HK1201988A1 - 無封蓋傳感器模塊及其製造方法 - Google Patents
無封蓋傳感器模塊及其製造方法Info
- Publication number
- HK1201988A1 HK1201988A1 HK15102393.2A HK15102393A HK1201988A1 HK 1201988 A1 HK1201988 A1 HK 1201988A1 HK 15102393 A HK15102393 A HK 15102393A HK 1201988 A1 HK1201988 A1 HK 1201988A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- cover
- sensor module
- making same
- free sensor
- free
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Geometry (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361778244P | 2013-03-12 | 2013-03-12 | |
US14/201,154 US20140264693A1 (en) | 2013-03-12 | 2014-03-07 | Cover-Free Sensor Module And Method Of Making Same |
Publications (1)
Publication Number | Publication Date |
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HK1201988A1 true HK1201988A1 (zh) | 2015-09-11 |
Family
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Family Applications (1)
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HK15102393.2A HK1201988A1 (zh) | 2013-03-12 | 2015-03-10 | 無封蓋傳感器模塊及其製造方法 |
Country Status (4)
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US (1) | US20140264693A1 (zh) |
KR (1) | KR20140111985A (zh) |
HK (1) | HK1201988A1 (zh) |
TW (1) | TWI533444B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103400807B (zh) * | 2013-08-23 | 2016-08-24 | 苏州晶方半导体科技股份有限公司 | 影像传感器的晶圆级封装结构及封装方法 |
CN103400808B (zh) * | 2013-08-23 | 2016-04-13 | 苏州晶方半导体科技股份有限公司 | 影像传感器的晶圆级封装结构及封装方法 |
US9496247B2 (en) * | 2013-08-26 | 2016-11-15 | Optiz, Inc. | Integrated camera module and method of making same |
US9543347B2 (en) * | 2015-02-24 | 2017-01-10 | Optiz, Inc. | Stress released image sensor package structure and method |
US9602804B2 (en) * | 2015-03-26 | 2017-03-21 | Intel Corporation | Methods of forming integrated package structures with low Z height 3D camera |
US9812555B2 (en) * | 2015-05-28 | 2017-11-07 | Semiconductor Components Industries, Llc | Bottom-gate thin-body transistors for stacked wafer integrated circuits |
US10425562B2 (en) * | 2015-06-23 | 2019-09-24 | Intel Corporation | Three-dimensional image sensing module with a low z-height |
CN105530413B (zh) * | 2015-12-01 | 2019-08-30 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架和线路导通方法 |
CN105516557B (zh) * | 2015-12-01 | 2021-08-10 | 宁波舜宇光电信息有限公司 | 摄像模组和电气支架及其导通方法 |
JP2019500747A (ja) | 2015-12-01 | 2019-01-10 | ▲寧▼波舜宇光▲電▼信息有限公司 | 撮像モジュール及びその電気的支持体 |
JP6947160B2 (ja) * | 2016-02-29 | 2021-10-13 | ソニーグループ株式会社 | 固体撮像素子 |
US10396117B2 (en) | 2016-10-14 | 2019-08-27 | Waymo Llc | Optical receiver systems and devices with detector array including a plurality of substrates disposed in an edge to edge array |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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DE50210653D1 (de) * | 2001-08-24 | 2007-09-20 | Schott Ag | Verfahren zur herstellung von elektronischen bauelementen |
FR2832252B1 (fr) * | 2001-11-14 | 2004-03-12 | St Microelectronics Sa | Boitier semi-conducteur a capteur, muni d'un insert de fixation |
US7573547B2 (en) * | 2004-09-27 | 2009-08-11 | Idc, Llc | System and method for protecting micro-structure of display array using spacers in gap within display device |
JP4483896B2 (ja) * | 2007-05-16 | 2010-06-16 | ソニー株式会社 | 半導体装置及びその製造方法 |
JP2009290033A (ja) * | 2008-05-29 | 2009-12-10 | Sharp Corp | 電子素子ウェハモジュールおよびその製造方法、電子素子モジュール、電子情報機器 |
JP5324890B2 (ja) * | 2008-11-11 | 2013-10-23 | ラピスセミコンダクタ株式会社 | カメラモジュールおよびその製造方法 |
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2014
- 2014-03-07 US US14/201,154 patent/US20140264693A1/en not_active Abandoned
- 2014-03-11 KR KR20140028501A patent/KR20140111985A/ko not_active Application Discontinuation
- 2014-03-11 TW TW103108373A patent/TWI533444B/zh active
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2015
- 2015-03-10 HK HK15102393.2A patent/HK1201988A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201436188A (zh) | 2014-09-16 |
TWI533444B (zh) | 2016-05-11 |
US20140264693A1 (en) | 2014-09-18 |
KR20140111985A (ko) | 2014-09-22 |
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