SG10201408088SA - Integrated circuit packaging system with embedded component and method of manufacture thereof - Google Patents

Integrated circuit packaging system with embedded component and method of manufacture thereof

Info

Publication number
SG10201408088SA
SG10201408088SA SG10201408088SA SG10201408088SA SG10201408088SA SG 10201408088S A SG10201408088S A SG 10201408088SA SG 10201408088S A SG10201408088S A SG 10201408088SA SG 10201408088S A SG10201408088S A SG 10201408088SA SG 10201408088S A SG10201408088S A SG 10201408088SA
Authority
SG
Singapore
Prior art keywords
manufacture
integrated circuit
packaging system
circuit packaging
embedded component
Prior art date
Application number
SG10201408088SA
Inventor
Ju Jeon Dong
Park Kyounghee
Roh Youngdal
Jung Jinhee
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG10201408088SA publication Critical patent/SG10201408088SA/en

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Classifications

    • H—ELECTRICITY
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
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    • H01L25/0657—Stacked arrangements of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG10201408088SA 2013-12-16 2014-12-04 Integrated circuit packaging system with embedded component and method of manufacture thereof SG10201408088SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361916405P 2013-12-16 2013-12-16
US14/556,992 US9171795B2 (en) 2013-12-16 2014-12-01 Integrated circuit packaging system with embedded component and method of manufacture thereof

Publications (1)

Publication Number Publication Date
SG10201408088SA true SG10201408088SA (en) 2015-07-30

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SG10201408088SA SG10201408088SA (en) 2013-12-16 2014-12-04 Integrated circuit packaging system with embedded component and method of manufacture thereof

Country Status (5)

Country Link
US (1) US9171795B2 (en)
KR (1) KR102326494B1 (en)
CN (1) CN104716057B (en)
SG (1) SG10201408088SA (en)
TW (1) TWI628772B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10319607B2 (en) * 2014-08-22 2019-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Package-on-package structure with organic interposer
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