EP3026764A4 - Method for fabrication of anisotropic conductive member and method for fabrication of anisotropic conductive bonding package - Google Patents

Method for fabrication of anisotropic conductive member and method for fabrication of anisotropic conductive bonding package

Info

Publication number
EP3026764A4
EP3026764A4 EP14830337.3A EP14830337A EP3026764A4 EP 3026764 A4 EP3026764 A4 EP 3026764A4 EP 14830337 A EP14830337 A EP 14830337A EP 3026764 A4 EP3026764 A4 EP 3026764A4
Authority
EP
European Patent Office
Prior art keywords
fabrication
anisotropic conductive
bonding package
conductive member
conductive bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14830337.3A
Other languages
German (de)
French (fr)
Other versions
EP3026764A1 (en
Inventor
Yusuke KOZAWA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of EP3026764A1 publication Critical patent/EP3026764A1/en
Publication of EP3026764A4 publication Critical patent/EP3026764A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/045—Anodisation of aluminium or alloys based thereon for forming AAO templates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/16—Pretreatment, e.g. desmutting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
EP14830337.3A 2013-07-22 2014-07-18 Method for fabrication of anisotropic conductive member and method for fabrication of anisotropic conductive bonding package Withdrawn EP3026764A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013151603 2013-07-22
PCT/JP2014/069239 WO2015012234A1 (en) 2013-07-22 2014-07-18 Method for fabrication of anisotropic conductive member and method for fabrication of anisotropic conductive bonding package

Publications (2)

Publication Number Publication Date
EP3026764A1 EP3026764A1 (en) 2016-06-01
EP3026764A4 true EP3026764A4 (en) 2016-11-16

Family

ID=52393273

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14830337.3A Withdrawn EP3026764A4 (en) 2013-07-22 2014-07-18 Method for fabrication of anisotropic conductive member and method for fabrication of anisotropic conductive bonding package

Country Status (6)

Country Link
US (1) US20160138180A1 (en)
EP (1) EP3026764A4 (en)
JP (2) JP6030241B2 (en)
KR (1) KR101795538B1 (en)
CN (1) CN105431987A (en)
WO (1) WO2015012234A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107113984B (en) * 2014-12-19 2019-06-04 富士胶片株式会社 Multi-layered wiring board
WO2018145287A1 (en) 2017-02-09 2018-08-16 Huawei Technologies Co., Ltd. Metal housing connector
JP6773884B2 (en) * 2017-02-28 2020-10-21 富士フイルム株式会社 Semiconductor device, laminate and method of manufacturing semiconductor device and method of manufacturing laminate
EP3431637A1 (en) 2017-07-18 2019-01-23 IMEC vzw Porous solid materials and methods for fabrication
KR102361397B1 (en) * 2019-01-21 2022-02-10 (주)포인트엔지니어링 Probe pin having substrate and manufacturing method of probe card using the same
JP7100166B2 (en) * 2019-02-15 2022-07-12 富士フイルム株式会社 Anodizing method and manufacturing method of anisotropic conductive member
CN110261020A (en) * 2019-06-18 2019-09-20 浙江工业大学 Suitable for measuring four pressure head components of nonequiaxial residual stress
CN110317944B (en) * 2019-06-27 2021-07-13 中国科学院宁波材料技术与工程研究所 Residual stress relieving device
KR102606892B1 (en) * 2021-06-15 2023-11-29 (주)포인트엔지니어링 Supporting plate for electrical test socket, socket pin for electrical test socket, and electrical test socket
CN115615591B (en) * 2022-08-16 2023-07-21 哈尔滨工业大学 Plane stress ultrasonic measurement method based on multi-wafer air coupling transducer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3120975A1 (en) * 1981-05-26 1982-12-16 Eberhard 7121 Freudental Keller Method of producing anodized metal printing sheets
JPH0277597A (en) * 1988-09-12 1990-03-16 Nippon Mining Co Ltd Production of reflow plated material
JP2011202194A (en) * 2010-03-24 2011-10-13 Fujifilm Corp Method of manufacturing metal filling fine structure
EP2399694A1 (en) * 2009-02-17 2011-12-28 FUJIFILM Corporation Metal member
JP2013069629A (en) * 2011-09-26 2013-04-18 Fujifilm Corp Anisotropic conductive member and method of manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3154713B2 (en) * 1990-03-16 2001-04-09 株式会社リコー Anisotropic conductive film and method for manufacturing the same
JPH0547428A (en) * 1991-08-12 1993-02-26 Ricoh Co Ltd Anisotropic conductive film and connecting method for electronic parts using the same
JP2004174630A (en) * 2002-11-26 2004-06-24 Niigata Tlo:Kk Residual tensile stress removing and compressive stress applying method and device using ultrasonic irradiation
JP2007204802A (en) 2006-01-31 2007-08-16 Fujifilm Corp Method of manufacturing structure
JP5043621B2 (en) 2007-03-27 2012-10-10 富士フイルム株式会社 Anisotropic conductive member and manufacturing method thereof
JP2009132974A (en) * 2007-11-30 2009-06-18 Fujifilm Corp Microfine structure
JP2009244244A (en) * 2008-03-14 2009-10-22 Fujifilm Corp Probe card
JP2012078222A (en) * 2010-10-01 2012-04-19 Fujifilm Corp Circuit substrate connection structure and circuit substrate connecting method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3120975A1 (en) * 1981-05-26 1982-12-16 Eberhard 7121 Freudental Keller Method of producing anodized metal printing sheets
JPH0277597A (en) * 1988-09-12 1990-03-16 Nippon Mining Co Ltd Production of reflow plated material
EP2399694A1 (en) * 2009-02-17 2011-12-28 FUJIFILM Corporation Metal member
JP2011202194A (en) * 2010-03-24 2011-10-13 Fujifilm Corp Method of manufacturing metal filling fine structure
JP2013069629A (en) * 2011-09-26 2013-04-18 Fujifilm Corp Anisotropic conductive member and method of manufacturing the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199017, 16 March 1990 Derwent World Patents Index; AN 1990-128608, XP002762582 *
See also references of WO2015012234A1 *

Also Published As

Publication number Publication date
JPWO2015012234A1 (en) 2017-03-02
CN105431987A (en) 2016-03-23
KR20160023844A (en) 2016-03-03
EP3026764A1 (en) 2016-06-01
JP2017022126A (en) 2017-01-26
JP6030241B2 (en) 2016-11-24
US20160138180A1 (en) 2016-05-19
KR101795538B1 (en) 2017-11-08
WO2015012234A1 (en) 2015-01-29
JP6166826B2 (en) 2017-07-19

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