220288A1 (zh) 2017-04-28

Family

ID=51984201

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16108207.4A HK1220288A1 (zh) 2013-06-03 2016-07-13 具有暴露的傳感器陣列的傳感器封裝以及製造其的方法

Country Status (7)

Country Link
US (2) US9142695B2 (zh)
JP (2) JP6307154B2 (zh)
KR (1) KR101817412B1 (zh)
CN (1) CN105247678B (zh)
HK (1) HK1220288A1 (zh)
TW (1) TWI573253B (zh)
WO (1) WO2014197370A2 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106558525A (zh) * 2015-09-25 2017-04-05 精材科技股份有限公司 晶片封装体及其制造方法
TWI561127B (en) * 2016-04-29 2016-12-01 Chunghwa Prec Test Tech Co Ltd Vertical interconnect structure and method for vertical interconnection
CN107611147B (zh) * 2016-07-11 2020-02-18 胜丽国际股份有限公司 多芯片塑胶球状数组封装结构
CN109311658A (zh) * 2016-07-22 2019-02-05 惠普发展公司，有限责任合伙企业 衬底组件和相关方法
CN106206756B (zh) * 2016-09-30 2018-03-02 深圳成光兴光电技术股份有限公司 一种光敏管与滤光片组合封装结构及其加工工艺
US20180102390A1 (en) * 2016-10-07 2018-04-12 Trutag Technologies, Inc. Integrated imaging sensor with tunable fabry-perot interferometer
US9996725B2 (en) * 2016-11-03 2018-06-12 Optiz, Inc. Under screen sensor assembly
KR20180128142A (ko) * 2017-05-23 2018-12-03 (주)파트론 광학센서 패키지 및 그 제조 방법
KR101898052B1 (ko) * 2017-06-23 2018-10-04 (주)파트론 광학센서 패키지 및 그 제조 방법
TWI685960B (zh) 2018-02-03 2020-02-21 美商伊路米納有限公司 使用感測器的主動表面的結構和方法
JP2020088066A (ja) * 2018-11-20 2020-06-04 キヤノン株式会社 電子部品および機器
CN111355871A (zh) * 2018-12-21 2020-06-30 三赢科技（深圳）有限公司 镜头模组及其组装方法
JP2020150207A (ja) 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器
US20210262963A1 (en) * 2020-02-21 2021-08-26 Culvert Engineering Solutions, Llc Graphene-based chemical sensing device and system
US11476171B2 (en) * 2020-02-27 2022-10-18 Illumina, Inc. Fluidic flow channel over active surface of a die
US20240006439A1 (en) 2020-12-03 2024-01-04 Sony Semiconductor Solutions Corporation Semiconductor module and method for manufacturing the same
CA3223107A1 (en) * 2021-11-05 2023-05-11 Ravi Billa Sensor having an active surface

Family Cites Families (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622574A (en) * 1985-07-29 1986-11-11 The Perkin-Elmer Corporation Semiconductor chip with recessed bond pads
GB8911607D0 (en) 1989-05-19 1989-07-05 Emi Plc Thorn A method of encapsulation for electronic devices and devices so encapsulated
US5731222A (en) * 1995-08-01 1998-03-24 Hughes Aircraft Company Externally connected thin electronic circuit having recessed bonding pads
IL123207A0 (en) 1998-02-06 1998-09-24 Shellcase Ltd Integrated circuit device
US6627864B1 (en) 1999-11-22 2003-09-30 Amkor Technology, Inc. Thin image sensor package
IL133453A0 (en) 1999-12-10 2001-04-30 Shellcase Ltd Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
JP2002009274A (ja) * 2000-06-21 2002-01-11 Horiba Ltd 化学ｃｃｄセンサ
JP2002222935A (ja) * 2001-01-25 2002-08-09 Canon Inc 固体撮像装置およびその製造方法、固体撮像システム
US20050051859A1 (en) 2001-10-25 2005-03-10 Amkor Technology, Inc. Look down image sensor package
JP2003279532A (ja) * 2002-03-22 2003-10-02 Horiba Ltd 化学濃度センサおよび化学濃度センサの製造方法
JP2004034270A (ja) * 2002-07-08 2004-02-05 Asahi Techno Glass Corp 凹み構造形成半導体部材の製造方法及び凹み構造形成半導体部材
JP4285966B2 (ja) * 2002-09-27 2009-06-24 三洋電機株式会社 カメラモジュール
JP3867785B2 (ja) * 2002-10-15 2007-01-10 セイコーエプソン株式会社 光モジュール
US7033664B2 (en) 2002-10-22 2006-04-25 Tessera Technologies Hungary Kft Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
JP2004242166A (ja) * 2003-02-07 2004-08-26 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
JP2004363400A (ja) * 2003-06-05 2004-12-24 Sanyo Electric Co Ltd 半導体装置およびその製造方法
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
CN100587962C (zh) 2003-07-03 2010-02-03 泰塞拉技术匈牙利公司 用于封装集成电路器件的方法和设备
JP4170950B2 (ja) * 2003-10-10 2008-10-22 松下電器産業株式会社 光学デバイスおよびその製造方法
US20050104186A1 (en) 2003-11-14 2005-05-19 International Semiconductor Technology Ltd. Chip-on-film package for image sensor and method for manufacturing the same
TWI234884B (en) * 2003-12-31 2005-06-21 Advanced Semiconductor Eng Image sensor package and method for manufacturing the same
KR100673950B1 (ko) 2004-02-20 2007-01-24 삼성테크윈 주식회사 이미지 센서 모듈과 이를 구비하는 카메라 모듈 패키지
JP3936365B2 (ja) * 2004-09-14 2007-06-27 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
JP4381274B2 (ja) * 2004-10-04 2009-12-09 シャープ株式会社 半導体装置およびその製造方法
JP2006145501A (ja) * 2004-11-24 2006-06-08 Hamamatsu Photonics Kk 赤外線検出装置
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
KR100738653B1 (ko) * 2005-09-02 2007-07-11 한국과학기술원 이미지 센서 모듈용 웨이퍼 레벨 칩 사이즈 패키지 및 이의제조방법
EP1945561B1 (en) * 2005-10-14 2018-10-24 STMicroelectronics Srl Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20070190747A1 (en) 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
JP3940423B1 (ja) * 2006-03-02 2007-07-04 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
KR100747611B1 (ko) * 2006-03-08 2007-08-08 삼성전자주식회사 미소소자 패키지 및 그 제조방법
KR100691398B1 (ko) 2006-03-14 2007-03-12 삼성전자주식회사 미소소자 패키지 및 그 제조방법
KR100770690B1 (ko) 2006-03-15 2007-10-29 삼성전기주식회사 카메라모듈 패키지
JP2008034787A (ja) * 2006-06-30 2008-02-14 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法、並びに半導体装置およびその製造方法
US7901989B2 (en) 2006-10-10 2011-03-08 Tessera, Inc. Reconstituted wafer level stacking
US8513789B2 (en) 2006-10-10 2013-08-20 Tessera, Inc. Edge connect wafer level stacking with leads extending along edges
US7829438B2 (en) 2006-10-10 2010-11-09 Tessera, Inc. Edge connect wafer level stacking
US7807508B2 (en) 2006-10-31 2010-10-05 Tessera Technologies Hungary Kft. Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
US7935568B2 (en) 2006-10-31 2011-05-03 Tessera Technologies Ireland Limited Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
US7791199B2 (en) 2006-11-22 2010-09-07 Tessera, Inc. Packaged semiconductor chips
US8569876B2 (en) 2006-11-22 2013-10-29 Tessera, Inc. Packaged semiconductor chips with array
JP2008148222A (ja) * 2006-12-13 2008-06-26 Matsushita Electric Ind Co Ltd 固体撮像装置とその製造方法
US7749886B2 (en) 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
JP4906496B2 (ja) * 2006-12-25 2012-03-28 新光電気工業株式会社 半導体パッケージ
US7569409B2 (en) 2007-01-04 2009-08-04 Visera Technologies Company Limited Isolation structures for CMOS image sensor chip scale packages
TWI341025B (en) * 2007-02-02 2011-04-21 Siliconware Precision Industries Co Ltd Sensor semiconductor package and method for fabricating the same
CN101246893A (zh) * 2007-02-13 2008-08-20 精材科技股份有限公司 具有高传导面积的集成电路封装体及其制作方法
CN101675516B (zh) 2007-03-05 2012-06-20 数字光学欧洲有限公司 具有通过过孔连接到前侧触头的后侧触头的芯片
JP4324623B2 (ja) * 2007-04-27 2009-09-02 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
CN100546026C (zh) 2007-04-29 2009-09-30 鸿富锦精密工业（深圳）有限公司 影像摄取装置
EP2213148A4 (en) 2007-10-10 2011-09-07 Tessera Inc ROBUST MULTILAYER WIRING ELEMENTS AND ASSEMBLIES INCLUDING MICROELECTRONIC ELEMENTS INCLUDED
JP4799543B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ及びカメラモジュール
US20090212381A1 (en) 2008-02-26 2009-08-27 Tessera, Inc. Wafer level packages for rear-face illuminated solid state image sensors
US20100053407A1 (en) 2008-02-26 2010-03-04 Tessera, Inc. Wafer level compliant packages for rear-face illuminated solid state image sensors
KR100950915B1 (ko) * 2008-06-17 2010-04-01 삼성전기주식회사 웨이퍼 레벨 카메라 모듈 및 그 제조방법
US7859033B2 (en) 2008-07-09 2010-12-28 Eastman Kodak Company Wafer level processing for backside illuminated sensors
KR100982270B1 (ko) * 2008-08-08 2010-09-15 삼성전기주식회사 카메라 모듈 및 이의 제조 방법
JP5317586B2 (ja) * 2008-08-28 2013-10-16 ラピスセミコンダクタ株式会社 カメラモジュール及びその製造方法
US8232633B2 (en) 2008-09-25 2012-07-31 King Dragon International Inc. Image sensor package with dual substrates and the method of the same
US8193555B2 (en) * 2009-02-11 2012-06-05 Megica Corporation Image and light sensor chip packages
JP2010203857A (ja) * 2009-03-02 2010-09-16 Alps Electric Co Ltd 圧力センサのパッケージ構造
JP2010219696A (ja) * 2009-03-13 2010-09-30 Sharp Corp 固体撮像装置およびそれを備えた電子機器
JP2010219425A (ja) 2009-03-18 2010-09-30 Toshiba Corp 半導体装置
JP2010238995A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 半導体モジュールおよびこれを搭載したカメラモジュール
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
US8283745B2 (en) 2009-11-06 2012-10-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating backside-illuminated image sensor
US8697569B2 (en) 2010-07-23 2014-04-15 Tessera, Inc. Non-lithographic formation of three-dimensional conductive elements
US8847376B2 (en) 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
US8791575B2 (en) 2010-07-23 2014-07-29 Tessera, Inc. Microelectronic elements having metallic pads overlying vias
US9640437B2 (en) 2010-07-23 2017-05-02 Tessera, Inc. Methods of forming semiconductor elements using micro-abrasive particle stream
US8796135B2 (en) 2010-07-23 2014-08-05 Tessera, Inc. Microelectronic elements with rear contacts connected with via first or via middle structures
US8598695B2 (en) 2010-07-23 2013-12-03 Tessera, Inc. Active chip on carrier or laminated chip having microelectronic element embedded therein
US8685793B2 (en) 2010-09-16 2014-04-01 Tessera, Inc. Chip assembly having via interconnects joined by plating
US8686565B2 (en) 2010-09-16 2014-04-01 Tessera, Inc. Stacked chip assembly having vertical vias
US8847380B2 (en) 2010-09-17 2014-09-30 Tessera, Inc. Staged via formation from both sides of chip
US8610259B2 (en) 2010-09-17 2013-12-17 Tessera, Inc. Multi-function and shielded 3D interconnects
US8546900B2 (en) * 2011-06-09 2013-10-01 Optiz, Inc. 3D integration microelectronic assembly for integrated circuit devices
US8604576B2 (en) * 2011-07-19 2013-12-10 Opitz, Inc. Low stress cavity package for back side illuminated image sensor, and method of making same
JP2013041922A (ja) * 2011-08-12 2013-02-28 Sumitomo Bakelite Co Ltd 受光装置
US8432011B1 (en) 2011-12-06 2013-04-30 Optiz, Inc. Wire bond interposer package for CMOS image sensor and method of making same
US8890274B2 (en) * 2012-07-11 2014-11-18 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for CIS flip-chip bonding and methods for forming the same
US8809984B2 (en) * 2012-08-02 2014-08-19 Larview Technologies Corporation Substrate connection type module structure
US8806743B2 (en) * 2012-08-07 2014-08-19 Excelitas Technologies Singapore Pte. Ltd Panelized process for SMT sensor devices

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TW201511241A (zh) 2015-03-16
JP6586445B2 (ja) 2019-10-02
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JP2018050054A (ja) 2018-03-29
KR20160016971A (ko) 2016-02-15
US9570634B2 (en) 2017-02-14
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CN105247678B (zh) 2019-02-22
JP2016524329A (ja) 2016-08-12
KR101817412B1 (ko) 2018-01-11
US9142695B2 (en) 2015-09-22
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WO2014197370A2 (en) 2014-12-11
US20160043240A1 (en) 2016-02-11

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