HK1204390A1 - 電路模塊以及電路模塊的製造方法 - Google Patents

電路模塊以及電路模塊的製造方法

Info

Publication number
HK1204390A1
HK1204390A1 HK15104814.9A HK15104814A HK1204390A1 HK 1204390 A1 HK1204390 A1 HK 1204390A1 HK 15104814 A HK15104814 A HK 15104814A HK 1204390 A1 HK1204390 A1 HK 1204390A1
Authority
HK
Hong Kong
Prior art keywords
circuit module
producing
producing circuit
module
circuit
Prior art date
Application number
HK15104814.9A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1204390A1 publication Critical patent/HK1204390A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK15104814.9A 2013-08-08 2015-05-20 電路模塊以及電路模塊的製造方法 HK1204390A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013165378 2013-08-08

Publications (1)

Publication Number Publication Date
HK1204390A1 true HK1204390A1 (zh) 2015-12-18

Family

ID=51175775

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104814.9A HK1204390A1 (zh) 2013-08-08 2015-05-20 電路模塊以及電路模塊的製造方法

Country Status (4)

Country Link
US (2) US8890309B1 (zh)
JP (1) JP5527785B1 (zh)
CN (1) CN104347540B (zh)
HK (1) HK1204390A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6262776B2 (ja) * 2014-02-04 2018-01-17 太陽誘電株式会社 回路モジュール
USD757538S1 (en) * 2015-02-17 2016-05-31 Ubotic Company Limited Sensor housing
WO2017002775A1 (ja) 2015-06-30 2017-01-05 株式会社村田製作所 高周波モジュールおよびその製造方法
CN108029226B (zh) * 2015-09-11 2020-04-17 株式会社村田制作所 高频模块
JP2017076663A (ja) * 2015-10-13 2017-04-20 日本精工株式会社 電子部品実装基板
JP6707419B2 (ja) * 2016-08-08 2020-06-10 アルプスアルパイン株式会社 回路モジュール及び回路モジュールの製造方法
WO2018079278A1 (ja) * 2016-10-25 2018-05-03 株式会社村田製作所 回路モジュール
US11637544B2 (en) 2016-11-24 2023-04-25 Daishinku Corporation Piezoelectric resonator device and system-in-package module including the same
JP2019012714A (ja) * 2017-06-29 2019-01-24 株式会社ディスコ 半導体パッケージの製造方法
CN109840238A (zh) * 2017-11-29 2019-06-04 北京搜狗科技发展有限公司 一种主板和翻译机
JP7013323B2 (ja) 2018-05-17 2022-01-31 株式会社東芝 回路装置
JP2021158202A (ja) * 2020-03-26 2021-10-07 シャープ株式会社 シールド構造および電子機器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06125191A (ja) * 1992-10-12 1994-05-06 Nippon Chemicon Corp シールド部品
JP2003209386A (ja) * 2002-01-17 2003-07-25 Hitachi Kokusai Electric Inc 高周波部品のシールドケース構造
JP4029822B2 (ja) * 2003-10-27 2008-01-09 三菱電機株式会社 電子回路装置
US6979899B2 (en) * 2003-12-31 2005-12-27 Texas Instruments Incorported System and method for high performance heat sink for multiple chip devices
JP2006286915A (ja) 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール
JP4650244B2 (ja) * 2005-12-02 2011-03-16 株式会社村田製作所 回路モジュールおよびその製造方法
JP4983219B2 (ja) * 2006-11-22 2012-07-25 株式会社村田製作所 部品内蔵基板
JP2009016715A (ja) * 2007-07-09 2009-01-22 Tatsuta System Electronics Kk シールド及び放熱性を有する高周波モジュール及びその製造方法
JP4138862B1 (ja) * 2008-01-15 2008-08-27 松下電器産業株式会社 回路基板モジュール及び電子機器
US8202765B2 (en) * 2009-01-22 2012-06-19 International Business Machines Corporation Achieving mechanical and thermal stability in a multi-chip package
JP2011165931A (ja) * 2010-02-10 2011-08-25 Mitsubishi Electric Corp 高周波回路モジュール
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
JP2012015548A (ja) * 2011-10-04 2012-01-19 Tatsuta Electric Wire & Cable Co Ltd シールド及び放熱性を有する高周波モジュール及びその製造方法

Also Published As

Publication number Publication date
US8890309B1 (en) 2014-11-18
US9018039B2 (en) 2015-04-28
JP5527785B1 (ja) 2014-06-25
US20150044822A1 (en) 2015-02-12
JP2015053297A (ja) 2015-03-19
CN104347540A (zh) 2015-02-11
CN104347540B (zh) 2018-12-07

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